ZMD-Standard August 2003 Package SSOP20 (3,9 mm) MDS 767 Dimensions in millimetres Based on JEDEC JEP95: MO-137 1 Dimensions View X bp A A2 X 1 10 e D Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 1,73 Amin 1,54 bPmin 0,20 A1min 0,10 bPmax 0,30 A1max 0,25 enom 0,635 A2min 1,40 HEmin 5,84 A2max 1,55 HEmax 6,20 cmin 0,18 LPmin 0,41 cmax 0,25 Zmax 1,5 Dmin* 8,55 Dmax* 8,73 2 Weight ≤ 0,4 g Emin* 3,82 3 Package Body Material Low Stress Epoxy Emax* 4,00 4 Lead Material Cu-Alloy kmin 0,25 5 Lead Finish solder plating θmin 0° 6 Lead Form Z-bends θmax 10° * without mold-flash Zentrum Mikroelektronik Dresden Editor: signed Schoder Date: 08.08.2003 Check: signed Marx Quality: signed Tina Kochan Doc-No. QS-000767-HD-01 θ A1 LP HE 11 E 20 c 0,1 0,15 M Z k x 45°