SN74ALVCH16827 20-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES041D – JULY 1995 – REVISED SEPTEMBER 2004 FEATURES • • • • • • DGG OR DL PACKAGE (TOP VIEW) Member of the Texas Instruments Widebus™ Family EPIC™ (Enhanced-Performance Implanted CMOS) Submicron Process ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Latch-Up Performance Exceeds 250 mA Per JESD 17 Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages 1OE1 1Y1 1Y2 GND 1Y3 1Y4 VCC 1Y5 1Y6 1Y7 GND 1Y8 1Y9 1Y10 2Y1 2Y2 2Y3 GND 2Y4 2Y5 2Y6 VCC 2Y7 2Y8 GND 2Y9 2Y10 2OE1 DESCRIPTION This 20-bit noninverting buffer/driver is designed for 1.65-V to 3.6-V VCC operation. The SN74ALVCH16827 is composed of two 10-bit sections with separate output-enable signals. For either 10-bit buffer section, the two output-enable (1OE1 and 1OE2 or 2OE1 and 2OE2) inputs must both be low for the corresponding Y outputs to be active. If either output-enable input is high, the outputs of that 10-bit buffer section are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. 1 56 2 55 3 54 4 53 5 52 6 51 7 50 8 49 9 48 10 47 11 46 12 45 13 44 14 43 15 42 16 41 17 40 18 39 19 38 20 37 21 36 22 35 23 34 24 33 25 32 26 31 27 30 28 29 1OE2 1A1 1A2 GND 1A3 1A4 VCC 1A5 1A6 1A7 GND 1A8 1A9 1A10 2A1 2A2 2A3 GND 2A4 2A5 2A6 VCC 2A7 2A8 GND 2A9 2A10 2OE2 Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. The SN74ALVCH16827 is characterized for operation from -40°C to 85°C. FUNCTION TABLE (each 10-bit section) INPUTS A OUTPUT Y OE1 OE2 L L L L L L H H H X X Z X H X Z Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus, EPIC are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1995–2004, Texas Instruments Incorporated SN74ALVCH16827 20-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES041D – JULY 1995 – REVISED SEPTEMBER 2004 LOGIC SYMBOL(1) 1OE1 1OE2 2OE1 2OE2 1A1 1A2 1A3 1A4 1A5 1A6 1A7 1A8 1A9 1A10 2A1 2A2 2A3 2A4 2A5 2A6 2A7 2A8 2A9 2A10 1 & EN1 56 28 & EN2 29 55 1 2 1 54 3 52 5 51 6 49 8 48 9 47 10 45 12 44 13 43 14 42 1 15 2 41 16 40 17 38 19 37 20 36 21 34 23 33 24 31 26 30 27 1Y1 1Y2 1Y3 1Y4 1Y5 1Y6 1Y7 1Y8 1Y9 1Y10 2Y1 2Y2 2Y3 2Y4 2Y5 2Y6 2Y7 2Y8 2Y9 2Y10 (1) This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. LOGIC DIAGRAM (POSITIVE LOGIC) 1 1OE1 1OE2 1A1 28 2OE1 2OE2 56 55 2 1Y1 To Nine Other Channels 2 2A1 29 42 15 2Y1 To Nine Other Channels SN74ALVCH16827 20-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES041D – JULY 1995 – REVISED SEPTEMBER 2004 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage range -0.5 4.6 V VI Input voltage range (2) -0.5 4.6 V VO Output voltage range (2) (3) -0.5 VCC + 0.5 IIK Input clamp current VI < 0 IOK Output clamp current VO < 0 IO Continuous output current Continuous current through each VCC or GND θJA Package thermal impedance (4) Tstg Storage temperature range (1) (2) (3) (4) mA -50 mA ±50 mA ±100 mA DGG package 81 DL package 74 -65 V -50 150 °C/W °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. This value is limited to 4.6 V maximum. The package thermal impedance is calculated in accordance with JESD 51. RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage VCC = 1.65 V to 1.95 V VIH High-level input voltage MIN MAX 1.65 3.6 Low-level input voltage V 0.65 × VCC VCC = 2.3 V to 2.7 V 1.7 VCC = 2.7 V to 3.6 V 2 V 0.35 × VCC VCC = 1.65 V to 1.95 V VIL UNIT VCC = 2.3 V to 2.7 V 0.7 VCC = 2.7 V to 3.6 V 0.8 V VI Input voltage 0 VCC V VO Output voltage 0 VCC V IOH High-level output current IOL Low-level output current ∆t/∆v Input transition rise or fall rate TA Operating free-air temperature (1) VCC = 1.65 V -4 VCC = 2.3 V -12 VCC = 2.7 V -12 VCC = 3 V -24 VCC = 1.65 V 4 VCC = 2.3 V 12 VCC = 2.7 V 12 VCC = 3 V 24 -40 mA mA 10 ns/V 85 °C All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 3 SN74ALVCH16827 20-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES041D – JULY 1995 – REVISED SEPTEMBER 2004 ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = -100 µA 1.65 V to 3.6 V 1.65 V IOH = -6 mA 2.3 V 2 2.3 V 1.7 2.7 V 2.2 3V 2.4 IOH = -24 mA 3V 2 IOL = 100 µA IOH = -12 mA II(hold) 0.2 1.65 V 0.45 IOL = 6 mA 2.3 V 0.4 2.3 V 0.7 1.65 V 25 1.65 V -25 VI = 0.7 V 2.3 V 45 VI = 1.7 V 2.3 V -45 VI = 0.8 V 3V 75 3V -75 VI = VCC or GND, ∆ICC One input at VCC - 0.6 V, Other inputs at VCC or GND (1) (2) V µA µA 3.6 V ±500 3.6 V ±10 µA 3.6 V 40 µA 3 V to 3.6 V 750 µA V (2) ICC Outputs ±5 VI = 1.07 V VO = VCC or GND Co 0.55 VI = 0.58 V VI = 0 to 3.6 Data inputs 0.4 3V 3.6 V IOZ Control inputs 2.7 V VI = VCC or GND VI = 2 V Ci V 1.65 V to 3.6 V IOL = 24 mA UNIT 1.2 IOL = 4 mA IOL = 12 mA II MAX VCC - 0.2 IOH = -4 mA VOH VOL MIN TYP (1) VCC IO = 0 VI = VCC or GND 3.3 V VO = VCC or GND 3.3 V 3.5 pF 6 7.5 pF All typical values are at VCC = 3.3 V, TA = 25°C. This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another. SWITCHING CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER tpd (1) 4 FROM (INPUT) TO (OUTPUT) VCC = 1.8 V A Y (1) TYP ten OE Y (1) tdis OE Y (1) This information was not available at the time of publication. VCC = 2.5 V ± 0.2 V VCC = 2.7 V MIN MAX 1 MIN VCC = 3.3 V ± 0.3 V UNIT MAX MIN MAX 4.1 3.9 1 3.4 ns 1 6 5.7 1 4.7 ns 1.2 5.6 4.9 1.3 4.5 ns SN74ALVCH16827 20-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES041D – JULY 1995 – REVISED SEPTEMBER 2004 OPERATING CHARACTERISTICS TA = 25°C PARAMETER Cpd (1) Power dissipation capacitance Outputs enabled Outputs disabled TEST CONDITIONS CL = 50 pF, f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V TYP TYP TYP (1) 16 18 (1) 4 6 UNIT pF This information was not available at the time of publication. 5 SN74ALVCH16827 20-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES041D – JULY 1995 – REVISED SEPTEMBER 2004 PARAMETER MEASUREMENT INFORMATION VCC = 1.8 V 2 × VCC S1 1 kΩ From Output Under Test Open TEST tpd tPLZ/tPZL tPHZ/tPZH GND CL = 30 pF (see Note A) 1 kΩ S1 Open 2 × VCC GND LOAD CIRCUIT tw VCC Timing Input VCC/2 VCC/2 VCC/2 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC/2 VCC/2 0V tPLH Output Control (low-level enabling) tPLZ VCC VCC/2 VOL + 0.15 V VOL tPZH VOH VCC/2 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VCC/2 0V Output Waveform 1 S1 at 2 × VCC (see Note B) tPHL VCC/2 VCC VCC/2 tPZL VCC Input VOLTAGE WAVEFORMS PULSE DURATION th VCC Data Input VCC/2 0V 0V tsu Output VCC VCC/2 Input Output Waveform 2 S1 at GND (see Note B) tPHZ VCC/2 VOH VOH − 0.15 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 6 SN74ALVCH16827 20-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES041D – JULY 1995 – REVISED SEPTEMBER 2004 PARAMETER MEASUREMENT INFORMATION VCC = 2.5 V ± 0.2 V 2 × VCC S1 500 Ω From Output Under Test Open TEST tpd tPLZ/tPZL tPHZ/tPZH GND CL = 30 pF (see Note A) 500 Ω S1 Open 2 × VCC GND LOAD CIRCUIT tw VCC Timing Input VCC/2 VCC/2 VCC/2 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC/2 VCC/2 0V tPLH Output Control (low-level enabling) tPLZ VCC VCC/2 tPZH VOH VCC/2 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VCC/2 0V Output Waveform 1 S1 at 2 × VCC (see Note B) tPHL VCC/2 VCC VCC/2 tPZL VCC Input VOLTAGE WAVEFORMS PULSE DURATION th VCC Data Input VCC/2 0V 0V tsu Output VCC VCC/2 Input Output Waveform 2 S1 at GND (see Note B) VOL + 0.15 V VOL tPHZ VCC/2 VOH VOH − 0.15 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 2. Load Circuit and Voltage Waveforms 7 SN74ALVCH16827 20-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES041D – JULY 1995 – REVISED SEPTEMBER 2004 PARAMETER MEASUREMENT INFORMATION VCC = 2.7 V AND 3.3 V ± 0.3 V 6V S1 500 Ω From Output Under Test GND CL = 50 pF (see Note A) TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open 6V GND Open 500 Ω tw LOAD CIRCUIT 2.7 V 2.7 V Timing Input 1.5 V Input 1.5 V 0V 1.5 V 0V tsu VOLTAGE WAVEFORMS PULSE DURATION th 2.7 V Data Input 1.5 V 1.5 V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 2.7 V Output Control (low-level enabling) 1.5 V 1.5 V 0V tPZL 2.7 V Input 1.5 V 1.5 V 0V tPLH tPHL 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES 3V 1.5 V VOL + 0.3 V VOL tPZH VOH Output Output Waveform 1 S1 at 6 V (see Note B) tPLZ Output Waveform 2 S1 at GND (see Note B) tPHZ 1.5 V VOH − 0.3 V VOH 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 3. Load Circuit and Voltage Waveforms 8 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74ALVCH16827DGGRE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCH16827DGGRG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCH16827DLG4 ACTIVE SSOP DL 56 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCH16827DLRG4 ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCH16827DGGR ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCH16827DL ACTIVE SSOP DL 56 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCH16827DLR ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 20 20 Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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OTHER QUALIFIED VERSIONS OF SN74ALVCH16827 : • Enhanced Product: SN74ALVCH16827-EP NOTE: Qualified Version Definitions: • Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74ALVCH16827DGGR TSSOP SN74ALVCH16827DLR SSOP SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1 DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ALVCH16827DGGR TSSOP DGG 56 2000 346.0 346.0 41.0 SN74ALVCH16827DLR SSOP DL 56 1000 346.0 346.0 49.0 Pack Materials-Page 2 MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0°–ā8° 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. 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