Document No.: Approval Product Specification Module name: C0240QGLB-T Issue date: 2008/12/03 Version: 1.6 Customer Approved by Customer Approved by CMEL PD Division ENG Division QA Dept FOR MORE INFORMATION: AZ DISPLAYS, INC. 75 COLUMBIA, ALISO VIEJO, CA 92656 Http://www.AZDISPLAYS.com Note: 1. The information contained may be changed without prior notice before approval. It is therefore advisable to contact Chi MEI EL Corp. before designing your product. 1 Document No.: Reversion History Version Date Page Ver.1.0 Ver.1.1 2008/05/12 2008/05/16 All 14 23 14 22 Specification was first issued Modify Initial Code(Vgh/Vgl) 14 4 Modify Electro-Optical Characteristic (CIE_Gx) Mod Absolute maximum ratings (Modify to the Panel Operating Condition) Instruction data => Parameter data Add Gamma Setting Group Code Mod Pin-46 to be Output Pin from IC Add Notice of Pin-45/46/47/48 that: SDI=SDIN、SDO=SDOUT CSB=CS=NCS、RW_WRB=SCL Ver.1.2 Ver.1.3 Ver.1.4 2008/05/16 2008/05/28 2008/10/22 11 14 18 18 Ver.1.5 Ver.1.6 2008/11/07 2008/12/03 20 21 22 4 14 Description Update Package Drawing Modify Initial Code(Vgl) Modify RA Test Condition (Thermal Shock-20C=>-40C) Add “Test and measurement conditions” Add Notice of “Handling & Storage” Add Label (Optional) ID Position on Drawing Mod the Range of Temperature Mod the Lifetime (From 20K to 30K) 2 Document No.: 1. Purpose: This documentation defines general product specification for OLED module supplied by CMEL. The information described in this technical specification is tentative. Please Contact CMEL’s representative while your product is modified. 2. General Description: Driving Mode: Active Matrix. Color Mode: Full Color (262K color) Driver IC: S6E63D6, COG Assembly Interface: 1. MPU i80-system 18-/16-/9-/8-bit bus interface 2. MPU i68-system 18-/16-/9-/8-bit bus interface 3. Serial data transfer interface (SPI) 4. RGB 18-/16-/6-bit bus interface (DOTCLK, VSYNC, HSYNC, DE, DB17-0) Application: Cell phone etc.. RoHS Compatible 3. Mechanical Data: No. Items Specification Unit 1 Diagonal Size 2.4” Inch 2 Resolution 3 Pixel Pitch 240 xRGBx320 0.051×0.153 mm 4 Active Area 36.72×48.96 mm 5 Outline Area 42×58.6 mm 6 Thickness 2.65 (Typ) mm 7 Weight 16 g 3 Document No.: 4. Absolute Maximum ratings: 4.1 Absolute ratings of environment: Item Symbol Value Min. Max. Unit Note Storage Temperature TST -40 +80 ºC (1) Operating Ambient Temperature TOP -20 +60 ºC (2) Note (1) The storage duration for both critical temperature (-40 & 80℃) meet reliability test criteria. (2) The operating duration for both critical temperature (-20 & 60℃) meet reliability test criteria. 4.2 Electrical absolute ratings: Item Symbol Unit Value Power supply voltage 1 AR_Vdd V +4.6V +/- 0.05 Power supply voltage 2 AR_Vss V -4.4V +/- 0.1 Power supply voltage 3 VCI V +2.5 ~ +3.3 Power supply voltage 4 VDD3 (IOVcc) V +1.65 ~ +3.3 4 Document No.: 5. Electrical Characteristic: 5.1 DC Characteristic 5 Document No.: 6 Document No.: 5.2 AC Characteristic 5.2.1 CPU interface M68 ( 7 Document No.: 5.2.2 CPU interface M80 ( 8 Document No.: Image Data format for 18bit CPU interface (262k color) Image Data format for 16bit CPU interface (65k color) Image Data format for 9bit CPU interface (262k color) Image Data format for 8bit CPU interface (65K color) Case 1: Case 2: Image Data format for 8bit CPU interface (262K color) 9 Document No.: 5.2.3 SPI ( 10 Document No.: ID RS RW (Note) RS = 0 : Index data RS = 1 : Parameter data 11 Document No.: 5.2.4 RGB Interface ( 12 Document No.: CLK DE DATA Image Data format for 18bit RGB interface (262k color) Image Data format for 16bit RGB interface (65k color) Image Data format for 6bit RGB interface (262k color) 13 Document No.: 6. Electro-Optical Characteristic: Items Symbol Min Typ. Max Unit Remark 2 Operating Luminance L 135 160 185 Cd/m (1)(5) Power Consumption Pon - 260 300 mW 30% pixels on (1) Max. Current Icc - - 120 mA (1) Response Time Tres - - 50 us (2) CIEx (White) Wx 0.26 0.31 0.36 - (5) CIEy( White) Wy 0.28 0.33 0.38 - (5) CIEx (Red) Rx 0.62 0.66 0.70 (5) CIEy( Red) Ry 0.30 0.34 0.38 (5) CIEx (Green) Gx 0.25 0.29 0.33 (5) CIEy( Green) Gy 0.62 0.66 0.70 (5) CIEx (Blue) Bx 0.11 0.15 0.19 (5) CIEy( Blue) By 0.12 0.16 0.20 (5) Viewing Angle VA 160 170 - Contrast CR 5000:1 10000:1 LTop 30000 Operation Lifetime Note: Measuring surrounding: dark room Surrounding temperature: 25oC IOVCC = 1.65V ~ 3.3V 1. Test condition: a. AR_VDD= 4.6V+/- 0.03V, AR_VSS= -4.4V+/- 0.03V b. IC Initial Register Setting: R03: 0x0030 // 16bit mode R10: 0x0000 // IC stand by off R18: 0x0028 // Frame Rate=80Hz RF8: 0x000F // VGH=+5V RF9: 0x0019 // VGL=-7V R05: 0x0001 // Display On Gamma Register Setting:(Gamma Setting Code:C) R70h 0x2B00 R71h 0x2C00 R72h 0x3280 R73h 0x2523 R74h 0x2319 R75h 0x2C24 R76h 0x251A R77h 0x2D2A R78h 0x281B 14 Degree (3) (4) Hrs (1)(6) Document No.: 2.response Time test condition Tf Tr 100% 90% 10% Time 3.Viewing angle test condition: Vss(GND) ψ=270° Viewing Angle= CR>10 4.Contrast Luminance with all pixels white CR = Luminance with all pixels black 5.Optical tester: CA210 6. Brightness of 30% power consumption. Operating Life Time is defined when the luminance has decayed to less than 50% of the initial measured luminance before life test. 15 Document No.: 7. System Diagram: 16 Document No.: 8. Pin Assignment: PIN 1 Symbol I/O Description AR_VDD I Positive voltage for OLED 2 AR_VSS I Nagative voltage for OLED 3 VCI I Power supply for analog circuit(2.5v~3.3v) 4 VCI1 O A reference voltage for 1st booster r(connect a 1u/10v capacitance to gnd) 5 GND I Ground 6 C12M I 7 C12P I 8 C11M I 9 C11P I 10 VLOUT1 O 11 C31P I 12 C31M I 13 C32P I 14 C32M I 15 VLOUT3 O 3rd booster output pin. (1u/16V) 16 VLOUT2 O 2nd booster output pin. (1u/16V) 17 C21P I 18 C21M I 19 VGS I A reference level for the grayscale voltage generation circuit. (connect to gnd) 20 IOVCC I I/O power supply 21 SPB I 22 ID_MIB I 23 DB17 I/O 24 DB16 I/O 25 DB15 I/O 26 DB14 I/O 27 DB13 28 DB12 I/O 18-bit interface : DB 17-0 18-bit interface : DB 17-0 I/O 29 DB11 I/O 30 DB10 31 DB9 I/O Fix unused pin to the VSS level I/O 32 DB8 I/O 33 DB7 I/O External capacitance connect pin between C12M and C12P (1u/10V) External capacitance connect pin between C11M and C11P (1u/10V) 1st booster output pin. (1u/10V) External capacitance connect pin between C31M and C31P (1u/10V) External capacitance connect pin between C32M and C32P (1u/10V) External capacitance connect pin between C21M and C21P. (1u/10V) Select the CPU interface mode. (0=parallel interface 1=serial interface) Select the CPU type (0=intel 80x-system 1=motorola 68x-system) BI-directional data bus. When CPU I/F, 18-bit interface : DB 17-0 16-bit interface : DB 17-10 , DB 8-1 9-bit interface : DB 8-0 8-bit interface : DB 8-1 When RGB I/F 16-bit interface : DB 17-10, DB 8-1 6-bit interface : DB 8-3 17 Remarks Document No.: 34 DB6 I/O 35 DB5 I/O 36 DB4 I/O 37 DB3 I/O 38 DB2 I/O 39 DB1 I/O 40 DB0 I/O 41 VSYNC I 42 HSYNC I 43 DOTCLK I Frame-synchronizing signal. (VSPL=0 Low active, VSPL=1 High active) FIX this pin at VSS level if the pin is not used Line-synchronizing signal. (HSPL=0 Low active, HSPL=1 High active) FIX this pin at VSS level if the pin is not used Input pin for clock signal of external interface : dot clock. DPL=0 Display data is fetched at DOTCLK’s rising edge DPL=1 Display data is fetched at DOTCLK’s falling edge Fix this pin at VSS level if the pin is not used. Data enablesignal pin for RGB interface. 44 ENABLE I 45 SDI (SDIN) I 46 SDO (SDOUT) O 47 CSB (CS/NCS) I 48 RW_WRB (SCL) I 49 RS I 50 E_RDB I EPL ENABLE GRAM write 0 0 Valid GRAM address Updated 0 1 Invalid Held 1 0 Invalid Held 1 1 Valid Updated For a serial peripheral interface (SPI), input data is fetched at the rising edge of the SCL signal, Fix SDI pin at VSS level if the pin is not used. For a serial peripheral interface (SPI), serves as the serial data output pin (SDO), Successive bits are output at the falling edge of the SCL signal. Chip select signal input pin. 0= driver IC is selected and can be accessed. 1= driver IC is not selected and cannot be accessed. Pin function CPU type Pin description Read/Write operation RW 68-system selection pin 0=write 1=read Write strobe signal.(Input pin) WRB 80_system Data is fetched at the rising edge. SCL SPI The synchronous clock signal Register select pin. 0=Index/status, 1=instruction parameter, GRAM data Must be fixed at VDD3 level when not used. Pin Function CPU type Pin description Read/Write operation enable E 68-system pin Read strobe signal. RDB 80_system Read out data at the low level When SPI mode is selected , fix this pin at VDD3 levle 18 Document No.: 53 VREG1OUT O Reset pin initializes the IC when low. Should be reset after power-on. Internal power for RAM. Connect a capacitance to gnd. Connect a capacitance (1u/10v) to gnd. A reference level for the grayscale voltage. Connect a capacitance (1u/10v) to gnd. 54 VCI I Power supply for analog circuit (2.5v~3.3v) 55 VGH O 56 VGL O 57 GND 58 X‐ For touch screen 59 Y‐ For touch screen 60 X+ For touch screen 61 Y+ For touch screen 51 RESETB I 52 MVDD O The positive voltage used in the gate driver. Connect a capacitance (1u/10v) to gnd. The negative voltage used in the gate driver. Connect a capacitance (1u/10v) to gnd. Ground 19 Document No.: 9. Reliability Test: No. Items Specification 1 High Temp. Storage 85°C, 240hrs 2 Low Temp. Storage -40°C, 240hrs 3 High Temp. Operation 60°C, 240hrs 4 Low Temp. Operation -40°C, 240hrs 5 High Temp / Humidity Storage 85°C, 85%RH, 240hrs 6 High Temp / Humidity Operation 60°C, 90%RH, 240hrs Thermal shock -40°C ~85°C (-40°C /30min; transit/3min; 85°C /30min; transit /3min) 1cycle: 66min, 100 cycles Vibration Frequency: 5~50HZ, 0.5G Scan rate : 1 oct/min Time : 2 hrs/axis Test axis : X, Y, Z 7 8 9 Drop 10 ESD Height: 76cm Sequence : 1 angle、3 edges and 6 faces Cycles: 1 Air discharge model, ±8kV, 10 times Test and measurement conditions All measurements shall not be started until the specimens attain to temperature stability. The degradation of Polarizer is ignored for item 1, 5 & 6. The test pattern at operating condition is 30%P.C. alternating pictures. Evaluation Criteria No damage to glass or encapsulation No drastic change to display Defects / Mura follow product specification Luminance: Within +/-50% of initial value Current consumption: within +/-50% of initial value 20 Document No.: 10. Handling: 10.1 Do not scratch the surface of the polarizer film as it is easily damaged. 10.2 When cleaning the display surface, use soft cloth with solvent (as recommended below) and wipe lightly Ethyl alcohol Isopropyl alcohol 10.3 Do not wipe the display surface with dry or hard materials that damage the polarizer surface. 10.4 Since this OLED panel is made of glass, dropping the module or banging it against hard objects may cause cracks or fragmentation. 10.5 Do not disassemble the OLED module as it may cause permanent damage. 10.6 Hold OLED very carefully when placing OLED module into the system housing. Do not excessive stress or pressure to OLED module. 11. Storage 11.1 Storing in a polyethylene bag with the opening sealed. 11.2 Placing in a dark place where neither exposure to direct sunlight nor any fluorescent light is permitted and keep at room temperature & room humidity. 11.3 Storing with no contact with polarizer surface. (It is recommended to store them in the inner container which we delivered.) 21 Document No.: 12. External Dimension: 22 Document No.: 12.1 Cautions for installing and assembling: 23 Document No.: 13. Package: 24