TXS03121 www.ti.com ...................................................................................................................................................... SCES680A – JULY 2007 – REVISED JANUARY 2009 COMPARATOR WITH OUTPUT VOLTAGE-LEVEL TRANSLATION FEATURES 1 • • • • • • Low Supply Current: 8 µA (Max) Supply Voltage: 2.5 V to 5.5 V Output FET Provides Down Translation Small Package: SOT-563 Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Performance – 2500-V Human-Body Model (JESD-A114E) – 250-V Machine Model (EIA/JESD A115-A) – 1500-V Charged-Device Model (JESD22-C101-A Level III) DRL PACKAGE (TOP VIEW) V+ 1 6 S +IN 2 5 D –IN 3 4 GND DESCRIPTION/ORDERING INFORMATION The TXS03121 is a comparator designed for battery monitoring applications. It can be operated with a voltage of 2.5 V to 5.5 V. The reference voltage is applied to the –IN terminal, whereas the voltage to be monitored is connected to +IN. When the voltage at +IN is greater than the voltage at –IN, the output FET is turned On. When the voltage at +IN is less than the voltage at –IN, the output FET is turned Off. The source (S) of the output FET can be connected to 1.1 V to 3.6 V, which allows the output signal to be level translated to another voltage value. The voltage at V+ must be greater than or equal to the voltage at S. The voltage at S must be greater than or equal to the voltage at D (V+ ≥ VS ≥ VD). ORDERING INFORMATION TA –40°C to 85°C (1) (2) PACKAGE (1) (2) SOT-563 – DRL Tape and reel ORDERABLE PART NUMBER TXS03121DRLR TOP-SIDE MARKING 2FR For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007–2009, Texas Instruments Incorporated TXS03121 SCES680A – JULY 2007 – REVISED JANUARY 2009 ...................................................................................................................................................... www.ti.com APPLICATION BLOCK DIAGRAM V+ = 5.5 V Input to Monitor S + T1 – Ref D GND PIN ASSIGNMENTS 2 NO. NAME 1 V+ Comparator supply voltage DESCRIPTION 2 +IN Comparator positive input 3 –IN Comparator negative input 4 GND 5 D Drain of output FET 6 S Source of output FET Ground Submit Documentation Feedback Copyright © 2007–2009, Texas Instruments Incorporated Product Folder Link(s): TXS03121 TXS03121 www.ti.com ...................................................................................................................................................... SCES680A – JULY 2007 – REVISED JANUARY 2009 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX V+ Supply voltage range (2) –0.5 6.5 V +IN, –IN Input voltage range –0.5 6.5 V IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current (On-state switch current) –50 mA Continuous current through V+ or GND θJA Package thermal impedance (3) Tstg Storage temperature range (1) (2) (3) DRL package UNIT ±100 mA 171.6 °C/W 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN MAX V+ Comparator supply voltage 2.5 5.5 V VS, VD (1) Output FET source or drain voltage 1.1 3.6 V TA Operating free-air temperature –40 85 °C (1) UNIT V+ must be greater than or equal to VS, and VS must be greater than or equal to VD (V+ ≥ VS ≥ VD). Submit Documentation Feedback Copyright © 2007–2009, Texas Instruments Incorporated Product Folder Link(s): TXS03121 3 TXS03121 SCES680A – JULY 2007 – REVISED JANUARY 2009 ...................................................................................................................................................... www.ti.com COMPARATOR ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VOS Input offset voltage V+ = 2.5 V to 5.5 V VCM Common-mode voltage range V+ = 2.5 V to 5.5 V I+IN Input leakage current V+ = 2.5 V to 5.5 V I+ Supply current V+ = 2.5 V to 5.5 V CIN Capacitance of +IN, –IN pins I–IN 4 VCM = 0.8 V, IO = 0 VCM = V+, IO = 0 MIN TYP MAX –10 0.5 10 mV V+ V 0.5 µA 8 µA 2.5 pF 0.8 V+IN = 0 V to V+ V–IN = 0 V to V+ 2 Submit Documentation Feedback UNIT Copyright © 2007–2009, Texas Instruments Incorporated Product Folder Link(s): TXS03121 TXS03121 www.ti.com ...................................................................................................................................................... SCES680A – JULY 2007 – REVISED JANUARY 2009 OUTPUT FET ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT IDS(ON) On leakage current VS = 1.1 V to 3.6 V, Switch ON 0.5 µA IDS(OFF) Off leakage current VS = 1.1 V to 3.6 V, VD = Open, Switch OFF 0.5 µA C(ON) On capacitance C(OFF) Off capacitance, S and D terminals rON On resistance of output FET V+ ≥ VS, ID = -100 µA V–IN = 0.8 V, VS = 1.65 V 20-mV overdrive V–IN = V+, VS = 1.65 V V-IN = 0.8 V, VS = 1.65 V 50-mV overdrive tEN Enable time V–IN = 0.8 V, VS = 1.65 V 100-mV overdrive V–IN = V+, VS = 1.65 V V–IN = 0.8 V, VS = 1.65 V 20-mV overdrive V–IN = V+, VS = 1.65 V V–IN = 0.8 V, VS = 1.65 V 50-mV overdrive tDIS Disable time V–IN = V+, VS = 1.65 V V–IN = 0.8 V, VS = 1.65 V 100-mV overdrive V–IN = V+, VS = 1.65 V 5.1 6 pF 1.5 3.4 5 pF VS = 1.1 V 150 VS = 1.4 V 65 VS = 1.65 V 61 VS = 2.3 V 50 VS = 3 V 44 V+ = 4.5 V 1.7 V+ = 3 V 3.9 V+ = 4.5 V 3.9 V+ = 4.5 V 1.2 V+ = 3 V 2.7 V+ = 2.5 V 6.2 1 V+ = 3 V 2.4 V+ = 2.5 V 5.3 V+ = 4.5 V 0.8 V+ = 3 V 1.4 V+ = 2.5 V 5 V+ = 4.5 V 0.7 V+ = 3 V 1.3 V+ = 2.5 V 4.7 V+ = 4.5 V 4.4 V+ = 3 V 12 V+ = 4.5 V 3.5 V+ = 3 V 6.1 V+ = 4.5 V 4.1 V+ = 3 V 9.6 V+ = 2.5 V 5.3 V+ = 4.5 V 2.5 V+ = 3 V 3.2 V+ = 2.5 V 5.2 V+ = 4.5 V 4.6 V+ = 3 V 6.7 V+ = 2.5 V 5.2 V+ = 4.5 V 1.9 V+ = 3 V 2.8 V+ = 2.3 V 4.9 Submit Documentation Feedback Copyright © 2007–2009, Texas Instruments Incorporated Product Folder Link(s): TXS03121 Ω 1 V+ = 3 V V+ = 4.5 V V–IN = V+, VS = 1.65 V 4 µs µs 5 TXS03121 SCES680A – JULY 2007 – REVISED JANUARY 2009 ...................................................................................................................................................... www.ti.com PARAMETER MEASUREMENT INFORMATION S +IN + –IN – D 50 pF 10 kW Overdrive voltage Voltage applied to –IN Overdrive voltage Voltage applied to +IN VS – 0.3 V VS VS/2 Voltage observed at D 0V tEN 6 tDIS Submit Documentation Feedback Copyright © 2007–2009, Texas Instruments Incorporated Product Folder Link(s): TXS03121 PACKAGE OPTION ADDENDUM www.ti.com 15-May-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TXS03121DRLR ACTIVE SOT DRL 6 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TXS03121DRLRG4 ACTIVE SOT DRL 6 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 15-May-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device TXS03121DRLR Package Package Pins Type Drawing SOT DRL 6 SPQ Reel Reel Diameter Width (mm) W1 (mm) 4000 180.0 9.2 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 1.78 1.78 0.69 4.0 W Pin1 (mm) Quadrant 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 15-May-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TXS03121DRLR SOT DRL 6 4000 202.0 201.0 28.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DLP® Products www.dlp.com Communications and Telecom www.ti.com/communications DSP dsp.ti.com Computers and Peripherals www.ti.com/computers Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps Interface interface.ti.com Energy www.ti.com/energy Logic logic.ti.com Industrial www.ti.com/industrial Power Mgmt power.ti.com Medical www.ti.com/medical Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Space, Avionics & Defense www.ti.com/space-avionics-defense RF/IF and ZigBee® Solutions www.ti.com/lprf Video and Imaging www.ti.com/video Wireless www.ti.com/wireless-apps Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2010, Texas Instruments Incorporated