Datasheet AS1367 150mA, Adaptive Low Drop-Out Linear Regulator 1 General Description 2 Key Features The AS1367 is a precise, low noise, high speed, low dropout regulator with adaptive operation. Features included are high ripple rejection and low dropout voltage, a reference voltage source, an error amplifier and a current limiter. ! Low Dropout Voltage: 110mV @ 150mA load ! Operating Input Voltage Range: 2.0V to 5.5V ! Output Voltage Range: 1.2V to 5.0V (50mV steps) ! Max. Output Current: 150mA The AS1367 provides high speed operation, low power consumption and high efficiency by automatically switching between a light load and a heavy load mode depending upon the output current level. ! Low Shutdown Current: 100nA ! High PSRR: 60dB @ 10kHz ! Integrated Overtemperature/Overcurrent Protection ! Under-Voltage Lockout Feature ! Chip Enable Input ! Power-OK ! Low Quiescent Current: 10µA ! Low Output Noise: 15µV @ 100kHz Bandwidth ! Operating Temperature Range: -40°C to +85°C ! 8-pin TDFN 2x2 Package The EN function enables the output to be turned off, while the electric charge at the output capacitor is discharged via the internal auto-discharge resistance, and as a result the VOUT pin quickly returns to the GND level. Furthermore a Bypass Pin is included to reduce noise. The device features integrate short-circuit and over current protection. Under-Voltage lockout prevents erratic operation when the input voltage is slowly decaying. Thermal Protection shuts down the device when die temperature reaches 160°C. This is a useful protection when the device is under sustained short circuit conditions. 3 Applications The AS1367 is ideal for cellular phones, cordless phones, wireless communication equipment, portable games, cameras, video recorders, portable audio-video equipment and personal digital assistants. The device is available in a 8-pin TDFN 2x2 package. Figure 1. AS1367 - Typical Application Diagram Input 2V to 5.5V CIN 1µF Output 1.2V to 5.0V OUT IN AS1367 IN COUT 3.3µF RPU 100kΩ POK CBYP 10nF ON / OFF www.austriamicrosystems.com EN BYP GND SET Revision 1.02 1 - 14 AS1367 Datasheet - P i n A s s i g n m e n t s 4 Pin Assignments Figure 2. Pin Assignments (Top View) OUT 1 BYP 2 8 IN AS1367 SET 3 EN 4 7 IN 6 POK Exposed Pad 5 GND Pin Descriptions Table 1. Pin Descriptions Pin Name OUT BYP SET EN GND POK IN GND Pin Number Description Regulated Output Voltage. The current flowing out of this pin is equivalent to a DC load current. Fixed 1.2, 1.5, 1.8, 3.0, 3.3 and 4.5V output, as well as 1 versions from 1.2V up to 5.0V can be ordered. Bypass this pin with 3.3µF to GND. 2 Bypass. This pin should be connected via a 10nF capacitor to pin OUT. Set Input. Connect to GND for preset output. Connect to a resistive voltage3 divider between OUT and GND to set the output voltage between 1.2V and 5.0V. Active-High Enable Input. A logic low reduces the supply current to < 1µA. 4 Connect this pin to pin IN for normal operation. Ground. This pin also functions as a heat sink. Solder it to a large pad or to 5 the circuit-board ground plane to maximize power dissipation. Power-OK Output. Active-low, open-drain output indicates an out-of6 regulation condition. Connect a 100kΩ pull-up resistor to pin OUT for logic levels. Leave this pin unconnected if the Power-OK feature is not used. Input Voltage. These pins should be connected to the positive terminal of 7, 8 the input capacitor. Bypass this pin with 1µF to GND. Input voltage can range from 2.0V to 5.5V. Exposed Pad. This pin also functions as a heat sink. Solder it to a large pad Exposed Pad or to the circuit-board ground plane to maximize power dissipation. Internally it is connected GND. www.austriamicrosystems.com Revision 1.02 2 - 14 AS1367 Datasheet - A b s o l u t e M a x i m u m R a t i n g s 5 Absolute Maximum Ratings Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 2. Absolute Maximum Ratings Parameter Min Max IN, POK to GND -0.3 +7 V OUT to GND -0.3 VIN + 0.3 V BYP to GND -0.3 VOUT + 0.3 V Output Short-Circuit Duration Indefinite 300 mW +85 ºC +150 ºC +140 ºC/W +150 ºC Continuous Power Dissipation Operating Temperature Range -40 Junction Temperature TJ Thermal Resistance ΘJA Storage Temperature Range Package Body Temperature www.austriamicrosystems.com -65 Typ Units Comments V +260 Revision 1.02 ºC Derate 7.1mW/ºC above +70ºC Internally limited The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/JEDEC J-STD020D “Moisture/Reflow Sensitivity Classification for non-hermetic Solid State Surface Mount Devices” 3 - 14 AS1367 Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s 6 Electrical Characteristics VIN = VOUT(NOM) + 0.5V or VIN = 2V (whichever is greater) , EN = IN, CIN = 1µF, COUT = 3.3µF, CBYP = 10nF, TAMB = 40°C to +85ºC (unless otherwise specified). Typical values are at TAMB = +25ºC. Table 3. Electrical Characteristics Symbol VIN VOUT ΔVOUT IOUT ILIM VSET ISET IQ Parameter Input Voltage Output Voltage Trimmable in 50mV steps TAMB = +25ºC, IOUT = 1mA, VOUT > 2V IOUT = 100µA to 150mA, VOUT > 2V Output Voltage Accuracy TAMB = +25ºC, IOUT = 1mA, VOUT ≤ 2V IOUT = 100µA to 150mA, VOUT ≤ 2V Maximum Output Current VOUT forced to GND Current Limit VOUT up to VIN, IOUT = 1mA SET Threshold SET = 0V SET Input Bias Current IOUT = 0mA IOUT = 100µA Quiescent Current IOUT = 150mA VIN -VOUT Dropout Voltage ΔVLNR ΔVLDR PSRR Shutdown tON IOFF VIH VIL Conditions 1 Line Regulation 3.0V < VOUT, IOUT = 150mA Typ 180 100 Max 5.5 5.0 1 2.5 20 50 10 10 15 150 100 16 20 30 110 200 Unit V V % mV mA mA mV nA µA mV 2 %/V 0.06 0.001 0.01 % / mA VIN = (VOUT(NOM) + 0.5V) to 5.5V, IOUT = 1mA 0.02 IOUT = 100µA to 150mA VIN = (VOUT(NOM) + 0.5V) to 5.5V within 10µs, Dynamic Line Transient IOUT = 1mA Dynamic Load Transient IOUT = 1mA to 150mA within 10µs Output Noise Voltage IOUT = 10mA, f = 100Hz to 100kHz IOUT = 10mA, f = 1kHz Output Voltage Power- IOUT = 10mA, f = 10kHz Supply Rejection Ratio IOUT = 10mA, f = 100kHz 17 12 15 75 60 52 mV 50 mV µVRMS dB 3 4 EN Exit Delay Shutdown Supply Current IOUT = 0mA EN = 0V 0.1 EN = 0V, IOUT = 0mA IOUT = 0mA, VOUTRISING IOUT = 0mA, VOUTFALLING POK Output Low Voltage POK sinking 1mA, EN = 0V POK Leakage Current VOUT in regulation www.austriamicrosystems.com µs 1 µA 0.4 Power-OK Voltage Threshold SET Threshold Voltage Set Input Bias Current 500 1.4 Enable Input Threshold Autodischarge Resistance Power-OK Output VOL IPOK SET VSET ISET 50 -100 Load Regulation RSHDN VPOK Min 2.0 1.2 -1 -2.5 -20 -50 150 VOUT to VIN SET = 0V 94 3 1 50 -100 Revision 1.02 Ω 740 90 100 V 97.5 % VOUT 0.3 100 V nA 150 100 mV nA 4 - 14 AS1367 Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s Table 3. Electrical Characteristics (Continued) Symbol Parameter Thermal Protection Thermal Shutdown TSHDN Temperature Thermal Shutdown ΔTSHDN Hysteresis Conditions Min Typ Max Unit 160 ºC 20 ºC 1. Dropout voltage = VIN - VOUT when VOUT is 100mV < VOUT for VIN = VOUT(NOM) + 0.5V (applies only to nominal output voltages ≥ 2.5V). 2. Guaranteed by design. 3. The rise and fall time of the shutdown signal must not exceed 1ms. 4. The delay time is defined as time required to set VOUT to 95% of its final nominal value. Note: All limits are guaranteed. The parameters with min and max values are guaranteed with production tests or SQC (Statistical Quality Control) methods. www.austriamicrosystems.com Revision 1.02 5 - 14 AS1367 Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s 7 Typical Operating Characteristics VOUT = 3.3V, IOUT = 10mA, TAMB = +25°C (unless otherwise specified); Figure 4. Output Voltage vs. Input Voltage 3.38 3.5 3.36 3 3.34 Output Voltage (V) Output Voltage (V) Figure 3. Output Voltage vs. Output Current 3.32 3.3 3.28 3.26 2.5 2 1.5 1 0.5 3.24 0 3.22 0.1 1 10 100 1.5 1000 2 2.5 3 3.5 4 4.5 5 5.5 Input Voltage (V) Output Current (mA) Figure 5. Output Voltage vs. Temperature Figure 6. No Load Battery Current vs. Input Voltage 50 3.38 Battery Current (µA) Output Voltage (V) 3.36 3.34 3.32 3.3 3.28 3.26 40 30 20 10 3.24 3.22 -40 0 -20 0 20 40 60 1.5 80 2 2.5 Temperature (°C) 3 3.5 4 4.5 5 5.5 Input Voltage (V) Figure 7. Quiescent Current vs. Output Current Figure 8. Quiescent Current vs. Input Voltage 16 100 no l oad l oad = 150mA Quiescent Current (µA) Quiescent Current (µA) 14 12 10 8 6 4 80 60 40 20 2 0 0 0.1 1 10 100 1000 Output Current (mA) www.austriamicrosystems.com 2 2.5 3 3.5 4 4.5 5 5.5 Input Voltage (V) Revision 1.02 6 - 14 AS1367 Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s Figure 9. PSRR vs. Frequency 100 90 PSRR (dB) 80 70 60 50 40 Iout = 100µA Iout = 1mA 30 Iout = 10mA 20 100 1000 10000 100000 Frequency (Hz) 20mV/DIV VIN VOUT 20mV/DIV VIN 500mV/Div Figure 13. Line Transient Response; VIN = 3.8V to 4.1V, IOUT = 100mA 200mV/Div Figure 12. Line Transient Response; VIN = 3.8V to 4.1V, IOUT = 100mA VOUT 1V/DIV EN VOUT EN VOUT 1V/DIV 20µs/Div 100µs/Div 1ms/Div www.austriamicrosystems.com 1V/Div Figure 11. Startup; VIN = 3.8V, IOUT = 100mA 1V/Div Figure 10. Startup; VIN = 3.8V, IOUT = 100mA 200µs/Div Revision 1.02 7 - 14 AS1367 Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s 100mA/DIV VOUT IOUT VOUT IOUT 100mA/DIV 10µs/Div 200µs/Div www.austriamicrosystems.com 20mV/Div Figure 15. Load Transient Response; VIN = 3.8V, IOUT = 1mA to 100mA 10mV/Div Figure 14. Load Transient Response; VIN = 3.8V, IOUT = 1mA to 100mA Revision 1.02 8 - 14 AS1367 Datasheet - D e t a i l e d D e s c r i p t i o n 8 Detailed Description The AS1367 is low-dropout, low-quiescent-current linear regulator intended for LDO regulator applications where output current load requirements range from no load to 150mA. All devices come standard with adjustable output voltages of 1.2V to 5.0V and fixed output voltages (see Ordering Information on page 13). The AS1367 also features a Power-OK output to indicate when the output is within 6% of final value, and also an Enable pin. Shutdown current for the whole regulator is typically 10nA. The device features integrated short-circuit and over current protection. Under-Voltage lockout prevents erratic operation when the input voltage is slowly decaying (e.g. in a battery powered application). Thermal Protection shuts down the device when die temperature reaches 160°C. This is a useful protection when the device is under sustained short circuit conditions. As illustrated in Figure 16, the devices comprise a reference, error amplifier, P-channel MOSFET pass transistor, Power-OK detect logic, internal voltage divider, current limiter, reverse-battery protection, thermal sensor and shutdown logic. The bandgap reference is connected to the inverting input of the error amplifier. The error amplifier compares this reference with the feedback voltage and amplifies the difference. If the feedback voltage is lower than the reference voltage, the P-channel MOSFET gate is pulled lower, allowing more current to pass to the output, and increases the output voltage. If the feedback voltage is too high, the pass-transistor gate is pulled up, allowing less current to pass to the output. The output voltage feeds back through an internal resistor voltage divider connected to pin OUT. Figure 16. AS1367 - Block Diagram IN EN AS1367 ReverseBattery Protection Thermal Overload Protection Shutdown/ Power-On Control Logic Error Amplifier OUT + Bandgap Voltage & Current Reference Trimmable Reference Voltage POK Power-OK Compare Logic NMOS GND Output Voltages Standard products are factory-set with output voltages from 1.2V to 5.0V. A two-digit suffix of the part number identifies the nominal output (see Ordering Information on page 13). Non-standard devices are available. For more information contact: http://www.austriamicrosystems.com/contact-us www.austriamicrosystems.com Revision 1.02 9 - 14 AS1367 Datasheet - D e t a i l e d D e s c r i p t i o n Power-OK The AS1367’s power-ok is built around an N-channel MOSFET. The circuitry monitors the voltage on pin SET and if the voltage goes out of regulation (e.g. during dropout, current limit, or thermal shutdown) the pin POK goes low. If the pin SET is connected to GND an internal resistive-divider is activated and connected to the output. Therefore, the PowerOK functionality can be realised with no additional external components. The Power-OK feature is not active during shutdown and provides a power-on-reset function that can operate down to VIN = 2.0V. A capacitor to GND may be added to generate a power-on-reset delay. To obtain a logic-level output, connect a pull-up resistor from pin POK to pin OUT. Larger values for this resistor will help to minimize current consumption; a 100kΩ resistor is perfect for most applications (see Figure 1 on page 1). Current Limiting The AS1367 include current limiting circuitry to protect against short-circuit conditions. The circuitry monitors and controls the gate voltage of the P-channel MOSFET, typically limiting the output current to 180mA. The P-channel MOSFET output can be shorted to ground for an indefinite period of time without damaging the device. Thermal-Overload Protection The devices are protected against thermal runaway conditions by the integrated thermal sensor circuitry. Thermal shutdown is an effective tool to prevent die overheating since the power transistor is the principle heat source in the device. If the junction temperature exceeds 160ºC with 20ºC hysteresis, the thermal sensor starts the shutdown logic, at which point the P-channel MOSFET is switched off. After the device temperature has dropped by approximately 20ºC, the thermal sensor will turn the P-channel MOSFET on again. Note that this will be exhibited as a pulsed output under continuous thermal-overload conditions. Note: The absolute maximum junction-temperature of +150ºC should not be exceeding during continual operation. Operating Region and Power Dissipation Maximum power dissipation is determined by the thermal resistance of the package and circuit board, the temperature difference between the die junction and the ambient air and the rate of the air flow. The power dissipation of the device is calculated by: P = I OUT × ( V IN – V OUT ) (EQ 1) T J – T AMB P MAX = ------------------------θ JA (EQ 2) Maximum power dissipation is calculated by: Where: TJ - TAMB is the temperature difference between the device die junction and the surrounding air. θJA is the thermal resistance through the circuit board, copper traces, and other materials to the surrounding. Note: Pin GND is a multi-function pin providing a connection to the system ground and acting as a heat sink. This pin should be connected to the system ground using a large pad or a ground plane. www.austriamicrosystems.com Revision 1.02 10 - 14 AS1367 Datasheet - A p p l i c a t i o n I n f o r m a t i o n 9 Application Information Capacitor Selection and Regulator Stability Ceramic capacitors are highly recommended as they offer distinct advantages over their tantalum and aluminum electrolytic components. For stable operation with load currents up to the maximum over the entire device temperature range, use a 3.3µF (min) ceramic output capacitor with an ESR <0.2Ω. Use large output capacitor values (10µF max) to reduce noise and improve load transient-response, stability and power-supply rejection. Note: Some ceramic capacitors exhibit large capacitance and ESR variations with variations in temperature. Z5U and Y5V capacitors may be required to ensure stability at temperatures below TAMB = -10ºC. With X7R or X5R capacitors, a 3.3µF capacitor should be sufficient at all operating temperatures. Power Supply Rejection Ratio The AS1367 are designed to deliver low dropout voltages and low quiescent currents. Power-supply rejection is typically 60dB at 10kHz. To improve power supply-noise rejection and transient response, increase the values of the input and output bypass capacitors. The Electrical Characteristics on page 4 show also the device line- and load-transient responses. For further details see the Power-Supply Rejection Ratio vs. Frequency graph in the Figure 9 on page 7. Dropout Voltage For standard products with output voltage greater than the minimum VIN (1.2V), the minimum input-output voltage differential (dropout voltage) determines the lowest usable supply voltage. This determines the useful end-of-life battery voltage in battery-powered systems. The dropout voltage is a function of the P-MOSFET drain-to-source onresistance multiplied by the load current, and it is calculated by: V DROPOUT = V IN – V OUT = R DS ( ON ) × I OUT (EQ 3) Where: RDS(ON) is the drain-to-source on-resistance. IOUT is the output current. Figure 17. Application Diagrams External Voltage Level Detection Internal Voltage Level Detection (Input Monitoring) (Output Monitoring) Input 2V to 5.5V Output 1.2V to 5.0V OUT IN CIN 1µF AS1367 IN ON / OFF RADJ RPU 100kΩ COUT 3.3µF Input 2V to 5.5V Output 1.2V to 5.0V OUT IN CIN 1µF AS1367 POK IN EN BYP GND SET COUT 3.3µF POK CBYP 10nF ON / OFF RPU 100kΩ CBYP 10nF EN BYP GND SET 270kΩ www.austriamicrosystems.com Revision 1.02 11 - 14 AS1367 Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s 10 Package Drawings and Markings The device is available in a 8-pin TDFN package. Figure 18. 8-pin TDFN 2x2 Package Diagram D A e b L B bbb C A B PIN#1 ID INDEX AREA 2x TOP VIEW k (D/2xE/2) aaa C INDEX AREA aaa C 2x E E2 (D/2xE/2) D2 A1 A A3 BOTTOM VIEW ccc C C SEATING PLANE 0.08 C SIDE VIEW Table 4. 8-pin TDFN 2x2 package Dimensions Symbol Min Typ A 0.51 0.55 A1 0.00 0.02 A3 0.15 REF 0.18 0.25 b 0.50 e aaa 0.15 bbb 0.10 ccc 0.10 Max 0.60 0.05 0.30 Symbol D BSC E BSC D2 E2 L k ND N Min 1.45 0.75 0.225 0.20 Typ 2.00 2.00 1.60 0.90 0.325 Max 1.70 1.00 0.425 4 8 Note: 1. 2. 3. 4. 5. Figure 18 is shown for illustration only. Dimensioning and tolerancing conform to ASME Y14.5M-1994. All dimensions are in millimeters, angle is in degrees (°). N is the total number of terminals. The location of the terminal #1 identifier and terminal numbering convention conforms to JEDEC publication 95 SPP-002. 6. ND and NE refer to the number of terminals on each D and E side respectively. 7. Dimension b applies to metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. If the terminal has the optional radius on the other end of the terminal, the dimension B should not be measured in that radius area. 8. Coplanarity applies to the terminals and all other bottom surface metallization. www.austriamicrosystems.com Revision 1.02 12 - 14 AS1367 Datasheet - O r d e r i n g I n f o r m a t i o n 11 Ordering Information The device is available as the standard products listed in Table 5. Table 5. Ordering Information Ordering Code AS1367-BTDT-12 Marking AB AS1367-BTDT-18 AC AS1367-BTDT-30 AS1367-BTDT-33 AS1367-BTDT-45 Output 1.2V Description 150mA, Adaptive LDO Delivery Form Tape and Reel Package 8-pin TDFN 2x2 1.8V 150mA, Adaptive LDO Tape and Reel 8-pin TDFN 2x2 AD 3.0V 150mA, Adaptive LDO Tape and Reel 8-pin TDFN 2x2 AE 3.3V 150mA, Adaptive LDO Tape and Reel 8-pin TDFN 2x2 AF 4.5V 150mA, Adaptive LDO Tape and Reel 8-pin TDFN 2x2 Non-standard devices from 1.2V to 5.0V are available in 50mV steps. For more information and inquiries contact http://www.austriamicrosystems.com/contact Note: All products are RoHS compliant and Pb-free. Buy our products or get free samples online at ICdirect: http://www.austriamicrosystems.com/ICdirect For further information and requests, please contact us mailto:[email protected] or find your local distributor at http://www.austriamicrosystems.com/distributor www.austriamicrosystems.com Revision 1.02 13 - 14 AS1367 Datasheet Copyrights Copyright © 1997-2009, austriamicrosystems AG, Tobelbaderstrasse 30, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered ®. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. All products and companies mentioned are trademarks or registered trademarks of their respective companies. Disclaimer Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. austriamicrosystems AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by austriamicrosystems AG for each application. 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Contact Information Headquarters austriamicrosystems AG Tobelbaderstrasse 30 A-8141 Unterpremstaetten, Austria Tel: +43 (0) 3136 500 0 Fax: +43 (0) 3136 525 01 For Sales Offices, Distributors and Representatives, please visit: http://www.austriamicrosystems.com/contact www.austriamicrosystems.com Revision 1.02 14 - 14