ZMD MDS764

ZMD-Standard
September 2002
MDS
764
Package TSOP (ll) 44
(400 mil)
Dimensions in millimetres
Detail Z
G
c
Based on JEDEC: JEP95 MO-133
1 Dimensions
A1
bp
D
0,1 M
0,1
e
Z
1
LP
HE
E
44
A2
A
Dimensions of Sub-Group B1
Dimensions of Sub-Group C1
Amax
1,20
Amin
bPmin
0,30
A1min
0,05
bPmax
0,45
A1max
0,15
enom
0,80
A2min
0,95
HEmin
11,56
A2max
1,05
HEmax
11,96
cmin
0,12
LPmin
0,40
cmax
0,21
Dmin*
18,28
-
2 Weight
£ 0,3 g
Dmax*
18,54
3 Package Body Material
Low Stress Epoxy
Emin*
10,03
4 Lead Material
FeNi-Alloy or Cu-Alloy
Emax*
10,29
5 Lead Finish
solder plating
qmin
0°
6 Lead Form
Z-bends
qmax
5°
* without mold-flash
Zentrum Mikroelektronik Dresden AG
Editor: signed Schoder
Date: 18.09.2002
Check: signed Marx
Quality: signed Kochan
Doc-No.
QS-000764-HD-01