ZMD-Standard March 2000 Package SSOP16 (3,9 mm) MDS 756 Dimensions in millimetres Supersedes Edition 02.99 Based on JEDEC JEP95: MO-137 A2 X b A 1 Dimensions View X k x 45° 0,1 0,15 M Z 1 G c LP HE E A1 16 e D Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 1,73 Amin 1,54 bPmin 0,20 A1min 0,10 bPmax 0,30 A1max 0,25 enom 0,635 A2min 1,40 HEmin 5,84 A2max 1,55 HEmax 6,20 cmin 0,18 LPmin 0,41 cmax 0,25 Zmax 0,27 Dmin* 4,80 Dmax* 4,98 2 Weight £ 0,4 g Emin* 3,82 3 Package Body Material Low Stress Epoxy Emax* 4,00 4 Lead Material FeNi-Alloy or Cu-Alloy kmin 0,25 5 Lead Finish solder plating qmin 0° 6 Lead Form Z-bends qmax 10° * without mold-flash Zentrum Mikroelektronik Dresden Editor: Date: Check: Quality: Doc-No. QS-000756-HD-02