ZMD-Standard September 2002 MDS 764 Package TSOP (ll) 44 (400 mil) Dimensions in millimetres Detail Z G c Based on JEDEC: JEP95 MO-133 1 Dimensions A1 bp D 0,1 M 0,1 e Z 1 LP HE E 44 A2 A Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 1,20 Amin bPmin 0,30 A1min 0,05 bPmax 0,45 A1max 0,15 enom 0,80 A2min 0,95 HEmin 11,56 A2max 1,05 HEmax 11,96 cmin 0,12 LPmin 0,40 cmax 0,21 Dmin* 18,28 - 2 Weight £ 0,3 g Dmax* 18,54 3 Package Body Material Low Stress Epoxy Emin* 10,03 4 Lead Material FeNi-Alloy or Cu-Alloy Emax* 10,29 5 Lead Finish solder plating qmin 0° 6 Lead Form Z-bends qmax 5° * without mold-flash Zentrum Mikroelektronik Dresden AG Editor: signed Schoder Date: 18.09.2002 Check: signed Marx Quality: signed Kochan Doc-No. QS-000764-HD-01