PGA2310 SBOS207B − OCTOBER 2001 − REVISED JUNE 2004 Stereo Audio Volume Control FEATURES APPLICATIONS D DIGITALLY-CONTROLLED ANALOG VOLUME D D D D D D D D CONTROL: Two Independent Audio Channels Serial Control Interface Zero Crossing Detection Mute Function D WIDE GAIN AND ATTENUATION RANGE: +31.5dB to −95.5dB with 0.5dB Steps D LOW NOISE AND DISTORTION: DESCRIPTION 120dB Dynamic Range 0.0004% THD+N at 1kHz D LOW INTERCHANNEL CROSSTALK: −126dBFS D NOISE-FREE LEVEL TRANSITIONS D POWER SUPPLIES: +15V Analog, +5V Digital D AVAILABLE IN DIP−16 AND SOL−16 PACKAGES D PIN AND SOFTWARE COMPATIBLE WITH THE PGA2311 AND CIRRUS LOGIC CS3310E AUDIO AMPLIFIERS MIXING CONSOLES MULTI-TRACK RECORDERS BROADCAST STUDIO EQUIPMENT MUSICAL INSTRUMENTS EFFECTS PROCESSORS A/V RECEIVERS CAR AUDIO SYSTEMS The PGA2310 is a high-performance, stereo audio volume control designed for professional and high-end consumer audio systems. The ability to operate from ±15V analog power supplies enables the PGA2310 to process input signals with large voltage swings, thereby preserving the dynamic range available in the overall signal path. Using high performance operational amplifier stages internal to the PGA2310 yields low noise and distortion, while providing the capability to drive 600Ω loads directly without buffering. The three-wire serial control interface allows for connection to a wide variety of host controllers, in addition to support for daisy-chaining of multiple PGA2310 devices. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. Copyright 2001 − 2004, Texas Instruments Incorporated ! ! www.ti.com " #$%& www.ti.com SBOS207B − OCTOBER 2001 − REVISED JUNE 2004 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) PGA2310 UNIT VA+ VA− +16.0 V −16.0 V VD+ +6.5 V Analog input voltage 0 to VA+, VA− V Digital input voltage −0.3 to VD+ V Operating temperature range −55 to +125 °C Storage temperature range −65 to +150 °C Junction temperature +150 °C Lead temperature (soldering, 10s) +300 °C Supply voltage Package temperature (IR, reflow, 10s) +235 °C (1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. ORDERING INFORMATION(1) PRODUCT PGA2310 PACKAGE−LEAD PACKAGE DESIGNATOR DIP-16 N SOL-16 DW SPECIFIED TEMPERATURE RANGE PACKAGE MARKING −40°C −40 C to +85 +85°C C PGA2310UA ORDERING NUMBER TRANSPORT MEDIA, QUANTITY PGA2310PA PGA2310PA Rails, 25 PGA2310UA PGA2310UA Rails, 48 PGA2310UA/1K Tape and Reel, 1000 (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet. 2 " #$%& www.ti.com SBOS207B − OCTOBER 2001 − REVISED JUNE 2004 ELECTRICAL CHARACTERISTICS At TA = +25°C, VA+ = +15V, VA− = −15V, VD+ = +5V, RL = 100kΩ, CL = 20pF, BW measure = 10Hz to 20kHz, unless otherwise noted. PGA2310 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DC CHARACTERISTICS Step Size Gain Error Gain Setting = 31.5dB 0.5 dB ±0.05 dB ±0.05 dB Input Resistance 10 kΩ Input Capacitance 7 pF Gain Matching AC CHARACTERISTICS THD+N Dynamic Range VIN = 10VPP, f = 1kHz VIN = AGND, Gain = 0dB Voltage Range, Input and Output Output Noise Interchannel Crosstalk 0.0004 116 120 (VA−) + 1.5 VIN = AGND, Gain = 0dB f = 1kHz 0.001 9.5 % dB (VA−) − 1.5 13.5 −126 V µVRMS dBFS OUTPUT BUFFER Offset Voltage VIN = AGND, Gain = 0dB 0.5 Load Capacitance Stability 3 1000 mV pF Short-Circuit Current 35 mA Unity-Gain Bandwidth, Small Signal 1.5 MHz DIGITAL CHARACTERISTICS High-Level Input Voltage, VIH +2.0 Low-Level Input Voltage, VIL −0.3 High-Level Output Voltage, VOH Low-Level Output Voltage, VOL IO = 200µA IO = −3.2mA VD+ 0.8 (VD+) − 1.0 Input Leakage Current V V V 1 0.4 V 10 µA 6.25 MHz SWITCHING CHARACTERISTICS Serial Clock (SCLK) Frequency Serial Clock (SCLK) Pulse Width Low Serial Clock (SCLK) Pulse Width High MUTE Pulse Width Low tSCLK tPH tPL tMI 0 80 ns 80 ns 2.0 ms tSDS tSDH 20 ns 20 ns tCSCR tCFCS 90 ns 35 ns Input Timing SDI Setup Time SDI Hold Time CS Falling to SCLK Rising SCLK Falling to CS Rising Output Timing CS Low to SDO Active SCLK Falling to SDO Data Valid CS High to SDO High Impedance tCSO tCFDO tCSZ 35 ns 60 ns 100 ns POWER SUPPLY Operating Voltage VA+ VA− VD+ Quiescent Current +4.5 +15 +15.5 V −4.5 −15 −15.5 V +4.5 +5 +5.5 V 10 mA IA+ IA− VA+ = +15V VA− = −15V 7.5 7.7 10 mA ID+ VD+ = +5V 0.8 1.5 mA 3 " #$%& www.ti.com SBOS207B − OCTOBER 2001 − REVISED JUNE 2004 ELECTRICAL CHARACTERISTICS (continued) At TA = +25°C, VA+ = +15V, VA− = −15V, VD+ = +5V, RL = 100kΩ, CL = 20pF, BW measure = 10Hz to 20kHz, unless otherwise noted. PGA2310 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TEMPERATURE RANGE Specified Range −40 +85 °C Operating Range −55 +125 °C Storage Range −65 +150 °C Thermal Resistance, θJC DIP−16 60 °C/W SOL−16 50 °C/W PIN CONFIGURATION PIN ASSIGNMENTS Top View ZCEN 1 16 VINL NAME FUNCTION 1 ZCEN Zero Crossing Enable Input (Active High) 2 CS Chip Select Input (Active Low) 3 SDI Serial Data input 4 Digital Power Supply, +5V 5 VD+ DGND 6 SCLK Serial Clock Input Digital Ground CS 2 15 AGNDL SDI 3 14 VOUTL 7 SDO Serial Data Output VD+ 4 13 VA− 8 MUTE Mute Control Input (Active Low) 9 VINR AGNDR Analog Input, Right Channel Analog Output, Right Channel PGA2310 DGND 5 12 VA+ SCLK 6 11 VOUTR 11 SDO 7 10 AGNDR 12 VOUTR VA+ 13 VA− Analog Power Supply, −15V 14 Analog Output, Left Channel 15 VOUTL AGNDL 16 VINL MUTE 4 PIN 8 9 VINR 10 Analog Ground, Right Channel Analog Power Supply, +15V Analog Ground, Left Channel Analog Input, Left Channel " #$%& www.ti.com SBOS207B − OCTOBER 2001 − REVISED JUNE 2004 TYPICAL CHARACTERISTICS At TA = +25°C, VA+ = +15V, VA− = −15V, VD+ = +5V, RL = 100kΩ, CL = 20pF, BW measure = 10Hz to 20kHz, unless otherwise noted. THD+N vs AMPLITUDE FREQUENCY RESPONSE 1 1 0.8 0.1 0.6 THD+N (%) Amplitude (dB) 0.4 0.2 0 −0.2 −0.4 0.01 0.001 −0.6 −0.8 0.0001 −1 100m 10 100 10k 1k 1 200k Frequency (Hz) THD+N vs FREQUENCY (VIN = 3.0VRMS, Load = 600Ω) 0.05 0.05 0.01 0.01 THD+N (%) THD+N (%) THD+N vs FREQUENCY (VIN = 3.0VRMS, Load = 100kΩ) 0.001 0.0001 0.001 0.0001 20 100 1k 10k 20k 20 100 1k Frequency (Hz) Frequency (Hz) THD+N vs FREQUENCY (VIN = 8.5VRMS, Load = 100kΩ) THD+N vs FREQUENCY (VIN = 8.5VRMS, Load = 600Ω) 0.05 0.05 0.01 0.01 THD+N (%) THD+N (%) 9 Amplitude (VRMS) 0.001 0.0001 10k 20k 10k 20k 0.001 0.0001 20 100 1k Frequency (Hz) 10k 20k 20 100 1k Frequency (Hz) 5 " #$%& www.ti.com SBOS207B − OCTOBER 2001 − REVISED JUNE 2004 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, VA+ = +15V, VA− = −15V, VD+ = +5V, RL = 100kΩ, CL = 20pF, BW measure = 10Hz to 20kHz, unless otherwise noted. AMPLITUDE vs FREQUENCY (Crosstalk with f IN = 10kHz) 0 −10 −20 −30 −40 −50 −60 −70 −80 −90 −100 −110 −120 −130 −140 −150 −160 Amplitude (dBFS) Amplitude (dBFS) AMPLITUDE vs FREQUENCY (Crosstalk with fIN = 1kHz) 20 2k 4k 6k 8k 0 −10 −20 −30 −40 −50 −60 −70 −80 −90 −100 −110 −120 −130 −140 −150 −160 0 10k 12k 14k 16k 18k 20k 22k 2k 4k 6k Amplitude (dBFS) AMPLITUDE vs FREQUENCY (Crosstalk with fIN = 20kHz) 0 −10 −20 −30 −40 −50 −60 −70 −80 −90 −100 −110 −120 −130 −140 −150 −160 0 2k 4k 6k 8k 10k 12k 14k 16k 18k 20k 22k Frequency (Hz) 6 8k 10k 12k 14k 16k 18k 20k 22k Frequency (Hz) Frequency (Hz) " #$%& www.ti.com SBOS207B − OCTOBER 2001 − REVISED JUNE 2004 GENERAL DESCRIPTION The PGA2310 is a stereo audio volume control. It may be used in a wide array of professional and consumer audio equipment. The PGA2310 is fabricated in a mixed-signal BiCMOS process, as to take advantage of the superior analog characteristics for which it offers. The heart of the PGA2310 is a resistor network, an analog switch array, and a high-performance bipolar op amp stage. The switches are used to select taps in the resistor network that, in turn, determine the gain of the amplifier stage. Switch selections are programmed using a serial control port. The serial port allows connection to a wide variety of host controllers. Figure 1 shows a functional block diagram of the PGA2310. POWER-UP STATE On power up, all internal flip-flops are reset. The gain byte value for both the left and right channels are set to 00HEX, or mute condition. The gain will remain at this setting until the host controller programs new settings for each channel via the serial control port. VINL ANALOG INPUTS AND OUTPUTS The PGA2310 includes two independent channels, referred to as the left and right channels. Each channel has a corresponding input and output pin. The input and output pins are unbalanced, or referenced to analog ground (either AGNDR or AGNDL). The inputs are named VINR (pin 9) and VINL (pin 16), while the outputs are named VOUTR (pin 11) and VOUTL (pin 14). The input and output pins may swing within 1.5V of the analog power supplies, VA+ (pin 12) and VA− (pin 13). Given VA+ = +15V and VA− = −15V, the maximum input or output voltage range is 27VPP. It is important to drive the PGA2310 with a low source impedance. If a source impedance of greater than 600Ω is used, the distortion performance of the PGA2310 will begin to degrade. 16 14 8 VOUTL MUTE MUX 8 1 8 AGNDL AGNDR 2 15 Serial Control Port 10 6 3 7 ZCEN CS SCLK SDI SDO 8 8 MUX 11 VINR 9 12 VA+VA− 13 4 VOUTR 5 VD+ DGND Figure 1. PGA2310 Block Diagram 7 " #$%& www.ti.com SBOS207B − OCTOBER 2001 − REVISED JUNE 2004 gain settings. Data is formatted as MSB first, straight binary code. SCLK is the serial clock input. Data is clocked into SDI on the rising edge of SCLK. SERIAL CONTROL PORT The serial control port is utilized to program the gain settings for the PGA2310. The serial control port includes three input pins and one output pin. The inputs include CS (pin 2), SDI (pin 3), and SCLK (pin 6). The sole output pin is SDO (pin 7). SDO is the serial data output pin, and is used when daisy-chaining multiple PGA2310 devices. Daisy-chain operation is described in detail later in this section. SDO is a tristate output, and assumes a high impedance state when CS is high. The CS pin functions as the chip select input. Data may be written to the PGA2310 only when CS is low. SDI is the serial data input pin. Control data is provided as a 16-bit word at the SDI pin, 8 bits each for the left and right channel The protocol for the serial control port is shown in Figure 2. See Figure 3 for detailed timing specifications of the serial control port. CS SCLK SDI R7 R6 R5 R4 R3 R2 R1 R0 L7 L6 L5 L4 L3 L2 L1 L0 SDO R7 R6 R5 R4 R3 R2 R1 R0 L7 L6 L5 L4 L3 L2 L1 L0 Gain Byte Format is MSB First, Straight Binary R0 is the Least Significant Bit of the Right Channel Gain Byte R7 is the Most Significant Bit of the Right Channel Gain Byte L0 is the Least Significant Bit of the Left Channel Gain Byte L7 is the Most Significant Bit of the Left Channel Gain Byte SDI is latched on the rising edge of SCLK. SDO transitions on the falling edge of SCLK. Figure 2. Serial Interface Protocol 8 " #$%& www.ti.com SBOS207B − OCTOBER 2001 − REVISED JUNE 2004 GAIN SETTINGS For N = 1 to 255: The gain for each channel is set by its corresponding 8-bit code, either R[7:0] or L[7:0], see Figure 2. The gain code data is straight binary format. If we let N equal the decimal equivalent of R[7:0] or L[7:0], then the following relationships exist for the gain settings: Gain (dB) = 31.5 − [0.5 • (255 − N)] This results in a gain range of +31.5dB (with N = 255) to −95.5dB (with N = 1). Changes in gain setting may be made with or without zero crossing detection. The operation of the zero crossing detector and timeout circuitry is discussed later in this data sheet. For N = 0: Mute Condition. The input multiplexer is connected to analog ground (AGNDR or AGNDL). CS tCSCR t SDS tCFCS SCLK tSDH SDI MSB SDO t CSO tCFDO tCSZ Figure 3. Serial Interface Timing Requirements 9 " #$%& www.ti.com SBOS207B − OCTOBER 2001 − REVISED JUNE 2004 DAISY-CHAINING MULTIPLE PGA2310 DEVICES In order to reduce the number of control signals required to support multiple PGA2310 devices on a printed circuit board, the serial control port supports daisy-chaining of multiple PGA2310 devices. Figure 4 shows the connection requirements for daisy-chain operation. This arrangement allows a three-wire serial interface to control many PGA2310 devices. As shown in Figure 4, the SDO pin from device #1 is connected to the SDI input of device #2, and is repeated for additional devices. This in turn forms a large shift register, in which gain data may be written for all PGA2310s connected to the serial bus. The length of the shift register is 16 x N bits, where N is equal to the number of PGA2310 devices included in the chain. The CS input must remain low for 16 x N SCLK periods, where N is the number of devices connected in the chain, in order to allow enough SCLK cycles to load all devices. ZERO CROSSING DETECTION The PGA2310 includes a zero crossing detection function that can provide for noise-free level transitions. The concept is to change gain settings on a zero crossing of the input signal, thus minimizing audible glitches. This function is enabled or disabled using the ZCEN input (pin 1). When ZCEN is low, zero crossing detection is disabled. When ZCEN is high, zero crossing detection will be enabled. The zero crossing detection takes effect with a change in gain setting for a corresponding channel. The new gain setting will not be latched until either two zero crossings are detected, or a timeout period of 16ms has elapsed without detecting two zero crossings. In the case of a timeout, the new gain setting takes effect with no attempt to minimize audible artifacts. Controller SCLK SDI CS Audio Input VINL VINR PGA2310 #1 SDO VOUTL VOUTR SDI SCLK 100kΩ CS Audio Input 100kΩ VINL VINR PGA2310 #2 SDO VOUTL VOUTR SDI SCLK CS Audio Input VINL VINR PGA2310 #3 VOUTL SDO VOUTR Figure 4. Daisy-Chaining Multiple PGA2310 Devices 10 " #$%& www.ti.com SBOS207B − OCTOBER 2001 − REVISED JUNE 2004 MUTE FUNCTION APPLICATIONS INFORMATION The PGA2310 includes a mute function. This function may be activated by either the MUTE input (pin 8), or by setting the gain byte value for one or both channels to 00HEX. The MUTE pin may be used to mute both channels, while the gain setting may be used to selectively mute the left and right channels. Muting is accomplished by switching the input multiplexer to analog ground (AGNDR or AGNDL) with zero crossing enabled. This section includes additional information that is pertinent to designing the PGA2310 into an end application. RECOMMENDED CONNECTION DIAGRAM Figure 5 depicts the recommended connections for the PGA2310. Power-supply bypass capacitors should be placed as close to the PGA2310 package as physically possible. The MUTE pin is active low. When MUTE is low, each channel will be muted following the next zero crossing event or timeout that occurs on that channel. If MUTE becomes active while CS is also active, the mute will take effect once the CS pin goes high. When the MUTE pin is high, the PGA2310 operates normally, with the mute function disabled. +5V Digital ZCEN CS 1 16 2 15 3 14 VINL SDI VOUTL C3 4 C1 Controller C2 13 − 15V Analog PGA2310 5 SCLK C4 +15V Analog 12 6 11 7 10 8 9 C5 C6 VOUTR SDO MUTE To Additional PGA2310s VINR C2, C3, C5 = 0.1µF ceramic or metal film. C1, C4, C6 = 10µF tantalum or aluminum electrolytic. DGND AGND Figure 5. Recommended Connection Diagram 11 " #$%& www.ti.com SBOS207B − OCTOBER 2001 − REVISED JUNE 2004 PRINTED CIRCUIT BOARD LAYOUT GUIDELINES It is recommended that the ground planes for the digital and analog sections of the printed circuit board (PCB) be separate from one another. The planes should be connected at a single point. Figure 6 shows the recommended PCB floor plan for the PGA2310. Analog Power Digital Power +5V DGND Host The PGA2310 is mounted so that it straddles the split between the digital and analog ground planes. Pins 1 through 8 are oriented to the digital side of the board, while pins 9 through 16 are on the analog side of the board. AGND − 15V +15V Analog Inputs and Outputs PGA2310 DIGITAL GROUND PLANE Digital Ground ANALOG GROUND PLANE Analog Ground Figure 6. Typical PCB Layout Floor Plan 12 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty PGA2310PA ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type PGA2310PAG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type PGA2310UA ACTIVE SOIC DW 16 48 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR PGA2310UA/1K ACTIVE SOIC DW 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR PGA2310UA/1KG4 ACTIVE SOIC DW 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR PGA2310UAG4 ACTIVE SOIC DW 16 CU NIPDAU Level-2-260C-1 YEAR 48 Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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