APL5910 1A, Ultra Low Dropout (0.12V Typical) Linear Regulator General Description Features • • • • • • Ultra Low Dropout - 0.12V (Typical) at 1A Output Current The APL5910 is a 1A ultra low dropout linear regulator. The IC needs two supply voltages, one is a control volt- 0.8V Reference Voltage age (VCNTL) for the control circuitry, the other is a main supply voltage (VIN) for power conversion, to reduce power High Output Accuracy - ±1.5% over Line, Load, and Temperature Range dissipation and provide extremely low dropout voltage. The APL5910 integrates many functions. A Power-On- Fast Transient Response Reset (POR) circuit monitors both supply voltages on VCNTL and VIN pins to prevent erroneous operations. Adjustable Output Voltage The functions of thermal shutdown and current-limit protect the device against thermal and current over-loads. A Power-On-Reset Monitoring on Both VCNTL and VIN Pins • • • • • • • • POK indicates that the output voltage status with a delay time set internally. It can control other converter for power Internal Soft-Start Current-Limit and Short Current-Limit Protections sequence. The APL5910 can be enabled by other power systems. Pulling and holding the EN voltage below 0.4V Thermal Shutdown with Hysteresis Open-Drain VOUT Voltage Indicator (POK) shuts off the output. The APL5910 is available in a SOP-8P package which Low Shutdown Quiescent Current (< 30µA ) features small size as SOP-8 and an Exposed Pad to reduce the junction-to-case resistance to extend power Shutdown/Enable Control Function Simple SOP-8P Package with Exposed Pad range of applications. Lead Free and Green Devices Available (RoHS Compliant) Simplified Application Circuit Applications • • • Motherboards, VGA Cards VCNTL Notebook PCs Add-in Cards VIN VCNTL Pin Configuration POK VIN POK VOUT VOUT APL5910 POK EN VIN VCNTL 8 7 6 5 1 2 3 4 GND FB VOUT NC EN Enable EN FB GND Optional SOP-8P (Top View) = Exposed Pad (connected to ground plane for better heat dissipation) ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.2 - Aug., 2008 1 www.anpec.com.tw APL5910 Ordering and Marking Information Package Code KA : SOP-8P Operating Ambient Temperature Range I : -40 to 85 °C Handling Code TR : Tape & Reel Assembly Material L : Lead Free Device G : Halogen and Lead Free Device APL5910 Assembly Material Handling Code Temperature Range Package Code APL5910 XXXXX APL5910 KA : XXXXX - Date Code Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Absolute Maximum Ratings Symbol VCNTL VIN VOUT Parameter Rating Unit VCNTL Supply Voltage (VCNTL to GND) -0.3 ~ 6 V VIN Supply Voltage (VIN to GND) -0.3 ~ 6 V -0.3 ~ VIN+0.3 V VOUT to GND Voltage POK to GND Voltage -0.3 ~ 7 EN, FB to GND Voltage -0.3 ~ VCNTL+0.3 V PD Power Dissipation Internally Limited W TJ Maximum Junction Temperature TSTG Storage Temperature Range TSDR Maximum Lead Soldering Temperature, 10 Seconds 150 ο -65 ~ 150 ο 260 ο C C C Thermal Characteristics Symbol θJA θJC Parameter Typical Value Junction-to-Ambient Resistance in Free Air (Note 1) SOP-8P Junction-to-Case Resistance in Free Air (Note 2) SOP-8P Unit 50 o 20 o C/W C/W Note 1: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. Note 2: The “Thermal-Pad Temperature” is measured on the PCB copper area connected to the thermal pad of package. 1 8 2 7 3 4 5 6 Measured Point PCB Copper Copyright ANPEC Electronics Corp. Rev. A.2 - Aug., 2008 2 www.anpec.com.tw APL5910 Recommended Operating Conditions Symbol VCNTL Parameter Range Unit 3.0 ~ 5.5 V 1.0 ~ 5.5 V 0.8 ~ VIN - VDROP V VCNTL Supply Voltage VIN VIN Supply Voltage VOUT VOUT Output Voltage (when VCNTL-VOUT>1.4V) IOUT VOUT Output Current R2 FB to GND IOUT=1A at 25% nominal VOUT COUT VOUT Output Capacitance ESRCOUT TA TJ 0~1 A 1k ~ 24k Ω 8 ~ 600 IOUT=0.5A at 25% nominal VOUT 8 ~ 900 IOUT=0.25A at 25% nominal VOUT 8 ~ 1100 µF ESR of VOUT Output Capacitor 0 ~ 200 Ambient Temperature -40 ~ 85 ο -40 ~ 125 ο Junction Temperature mΩ C C Electrical Characteristics Refer to the typical application circuits. These specifications apply over VCNTL=5V, VIN=1.5V, VOUT=1.2V, and TA= -40 ~ 85oC, unless otherwise specified. Typical values are at TJ=25oC. Symbol Parameter APL5910 Test Conditions Min. Typ. Max. Unit SUPPLY CURRENT IVCNTL ISD VCNTL Supply Current EN = VCNTL, IOUT=0A - 1.0 1.5 mA VCNTL Supply Current at Shutdown EN = GND - 20 30 µA VIN Supply Current at Shutdown EN = GND, VIN=5.5V - - 1 µA 2.5 2.7 2.9 V - 0.4 - V 0.8 0.9 1.0 - 0.5 - V 0.792 0.8 0.808 V -1.5 - +1.5 % - 0.06 0.15 % POWER-ON-RESET (POR) Rising VCNTL POR Threshold VCNTL POR Hysteresis Rising VIN POR Threshold VIN POR Hysteresis OUTPUT VOLTAGE VREF Reference Voltage FB=VOUT, IOUT=10mA,TJ=25oC o Output Voltage Accuracy IOUT= 0~1A, TJ= -40~125 C Load Regulation IOUT=0A ~1A Line Regulation IOUT=10mA, VCNTL= 3.0 ~ 5.5V -0.15 - +0.15 %/V VOUT Pull-Low Resistance VCNTL=3.3V,VEN=0V, VOUT<0.8V - 85 - Ω FB Input Current VFB=0.8V -100 - 100 nA TJ=25oC - 0.13 0.16 TJ=-40~125oC - - 0.22 TJ=25 C - 0.12 0.15 TJ=-40~125oC - - 0.20 TJ=25oC - 0.12 0.14 TJ=-40~125oC - - 0.19 DROPOUT VOLTAGES VOUT=2.5V VDROP VIN-to-VOUT Dropout Voltage VCNTL=4.5V, IOUT=1A o VOUT=1.8V VOUT=1.2V Copyright ANPEC Electronics Corp. Rev. A.2 - Aug., 2008 3 V www.anpec.com.tw APL5910 Electrical Characteristics (Cont.) Refer to the typical application circuits. These specifications apply over VCNTL=5V, VIN=1.5V, VOUT=1.2V, and TA= -40 ~ 85oC, unless otherwise specified. Typical values are at TJ=25oC. Symbol Parameter APL5910 Test Conditions Min. Typ. Max. Unit PROTECTIONS ILIM TJ=25οC 1.7 2.1 2.5 1.4 - - - 0.4 - 0.6 1.6 - ms Thermal Shutdown Temperature TJ rising - 170 - o Thermal Shutdown Hysteresis - 50 - o 0.5 0.8 1.1 V - 80 - mV Current-Limit Level ο TJ= -40 ~ 125 C ISHORT TSD Short Current-Limit Level VFB<0.2V Short Current-Limit Blanking Time From beginning of soft-start A C C ENABLE AND SOFT-START EN Logic High Threshold Voltage VEN rising EN Hysteresis EN Pull-High Current TSS EN=GND Soft-Start Interval - 5 - µA 0.3 0.6 1 ms 90 92 94 % POWER-OK AND DELAY VTHPOK Rising POK Threshold Voltage VFB rising POK Threshold Hysteresis - 8 - % POK sinks 5mA - 0.25 0.4 V POK Debounce Interval VFB<falling POK voltage threshold - 10 - µs POK Delay Time From VFB =VTHPOK to rising edge of the VPOK 1 2 4 ms POK Pull-Low Voltage Pin Description PIN FUNCTION NO. NAME 1 POK Power-OK signal output pin. This pin is an open-drain output used to indicate the status of output voltage by sensing FB voltage. This pin is pulled low when output voltage is not within the Power-OK voltage window. 2 EN Active-high enable control pin. Applying and holding the voltage on this pin below the enable voltage threshold shuts down the output. When re-enabled, the IC undergoes a new soft-start process. When left this pin open, an internal pull-up current (5µA typical) pulls the EN voltage and enables the regulator. 3 VIN Main supply input pin for voltage conversions. A decoupling capacitor (≥10µF recommended) is usually connected near this pin to filter the voltage noise and improve transient response. The voltage on this pin is monitored for Power-On-Reset purpose 4 VCNTL Bias voltage input pin for internal control circuitry. Connect this pin to a voltage source (+5V recommended). A decoupling capacitor (1µF typical) is usually connected near this pin to filter the voltage noise. The voltage at this pin is monitored for Power-On-Reset purpose. 5 NC 6 VOUT Output pin of the regulator. Connecting this pin to load and output capacitors (10µF at least) is required for stability and improving transient response. The output voltage is programmed by the resistor-divider connected to FB pin. The VOUT can provide 1A (max.) load current to loads. During shutdown, the output voltage is quickly discharged by an internal pull-low MOSFET. 7 FB Voltage Feedback Pin. Connecting this pin to an external resistor divider receives the feedback voltage of the regulator. No Connection. Copyright ANPEC Electronics Corp. Rev. A.2 - Aug., 2008 4 www.anpec.com.tw APL5910 Pin Description (Cont.) PIN NO. NAME 8 GND Exposed Pad - FUNCTION Ground pin of the circuitry. All voltage levels are measured with respect to this pin. P-Type Substrate connection of the chip. Connect this pad to system ground plane for good thermal conductivity. Block Diagram VCNTL Thermal Shutdown VCNTL PowerOn-Reset (POR) POR 5µA Enable EN 0.8V Control Logic and Soft-Start POR VIN VOUT Error Amplifier Dela y Current-Limit and Short Current-Limit 90% VREF ISEN PWOK VREF 0.8V Enabl e Soft-Start POK GND FB Typical Application Circuit VCNTL (+5V is preferred) CCNTL 1µF VIN 4 R3 5.1kΩ 1 POK VIN POK +1.5V CIN 10µF VCNTL VOUT 3 6 VOUT +1.2V / 1A EN 2 Enable APL5910 EN FB 7 GND 8 R2 24kΩ R1 12kΩ COUT 10µF (X5R/X7R Recommended) C1 Optional (X5R/X7R Recommended) 10µF: GRM31MR60J106KE19 Murata Copyright ANPEC Electronics Corp. Rev. A.2 - Aug., 2008 5 www.anpec.com.tw APL5910 Typical Operating Characteristics Short Current-Limit vs. Junction Temperature Current-Limit vs. Junction Temperature 2.5 600 Current-Limit, ILIM (A) 2.3 Short Current-Limit, ISHORT (mA) VOUT = 1.2V 2.4 VCNTL = 5V 2.2 2.1 2.0 1.9 VCNTL = 3.3V 1.8 1.7 1.6 1.5 550 500 VCNTL = 3.3V 450 400 350 VCNTL = 5V 300 250 200 1.4 -50 -25 0 25 50 75 100 125 -50 Dropout Voltage vs. Output Current 25 50 75 100 125 Droput Voltage vs. Output Current 200 180 VCNTL = 5V VOUT = 1.2V 160 TJ = 125° C 140 TJ = 75° C 120 TJ = 25° C 100 VCNTL = 3.3V VOUT = 1.2V 180 Dropout Voltage, VDROP (mV) Dropout Voltage, VDROP (mV) 0 Junction Temperature (oC) Junction Temperature (oC) 80 TJ = 0° C 60 40 TJ = - 40° C 20 TJ = 125° C 160 140 TJ = 75° C TJ = 25° C 120 100 80 TJ = 0° C 60 40 TJ = - 40° C 20 0 0 0 0.25 0.5 0.75 0 1 0.25 0.5 0.75 Output Current, IOUT (A) Output Current, IOUT (A) Dropout Voltage vs. Output Current Dropout Voltage vs. Output Current 200 1 220 VCNTL = 5V VOUT = 1.8V TJ = 125° C 160 TJ = 75° C 140 TJ = 25° C 120 VCNTL = 3.3V VOUT = 1.8V 200 Dropout Voltage, VDROP (mV) 180 Dropout Voltage, VDROP (mV) -25 100 80 60 TJ = 0° C 40 TJ = - 40° C 20 180 TJ = 125° C TJ = 75° C 160 140 TJ = 25° C 120 100 80 TJ = 0° C 60 TJ = - 40° C 40 20 0 0 0 0.25 0.5 0.75 0 1 Output Current, IOUT (A) Copyright ANPEC Electronics Corp. Rev. A.2 - Aug., 2008 0.25 0.5 0.75 1 Output Current, IOUT (A) 6 www.anpec.com.tw APL5910 Typical Operating Characteristics (Cont.) Dropout Voltage vs. Output Current Reference Voltage vs. Junction Temperature 220 0.808 Dropout Voltage, VDROP (mV) 180 Reference Voltage, VREF (V) VCNTL = 5V VOUT = 2.5V 200 TJ = 125° C 160 TJ = 75° C 140 TJ = 25° C 120 100 80 60 TJ = 0° C 40 0 0 0.5 0.25 0.804 0.802 0.800 0.798 0.796 0.794 TJ = - 40° C 20 0.806 0.75 0.792 -50 1 -25 VCNTL Power Supply Rejection Ratio (PSRR) 0 Power Supply Rejection Ratio (dB) Power Supply Rejection Ratio (dB) VCNTL=4.6~5.4V VIN=1.5V VOUT=1.2V IOUT=1A CIN=COUT=10µF -30 -40 -50 -60 -70 -80 1000 10000 100000 75 100 125 -10 -20 VCNTL=5V VIN=1.55V VINPK-PK=100mV VOUT=1.2V IOUT=1A COUT=10µF -30 -40 -50 -60 -70 1000 1000000 Frequency (Hz) Copyright ANPEC Electronics Corp. Rev. A.2 - Aug., 2008 50 VIN Power Supply Rejection Ratio (PSRR) 0 -20 25 Junction Temperature (oC) Output Current, IOUT (A) -10 0 10000 100000 1000000 Frequency (Hz) 7 www.anpec.com.tw APL5910 Operating Waveforms Refer to the typical application circuit. The test condition is VIN=1.5V, VCNTL=5V, VOUT=1.2V, TA= 25oC unless otherwise specified. Power Off Power On 1 VCNTL VCNTL 1 VIN VIN 2 2 VOUT VOUT 3 4 3 VPOK VPOK 4 COUT=10µF, CIN=10µF, RL=1.2Ω CH1: VCNTL, 5V/Div, DC CH2: VIN, 1V/Div, DC CH3: VOUT, 1V/Div, DC CH4: VPOK, 5V/Div, DC TIME: 5ms/Div COUT=10µF, CIN=10µF, RL=1.2Ω CH1: VCNTL, 5V/Div, DC CH2: VIN, 1V/Div, DC CH3: VOUT, 1V/Div, DC CH4: VPOK, 5V/Div, DC TIME: 10ms/Div Load Transient Response Over Current Protection VOUT 1 VOUT 1 IOUT IOUT 4 4 IOUT=10mA to 1A to 10mA (rise / fall time = 1µs) COUT=10µF, CIN=10µF CH1: VOUT, 20mV/Div, AC CH4: IOUT, 0.5A/Div, DC TIME: 20µs/Div Copyright ANPEC Electronics Corp. Rev. A.2 - Aug., 2008 COUT=10µF, CIN=10µF, IOUT=1A to 2.3A CH1: VOUT, 1V/Div, DC CH4: IOUT, 1A/Div, DC TIME: 50µs/Div 8 www.anpec.com.tw APL5910 Operating Waveforms (Cont.) Refer to the typical application circuit. The test condition is VIN=1.5V, VCNTL=5V, VOUT=1.2V, TA= 25oC unless otherwise specified. Enable Shutdown VEN VEN 1 1 VOUT VOUT 2 2 VPOK VPOK 3 3 IOUT IOUT 4 4 COUT=10µF, CIN=10µF, RL=1.2Ω CH1: VEN, 5V/Div, DC CH2: VOUT, 1V/Div, DC CH3: VPOK, 5V/Div, DC CH4: IOUT, 1.0A/Div, DC TIME: 10µs/Div Copyright ANPEC Electronics Corp. Rev. A.2 - Aug., 2008 COUT=10µF, CIN=10µF, RL=1.2Ω CH1: VEN, 5V/Div, DC CH2: VOUT, 1V/Div, DC CH3: VPOK, 5V/Div, DC CH4: IOUT, 1.0A/Div, DC TIME: 0.5ms/Div 9 www.anpec.com.tw APL5910 Function Description A Power-On-Reset (POR) circuit monitors both of supply resulting in a pulsed output during continuous thermal overload conditions. The thermal shutdown is designed voltages on VCNTL and VIN pins to prevent wrong logic controls. The POR function initiates a soft-start process with a 50oC hysteresis to lower the average junction temperature during continuous thermal overload conditions, after both of the supply voltages exceed their rising POR voltage thresholds during powering on. The POR func- extending lifetime of the device. For normal operation, the device power dissipation should tion also pulls low the POK voltage regardless of the output status when one of the supply voltages falls below be externally limited so that junction temperatures will not exceed +125οC. its falling POR voltage threshold. Enable Control Internal Soft-Start An internal soft-start function controls rise rate of the out- The APL5910 has a dedicated enable pin (EN). A logic low signal applied to this pin shuts down the output. Fol- put voltage to limit the current surge during start-up. The typical soft-start interval is about 0.6ms. lowing a shutdown, a logic high signal re-enables the output through initiation of a new soft-start cycle. When Output Voltage Regulation left open, this pin is pulled up by an internal current source (5µA typical) to enable normal operation. It’s not neces- An error amplifier working with a temperature-compen- sary to use an external transistor to save cost. sated 0.8V reference and an output NMOS regulates output to the preset voltage. The error amplifier is designed Power-OK and Delay Power-On-Reset The APL5910 indicates the status of the output voltage by with high bandwidth and DC gain provides very fast transient response and less load regulation. It compares the monitoring the feedback voltage (VFB) on FB pin. As the VFB rises and reaches the rising Power-OK voltage thresh- reference with the feedback voltage and amplifies the difference to drive the output NMOS which provides load old (VTHPOK), an internal delay function starts to work. At the end of the delay time, the IC turns off the internal NMOS of current from VIN to VOUT. the POK to indicate that the output is ok. As the VFB falls and reaches the falling Power-OK voltage threshold, the Current-Limit Protection The APL5910 monitors the current flowing through the IC turns on the NMOS of the POK (after a debounce time output NMOS and limits the maximum current to prevent load and APL5910 from damages during current over- of 10µs typical). load conditions. Short Current-Limit Protection The short current-limit function reduces the current-limit level down to 0.4A (typical) when the voltage on FB pin falls below 0.2V (typical) during current overload or shortcircuit conditions. The short current-limit function is disabled for successful start-up during soft-start interval. Thermal Shutdown A thermal shutdown circuit limits the junction temperature of APL5910. When the junction temperature exceeds +170oC, a thermal sensor turns off the output NMOS, allowing the device to cool down. The regulator regulates the output again through initiation of a new soft-start process after the junction temperature cools by 50oC, Copyright ANPEC Electronics Corp. Rev. A.2 - Aug., 2008 10 www.anpec.com.tw APL5910 Application Information Power Sequencing More capacitance reduces the variations of the supply voltage on VIN pin. The power sequencing of VIN and VCNTL is not necessary to be concerned. However, do not apply a voltage to VOUT for a long time when the main voltage applied at Setting The Output Voltage The output voltage is programmed by the resistor divider connected to FB pin. The preset output voltage is calcu- VIN is not present. The reason is the internal parasitic diode from VOUT to VIN conducts and dissipates power lated by the following equation : without protections due to the forward-voltage. R1 VOUT = 0.8 ⋅ 1 + R2 Output Capacitor ........... (V) The APL5910 requires a proper output capacitor to maintain stability and improve transient response. The output where R1 is the resistor connected from VOUT to FB with Kelvin sensing connection and R2 is the resistor con- capacitor selection is dependent upon ESR (equivalent series resistance) and capacitance of the output capacitor nected from FB to GND. A bypass capacitor (C1) may be connected with R1 in parallel to improve load transient over the operating temperature. response and stability. Ultra-low-ESR capacitors (such as ceramic chip capacitors) and low-ESR bulk capacitors (such as solid tantalum, POSCap, and Aluminum electrolytic capacitors) can all be used as output capacitors. During load transients, the output capacitors which is depending on the stepping amplitude and slew rate of load current, are used to reduce the slew rate of the current seen by the APL5910 and help the device to minimize the variations of output voltage for good transient response. For the applications with large stepping load current, the low-ESR bulk capacitors are normally recommended. Decoupling ceramic capacitors must be placed at the load and ground pins as close as possible and the impedance of the layout must be minimized. Input Capacitor The APL5910 requires proper input capacitors to supply current surge during stepping load transients to prevent the input voltage rail from dropping. Because the parasitic inductor from the voltage sources or other bulk capacitors to the VIN pin limits the slew rate of the surge currents, more parasitic inductance needs, more input capacitance. Ultra-low-ESR capacitors (such as ceramic chip capacitors) and low-ESR bulk capacitors (such as solid tantalum, POSCap, and Aluminum electrolytic capacitors can all be used as an input capacitor of VIN. For most applications, the recommended input capacitance of VIN is 10µF at least. However, if the drop of the input voltage is not cared, the input capacitance can be less than 10µF. Copyright ANPEC Electronics Corp. Rev. A.2 - Aug., 2008 11 www.anpec.com.tw APL5910 Layout Consideration (See figure 1) Thermal Consideration 1. Please solder the Exposed Pad on the system ground pad on the top-layer of PCBs. The ground pad must Refer to the figure 2, the SOP-8P is a cost-effective package featuring a small size like a standard SOP-8 and a have wide size to conduct heat into the ambient air through the system ground plane and PCB as a heat bottom exposed pad to minimize the thermal resistance of the package, being applicable to high current sink. 2. Please place the input capacitors for VIN and VCNTL applications. The exposed pad must be soldered to the top-layer ground plane. It is recommended to connect the pins near the pins as close as possible for decoupling high-frequency ripples. top-layer ground pad to the internal ground plan by using vias. The copper of the ground plane on the top-layer con- 3. Ceramic decoupling capacitors for load must be placed near the load as close as possible for ducts heat into the PCB and ambient air. Please enlarge the area of the top-layer pad and the ground plane to decoupling high-frequency ripples. 4. To place APL5910 and output capacitors near the load reduce the case-to-ambient resistance (θCA). reduces parasitic resistance and inductance for excellent load transient reponse. 5. The negative pins of the input and output capacitors and the GND pin must be connected to the ground plane of the load. 6. Large current paths, shown by bold lines on the figure 1, must have wide tracks. 7. Place the R1, R2, and C1 near the APL5910 as close as possible to avoid noise coupling. 8. Connect the ground of the R2 to the GND pin by using 1 8 2 7 SOP-8P 3 6 4 5 Internal ground plane a dedicated track. 9. Connect the one pin of the R1 to the load for Kelvin Die Exposed Pad Top ground plane Ambient Air sensing. 10. Connect one pin of the C1 to the VOUT pin for reliable PCB feedback compensation. Figure 2 VCNTL Recommanded Minimum Footprint CIN 0.024 VCNTL VIN VIN APL5910 8 7 6 5 0.072 CCNTL VOUT VOUT C1 COUT (Optional) 0.138 R2 0.118 R1 Load 0.212 FB GND Figure 1 1 2 0.050 Copyright ANPEC Electronics Corp. Rev. A.2 - Aug., 2008 12 3 4 Unit : Inch www.anpec.com.tw APL5910 Package Information SOP-8P D SEE VIEW A E E2 THERMAL PAD E1 D1 h X 45 ° c A 0.25 b L 0 GAUGE PLANE SEATING PLANE A1 A2 e VIEW A S Y M B O L SOP-8P MILLIMETERS MIN. MAX. A A1 INCHES MAX. MIN. 0.063 1.60 0.006 0.000 0.15 0.00 0.049 A2 1.25 b 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 D1 2.25 3.50 0.098 0.138 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 E2 2.00 3.00 0.079 0.118 e h 1.27 BSC 0.25 0.050 BSC 0.50 0.010 0.020 0.050 8o L 0.40 1.27 0.016 0 0o 8o 0o Note : 1. Follow JEDEC MS-012 BA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. A.2 - Aug., 2008 13 www.anpec.com.tw APL5910 Carrier Tape & Reel Dimensions P0 P2 P1 A B0 W F E1 OD0 K0 A0 A OD1 B B T SECTION A-A SECTION B-B H A d T1 Application SOP- 8P A H T1 C d 12.4+2.00 13.0+0.50 330.0±2.00 50 MIN. 1.5 MIN. -0.00 -0.20 P0 P1 P2 D0 D1 1.5+0.10 4.0±0.10 8.0±0.10 2.0±0.05 1.5 MIN. -0.00 D W E1 20.2 MIN. 12.0±0.30 1.75±0.10 F 5.5±0.05 T A0 B0 K0 0.6+0.00 6.40±0.20 5.20±0.20 2.10± 0.20 -0.40 (mm) Devices Per Unit Package Type Unit Quantity SOP- 8P Tape & Reel 2500 Copyright ANPEC Electronics Corp. Rev. A.2 - Aug., 2008 14 www.anpec.com.tw APL5910 Taping Direction Information SOP-8P USER DIRECTION OF FEED Reflow Condition (IR/Convection or VPR Reflow) tp TP Critical Zone TL to TP Temperature Ramp-up TL tL Tsmax Tsmin Ramp-down ts Preheat 25 t 25°C to Peak Time Reliability Test Program Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B, A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 Copyright ANPEC Electronics Corp. Rev. A.2 - Aug., 2008 15 Description 245°C, 5 sec 1000 Hrs Bias @125°C 168 Hrs, 100%RH, 121°C -65°C~150°C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms, 1tr > 100mA www.anpec.com.tw APL5910 Classification Reflow Profiles Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5°C of actual Peak Temperature (tp) Ramp-down Rate Sn-Pb Eutectic Assembly 3°C/second max. Pb-Free Assembly 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 217°C 60-150 seconds See table 1 See table 2 10-30 seconds 20-40 seconds 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Time 25°C to Peak Temperature Notes: All temperatures refer to topside of the package. Measured on the body surface. Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures 3 3 Package Thickness Volume mm Volume mm <350 ≥350 <2.5 mm 240 +0/-5°C 225 +0/-5°C ≥2.5 mm 225 +0/-5°C 225 +0/-5°C Table 2. Pb-free Process – Package Classification Reflow Temperatures 3 3 3 Package Thickness Volume mm Volume mm Volume mm <350 350-2000 >2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level. Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838 Copyright ANPEC Electronics Corp. Rev. A.2 - Aug., 2008 16 www.anpec.com.tw