Document No.: Approval Product Specification Module name: C0201QILK-C Issue date: 2009/01/06 Version: 1.1 Customer Approved by Customer Approved by CMEL PD Division ENG Division QA Dept FOR MORE INFORMATION: AZ DISPLAYS, INC. 75 COLUMBIA, ALISO VIEJO, CA 92656 Http://www.AZDISPLAYS.com Note: 1. The information contained herein may be change without prior notice. It is therefore advisable to contact Chi MEI ELCorp before designed your product based on this specification. 1 Document No.: Reversion History Version Date Page P-Ver.1.0 P-Ver.1.1 P-Ver.1.2 2008/03/11 2008/03/12 2008/06/04 P-Ver1.3 2008/06/19 P-Ver1.4 P-Ver1.5 2008/06/20 2008/06/24 All Page17 Page3 Page17 Page18 Page19 Page12 Page13 Page12 Page19 A-Ver.10 2008/12/03 All A-Ver1.1 2009/01/06 Page2 Description Preliminary specification was first issued Modify the connector in the drawing Modify the pixel pitch size Modify the Panel drawing Add Reliability Test Add the Package drawing Modify Electro-Optical Characteristic table Modify Gamma Register Setting Modify IC Initial Register Setting Add RA condition Modify Low Temp. Operation Approval specification was first issued Modify Electro-Optical Characteristic table Add Preliminary specification reversion history 2 Document No.: 1. Purpose: This documentation defines general product specification for OLED module supplied by CMEL. The information described in this technical specification is tentative. Please Contact CMEL’s representative while your product is modified. 2. General Description: Driving Mode: Active Matrix. Color Mode: Full Color (262K color) Driver IC: S6E63D6, COG Assembly Interface: 1. MPU i80-system 18-/16-/9-/8-bit bus interface 2. MPU i68-system 18-/16-/9-/8-bit bus interface 3. Serial data transfer interface(SPI) Application: Cell phone etc.. RoHS Compatible 3. Mechanical Data: No. Items Specification Unit 1 Diagonal Size 2.0” Inch 2 Resolution 3 Pixel Pitch 176 xRGBx220 0.18×0.18 mm 4 Active Area 31.68×39.6 mm 5 Outline Area(M/F) 37.3×50.25 mm 6 Thickness 1.60 (Typ) mm 7 Weight 9.2 g 3 Document No.: 4. Absolute Maximum ratings: 4.1 Absolute ratings of environment： Item Symbol Value Min. Max. Unit Note Storage Temperature TST -40 +85 ºC (1) Operating Ambient Temperature TOP -40 +70 ºC (2) Note (1) The storage duration for both critical temperature (-40 & 85℃) meet reliability test criteria of product . (2) The operating duration for both critical temperature (-40 & 70℃) meet reliability test criteria of product. 4.2 Electrical absolute ratings： Item Symbol Unit Value Power supply voltage 1 AR_Vdd V +4.6V +/- 0.05 Power supply voltage 2 AR_Vss V -4.4V +/- 0.1 Power supply voltage 3 VCI V +2.5 ~ +3.3 Power supply voltage 4 VDD3 (IOVcc) V +1.65 ~ +3.3 4 Document No.: 5. Electrical Characteristic: 5.1 DC Characteristic 5 Document No.: 6 Document No.: 5.2 AC Characteristic 5.2.1 CPU interface M68 (VDD3=1.65 to 3.3V,TA=-40 to +85°C) 7 Document No.: 5.2.2 CPU interface M80 (VDD3=1.65 to 3.3V,TA=-40 to +85°C) 8 Document No.: Image Data format for 18bit CPU interface (262k color) Image Data format for 16bit CPU interface (65k color) Image Data format for 9bit CPU interface (262k color) Image Data format for 8bit CPU interface (65K color) Case 1: Case 2: Image Data format for 8bit CPU interface (262K color) 9 Document No.: 5.2.3 SPI (VDD3=1.65 to 3.3V,TA=-40 to +85°C) 10 Document No.: ID RS RW ID RS AW (Note) RS=”0” : Index data RS=”1” : Parameter data 11 Document No.: 6. Electro-Optical Characteristic: Items Symbol Min Typ. Max Unit Remark 2 Operating Luminance L 150 190 230 Cd/m (1)(5) Power Consumption Pon - 170 233 mW 30% pixels on (1) Max. Current Icc - - 78 mA (1) Response Time Tres - - 50 us (2) CIEx (White) Wx 0.26 0.31 0.36 - (5) CIEy( White) Wy 0.28 0.33 0.38 - (5) CIEx (Red) Rx 0.62 0.66 0.70 (5) CIEy( Red) Ry 0.30 0.34 0.38 (5) CIEx (Green) Gx 0.25 0.29 0.33 (5) CIEy( Green) Gy 0.62 0.66 0.70 (5) CIEx (Blue) Bx 0.11 0.15 0.19 (5) CIEy( Blue) By 0.12 0.16 0.20 (5) Viewing Angle VA 160 170 - Contrast CR 5000:1 10000:1 LTop 30000 Operation Lifetime Note: Measuring surrounding: dark room Surrounding temperature: 25oC IOVCC = 1.65V ~ 3.3V 1. Test condition: a. AR_VDD= 4.6V+/- 0.03V, AR_VSS= -4.4V+/- 0.03V b. IC Initial Register Setting: R01: 0x881C // Set scan line R02: 0x0000 R03: 0x0030 // 16bit mode R10: 0x0000 // IC stand by off R18: 0x0028 // Frame Rate=80Hz RF8: 0x000F // VGH=+5V RF9: 0x0019 // VGL=-7V R05: 0x0001 // Display On R35: 0x0000 // window display R36: 0x00DB // window display R37: 0x20CF // window display R20: 0x0020 // window display R21: 0x0000 // window display 12 Degree (3) (4) Hrs (1)(6) Document No.: Gamma Register Setting: （Gamma Setting Code：B） R70: 0x3300 R71: 0x3900 R72: 0x3800 R73: 0x2924 R74: 0x261C R75: 0x3125 R76: 0x271C R77: 0x352A R78: 0x2A1E 2.Response Time test condition Tf Tr 100% 90% 10% Time 3.Viewing angle test condition: Viewing Angle= CR>10 4.Contrast Luminance with all pixels white CR = Luminance with all pixels black 5.Optical tester: CA210 6. Brightness of 30% power consumption. Operating Life Time is defined when the luminance has decayed to less than 50% of the initial measured luminance before life test. 13 Document No.: 7. System Diagram: HOST S6E63D6 CSB SDIN RW_WRB(SCL) SPI interface 14 Document No.: 8. Pin Assignment: PIN 1 Symbol I/O Description AR_VDD I Positive voltage for OLED 2 AR_VSS I Nagative voltage for OLED 3 VCI I Power supply for analog circuit(2.5v~3.3v) 4 VCI1 O A reference voltage for 1st booster r(connect a 1u/10v capacitance to gnd) 5 GND I Ground 6 C12M I 7 C12P I 8 C11M I 9 C11P I 10 VLOUT1 O 11 C31P I 12 C31M I 13 C32P I 14 C32M I 15 VLOUT3 O 3rd booster output pin. (1u/16V) 16 VLOUT2 O 2nd booster output pin. (1u/16V) 17 C21P I 18 C21M I 19 FLM O 20 IOVCC I 21 SPB I 22 ID_MIB I 23 DB17 I/O 24 DB16 I/O 25 DB15 I/O 26 DB14 I/O 27 DB13 28 DB12 I/O 18-bit interface : DB 17-0 18-bit interface : DB 17-0 I/O 29 DB11 I/O 30 DB10 31 DB9 I/O Fix unused pin to the VSS level I/O 32 DB8 I/O 33 DB7 I/O External capacitance connect pin between C12M and C12P (1u/10V) External capacitance connect pin between C11M and C11P (1u/10V) 1st booster output pin. (1u/10V) External capacitance connect pin between C31M and C31P (1u/10V) External capacitance connect pin between C32M and C32P (1u/10V) External capacitance connect pin between C21M and C21P. (1u/10V) Tearing effect output signal. In normal operation, leave this pad open. I/O power supply Select the CPU interface mode. (0=parallel interface 1=serial interface) Select the CPU type (0=intel 80x-system 1=motorola 68x-system) BI-directional data bus. When CPU I/F, 18-bit interface : DB 17-0 16-bit interface : DB 17-10 , DB 8-1 9-bit interface : DB 8-0 8-bit interface : DB 8-1 When RGB I/F 16-bit interface : DB 17-10, DB 8-1 6-bit interface : DB 8-3 15 Remarks Document No.: 34 DB6 I/O 35 DB5 I/O 36 DB4 I/O 37 DB3 I/O 38 DB2 I/O 39 DB1 I/O 40 DB0 I/O 41 NC 42 NC 43 NC 44 NC 45 SDI (SDIN) I 46 SDO (SDOUT) O 47 CSB (CS/NCS) I 48 RW_WRB (SCL) I 49 RS I 50 E_RDB I 51 RESETB I 52 MVDD O 53 VREG1OUT O For a serial peripheral interface(SPI), input data is fetched at the rising edge of the SCL signal, Fix SDI pin at VSS level if the pin is not used. For a serial peripheral interface (SPI), serves as the serial data olutput pin(SDO), Successive bits are output at the falling edge of the SCL signal. Chip select signal input pin. 0= driver IC is selected and can be accessed. 1= driver IC is not selected and cannot be accessed. Pin function CPU type Pin description Read/Write operation RW 68-system selection pin 0=write 1=read Write strobe signal.(Input pin) WRB 80_system Data is fetched at the rising edge. SCL SPI The synchronous clock signal Register select pin. 0=Index/status, 1=instruction parameter, GRAM data Must be fixed at VDD3 level when not used. Pin Function CPU type Pin description Read/Writeoperation enable E 68-system pin Read strobe signal. RDB 80_system Read out data at the low level When SPI mode is selected , fix this pin at VDD3 levle Reset pin initializes the IC when low. Should be reset after power-on. Internal power for RAM. Connect a capacitance to gnd. Connect a capacitance(1u/10v) to gnd. A reference level for the grayscale voltage. Connect a capacitance(1u/10v) to gnd. 54 VCI I Power supply for analog circuit(2.5v~3.3v) 55 VGH O 56 VGL O 57 GND 58 X- The positive voltage used in the gate driver. Connect a capacitance(1u/10v) to gnd. The negative voltage used in the gate driver. Connect a capacitance(1u/10v) to gnd. Ground For touch screen 16 Document No.: 59 Y- For touch screen 60 X+ For touch screen 61 Y+ For touch screen 17 Document No.: 9. Reliability Test: No. Items Specification 1 High Temp. Storage 85°C, 240hrs 2 Low Temp. Storage -40°C, 240hrs 3 High Temp. Operation 70°C, 240hrs 4 Low Temp. Operation -40°C, 240hrs 5 High Temp / Humidity Storage 85°C, 85%RH, 240hrs 6 High Temp / Humidity Operation 60°C, 90%RH, 240hrs Thermal shock -40°C ~85°C (-40°C /30min; transit/3min; 85°C /30min; transit /3min) 1cycle: 66min, 100 cycles Vibration Frequency: 5~50HZ, 0.5G Scan rate: 1 oct/min Time: 2 hrs/axis Test axis: X, Y, Z 7 8 9 Drop Height: Follow ISTA spec. Sequence : 1 angle、3 edges and 6 faces Cycles: 1 10 ESD Air discharge model, ±8kV, 10 times Test and measurement conditions ¾ All measurements shall not be started until the specimens attain to temperature stability. ¾ The degradation of Polarizer is ignored for item 1, 5 & 6. ¾ The test pattern at operating condition is 30%P.C. alternating pictures. Evaluation Criteria ¾ No damage to glass or encapsulation ¾ No drastic change to display ¾ Defects / Mura follow product specification ¾ Luminance: Within +/-50% of initial value ¾ Current consumption: within +/-50% of initial value 18 Document No.: 10. Handling: 10.1 Do not scratch the surface of the polarizer film as it is easily damaged. 10.2 When cleaning the display surface, use soft cloth with solvent (as recommended below) and wipe lightly z Ethyl alcohol z Isopropyl alcohol 10.3 Do not wipe the display surface with dry or hard materials that damage the polarizer surface. 10.4 Since this OLED panel is made of glass, dropping the module or banging it against hard objects may cause cracks or fragmentation. 10.5 Do not disassemble the OLED module as it may cause permanent damage. 10.6 Hold OLED very carefully when placing OLED module into the system housing. Do not excessive stress or pressure to OLED module. 11. Storage 11.1 Storing in a polyethylene bag with the opening sealed. 11.2 Placing in a dark place where neither exposure to direct sunlight nor any fluorescent light is permitted and keep at room temperature & room humidity. 11.3 Storing with no contact with polarizer surface. （It is recommended to store them in the inner container which we delivered.） 19 Document No.: 12. External Dimension: 20 Document No.: 13. Package: 21