TI SN74AUP1T34

SN74AUP1T34
www.ti.com
SCES841B – JUNE 2012 – REVISED JULY 2012
1-Bit Unidirectional Voltage-Level Translator
Check for Samples: SN74AUP1T34
FEATURES
1
•
•
•
•
•
•
•
•
•
Wide Operating VCC Range of 0.9 V to 3.6 V
Balanced Propagation Delays: tPLH = tPHL (1.8 V
to 3.3 V Translation Typical)
Low Static-Power Consumption, 5 µA Max ICC
±6 mA Output Drive at 3 V
Ioff Supports Partial Power-Down-Mode
Operation
Input Hysteresis Allows Slow Input Transition
and Better Switching Noise Immunity at Input
ESD Protection Exceeds JESD 22
5000-V Human-Body Model (A114-A)
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
DCK PACKAGE
(TOP VIEW)
VCCA
1
A
2
GND
3
5
VCCB
4
B
DRY PACKAGE
(TOP THROUGH VIEW)
VCCA
1
6
VCCB
A
2
5
NC
GND
3
4
B
DSF PACKAGE
(TOP THROUGH VIEW)
VCCA
1
6
VCCB
A
2
5
NC
GND
3
4
B
DESCRIPTION
The SN74AUP1T34 is a 1-bit non-inverting translator that uses two separate configurable power-supply rails. The
A port is designed to track VCCA. VCCA accepts supply voltages from 0.9 V to 3.6 V. The B port is designed to
track VCCB. VCCB accepts supply voltages from 0.9 V to 3.6 V. This allows for low-voltage bidirectional
translation between 1-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes. The SN74AUP1T34 is also fully
specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing
damaging current backflow through the device when it is powered down.
ORDERING INFORMATION (1)
TA
–40°C to 85°C
(1)
(2)
PACKAGE (2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
DCK – SOT23
Reel of 3000
SN74AUP1T34DCKR
U2E
DRY – MicroQFN
Reel of 5000
SN74AUP1T34DRYR
U2
DSF – MicroQFN
Reel of 5000
SN74AUP1T34DSFR
U2
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
SN74AUP1T34
SCES841B – JUNE 2012 – REVISED JULY 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
PIN FUNCTIONS
PIN
FUNCTION
VCCA
Input Port DC Power Supply
VCCB
Output Port DC Power Supply
GND
Ground
An
Input Port
Bn
Output Port
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
VCCA,
VCCB
Supply voltage range
VI
Input voltage range
Voltage range applied to any output in the high-impedance or power-off state
VO
Voltage range applied to any output in the high or low state
MIN
MAX
–0.3
4.0
–0.5
4.6
–0.5
4.6
–0.5
4.6
–0.5
4.6
–0.5
4.6
–0.5
4.6
–0.5
4.6
UNIT
V
V
V
V
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
150
°C
Continuous current through VCCA or GND
Tstg
Storage temperature range
–65
RECOMMENDED OPERATING CONDITIONS
VCCA
VCCA,
VCCB
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
Δt/Δv
Input transition rise or fall rate
TA
Operating free-air temperature
2
VCCB
MIN
MAX
0.9
3.6
0.9 to 1.95V
0.9 to 1.95V
0.65 x VCCA
2.3 to 2.7V
0.9 to 3.6V
1.6
3.0 to 3.6V
0.9 to 3.6V
2
0.9 V
0.9 to 1.95V
0.3 x VCCA
0.9 to 1.95V
0.35 x VCCA
2.3 to 2.7V
0.9 to 3.6V
0.7
3.0 to 3.6V
0.9 to 3.6V
0.9
3.0 to 3.6V
0.9 to 3.6V
Submit Documentation Feedback
V
V
1 to 1.95V
–40
UNIT
V
200
ns/V
85
°C
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): SN74AUP1T34
SN74AUP1T34
www.ti.com
SCES841B – JUNE 2012 – REVISED JULY 2012
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
VCCA
VCCB
IOH = –100 µA
0.9 V to 3.6 V
0.9 V to 3.6 V
VCCB – 0.2
IOH = –0.25 mA
0.9 V 1V
0.9 V 1V
0.75 x VCCB
IOH = –1.5 mA
VOH
1.2 V
1.0
1.65 V
1.32
IOH = –3 mA
2.3 V
2.3 V
1.9
IOH = –6 mA
3V
3V
2.72
IOL = 100 µA
0.9 V to 3.6 V
0.9 V to 3.6 V
IOL = 0.25 mA
0.9 V 1V
0.9 V 1V
IOL = 1.5 mA
1.2 V
1.2 V
0.3 x VCCB
1.65 V
1.65 V
0.31
IOL = 3 mA
2.3 V
2.3 V
0.31
IOL = 6 mA
3V
3V
0.31
0.9 V to 3.6 V
0.9 V to 3.6 V
±1
0V
0 V to 3.6 V
±5
0 V to 3.6 V
0V
±5
3.6 V
3.6 V
±5
0.9 V to 3.6 V
0.9 V to 3.6 V
5
0.9 V to 3.6 V
VCCA
2
0V
0 V to 3.6 V
1
VI = VIH
VI = VIL
VI = VCCA or GND
Ioff
A or B port
VI or VO = 0 to 3.6 V
IOZ
A or B port
VO = VCCO or GND,
VI = VCCI or GND, OE = VIH
ICCA
MAX
1.2 V
IOL = 2 mA
Control inputs
MIN
1.65 V
IOH = –2 mA
VOL
II
TEST CONDITIONS
VI = VCCI or GND, IO = 0
ICCB
VI = VCCI or GND, IO = 0
ICCA + ICCB
VI = VCCI or GND, IO = 0
V
0.1
0.1
0 V to 3.6 V
0V
1
0.9 V to 3.6 V
0.9 V to 3.6 V
5
0.9 V to 3.6 V
VCCA
2
0V
0 V to 3.6 V
1
0 V to 3.6 V
0V
0.9 V to 3.6 V
0.9 V to 3.6 V
UNIT
V
µA
µA
µA
µA
µA
1
5.2
µA
Ci
Control inputs
VI = 3.3 V or GND
3.3 V
3.3 V
4
pF
Cio
A or B port
VO = 3.3 V or GND
0V
3.3 V
7
pF
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Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): SN74AUP1T34
3
SN74AUP1T34
SCES841B – JUNE 2012 – REVISED JULY 2012
www.ti.com
AC ELECTRICAL CHARACTERISTICS
PARAMETER
tPLH/tPHL
tPLH/tPHL
tPLH/tPHL
tPLH/tPHL
4
CL
VCCA
5 pF
0.9V
5 pF
1.2V
5 pF
5 pF
VCCB = 0.9 V
TYP
MAX
25
VCCB = 1.2 V
TYP
MAX
18
VCCB = 1.65 V
TYP
MAX
16.2
VCCB = 2.3 V
TYP
MAX
16.3
VCCB = 3 V
TYP
MAX
16.8
42.5
24.9
23.2
22.6
22.5
1.65V
40
10.7
8.84
8.08
7.88
2.3V
41.3
8.02
5.73
4.92
4.2
5 pF
3V
42.5
7.61
4.5
3.65
3.39
10 pF
0.9V
10 pF
1.2V
43.22
12.33
9.57
8.81
8.61
10 pF
1.65V
40.44
9.21
6.57
5.5
4.73
10 pF
2.3V
41.56
8.3
5.54
4.42
4.01
10 pF
3V
42.81
7.87
4.55
3.8
15 pF
0.9V
15 pF
1.2V
43.87
12.98
10.3
9.54
9.34
15 pF
1.65V
40.78
9.59
6.95
5.87
5.07
15 pF
2.3V
41.79
8.55
5.8
4.68
4.27
15 pF
3V
43.09
8.16
4.84
4.09
3.65
30 pF
0.9V
30 pF
1.2V
45.65
14.76
12.37
11.61
11.41
30 pF
1.65V
41.72
10.65
8.01
6.94
5.99
30 pF
2.3V
42.44
9.26
6.51
5.39
4.97
30 pF
3V
43.69
8.8
5.48
4.72
4.28
28.9
19.8
30.6
17.9
21.6
32.1
18.0
19.6
21.3
ns
3.36
20.3
18
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ns
18.5
19.7
18.7
UNIT
ns
18.3
ns
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): SN74AUP1T34
SN74AUP1T34
www.ti.com
SCES841B – JUNE 2012 – REVISED JULY 2012
VCC
Pulse
Generator
DUT
CL
RL
Figure 1. AC (Progagation Delay) Test Circuit
SPACER
TEST
tPLH, tPHL
CL = 5 pF, 10 pF, 15 pF, 30 pF or equivalent (includes probe and jig capacitance)
RL = 1 MΩ or equivalent
ZOUT of pulse generator = 50 Ω
VIH
Vm
Input (An)
Vm
0V
tPLH
tPLH
Vm
Output(Bn)
VOH
Vm
VOL
NOTE: tR = tF = 2.0 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
Figure 2. Waveform 1 - Propagation Delays
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Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): SN74AUP1T34
5
SN74AUP1T34
SCES841B – JUNE 2012 – REVISED JULY 2012
www.ti.com
REVISION HISTORY
Changes from Revision A (June 2012) to Revision B
•
6
Page
Removed Feature: Output Enable Feature Allows User to Disable Outputs to Reduce Power Consumption. ................... 1
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Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): SN74AUP1T34
PACKAGE OPTION ADDENDUM
www.ti.com
23-Aug-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
SN74AUP1T34DCKR
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74AUP1T34DRYR
ACTIVE
SON
DRY
6
5000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74AUP1T34DSFR
ACTIVE
SON
DSF
6
5000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(3)
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Aug-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
2.5
1.2
4.0
8.0
Q3
SN74AUP1T34DCKR
SC70
DCK
5
3000
178.0
9.0
2.4
SN74AUP1T34DRYR
SON
DRY
6
5000
180.0
9.5
1.15
1.6
0.75
4.0
8.0
Q1
SN74AUP1T34DSFR
SON
DSF
6
5000
180.0
9.5
1.16
1.16
0.5
4.0
8.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Aug-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74AUP1T34DCKR
SC70
DCK
5
3000
180.0
180.0
18.0
SN74AUP1T34DRYR
SON
DRY
6
5000
180.0
180.0
30.0
SN74AUP1T34DSFR
SON
DSF
6
5000
180.0
180.0
30.0
Pack Materials-Page 2
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