LC5200 Series
LED Drivers
Features and Benefits
Description
▪ Supply voltage, VBB, 450 V maximum,
25 to 400 V recommended; Note: lowest voltage can vary
depending on LED loads
▪ Output current IO(max) options:
▫ 0.5 A, LC5205D
▫ 1.0 A, LC5210D
▪ Constant current control circuit:
▫ Fixed off-time PWM constant current control, off-time
adjustable by external components
▫ Externally adjustable output current by input voltage
to REF pin
▪ Output current dimming by external PWM signal; low
signal to TOFF pin shuts off output current, and PWM
signal input to that pin enables dimming
▪ Undervoltage lockout protection (UVLO)
▪ Overcurrent protection (OCP); latched in response to the
short-to-GND condition
▪ Thermal Shutdown protection (TSD); protects IC from
damage due to excess temperature, auto-restart when
temperature drops below threshold
LC5200 series is an off-line LED driver IC which includes
both a main controller integrated circuit (MIC) and a
power MOSFET. Its high voltage capability allows direct
connection to a wide range of supply voltages ranging from
25 to 400 V (recommended). The LC5200 uses constant
current mode to drive LEDs. The package is a standard
8-pin DIP, with pin 7 removed for greater creepage distance
from the supply pin.
Package: 7-pin DIP
Not to scale
Functional Block Diagram
VBB
OUT
MIC
Reg
Regulator
UVLO
Toff
Current
Logic
Ref
Control
TSD
Gate
Driver
OCP
GND
48102.002
Sen
LED Drivers
LC5200 Series
Selection Guide
Part Number
Output Current, IO(max)
(A)
LC5205D
LC5210D
0.5
1.0
Absolute Maximum Ratings at TA = 25°C
Characteristic
Symbol
Notes
Rating
Units
Supply Voltage
VBB
450
V
Output Breakdown Voltage
VO
450
V
Output Current
IO
LC5205D, tw ≥ 1 μs
0.5
A
LC5210D, tw ≥ 1 μs
1.0
A
REF Pin Input Voltage
VREF
SENSE Pin Voltage
VRS
tw ≥ 1 μs
Allowable Power Dissipation
PD
On Sanken evaluation PCB; affected by application PCB layout
Junction Temperature
–0.3 to VREG + 0.3
V
±2
V
1.73
W
TJ
150
ºC
Operating Ambient Temperature
TA
–40 to 105
ºC
Storage Temperature
Tstg
–40 to 150
ºC
Recommended Operating Conditions
Characteristic
Supply Voltage
Symbol
VBB
Average Output Current
IO
REF Input Voltage
VREF
Case Temperature
TC
Min.
Typ.
Max.
Unit
Lowest voltage can vary depending on LED
loads
Conditions
25
–
400
V
LC5205D
–
–
0.4
A
LC5210D
–
–
0.8
A
In normal operation
–
–
0.5
V
Measured at center of case, TJ < 150°C
–
–
105
°C
Terminal List Table
Name
Pin-out Diagram
Reg 1
8 GND
Toff 2
7 (Removed)
Ref 3
6 VBB
Sen 4
5 OUT
Number
Function
Reg
1
Regulator output pin for powering external components. Connect 0.1 μF bypass
capacitor between this pin and GND.
Toff
2
For self-oscillation operation, connect external capacitor and resistor to set
off-time. For externally-controlled PWM operation, input PWM adjustment signal.
Ref
3
Reference voltage input pin, for output peak current.
Sen
4
Connect external resistor for PWM peak current control and OCP.
OUT
5
Internally connected to the MOSFET drain, output connection to LED load.
VBB
6
Supply voltage pin; internally connected to the voltage regulator to power the
internal circuits.
–
7
No connection; pin removed to increase creepage distance from VBB pin.
GND
8
Device ground pin.
All performance characteristics given are typical values for
circuit or system baseline design only and are at the nominal
operating voltage and an ambient temperature of 25°C, unless otherwise stated.
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
2
48102.002
LED Drivers
LC5200 Series
ELECTRICAL CHARACTERISTICS Valid at TA = 25°C and VBB = 140 V, unless otherwise noted
Characteristics
Symbol
Supply Voltage Input Current
MOSFET Breakdown Voltage
MOSFET On-Voltage
Min.
Typ.
Max.
Unit
IBB
Normal operation
–
2
–
mA
IBBS
At output off
–
0.6
1
mA
VDSS
ID = 1 mA
VDS(on)
MOSFET Diode Forward Voltage
VF
Test Conditions
450
–
–
V
ID = 0.5 A, LC5205
–
3
–
V
ID = 1.0 A, LC5210
–
2.5
–
V
ID = 0.5 A, LC5205
–
0.85
–
V
–
0.9
–
V
11.5
12
12.5
V
ID = 1.0 A, LC5210
REG Pin Output Voltage
VREG
IREG = 0 mA
REG Pin Maximum Output Current
IREG
VREG = 11.5 V
–
–
2
mA
PWM frequency
–
–
200
kHz
Maximum PWM Operating Frequency
fclk
REF Pin Input Voltage
VREF
0
–
1
V
REF Pin Input Current
IREF
–
±10
–
μA
SENSE Pin Voltage
VRS
VREF
– 0.03
VREF
VREF
+ 0.03
V
SENSE Pin Current
IRS
–
±10
–
μA
OCP Threshold Voltage
VOCP
Measured at SENSE pin
–
3
–
V
PWM Off-Time
TPOFF
RTOFF = 560 kΩ, CTOFF = 220 pF
–
21
–
μs
UVLO On Threshold Voltage
VUVLO(on)
For VBB
–
13
–
V
UVLO Off Threshold Voltage
VUVLO(off)
For VBB
–
14
–
V
Main controller IC (MIC) temperature
–
150
–
°C
–
55
–
°C
TSD Threshold Temperature
TTSD
TSD Hysteresis Temperature
TTSDhys
Switching Time
tr
ID = 0.4 A
–
20
–
ns
tf
ID = 0.4 A
–
50
–
ns
Maximum Allowable Power Dissipation
PD (W)
Power Dissipation versus Ambient Temperature
2
PD = 1.73 W
1.5
RθJA = 72°C/W
1
0.5
0
0
25
50
75
100
125
150
Ambient Temperature, TA (°C)
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
3
48102.002
LED Drivers
LC5200 Series
Functional Description
Regulator
The LC5200 series provides 12 V output voltage, generated
from the supply voltage on the VBB pin, which is used to power
internal circuits and external components. When the gate capacitance charging of the MOSFET occurs, it generates a current
surge, which results in ripple voltage. This could affect operation,
therefore, connect a 0.1 μF ceramic capacitor at the REG pin to
stabilize operation.
Current Control
Current control is done by a fixed off-time PWM topology. The
output current level can be set by the input voltage on the REF
pin, and voltage across the current sense resistor at the SENSE
pin. In addition, the fixed off-time can be adjusted by the values
selected for the external capacitor and resistor at the TOFF pin.
perature increase. When the temperature drops by the hysteresis
amount, TTSDhys , or if the supply voltage is recycled, the device
returns to normal operation. Note: The primary source of heating
is the MOSFET, and there is a delay while the heat spreads to the
MIC and is sensed. Therefore, a rapid temperature increase of the
MOSFET may damage the device.
OCP (Overcurrent Protection)
When the SENSE pin input voltage reaches the OCP threshold,
VOCP , it shuts off the output and shifts into latch mode. In order
to release from latch mode, cycle the device power supply.
Note: OCP is for protecting the device from excess current. OCP
may not work at an LED-short condition because the coil may
suppress current increase.
UVLO (Undervoltage Lock Out)
Internal Switching Logic
This prevents the device from malfunctioning by shutting down
the output circuit when the internal supply voltage becomes lower
than the ULVO threshold voltage, VUVLO . In addition, the UVLO
circuit is used for the power-on reset function of overcurrent
protection (OCP).
The device turns the MOSFET gate driver circuit on or off based
on the status of the current control sensing circuit and the protection circuits.
TSD (Thermal Shutdown)
This comprises the MOSFET gate driver circuit.
When the main control chip (MIC) temperature exceeds the TSD
threshold temperature, TTSD , the device shuts off the output (system logic continues to operate), in order to avoid abnormal tem-
The two device versions in the LC5200 series are distinguished
from each other by the MOSFET current rating. Select the current
rating that best matches the application circuit.
Gate-Driver Operation
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
4
48102.002
LED Drivers
LC5200 Series
Application Information
Typical Application Example
A typical application circuit is shown in figure 1. The values of
the external components are shown in the adjacent table.
Component Value Setting
LED LED current should not exceed the LC5200 device current
Input
Line
Filter
ratings. Set the total voltage drop across the LED string to be
less than VBB; otherwise, the LED string turns off. As a general
design rule, the PWM off-time should be longer if there is a small
drop in voltage across the LED string, and it should be shorter
if there is a high drop in voltage across the LED string. For the
LC5205D, a 9 to 30 V drop across the LED string is recommended for proper operation.
CO
Di
Reg
ROff
R1
Toff
Ref
COff
R2
LED
VBB
LC5200 OUT
GND
L
Sen
RS
C1
Figure 1. Typical application circuit
Referenced Typical Application Components
Symbol
Components
Values / Ratings
C0
Electrolytic capacitor
≈100 μF / 450 V
C1
Capacitor
0.1 μF / 25 V
COff
Capacitor
100 pF / 25 V
Di
Diode
RL3A
L
Coil
1 mH / 1 A
LED
LEDs
―――
Descriptions
Main supply source voltage rectifying capacitor
Note: ≤ 1 μF can be used
The internal regulator output capacitor
PWM off-time adjusting capacitor
High voltage, ultrafast rectifying, current recirculation diode
PWMing choke coil
LED load
R1
Resistor
680 kΩ /
W
Reference pin voltage setup resistor
R2
Resistor
20 kΩ / 1/8 W
Reference pin voltage setup resistor
ROff
Resistor
RS
Resistor
620 kΩ /
1/
8
1/
8
W
1.0 Ω / 1 W
PWM off-time adjusting resistor
Output current sensing resistor
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
5
48102.002
LED Drivers
LC5200 Series
L This is the choke coil for constant-current PWM operation. The
higher the inductance of this component, the less ripple amplitude
the output current has. In general, 0.5 to 20 mH is recommended.
Also ensure the coil does not saturate at the peak of the ripple
current. Saturation causes high surge current and it could cause
damage to the LEDs or the device.
Di This diode provides a path for recirculation current. If a diode
with slow recovery characteristics is used, it will cause surge
current when the MOSFET turns on, as well as noise increase and
device malfunction may result. In addition, it causes efficiency
drop. Therefore, the Sanken RL3A ultrafast recovery diode, or a
diode of better or equal recovery characteristics (50 ns), is recommended.
CO This is the main supply voltage rectifying capacitor. The
greater the capacitance, the less ripple voltage occurs. In addition,
because higher output power causes an increase of the ripple voltage, choose a proper value of capacitance for the output power.
Even if the capacitance is low (like 1000 pF) and the ripple
voltage becomes high, the device works. It also makes possible
a non-electrolytic capacitor design, which results in lengthening
unit life and reducing unit size and cost. However, if the bottom
of the ripple voltage falls below the LC5200 UVLO threshold,
or below the voltage drop of the LED string, the LEDs are turned
off during that period.
C1 This capacitor is for stabilizing the internal regulator circuit
operation. Connect a 0.1 μF capacitor as close to the device as
possible in order to operate the MOSFET properly. Using a small
capacitance value causes slow switching speed and malfunctioning, however, a large value of capacitance causes slow startup.
R1, R2, RS These determine the LED peak current, according to
the following formula:
IPEAK = VREG × R2 / ( [ R1 + R2 ] × RS )
For example, if the target is an IPEAK of 0.35 A, the formula
becomes:
IPEAK ≈ 12 (V) × 20 (kΩ) / ([20 (kΩ) + 680 (kΩ) ] × 1 Ω)
= 0.35 A
Based on it, R1 = 20 kΩ, R2 = 680 kΩ, and RS = 1 Ω can be
determined.
Note that R1 and R2 cause power consumption by the internal
regulator. Therefore, follow the formula below in order to minimize the power consumption:
( R1 + R2 ) > 500 kΩ
In actual design, the current peak tends to be higher than the estimated value, due to internal circuit delays. This becomes obvious
at high di/dt conditions, which can result from high VBB or from
low coil inductance.
With regard to the resistor RS, because output current runs
through it, use a resistor rated for 2 to 3 times higher than the
power dissipation.
ROFF, COFF These decide PWM off-time, TPOFF. Figure 2 shows
PWM off-time curves based on various values of Coff and Roff.
PWM off-time is approximately 20 μs at the recommended values: Roff = 560 kΩ and Coff = 220 pF.
PWM TOff [μs]
50
0p F
C O ff=47
20
2 0pF
C Of f=2
pF
CO ff=100
10
COf f=47p
F
CO ff=22pF
C f f=10pF
5
O
2
1
200
400
600
800
1000
ROff[kΩ]
Figure 2. Affect of various values for capacitor COFF and resistor ROFF on PWM off-time
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
6
48102.002
LC5200 Series
LED Drivers
Description of Operation
Current Control
PWM current control works as shown in figure 3.
• PWM On Period. During MOSFET on-time, the current runs
through the ION path (shown in red in figure 3, panel A).
• MOSFET Turn Off. During on-time, the current increases as
the red waveform in panel B, and when it reaches the VSENSE
threshold voltage, the MOSFET turns off.
• PWM Off Period. During MOSFET off-time, the back EMF
occurs on the coil and the energy which is charged on the coil
during the on-time is deenergized by the current IOFF running
through the path in blue of panel A.
Reg
3V
ION
VBB
Di
LED
Ion
Ioff
Ion
ILED
OUT
L
VREF
VSENSE
toff
SENSE
RS
Ioff
C Off
Ref
+ Comp2
VRef
I
O
OUT
Gate Driver
Logic
Sen
RS
GND
Figure 4. Current Control Circuit
VRef
VSen
Comp2
OUT
Valid
Invalid
Valid
VToff
Comp1
-IN
Comp1
OUT
ON
OFF
A
Figure 3. Output current control circuit
Q
Blank Pulse
-
GND
(A)
S
+
6V
OUT
VSENSE
Comp1
R
Comp2
IOFF
-
Toff
• MOSFET Turn On. After the fixed off-time, which is set by the
external capacitor and resistor at the Toff pin, the MOSFET turns
on again, and repeats the above operations.
Figure 4 shows the current control circuit and figure 5 shows the
timing diagram of that circuit. When the MOSFET turns on, both
the load current and VSen, across the sensing resistor RS, increase.
Comp2 compares VSen and VRef and its output is inverted at VSen
> VRef (see point A in figure 5). This resets the latter RS latch and
it results in turning off the MOSFET after the signal goes through
several logic circuits. At the same time, Coff at the Toff pin is discharged by the internal MOS switch, and when the Comp1 inverting input (linked to the Toff pin) voltage becomes lower than 2 V,
Comp1 output is inverted and it sets the RS latch. This turns off
the MOS switch and initiates the charging process of Coff by Roff.
Coff voltage (Toff pin) increases by it and when its voltage reaches
3 V, Comp1 output becomes high and it turns on the MOSFET
(point B in figure 5). The Blank Pulse circuit creates periods that
mask surge or ringing noise, from turn off edge to just after the
turn on edge, for securing proper PWM operation.
2V
R Off
Toff
ON
OFF
B
(B)
Figure 5. Current Control Circuit Timing Chart
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
7
48102.002
LED Drivers
LC5200 Series
LED Current Setting and Dimming
Output current level can be set using two alternative methods:
• Internal PWM Control. The LC5200 series provides fixed offtime PWM current control operation, allowing implementation
of an LED constant-current control circuit with only a small
quantity of external components.
The output current is calculated by the formula below:
IO = VREF / RS
Based on this formula, there are two methods of LED current
control available:
▫ Analog control, varying the REF pin voltage as shown in
figure 6, panel A)
▫ PWM integrated control, inputting external PWM signal
through a low pass filter (LPF) and connecting the output to the
REF pin (figure 6, panel B)
In either method, the TOFF pin voltage is used to turn the
MOSFET on or off, therefore, the circuit in figure 6, panel C
also works to adjust the output current by the external signal. In
this application, when the external small signal MOSFET turns
on, LC5200 stops an output pulse.
• External PWM Control. In this method of control, the LC5200
allows direct on/off control of the MOSFET, for synchronizing PWM operation among LED arrays or for other reasons.
With this method, a pull-up shunt is connected from the REF
pin to the regulator output as shown figure 7. The capacitor and
resistor are removed from the TOFF pin, and instead the PWM
signal is input to the TOFF pin. Note that for this method, the
internal peak current control is disabled; therefore, it requires
an external current control circuit for constant current operation. However, overcurrent protection is still in active to protect
the LC5200 and LEDs from excessive current. The TOFF pin
threshold has hysteresis characteristics: from < 2 V to MOSFET
off, and from > 3 V to MOSFET on. Therefore, use 5 V CMOS
compatible input for the control.
REG
ROFF
REG
R1
TOFF
REF
COFF
ROFF
LC5200
GND
PWM
SENSE
R2
TOFF
REF
LPF
RLPF
RS
LC5200
CLPF
GND
SENSE
COFF
(A) Analog control
RS
(B) Integrated PWM control
REG
ROFF
R1
PWM
Internal PWM Truth Table
TOFF
REF GND SENSE
MOSFET
COFF
LC5200
R2
RS
PWM
OUT
Low
Low (ON)
High
High (OFF)
z100 Hz
(C) External signal on TOFF pin
Figure 6. Implementations of internal PWM control
REG
LC5200
REF
PWM
TOFF
GND
External PWM Truth Table
SENSE
RS
TOFF
OUT
Low < 2 V
High (OFF)
High > 3 V
Low (ON)
Figure 7. Implementation of external PWM control
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
8
48102.002
LED Drivers
LC5200 Series
About TRIAC Dimming Control (Phase Control)
Commonly used TRIAC dimmers are designed for mainly resistive loads and they require TRIAC holding current for proper
phase controls. LC5200 series does not respond to this type of
dimmers because it does not have function to create the holding
current during phase off period.
Power Factor Improvement
Making the LED current proportional to the AC input voltage
improves the power factor, and it can be realized using LC5200
series REF pin function. Figure 8 shows the application circuit.
There is no AC rectification capacitor, and R2 and R3 divide the
AC voltage to create a proportional low voltage as the AC voltage
vBB
Optional
clamp diode
for the REF pin. This way, LED current follows the AC voltage
shape and improves the power factor. In case the REF voltage
fluctuates widely, place a clamp diode in parallel with R2 to protect the REF pin. In that case, the REF voltage becomes distorted
(lower waveform in figure 8) and could cause the power factor to
decrease.
Figure 9 shows actual waveforms of the operation. Panel A shows
operation with fixed REF pin voltage, and panel B shows operation with AC proportional REF pin voltage. For both operations,
there is no AC rectification capacitor used. The yellow waveform is the AC input current, and the black waveform is a 2 kHz
low pass filtered waveform. In panel B, the current forms a sine
waveform, which means the power factor is improved.
PF improved
VBB
R3
vREF
R2
vBB
LC5200
REF
GND
VF
vRef
vRef
Figure 8. Power factor improvement circuit
PF loss with clamping
R2
vBB
R2 R3
VBB
VBB
IAC after
2 kHz LPF
IAC after
2 kHz LPF
ILED
ILED
Fixed VREF, PF = 49.1%
AC proportional voltage, PF = 82.9%
Figure 9. Power factor improvement operating waveforms: 100 VAC, 5 white LEDs in series, average LED current 0.5 A; black trace: AC input current IAC
after 2 kHz low pass filter = 500 mA/ div.; red trace: IAC after 2 kHz low pass filter = 200 mA/ div.
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
9
48102.002
LED Drivers
LC5200 Series
Thermal Design
150
ΔT
ΔT[͠]
100
D
2×P
7
=
j-a
×P D
=60
Tj-c
Δ
50
0
0
0.5
1
1.5
2
PD[W]
MOSFET On Voltage versus Drain Current
2
1.5
VDS[V]
210
05
5
LC
2
C5
L
1
0.5
0
0
0.2
0.4
0.6
0.8
1
1.2
ID[A]
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
10
48102.002
LED Drivers
LC5200 Series
WARNING — These devices are designed to be operated at lethal voltages and energy levels. Circuit designs
that embody these components must conform with applicable safety requirements. Precautions must be
taken to prevent accidental contact with power-line potentials. Do not connect grounded test equipment.
The use of an isolation transformer is recommended during circuit development and breadboarding.
Because reliability can be affected adversely by improper storage
environments and handling methods, please observe the following
cautions.
Cautions for Storage
•
Ensure that storage conditions comply with the standard
temperature (5°C to 35°C) and the standard relative humidity
(around 40 to 75%); avoid storage locations that experience
extreme changes in temperature or humidity.
•
Avoid locations where dust or harmful gases are present and
avoid direct sunlight.
•
Reinspect for rust on leads and solderability of products that have
been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other
standard test periods, protect the products from power surges
from the testing device, shorts between adjacent products, and
shorts to the heatsink.
Remarks About Using Silicone Grease with a Heatsink
• When silicone grease is used in mounting this product on a
heatsink, it shall be applied evenly and thinly. If more silicone
grease than required is applied, it may produce stress.
• Coat the back surface of the product and both surfaces of the
insulating plate to improve heat transfer between the product and
the heatsink.
• Volatile-type silicone greases may permeate the product and
produce cracks after long periods of time, resulting in reduced
heat radiation effect, and possibly shortening the lifetime of the
product.
• Our recommended silicone greases for heat radiation purposes,
which will not cause any adverse effect on the product life, are
indicated below:
Type
Suppliers
G746
Shin-Etsu Chemical Co., Ltd.
YG6260
Momentive Performance Materials
SC102
Dow Corning Toray Silicone Co., Ltd.
Heatsink Mounting Method
•
Torque When Tightening Mounting Screws. Thermal resistance
increases when tightening torque is low, and radiation effects are
decreased. When the torque is too high, the screw can strip, the
heatsink can be deformed, and distortion can arise in the product frame.
To avoid these problems, observe the recommended tightening torques
for this product package type, TO-3P (MT-100): 0.686 to 0.882 N•m (7
to 9 kgf•cm).
•
Diameter of Heatsink Hole: < 4 mm. The deflection of the press mold
when making the hole may cause the case material to crack at the joint
with the heatsink. Please pay special attention for this effect.
Soldering
•
When soldering the products, please be sure to minimize the
working time, within the following limits:
260±5°C 10 s
350±5°C
•
3s
Soldering iron should be at a distance of at least 1.5 mm from the
body of the products
Electrostatic Discharge
•
When handling the products, operator must be grounded.
Grounded wrist straps worn should have at least 1 MΩ of
resistance to ground to prevent shock hazard.
•
Workbenches where the products are handled should be
grounded and be provided with conductive table and floor mats.
•
When using measuring equipment such as a curve tracer, the
equipment should be grounded.
•
When soldering the products, the head of soldering irons or the
solder bath must be grounded in other to prevent leak voltages
generated by them from being applied to the products.
•
The products should always be stored and transported in our
shipping containers or conductive containers, or be wrapped in
aluminum foil.
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
11
48102.002
LC5200 Series
Package Drawing, DIP-7 (DIP-8)
LED Drivers
SKx y z D
{|}~
Dimensions in MM
Terminal treatment: Ni plating and solder plating (Pb-free)
Marking
Position
Contents
Indication
①
The last digit of the year
0 to 9
②
The Month
1 to 9,O,N,D
③
The Week
1 to 3
④
Sanken Registration Number
alphanumeric characters
⑤
⑥
⑦
Appearance: The body shall be clean and shall not bear any stain, rust or flaw.
Marking: The type number and lot number shall be clearly marked by laser so that cannot be erased easily.
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
12
48102.002
LED Drivers
LC5200 Series
Packing Specifications
Minimum type of packing: Stick
Capacity:50pcs per stick
Dimensions in millimeters
Direction of parts insertion
Plugs with tab
Plugs without tab
50 pcs
Packing style
Stick Packing 1 (Inner box)
Capacity:50 Sticks per box
Dimensions in millimeters
Stick Packing 2 (Outer Box)
Capacity:4 inner boxes per outer box
(Maximum quantity of Products:10,000 pcs.)
Dimensions in millimeters
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
13
48102.002
LED Drivers
LC5200 Series
Application and operation examples described in this document are quoted for the
sole purpose of reference for the use of the products herein and neither Sanken
nor Allegro can assume any responsibility for any infringement of industrial
property rights, intellectual property rights or any other rights of Sanken or any
third party which may result from its use.
Cautions and Warnings
Terminal connection
To avoid malfunction, terminals of this IC should not be left open.
When using the products herein, the applicability and suitability of such products
for the intended purpose shall be reviewed at the user’s responsibility.
Operation of the protection circuit
Although Sanken undertakes to enhance the quality and reliability of its products,
the occurrence of failure and defect of semiconductor products at a certain rate is
inevitable.
(OCP,TSD)
This product has two protection circuits (OCP and TSD). These protection circuits
work by detecting excessive applied to the driver. Therefore, these function are
not able to protect if the power exceeds the tolerance of the driver.
Handling
When static electricity is a problem, care should be taken to properly control
the room humidity, especially in the winter when static electricity is most
troublesome.
IC
Care should be taken with device leads and with assembly sequence to avoid
applying static charges to IC leads. PC board pins should be shorted together to
keep them at the same potential to avoid this kind of trouble.
Cautions for Storage
Ensure that storage conditions comply with the standard temperature (5°C to
35°C) and the standard relative humidity (approximately 40% to 75%) and avoid
storage locations that experience extreme changes in temperature or humidity.
Users of Sanken products are requested to take, at their own risk, preventative
measures including safety design of the equipment or systems against any
possible injury, death, fires or damages to the society due to device failure or
malfunction.
Sanken products listed in this document are designed and intended for the use
as components in general purpose electronic equipment or apparatus (home
appliances, office equipment, telecommunication equipment, measuring
equipment, etc.).
When considering the use of Sanken products in the applications where higher
reliability is required (transportation equipment and its control systems, traffic
signal control systems or equipment, fire/crime alarm systems, various safety
devices, etc.), please contact your nearest Sanken or Allegro sales representative
to discuss and obtain written confirmation of your spec ifications.
The use of Sanken products without the written consent of Sanken in the
applications where extremely high reliability is required (aerospace equipment,
nuclear power control systems, life support systems, etc.) is strictly prohibited.
Anti radioactive ray design is not considered for the products listed herein.
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
14
48102.002
LED Drivers
LC5200 Series
The products described herein are manufactured in Japan by Sanken Electric Co., Ltd. for sale by Allegro MicroSystems, Inc.
Sanken and Allegro reserve the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Therefore, the user is cautioned to verify that the information in this
publication is current before placing any order.
When using the products described herein, the applicability and suitability of such products for the intended purpose shall be reviewed at the users
responsibility.
Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products
at a certain rate is inevitable.
Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems
against any possible injury, death, fires or damages to society due to device failure or malfunction.
Sanken products listed in this publication are designed and intended for use as components in general-purpose electronic equipment or apparatus
(home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Their use in any application requiring radiation
hardness assurance (e.g., aerospace equipment) is not supported.
When considering the use of Sanken products in applications where higher reliability is required (transportation equipment and its control systems
or equipment, fire- or burglar-alarm systems, various safety devices, etc.), contact a company sales representative to discuss and obtain written
confirmation of your specifications.
The use of Sanken products without the written consent of Sanken in applications where extremely high reliability is required (aerospace equipment, nuclear power-control stations, life-support systems, etc.) is strictly prohibited.
The information included herein is believed to be accurate and reliable. Application and operation examples described in this publication are
given for reference only and Sanken and Allegro assume no responsibility for any infringement of industrial property rights, intellectual property
rights, or any other rights of Sanken or Allegro or any third party that may result from its use.
Anti radioactive ray design is not considered for the products listed herein.
Copyright © 2009 Allegro MicroSystems, Inc.
This datasheet is based on Sanken datasheet SSE-23014
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
15
48102.002