SBOS218A – DECEMBER 2001 – REVISED JUNE 2002 FEATURES APPLICATIONS D AUDIO AMPLIFIERS D MIXING CONSOLES D MULTI-TRACK RECORDERS D BROADCAST STUDIO EQUIPMENT D MUSICAL INSTRUMENTS D EFFECTS PROCESSORS D A/V RECEIVERS D CAR AUDIO SYSTEMS D DIGITALLY-CONTROLLED ANALOG VOLUME CONTROL Two Independent Audio Channels Serial Control Interface Zero Crossing Detection Mute Function D WIDE GAIN AND ATTENUATION RANGE +31.5dB to –95.5dB with 0.5dB Steps D LOW NOISE AND DISTORTION 120dB Dynamic Range 0.0004% THD+N at 1kHz (U-Grade) 0.0002% THD+N at 1kHz (A-Grade) DESCRIPTION D NOISE-FREE LEVEL TRANSITIONS D LOW INTERCHANNEL CROSSTALK –130dBFS D POWER SUPPLIES: ±5V Analog, +5V Digital D AVAILABLE IN DIP-16 AND SOL-16 PACKAGES D PIN AND SOFTWARE COMPATIBLE WITH THE CRYSTAL CS3310 The PGA2311 is a high–performance, stereo audio volume control designed for professional and high-end consumer audio systems. Using high performance operational amplifier stages internal to the PGA2311 yields low noise and distortion, while providing the capability to drive 600Ω loads directly without buffering. The 3-wire serial control interface allows for connection to a wide variety of host controllers, in addition to support for daisy-chaining of multiple PGA2311 devices. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2001, Texas Instruments Incorporated ! " # $ %&" ' & ' " www.ti.com www.ti.com SBOS218A – DECEMBER 2001 – REVISED JUNE 2002 ABSOLUTE MAXIMUM RATINGS(1) Supply Voltage, VA+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5.5V VA– . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –5.5V VD+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5.5V VA+ to VD+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . < ± 0.3V Analog Input Voltage . . . . . . . . . . . . . . . . . . . . . . 0V to VA+, VA– Digital Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . –0.3V to VD+ Operating Temperature Range . . . . . . . . . . . . . . . . –40°C to +85°C Storage Temperature Range . . . . . . . . . . . . . . . . –65°C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C Lead Temperature (soldering, 10s) . . . . . . . . . . . . . . . . . . . +300°C Package Temperature (IR reflow, 10s) . . . . . . . . . . . . . . . . . +235°C (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION PRODUCT PACKAGE–LEAD PACKAGE DESIGNATOR(1) DIP–16 N PGA2311 (U–Grade) (U Grade) SOL 16 SOL–16 DW DIP–16 N PGA2311 (A–Grade) (A Grade) OPERATING TEMPERATURE RANGE PACKAGE MARKING –40°C 40 C to +85 +85°C C PGA2311U –40°C +85°C 40 C to +85 C SOL 16 SOL–16 DW ORDERING NUMBER TRANSPORT MEDIA, QUANTITY PGA2311P PGA2311P Rails PGA2311U PGA2311U Rails PGA2311U/1K Tape and Reel, 1000 Rails PGA2311PA PGA2311PA PGA2311UA PGA2311UA Rails PGA2311UA PGA2311UA/1K Tape and Reel, 1000 (1) For the most current specifications and package information, refer to our web site at www. ti.com. ELECTRICAL CHARACTERISTICS At TA = +25°C, VA+ = +5V, VA– = –5V, VD+ = +5V, RL = 100kΩ, CL = 20pF, BW measure = 10Hz to 20kHz, unless otherwise noted. PGA2311P, U (U–Grade). PARAMETER CONDITIONS MIN TYP MAX PGA2311PA, UA (A–Grade) MIN TYP MAX UNITS DC CHARACTERISTICS Step Size 0.5 0.5 dB ±0.05 ±0.05 dB ±0.05 ±0.05 dB Input Resistance 10 10 kΩ Input Capacitance 3 3 pF Gain Error Gain Setting = 31.5dB Gain Matching AC CHARACTERISTICS THD+N Dynamic Range VIN = 2Vrms, f = 1kHz VIN = AGND, Gain = 0dB Voltage Range, Input (without clipping) Interchannel Crosstalk 0.001 120 (VA–) + 1.25 Voltage Range, Output Output Noise 0.0004 116 (VA+) – 1.25 2.5 VIN = AGND, Gain = 0dB f = 1kHz 2.5 –130 VIN = AGND, Gain = 0dB 0.25 0.0002 116 0.0004 120 (VA–) + 1.25 (VA+) – 1.25 V 4 µVrms 2.5 4 2.5 % dB Vrms –130 dBFS OUTPUT BUFFER Offset Voltage 0.5 0.25 0.5 mV Load Capacitance Stability 100 100 pF Short–Circuit Current 50 50 mA Unity–Gain Bandwidth, Small Signal 10 10 MHz 2 www.ti.com SBOS218A – DECEMBER 2001 – REVISED JUNE 2002 ELECTRICAL CHARACTERISTICS (Cont.) At TA = +25°C, VA+ = +5V, VA– = –5V, VD+ = +5V, RL = 100kΩ, CL = 20pF, BW measure = 10Hz to 20kHz, unless otherwise noted. PGA2311P, U (U–Grade) PARAMETER CONDITIONS MIN TYP PGA2311PA, UA (A–Grade) MAX MIN VD+ 0.8 +2.0 TYP MAX UNITS DIGITAL CHARACTERISTICS High–Level Input Voltage, VIH +2.0 Low–Level Input Voltage, VIL –0.3 High–Level Output Voltage, VOH IO = 200µA Low–Level Output Voltage, VOL IO = –3.2mA (VA+) – 1.0 VD+ 0.8 –0.3 (VD+) – 1.0 1 10 V V 0.4 Input Leakage Current V 1 0.4 V 10 µA 6.25 MHz SWITCHING CHARACTERISTICS Serial Clock (SCLK) Frequency Serial Clock (SCLK) Pulse Width LOW Serial Clock (SCLK) Pulse Width HIGH MUTE Pulse Width LOW fSCLK tPH 0 6.25 0 80 80 80 80 ns 2.0 2.0 ms tSDS tSDH 20 20 ns 20 20 ns tCSCR tCFCS 90 90 ns 35 35 ns tPL tMI ns Input Timing SDI Setup Time SDI Hold Time CS Falling to SCLK Rising SCLK Falling to CS Rising Output Timing CS LOW to SDO Active SCLK Falling to SDO Data Valid CS HIGH to SDO High Impedance tCSO tCFDO tCSZ 35 35 ns 60 60 ns 100 100 ns POWER SUPPLY Operating Voltage VA+ VA– VD+ Quiescent Current IA+ IA– ID+ Power–Supply Rejection Ratio PSRR (250Hz) +4.75 +5 +5.25 +4.75 +5 +5.25 V –4.75 –5 –5.25 –4.75 –5 –5.25 V +4.75 +5 +5.25 +4.75 +5 +5.25 V VA+ = +5V VA– = –5V 8 10 8 10 mA 10 12 10 12 mA VD+ = +5V 0.5 1.0 0.5 1.0 mA 100 100 dB TEMPERATURE RANGE Operating Range –40 +85 –40 +85 °C Storage Range –65 +150 –65 +150 °C Thermal Resistance, JC DIP–16 SOL–16 60 60 °C/W 50 50 °C/W 3 www.ti.com SBOS218A – DECEMBER 2001 – REVISED JUNE 2002 PIN CONFIGURATION Top View PIN ASSIGNMENTS DIP, SOL PIN NAME FUNCTION 1 ZCEN Zero Crossing Enable Input (Active HIGH) 2 CS Chip Select Input (Active LOW) 3 SDI Serial Data input 4 Digital Power Supply, +5V 5 VD+ DGND 6 SCLK Serial Clock Input 7 SDO Serial Data Output 8 MUTE 9 VINR AGNDR Analog Input, Right Channel Analog Output, Right Channel 12 VOUTR VA+ 13 VA– 14 15 VOUTL AGNDL 16 VINL 10 11 4 Digital Ground Mute Control Input (Active LOW) Analog Ground, Right Channel Analog Power Supply, +5V Analog Power Supply, –5V Analog Output, Left Channel Analog Ground, Left Channel Analog Input, Left Channel www.ti.com SBOS218A – DECEMBER 2001 – REVISED JUNE 2002 TYPICAL CHARACTERISTICS At TA = +25°C, VA+ = +5V, VA– = –5V, VD+ = +5V, RL = 100kΩ, CL = 20pF, BW measure = 10Hz to 20kHz, unless otherwise noted. (NOTE: All plots taken with PGA2311 A–Grade.) 5 www.ti.com SBOS218A – DECEMBER 2001 – REVISED JUNE 2002 TYPICAL CHARACTERISTICS (CONT.) At TA = +25°C, VA+ = +5V, VA– = –5V, VD+ = +5V, RL = 100kΩ, CL = 20pF, BW measure = 10Hz to 20kHz, unless otherwise noted. (NOTE: All plots taken with PGA2311 A–Grade.) 6 www.ti.com SBOS218A – DECEMBER 2001 – REVISED JUNE 2002 GENERAL DESCRIPTION The PGA2311 is a stereo audio volume control. It may be used in a wide array of professional and consumer audio equipment. The PGA2311 is fabricated in a sub– micron CMOS process. The heart of the PGA2311 is a resistor network, an analog switch array, and a high–performance op amp stage. The switches are used to select taps in the resistor network that, in turn, determine the gain of the amplifier stage. Switch selections are programmed using a serial control port. The serial port allows connection to a wide variety of host controllers. Figure 1 shows a functional block diagram of the PGA2311. POWER–UP STATE On power up, “power–up reset” is activated for about 100ms during which the circuit is in hardware MUTE state and all internal flip-flops are reset. At the end of this period, the offset calibration is initiated without any external signals. Once this has been completed, the gain byte value for both the left and right channels are set to 00HEX, or the software MUTE condition. The gain will remain at this setting until the host controller programs new settings for for each channel via the serial control port. If during normal operation the power supply voltage drops below ±3.2V, the circuit enters a hardware MUTE state. A power-up sequence will be initiated if the power supply voltage returns to greater than ±3.2V. ANALOG INPUTS AND OUTPUTS The PGA2311 includes two independent channels, referred to as the left and right channels. Each channel has a corresponding input and output pin. The input and output pins are unbalanced, or referenced to analog ground (either AGNDR or AGNDL). The inputs are named VINR (pin 9) and VINL (pin 16), while the outputs are named VOUTR (pin 11) and VOUTL (pin 14). The input and output pins may swing within 1.25V of the analog power supplies, VA+ (pin 12) and VA– (pin 13). Given VA+ = +5V and VA– = –5V, the maximum input or output voltage range is 7.5Vp-p. For optimal performance, it is best to drive the PGA2311 with a low source impedance. A source impedance of 600Ω or less is recommended. Source impedances up to 2kΩ will cause minimal degradation of THD+N. Please refer to the “THD+N vs Source Impedance” plot in the Typical Characteristics section of the datasheet. Figure 1. PGA2311 Block Diagram. 7 www.ti.com SBOS218A – DECEMBER 2001 – REVISED JUNE 2002 SERIAL CONTROL PORT The serial control port is utilized to program the gain settings for the PGA2311. The serial control port includes three input pins and one output pin. The inputs include CS (pin 2), SDI (pin 3), and SCLK (pin 6). The sole output pin is SDO (pin 7). The CS pin functions as the chip select input. Data may be written to the PGA2311 only when CS is LOW. SDI is the serial data input pin. Control data is provided as a 16-bit word at the SDI pin, 8 bits each for the left and right channel gain settings. Data is formatted as MSB first, straight binary code. SCLK is the serial clock input. Data is clocked into SDI on the rising edge of SCLK. SDO is the serial data output pin, and is used when daisy-chaining multiple PGA2311 devices. Daisy-chain operation is described in detail later in this section. SDO is a tri-state output, and assumes a high impedance state when CS is HIGH. The protocol for the serial control port is shown in Figure 2. See Figure 3 for detailed timing specifications for the serial control port. Gain Byte Format is MSB First, Straight Binary R0 is the Least Significant Bit of the Right Channel Gain Byte R7 is the Most Significant Bit of the Right Channel Gain Byte L0 is the Least Significant Bit of the Left Channel Gain Byte L7 is the Most Significant Bit of the Left Channel Gain Byte SDI is latched on the rising edge of SCLK. SDO transitions on the falling edge of SCLK. Figure 2. Serial Interface Protocol. 8 www.ti.com SBOS218A – DECEMBER 2001 – REVISED JUNE 2002 GAIN SETTINGS For N = 1 to 255: The gain for each channel is set by its corresponding 8–bit code, either R[7:0] or L[7:0] (see Figure 2). The gain code data is straight binary format. If we let N equal the decimal equivalent of R[7:0] or L[7:0], then the following relationships exist for the gain settings: For N = 0: Mute Condition. The input multiplexer is connected to analog ground (AGNDR or AGNDL). Gain (dB) = 31.5 – [0.5 w (255 – N)] This results in a gain range of +31.5dB (with N = 255) to –95.5dB (with N = 1). Changes in gain setting may be made with or without zero crossing detection. The operation of the zero crossing detector and timeout circuitry is discussed later in this data sheet. Figure 3. Serial Interface Timing Requirements. 9 www.ti.com SBOS218A – DECEMBER 2001 – REVISED JUNE 2002 DAISY-CHAINING MULTIPLE PGA2311 DEVICES ZERO CROSSING DETECTION In order to reduce the number of control signals required to support multiple PGA2311 devices on a printed circuit board, the serial control port supports daisy-chaining of multiple PGA2311 devices. Figure 4 shows the connection requirements for daisy-chain operation. This arrangement allows a 3-wire serial interface to control many PGA2311 devices. As shown in Figure 4, the SDO pin from device #1 is connected to the SDI input of device #2, and is repeated for additional devices. This in turn forms a large shift register, in which gain data may be written for all PGA2311s connected to the serial bus. The length of the shift register is 16 • N bits, where N is equal to the number of PGA2311 devices included in the chain. The CS input must remain LOW for 16 • N SCLK periods, where N is the number of devices connected in the chain, in order to allow enough SCLK cycles to load all devices. The PGA2311 includes a zero crossing detection function that can provide for noise-free level transitions. The concept is to change gain settings on a zero crossing of the input signal, thus minimizing audible glitches. This function is enabled or disabled using the ZCEN input (pin 1). When ZCEN is LOW, zero crossing detection is disabled. When ZCEN is HIGH, zero crossing detection will be enabled. The zero crossing detection takes effect with a change in gain setting for a corresponding channel. The new gain setting will not be implemented until either positive slope zero crossing is detected or a time-out period of 16ms has elapsed. In the case of a time-out, the new gain setting takes effect with no attempt to minimize audible artifacts. Figure 4. Daisy-Chaining Multiple PGA2311 Devices. 10 www.ti.com SBOS218A – DECEMBER 2001 – REVISED JUNE 2002 MUTE FUNCTION Muting can be achieved by either hardware or software control. Hardware muting is accomplished via the MUTE input, and software muting by loading all zeroes into the volume control register. MUTE disconnects the internal buffer amplifiers from the output pins and terminates AOUTL and AOUTR with 10kΩ resistors to ground. The mute is activated with a zero crossing detection (independent of the zero cross enable status) or an 16ms time-out to eliminate any audible “clicks” or “pops”. MUTE also initiates an internal offset calibration. A software mute is implemented by loading all zeroes into the volume control register. The internal amplifier is set to unity gain with the amplifier input connected to AGND. APPLICATIONS INFORMATION This section includes additional information that is pertinent to designing the PGA2311 into an end application. RECOMMENDED CONNECTION DIAGRAM Figure 5 depicts the recommended connections for the PGA2311. Power-supply bypass capacitors should be placed as close to the PGA2311 package as physically possible. Figure 5. Recommended Connection Diagram. 11 www.ti.com SBOS218A – DECEMBER 2001 – REVISED JUNE 2002 PRINTED CIRCUIT BOARD (PCB) LAYOUT GUIDELINES It is recommended that the ground planes for the digital and analog sections of the PCB be separate from one another. The planes should be connected at a single point. Figure 6 shows the recommended PCB floor plan for the PGA2311. Figure 6. Typical PCB Layout Floor Plan. 12 The PGA2311 is mounted so that it straddles the split between the digital and analog ground planes. Pins 1 through 8 are oriented to the digital side of the board, while pins 9 through 16 are on the analog side of the board. www.ti.com SBOS218A – DECEMBER 2001 – REVISED JUNE 2002 PACKAGE DRAWINGS 13 www.ti.com SBOS218A – DECEMBER 2001 – REVISED JUNE 2002 PACKAGE DRAWINGS (Cont.) 14 PACKAGE OPTION ADDENDUM www.ti.com 10-Jul-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty PGA2311P ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type PGA2311PA ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type PGA2311PAG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type PGA2311PG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type PGA2311U ACTIVE SOIC DW 16 48 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR PGA2311U/1K ACTIVE SOIC DW 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR PGA2311U/1KG4 ACTIVE SOIC DW 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR PGA2311UA ACTIVE SOIC DW 16 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR PGA2311UA/1K ACTIVE SOIC DW 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR PGA2311UA/1KG4 ACTIVE SOIC DW 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR PGA2311UAG4 ACTIVE SOIC DW 16 48 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR PGA2311UG4 ACTIVE SOIC DW 16 48 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 48 Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 10-Jul-2006 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. 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