SN74ALVCH162244 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES065F – JANUARY 1996 – REVISED OCTOBER 2004 FEATURES • • • • • • • DGG OR DL PACKAGE (TOP VIEW) Member of the Texas Instruments Widebus™ Family EPIC™ (Enhanced-Performance Implanted CMOS) Submicron Process Output Ports Have Equivalent 26-Ω Series Resistors, So No External Resistors Are Required ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Latch-Up Performance Exceeds 250 mA Per JESD 17 Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages 1OE 1Y1 1Y2 GND 1Y3 1Y4 VCC 2Y1 2Y2 GND 2Y3 2Y4 3Y1 3Y2 GND 3Y3 3Y4 VCC 4Y1 4Y2 GND 4Y3 4Y4 4OE NOTE: For tape-and-reel order entry, the DGGR package is abbreviated to GR. DESCRIPTION This 16-bit buffer/driver is designed for 1.65-V to 3.6-V VCC operation. The SN74ALVCH162244 is designed specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 29 21 28 22 27 23 26 24 25 2OE 1A1 1A2 GND 1A3 1A4 VCC 2A1 2A2 GND 2A3 2A4 3A1 3A2 GND 3A3 3A4 VCC 4A1 4A2 GND 4A3 4A4 3OE The device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. It provides true outputs and symmetrical active-low output-enable (OE) inputs. The outputs, which are designed to sink up to 12 mA, include equivalent 26-Ω resistors to reduce overshoot and undershoot. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. The SN74ALVCH162244 is characterized for operation from -40°C to 85°C. FUNCTION TABLE (each 4-bit buffer) INPUTS OE A OUTPUT Y L H H L L L H X Z Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus, EPIC are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1996–2004, Texas Instruments Incorporated SN74ALVCH162244 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES065F – JANUARY 1996 – REVISED OCTOBER 2004 LOGIC SYMBOL(1) 1OE 2OE 1 48 25 3OE 4OE 1A1 1A2 1A3 1A4 2A1 2A2 2A3 2A4 3A1 3A2 3A3 3A4 4A1 4A2 4A3 4A4 24 47 EN1 EN2 EN3 EN4 1 1 2 46 3 44 5 43 6 41 8 40 1 2 9 38 11 37 12 36 35 1 3 13 14 33 16 32 17 30 19 1 4 29 20 27 22 26 23 1Y1 1Y2 1Y3 1Y4 2Y1 2Y2 2Y3 2Y4 3Y1 3Y2 3Y3 3Y4 4Y1 4Y2 4Y3 4Y4 (1) This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. 2 SN74ALVCH162244 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES065F – JANUARY 1996 – REVISED OCTOBER 2004 LOGIC DIAGRAM (POSITIVE LOGIC) 1OE 1A1 1A2 1A3 1A4 2OE 2A1 2A2 2A3 2A4 1 3OE 47 2 46 3 44 5 43 6 1Y1 3A1 1Y2 3A2 1Y3 3A3 1Y4 3A4 48 4OE 41 8 40 9 38 11 37 12 2Y1 4A1 2Y2 4A2 2Y3 4A3 2Y4 4A4 25 36 13 35 14 33 16 32 17 3Y1 3Y2 3Y3 3Y4 24 30 19 29 20 27 22 26 23 4Y1 4Y2 4Y3 4Y4 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VCC MIN MAX Supply voltage range -0.5 4.6 V range (2) -0.5 4.6 V -0.5 VCC + 0.5 VI Input voltage VO Output voltage range (2) (3) IIK Input clamp current VI < 0 IOK Output clamp current VO < 0 IO Continuous output current Continuous current through each VCC or GND θJA Package thermal impedance (4) Tstg Storage temperature range (1) (2) (3) (4) V -50 mA -50 mA ±50 mA ±100 mA DGG package 89 DL package 94 -65 UNIT 150 °C/W °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. This value is limited to 4.6 V maximum. The package thermal impedance is calculated in accordance with JESD 51. 3 SN74ALVCH162244 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES065F – JANUARY 1996 – REVISED OCTOBER 2004 RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage VCC = 1.65 V to 1.95 V VIH High-level input voltage MIN MAX 1.65 3.6 Low-level input voltage VI Input voltage VO Output voltage IOH High-level output current VCC = 2.3 V to 2.7 V 1.7 VCC = 2.7 V to 3.6 V 2 Low-level output current ∆t/∆v Input transition rise or fall rate TA Operating free-air temperature VCC = 2.3 V to 2.7 V 0.7 VCC = 2.7 V to 3.6 V 0.8 4 V 0 VCC V 0 VCC V VCC = 1.65 V -2 VCC = 2.3 V -6 VCC = 2.7 V -8 mA -12 VCC = 1.65 V 2 VCC = 2.3 V 6 VCC = 2.7 V 8 VCC = 3 V (1) V 0.35 × VCC VCC = 3 V IOL V 0.65 × VCC VCC = 1.65 V to 1.95 V VIL UNIT mA 12 -40 10 ns/V 85 °C All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. SN74ALVCH162244 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES065F – JANUARY 1996 – REVISED OCTOBER 2004 ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = -100 µA VOH 1.65 V to 3.6 V 1.65 V 1.2 IOH = -4 mA 2.3 V 1.9 2.3 V 1.7 3V 2.4 IOH = -8 mA 2.7 V 2 IOH = -12 mA 3V 2 IOL = 100 µA II(hold) 1.65 V to 3.6 V 0.2 1.65 V 0.45 IOL = 4 mA 2.3 V 0.4 2.3 V 0.55 3V 0.55 IOL = 8 mA 2.7 V 0.6 IOL = 12 mA 3V 0.8 ±5 VI = VCC or GND 3.6 V VI = 0.58 V 1.65 V 25 VI = 1.07 V 1.65 V -25 VI = 0.7 V 2.3 V 45 VI = 1.7 V 2.3 V -45 VI = 0.8 V 3V 75 3V -75 VI = 2 V UNIT V IOL = 2 mA IOL = 6 mA II MAX VCC - 0.2 IOH = -2 mA IOH = -6 mA VOL MIN TYP (1) VCC V µA µA VI = 0 to 3.6 V (2) 3.6 V ±500 IOZ VO = VCC or GND 3.6 V ±10 µA ICC VI = VCC or GND, IO = 0 3.6 V 40 µA One input at VCC - 0.6 V, Other inputs at VCC or GND 750 µA ∆ICC Ci Co (1) (2) Control inputs Data inputs Outputs 3 V to 3.6 V VI = VCC or GND 3.3 V VO = VCC or GND 3.3 V 3 pF 6 7 pF All typical values are at VCC = 3.3 V, TA = 25°C. This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another. SWITCHING CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 through Figure 3) FROM (INPUT) TO (OUTPUT) VCC = 1.8 V tpd A Y ten OE PARAMETER tdis (1) OE TYP VCC = 2.5 V ± 0.2 V VCC = 2.7 V MIN MAX VCC = 3.3 V ± 0.3 V UNIT MIN MAX MIN MAX (1) 1 4.9 4.7 1 4.2 ns Y (1) 1 6.8 6.7 1 5.6 ns Y (1) 1 6.3 5.7 1 5.5 ns This information was not available at the time of publication. 5 SN74ALVCH162244 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES065F – JANUARY 1996 – REVISED OCTOBER 2004 OPERATING CHARACTERISTICS TA = 25°C PARAMETER Cpd Power dissipation capacitance (1) 6 TEST CONDITIONS Outputs enabled Outputs disabled CL = 50 pF, This information was not available at the time of publication. f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V TYP TYP TYP (1) 16 19 (1) 4 5 UNIT pF SN74ALVCH162244 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES065F – JANUARY 1996 – REVISED OCTOBER 2004 PARAMETER MEASUREMENT INFORMATION VCC = 1.8 V 2 × VCC S1 1 kΩ From Output Under Test Open TEST tpd tPLZ/tPZL tPHZ/tPZH GND CL = 30 pF (see Note A) 1 kΩ S1 Open 2 × VCC GND LOAD CIRCUIT tw VCC Timing Input VCC/2 VCC/2 VCC/2 VCC/2 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC/2 VCC/2 0V tPLH Output Control (low-level enabling) VCC/2 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES tPLZ VCC VCC/2 tPZH VOH VCC/2 0V Output Waveform 1 S1 at 2 × VCC (see Note B) tPHL VCC/2 VCC VCC/2 tPZL VCC Input VOLTAGE WAVEFORMS PULSE DURATION th VCC Data Input VCC/2 0V 0V tsu Output VCC Input Output Waveform 2 S1 at GND (see Note B) VOL + 0.15 V VOL tPHZ VCC/2 VOH VOH − 0.15 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 7 SN74ALVCH162244 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES065F – JANUARY 1996 – REVISED OCTOBER 2004 PARAMETER MEASUREMENT INFORMATION VCC = 2.5 V ± 0.2 V 2 × VCC S1 500 Ω From Output Under Test Open TEST tpd tPLZ/tPZL tPHZ/tPZH GND CL = 30 pF (see Note A) 500 Ω S1 Open 2 × VCC GND LOAD CIRCUIT tw VCC Timing Input VCC/2 VCC/2 VCC/2 VCC/2 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC/2 VCC/2 0V tPLH Output Control (low-level enabling) VCC/2 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES tPLZ VCC VCC/2 tPZH VOH VCC/2 0V Output Waveform 1 S1 at 2 × VCC (see Note B) tPHL VCC/2 VCC VCC/2 tPZL VCC Input VOLTAGE WAVEFORMS PULSE DURATION th VCC Data Input VCC/2 0V 0V tsu Output VCC Input Output Waveform 2 S1 at GND (see Note B) VOL + 0.15 V VOL tPHZ VCC/2 VOH VOH − 0.15 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 2. Load Circuit and Voltage Waveforms 8 SN74ALVCH162244 16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES065F – JANUARY 1996 – REVISED OCTOBER 2004 PARAMETER MEASUREMENT INFORMATION VCC = 2.7 V AND 3.3 V ± 0.3 V 6V S1 500 Ω From Output Under Test CL = 50 pF (see Note A) Open GND 500 Ω TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open 6V GND tw LOAD CIRCUIT 2.7 V 2.7 V Timing Input Input 1.5 V 1.5 V 1.5 V 0V 0V tsu VOLTAGE WAVEFORMS PULSE DURATION th 2.7 V Data Input 1.5 V 1.5 V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES Output Control (low-level enabling) 2.7 V 1.5 V 1.5 V 0V tPZL 2.7 V Input 1.5 V 1.5 V 0V tPLH tPHL 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES 3V 1.5 V VOL + 0.3 V VOL tPZH VOH Output Output Waveform 1 S1 at 6 V (see Note B) tPLZ Output Waveform 2 S1 at GND (see Note B) tPHZ 1.5 V VOH − 0.3 V VOH 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 3. Load Circuit and Voltage Waveforms 9 PACKAGE OPTION ADDENDUM www.ti.com 6-Aug-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74ALVCH162244DLG4 ACTIVE SSOP DL 48 74ALVCH162244DLRG4 ACTIVE SSOP DL 74ALVCH162244GRG4 ACTIVE TSSOP SN74ALVCH162244DGGR OBSOLETE SN74ALVCH162244DL ACTIVE SN74ALVCH162244DLR SN74ALVCH162244GR 25 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSSOP DGG 48 SSOP DL 48 ACTIVE SSOP DL ACTIVE TSSOP DGG TBD Call TI Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 25 Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74ALVCH162244DLR SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 SN74ALVCH162244GR TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ALVCH162244DLR SSOP DL 48 1000 346.0 346.0 49.0 SN74ALVCH162244GR TSSOP DGG 48 2000 346.0 346.0 41.0 Pack Materials-Page 2 MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0°–ā8° 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. 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