UCD7100 www.ti.com SLUS651C – MARCH 2005 – REVISED MAY 2010 Digital Control Compatible Single Low-Side ±4-A MOSFET Driver with Current Sense Check for Samples: UCD7100 FEATURES DESCRIPTION • • • • • The UCD7100 is a member of the UCD7K family of digital control compatible drivers for applications utilizing digital control techniques or applications requiring fast local peak current limit protection. 1 2 • • • • • • • Adjustable Current Limit Protection 3.3-V, 10-mA Internal Regulator DSP/µC Compatible Inputs Single ±4-A TrueDrive™ High Current Driver 10-ns Typical Rise and Fall Times with 2.2-nF Loads 25-ns Input-to-Output Propagation Delay 25-ns Current Sense to Output Delay Programmable Current Limit Threshold Digital Output Current Limit Flag 4.5-V to 15-V Supply Voltage Range Rated from -40°C to 105°C Lead(Pb)-Free Packaging APPLICATIONS • • • • Digitally Controlled Power Supplies DC/DC Converters Motor Controllers Line Drivers The UCD7100 is a low-side ±4-A high-current MOSFET gate driver. It allows the digital power controllers such as UCD9110 or UCD9501 to interface to the power stage in single ended topologies. It provides a cycle-by-cycle current limit function with programmable threshold and a digital output current limit flag which can be monitored by the host controller. With a fast 25-ns cycle-by-cycle current limit protection, the driver can turn off the power stage in the unlikely event that the digital system can not respond to a failure situation in time. For fast switching speeds, the UCD7100 output stage uses the TrueDrive™ output architecture, which delivers rated current of ±4 A into the gate of a MOSFET during the Miller plateau region of the switching transition. It also includes a 3.3-V, 10-mA linear regulator to provide power to the digital controller. TYPICAL APPLICATION DIAGRAMS VIN VOUT Bias Winding Digital Controller AN1 AGND UCD7100PWP 3 3V3 PWMA 2 IN INT 5 CLF VDD PWMB VDD 14 OUT 12 6 ILIM CS 8 4 AGND Communication 2 AN2 AN3 Isolation Amplifier 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. TrueDrive, PowerPAD are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2010, Texas Instruments Incorporated UCD7100 SLUS651C – MARCH 2005 – REVISED MAY 2010 www.ti.com DESCRIPTION (CONT.) The UCD7000 driver family is compatible with standard 3.3-V I/O ports of DSPs, Microcontrollers, or ASICs. UCD7100 is offered in a PowerPAD™ HTSSOP-14. CONNECTION DIAGRAMS PWP−14 PACKAGE (TOP VIEW) VDD IN 3V3 AGND CLF ILIM NC 14 13 12 11 10 9 8 1 2 3 4 5 6 7 PVDD PVDD OUT OUT PGND PGND CS NC − No internal connection ORDERING INFORMATION (1) (2) Temperature Range 110-V HV Startup Circuit -40°C to 105°C No Packaged Devices (1) PowerPAD™ HTSSOP-14 (PWP) UCD7100PWP HTSSOP-14 (PWP) package is available taped and reeled. Add R suffix to device type (e.g. UCD7100PWPR) to order quantities of 2,000 devices per reel for the PWP package. These products are packaged in Pb-Free and Green lead finish of Pd-Ni-Au which is compatible with MSL level 1 at 255°C to 260°C peak reflow temperature to be compatible with either lead free or Sn/Pb soldering operations. ABSOLUTE MAXIMUM RATINGS (1) SYMBOL VDD (2) PARAMETER Supply Voltage 20 Switching, TA = 25°C, TJ = 125°C, VDD = 12 V 200 VOUT Output Gate Drive Voltage OUT Output Gate Drive Current OUT IOUT(source) -1 V to VDD 4.0 -4.0 ISET, CS -0.3 to 3.6 ILIM -0.3 to 3.6 Digital I/O’s IN, CLF -0.3 to 3.6 Power Dissipation TA = 25°C, TJ = 125°C, (PWP-14) Analog Input 2.67 TJ Junction Operating Temperature -55 to 150 Tstr Storage Temperature -65 to 150 HBM CDM TSOL (2) 2 ESD Rating UNIT 16 Supply Current IOUT(sink) UCD7100 Quiescent IDD (1) (2) Human body model 2000 Change device model 500 Lead Temperature (Soldering, 10 sec) +300 mA V A V W °C V °C Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to GND. Currents are positive into, negative out of the specified terminal. Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated Product Folder Link(s): UCD7100 UCD7100 www.ti.com SLUS651C – MARCH 2005 – REVISED MAY 2010 RECOMMENDED OPERATING CONDITIONS PARAMETER Supply Voltage, VDD Supply bypass capacitance MIN TYP MAX UNIT 4.25 12 14.5 V 1 Reference bypass capacitance 0.22 Operating junction temperature -40 µF 105 °C TYP MAX UNIT ELECTRICAL CHARACTERISTICS VDD = 12 V, 4.7-µF capacitor from VDD to GND, TA = TJ = -40°C to 105°C, (unless otherwise noted). PARAMETER TEST CONDITIONS MIN SUPPLY SECTION Supply current, OFF VDD = 4.2 V 200 400 µA Supply current Outputs not switching IN = LOW 1.5 2.5 mA LOW VOLTAGE UNDER-VOLTAGE LOCKOUT VDD UVLO ON 4.25 4.5 4.75 VDD UVLO OFF 4.05 4.25 4.45 VDD UVLO hysteresis 150 250 350 3.267 3.3 3.333 3.234 3.3 3.366 V mV REFERENCE / EXTERNAL BIAS SUPPLY 3V3 initial set point TA = 25°C 3V3 over temperature 3V3 load regulation ILOAD = 1 mA to 10 mA, VDD = 5 V 1 6.6 3V3 line regulation VDD = 4.75 V to 12 V, ILOAD = 10 mA 1 6.6 Short circuit current VDD = 4.75 to 12 V 11 20 35 3V3 OK threshold, ON 3.3 V rising 2.9 3.0 3.1 3V3 OK threshold, OFF 3.3 V falling 2.7 2.8 2.9 V mV mA V INPUT SIGNAL HIGH, positive-going input threshold voltage (VIT+) 1.65 2.08 LOW negative-going input threshold voltage (VIT-) 1.16 1.5 0.6 0.8 Input voltage hysteresis, (VIT+ VIT-) Frequency 2 V MHz CURRENT LIMIT (ILIM) ILIM internal current limit threshold 0.466 0.50 0.536 ILIM maximum current limit threshold ILIM = 3.3 V ILIM = OPEN 0.975 1.025 1.075 ILIM current limit threshold ILIM = 0.75 V 0.700 0.725 0.750 ILIM minimum current limit threshold ILIM = 0.25 V 0.21 0.23 0.25 CLF output high level CS > ILIM , ILOAD = -7 mA 2.64 CLF output low level CS ≤ ILIM, ILOAD = 7 mA Propagation delay from IN to CLF IN rising to CLF falling after a current limit event 0.66 10 20 Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated Product Folder Link(s): UCD7100 V V mV V ns 3 UCD7100 SLUS651C – MARCH 2005 – REVISED MAY 2010 www.ti.com ELECTRICAL CHARACTERISTICS (continued) VDD = 12 V, 4.7-µF capacitor from VDD to GND, TA = TJ = -40°C to 105°C, (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX 5 25 50 UNIT CURRENT SENSE COMPARATOR Bias voltage Includes CS comp offset Input bias current –1 mV uA Propagation delay from CS to OUTx ILIM = 0.5 V, measured on OUTx, CS = threshold + 60 mV 25 40 Propagation delay from CS to CLF ILIM = 0.5 V, measured on CLF, CS = threshold + 60 mV 25 50 35 75 ns CURRENT SENSE DISCHARGE TRANSISTOR Discharge resistance IN = low, resistance from CS to AGND 10 Ω OUTPUT DRIVERS Source current (1) (1) Sink current Source current (1) (1) Sink current Rise time, tR (1) VDD = 12 V, IN = high, OUT = 5 V 4 VDD = 12 V, IN = low, OUT = 5 V 4 VDD = 4.75 V, IN = high, OUT = 0 2 VDD = 4.75 V, IN = low, OUT = 4.75 V A 3 CLOAD = 2.2 nF, VDD = 12 V 10 20 CLOAD = 2.2 nF, VDD = 12 V 10 15 Output with VDD < UVLO VDD = 1.0 V, ISINK = 10 mA 0.8 1.2 V Propagation delay from IN to OUTx, tD1 CLOAD = 2.2 nF, VDD = 12 V, CLK rising 20 35 ns Fall time, tF (1) (1) ns Ensured by design. Not 100% tested in production. VIT+ INPUT VIT− tF tF tD1 90% tD2 OUTPUT 10% NOTE The 10% and 90% thresholds depict the dynamics of the bipolar output devices that dominate the power MOSFET transition through the Miller regions of operation. 4 Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated Product Folder Link(s): UCD7100 UCD7100 www.ti.com SLUS651C – MARCH 2005 – REVISED MAY 2010 FUNCTIONAL BLOCK DIAGRAM 14 PVDD VDD 1 13 PVDD 3V3 Regulator & Reference UVLO 11 OUT IN 2 3V3 3 10 PGND AGND 4 25 mV Q SD Q + 9 PGND 8 CS + CLF 5 12 OUT R ILIM 6 N/C 7 Figure 1. UCD7100 Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated Product Folder Link(s): UCD7100 5 UCD7100 SLUS651C – MARCH 2005 – REVISED MAY 2010 www.ti.com TERMINAL FUNCTIONS UCD7100 PIN NAME I/O 1 VDD I Supply input pin to power the driver. The UCD7K devices accept an input range of 4.25 V to 15 V. Bypass the pin with at least 4.7 µF of capacitance. 2 2 IN I The IN pin is a high impedance digital input capable of accepting 3.3-V logic level signals up to 2 MHz. There is an internal Schmitt trigger comparator which isolates the internal circuitry from any external noise. 3 3 3V3 O Regulated 3.3-V rail. The onboard linear voltage regulator is capable of sourcing up to 10 mA of current. Place 0.22-µF of ceramic capacitance from the pin to ground. 4 4 AGND - Analog ground return. 5 5 CLF O Current limit flag. When the CS level is greater than the ILIM voltage minus 25 mV, the output of the driver is forced low and the current limit flag (CLF) is set high. The CLF signal is latched high until the UCD7K device receives the next rising edge on the IN pin. 6 6 ILIM I Current limit threshold set pin. The current limit threshold can be set to any value between 0.25 V and 1.0 V. 7 7 NC - No Connection. 8 8 CS I Current sense pin. Fast current limit comparator connected to the CS pin is used to protect the power stage by implementing cycle-by-cycle current limiting. 9 9 PGND - Power ground return. Connect the two PGNDs together. These ground pins should be connected very closely to the source of the power MOSFET. 10 10 PGND - Power ground return. Connect the two PGNDs together. These ground pins should be connected very closely to the source of the power MOSFET. 11 11 OUT O The high-current TrueDrive™ driver output. Connect the two OUT pins together. 12 12 OUT O The high-current TrueDrive™ driver output. Connect the two OUT pins together. 13 13 PVDD I Supply pin provides power for the output drivers. It is not connected internally to the VDD supply rail. Connect the two PVDD pins together. 14 14 PVDD I Supply pin provides power for the output drivers. It is not connected internally to the VDD supply rail. Connect the two PVDD pins together. HTSSOP -14 PIN # DFN-14 PIN # 1 6 FUNCTION Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated Product Folder Link(s): UCD7100 UCD7100 www.ti.com SLUS651C – MARCH 2005 – REVISED MAY 2010 APPLICATION INFORMATION The UCD7100 is part of a family of digital compatible drivers targeting applications utilizing digital control techniques or applications that require local fast peak current limit protection. Supply The UCD7K devices accept an input range of 4.5 V to 15 V. The device has an internal precision linear regulator that produces the 3V3 output from this VDD input. A separate pin, PVDD, not connected internally to the VDD supply rail provides power for the output drivers. In all applications the same bus voltage supplies the two pins. It is recommended that a low value of resistance be placed between the two pins so that the local capacitance on each pin forms low pass filters to attenuate any switching noise that may be on the bus. Although quiescent VDD current is low, total supply current will be higher, depending on the gate drive output current required by the switching frequency. Total VDD current is the sum of quiescent VDD current and the average OUT current. Knowing the operating frequency and the MOSFET gate charge (QG), average OUT current can be calculated from: IOUT = QG x f, where f is frequency. For high-speed circuit performance, a VDD bypass capacitor is recommended to prevent noise problems. A 4.7-µF ceramic capacitor should be located close to the VDD to ground connection. A larger capacitor with relatively low ESR should be connected to the PVDD pin, to help deliver the high current peaks to the load. The capacitors should present a low impedance characteristic for the expected current levels in the driver application. The use of surface mount components for all bypass capacitors is highly recommended. Reference / External Bias Supply All devices in the UCD7K family are capable of supplying a regulated 3.3-V rail to power various types of external loads such as a microcontroller or an ASIC. The onboard linear voltage regulator is capable of sourcing up to 10 mA of current. For normal operation, place a minimum of 0.22 µF of ceramic capacitance from the reference pin to ground. Input The IN pin is a high impedance digital input capable of accepting 3.3-V logic level signals up to 2 MHz. There is an internal Schmitt Trigger comparator which isolates the internal circuitry from any external noise. If limiting the rise or fall times to the power device is desired, then an external resistance can be added between the output of the driver and the load device, which is generally a power MOSFET gate. The external resistor may also help remove power dissipation from the package. Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated Product Folder Link(s): UCD7100 7 UCD7100 SLUS651C – MARCH 2005 – REVISED MAY 2010 www.ti.com Current Sensing and Protection A very fast current limit comparator connected to the CS pin is used to protect the power stage by implementing cycle-by-cycle current limiting. The current limit threshold is equal to the lesser of the positive inputs at the current limit comparator. The current limit threshold can be set to any value between 0.25 V and 1.0 V by applying the desired threshold voltage to the current limit (ILIM) pin. When the CS level is greater than the ILIM voltage minus 25 mV, the output of the driver is forced low and the current limit flag (CLF) is set high. The CLF signal is latched high until the UCD7K device receives the next rising edge on the IN pin. When the CS voltage is below ILIM, the driver output will follow the PWM input. The CLF digital output flag can be monitored by the host controller to determine when a current limit event occurs and to then apply the appropriate algorithm to obtain the desired current limit profile. One of the main benefits of this local protection feature is that the UCD7K devices can protect the power stage if the software code in the digital controller becomes corrupted and hangs up. If the controller’s PWM output stays high, the local current sense circuit will turn off the driver output when an over-current condition occurs. The system would likely go into a retry mode because; most DSP and microcontrollers have on-board watchdog, brown-out, and other supervisory peripherals to restart the device in the event that it is not operating properly. But these peripherals typically do not react fast enough to save the power stage. The UCD7K’s local current limit comparator provides the required fast protection for the power stage. The CS threshold is 25 mV below the ILIM voltage. This way, if the user attempts to command zero current (ILIM < 25 mV) while the CS pin is at ground, for example at start-up, the CLF flag latches high until the IN pin receives a pulse. At start-up it is necessary to ensure that the ILIM pin always greater than the CS pin for the handshaking to work as described below. If for any reason the CS pin comes to within 25 mV of the ILIM pin during start-up, then the CLF flag is latched high and the digital controller must poll the UCD7K device, by sending it a narrow IN pulse. If the fault condition is not present the IN pulse resets the CLF signal to low indicating that the UCD7K device is ready to process power pulses. 8 Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated Product Folder Link(s): UCD7100 UCD7100 www.ti.com SLUS651C – MARCH 2005 – REVISED MAY 2010 Handshaking The UCD7K family of devices have a built-in handshaking feature to facilitate efficient start-up of the digitally controlled power supply. At start-up the CLF flag is held high until all the internal and external supply voltages of the UCD7K device are within their operating range. Once the supply voltages are within acceptable limits, the CLF goes low and the device will process input drive signals. The micro-controller should monitor the CLF flag at start-up and wait for the CLF flag to go LOW before sending power pulses to the UCD7K device. Driver Output The high-current output stage of the UCD7K device family is capable of supplying ±4-A peak current pulses and swings to both VDD and GND. The driver outputs follows the state of the IN pin provided that the VDD and 3V3 voltages are above their respective under-voltage lockout threshold. The drive output utilizes Texas Instruments’ TrueDrive™ architecture, which delivers rated current into the gate of a MOSFET when it is most needed during the Miller plateau region of the switching transition providing efficiency gains. TrueDrive™ consists of pullup/ pulldown circuits using bipolar and MOSFET transistors in parallel. The peak output current rating is the combined current from the bipolar and MOSFET transistors. The output resistance is the RDS(on) of the MOSFET transistor when the voltage on the driver output is less than the saturation voltage of the bipolar transistor. This hybrid output stage also allows efficient current sourcing at low supply voltages. Each output stage also provides a very low impedance to overshoot and undershoot due to the body diode of the external MOSFET. This means that in many cases, external-schottky-clamp diodes are not required. Source/Sink Capabilities During Miller Plateau Large power MOSFETs present a large load to the control circuitry. Proper drive is required for efficient, reliable operation. The UCD7K drivers have been optimized to provide maximum drive to a power MOSFET during the Miller plateau region of the switching transition. This interval occurs while the drain voltage is swinging between the voltage levels dictated by the power topology, requiring the charging/discharging of the drain-gate capacitance with current supplied or removed by the driver device. See Reference [1] Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated Product Folder Link(s): UCD7100 9 UCD7100 SLUS651C – MARCH 2005 – REVISED MAY 2010 www.ti.com Drive Current and Power Requirements The UCD7K family of drivers can deliver high current into a MOSFET gate for a period of nanoseconds. High peak current is required to turn the device ON quickly. Then, to turn the driver is required to sink a similar amount of current to ground. This repeats at the operating power device. A MOSFET is used in this discussion because it is the most common type of used in high frequency power conversion equipment. several hundred device OFF, the frequency of the switching device Reference [1] discusses the current required to drive a power MOSFET and other capacitive-input switching devices. When a driver device is tested with a discrete, capacitive load it is a fairly simple matter to calculate the power that is required from the bias supply. The energy that must be transferred from the bias supply to charge the capacitor is given by: E + 1 CV2 2 (1) where C is the load capacitor and V is the bias voltage feeding the driver. There is an equal amount of energy transferred to ground when the capacitor is discharged. This leads to a power loss given by the following: P + 1 CV2 f 2 (2) where f is the switching frequency. This power is dissipated in the resistive elements of the circuit. Thus, with no external resistor between the driver and gate, this power is dissipated inside the driver. Half of the total power is dissipated when the capacitor is charged, and the other half is dissipated when the capacitor is discharged. An actual example using the conditions of the previous gate drive waveform should help clarify this. With VDD = 12 V, CLOAD = 10 nF, and f = 300 kHz, the power loss can be calculated as: P + 10 nF 122 300 kHz + 0.432 W (3) With a 12-V supply, this would equate to a current of: I + P + 0.432 W + 0.036 A V 12 V (4) The actual current measured from the supply was 0.037 A, and is very close to the predicted value. But, the IDD current that is due to the device internal consumption should be considered. With no load the device current drawn is 0.0027 A. Under this condition the output rise and fall times are faster than with a load. This could lead to an almost insignificant, yet measurable current due to cross-conduction in the output stages of the driver. However, these small current differences are buried in the high frequency switching spikes, and are beyond the measurement capabilities of a basic lab setup. The measured current with 10-nF load is close to the value expected. The switching load presented by a power MOSFET can be converted to an equivalent capacitance by examining the gate charge required to switch the device. This gate charge includes the effects of the input capacitance plus the added charge needed to swing the drain of the device between the ON and OFF states. Most manufacturers provide specifications that provide the typical and maximum gate charge, in nC, to switch the device under specified conditions. Using the gate charge QG, one can determine the power that must be dissipated when charging a capacitor. This is done by using the equivalence QG = CEFF x V to provide the following equation for power: P+C V2 f + QG V f (5) This equation allows a power designer to calculate the bias power required to drive a specific MOSFET gate at a specific bias voltage. 10 Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated Product Folder Link(s): UCD7100 UCD7100 www.ti.com SLUS651C – MARCH 2005 – REVISED MAY 2010 Thermal Information The useful range of a driver is greatly affected by the drive power requirements of the load and the thermal characteristics of the device package. In order for a power driver to be useful over a particular temperature range the package must allow for the efficient removal of the heat produced while keeping the junction temperature within rated limits. The UCD7K family of drivers is available in PowerPAD™ TSSOP package to cover a range of application requirements. Both have the exposed pads to relieve thermal dissipation from the semiconductor junction. As illustrated in Reference [2], the PowerPAD™ packages offer a leadframe die pad that is exposed at the base of the package. This pad is soldered to the copper on the PC board (PCB) directly underneath the device package, reducing the ΘJC down to 4.7°C/W. The PC board must be designed with thermal lands and thermal vias to complete the heat removal subsystem, as summarized in Reference [3]. Note that the PowerPAD™ is not directly connected to any leads of the package. However, it is electrically and thermally connected to the substrate which is the ground of the device. Circuit Layout Recommendations In a power driver operating at high frequency, it is a significant challenge to get clean waveforms without much overshoot/undershoot and ringing. The low output impedance of these drivers produces waveforms with high di/dt. This tends to induce ringing in the parasitic inductances. Utmost care must be used in the circuit layout. It is advantageous to connect the driver IC as close as possible to the leads. The driver device layout has the analog ground on the opposite side of the output, so the ground should be connected to the bypass capacitors and the load with copper trace as wide as possible. These connections should also be made with a small enclosed loop area to minimize the inductance. VIN VOUT Bias Supply Bias Winding UCD7100PWP 1 VDD 3 3V3 1 VDS 2 UCD91xx with CLA Peripheral PVDD 14 VDS PVDD 13 IN 2 4 AGND 5 CLF CS OUT 12 OUT 11 6 ILIM FB 7 NC PGND 10 PGND 9 2 CS 8 CS COMMUNICATION (Programming & Status Reporting) 2 Isolation Amplifier Figure 2. Isolated Forward Converter Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated Product Folder Link(s): UCD7100 11 UCD7100 SLUS651C – MARCH 2005 – REVISED MAY 2010 www.ti.com ~ VAC − + ~ Bias Supply VOUT UCD7100PWP 1 VDD 3 3V3 Signal Conditioning Amplifier UCD9501 Digital Controller PFC_ISENSE VDS PVDD 14 VDS PVDD 13 2 IN 4 AGND OUT 12 OUT 11 CS 5 CLF FB 6 ILIM PGND 10 PGND 9 7 NC CS 8 CS COMMUNICATION (Programming & Status Reporting) Signal Conditioning Amplifier Figure 3. PFC Boost Front-End Power Supply 12 Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated Product Folder Link(s): UCD7100 UCD7100 www.ti.com SLUS651C – MARCH 2005 – REVISED MAY 2010 TYPICAL CHARACTERISTICS UVLO THRESHOLDS vs TEMPERATURE 3V3 REFERENCE VOLTAGE vs TEMPERATURE 5.0 3.36 UVLO on 4.5 3.34 UVLO on 3V3 − Reference Voltage − V VUVLO − UVLO Thresholds − V 4.0 3.5 3.0 2.5 2.0 1.5 3.32 3.30 3.28 1.0 3.26 0.5 0.0 −50 UVLO on 3.24 −25 0 25 50 75 100 125 −50 −25 0 t − Temperature − °C Figure 4. Figure 5. 3V3 SHORT CIRCUIT CURRENT vs TEMPERATURE INPUT THRESHOLDS vs TEMPERATURE 125 100 125 Input Rising 22.5 2.0 VINPUT − Input Voltage − V ISHORT_CKT − Short Circuit Current − mA 100 2.5 23.0 22.0 VDD = 4.75 V 21.5 VDD = 12 V 21.0 1.5 Input Falling 1.0 0.5 20.5 20.0 −50 25 50 75 t − Temperature − °C 0.0 −25 0 25 50 75 t − Temperature − °C 100 125 −50 −25 0 25 50 75 TJ − Temperature − °C Figure 6. Figure 7. Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated Product Folder Link(s): UCD7100 13 UCD7100 SLUS651C – MARCH 2005 – REVISED MAY 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) OUTPUT RISE TIME AND FALL TIME vs TEMPERATURE (VDD = 12 V ) RISE TIME vs SUPPLY VOLTAGE 65 18.0 tR = Rise Time 55 CLOAD = 10 nF 14.0 12.0 10.0 tR − Rise Time − ns tR, tF − Rise and Fall Times − ns 16.0 tF = Fall Time 8.0 6.0 45 CLOAD = 4.7 nF 35 25 CLOAD = 2.2 nF 4.0 15 2.0 CLOAD = 1 nF 0.0 5 −50 −25 0 25 50 75 100 5 125 7.5 TJ − Temperature − °C 10 12.5 15 VDD − Supply Voltage − V Figure 8. Figure 9. FALL TIME vs SUPPLY VOLTAGE PROPAGATION DELAY RISING vs SUPPLY VOLTAGE 20 45 tF − Fall Time − ns 35 tPD − Propagation Delay, Rising − ns 40 CLOAD = 10 nF 30 25 CLOAD = 4.7 nF 20 CLOAD = 2.2 nF 15 CLOAD = 10 nF 15 10 CLOAD = 4.7 nF 5 CLOAD = 2.2 nF CLOAD = 1 nF 10 CLOAD = 1 nF 0 5 5 7.5 10 12.5 15 5 10 12.5 15 VDD − Supply Voltage − V VDD − Supply Voltage − V Figure 10. 14 7.5 Figure 11. Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated Product Folder Link(s): UCD7100 UCD7100 www.ti.com SLUS651C – MARCH 2005 – REVISED MAY 2010 TYPICAL CHARACTERISTICS (continued) PROPAGATION DELAY FALLING vs SUPPLY VOLTAGE DEFAULT CURRENT LIMIT THRESHOLD vs TEMPERATURE 0.54 0.53 VCS − Current Limit Threshold − V tPD − Propagation Delay, Falling − ns 25 CLOAD = 10 nF 20 15 CLOAD = 4.7 nF 10 CLOAD = 2.2 nF 0.52 0.51 0.50 0.49 0.48 0.47 CLOAD = 1 nF 5 0.46 5 7.5 10 12.5 15 −50 −25 25 50 75 Figure 12. Figure 13. CS TO OUTx PROPAGATION DELAY vs TEMPERATURE CS TO CLF PROPAGATION DELAY vs TEMPERATURE 40 100 125 50 45 35 tPD − CS to CLF Propagation Delay − ns tPD − CS to OUTx Propagation Delay − ns 0 TJ − Temperature − °C VDD − Supply Voltage − V 30 25 20 15 10 5 40 35 30 25 20 15 10 5 0 0 −50 −25 0 25 50 75 100 125 −50 −25 0 25 50 75 100 125 TJ − Temperature − °C TJ − Temperature − °C Figure 14. Figure 15. Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated Product Folder Link(s): UCD7100 15 UCD7100 SLUS651C – MARCH 2005 – REVISED MAY 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) IN TO OUT PROPAGATION DELAY vs TEMPERATURE START-UP BEHAVIOR AT VDD = 12 V (INPUT TIED TO 3V3) 35 VDD (2 V/div) tPD − Propagation Delay − ns 30 25 20 15 3V3 (2 V/div) 10 5 OUTx (2 V/div) 0 −50 −25 0 25 50 75 100 t − Time − 40 µs/div 125 TJ − Temperature − °C Figure 16. Figure 17. SHUT DOWN BEHAVIOR AT VDD = 12 V (INPUT TIED TO 3V3) START-UP BEHAVIOR AT VDD = 12 V (INPUT SHORTED TO GND) VDD (2 V/div) VDD (2 V/div) 3V3 (2 V/div) 3V3 (2 V/div) OUTx (2 V/div) OUTx (2 V/div) t − Time − 40 µs/div t − Time − 40 µs/div Figure 18. 16 Figure 19. Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated Product Folder Link(s): UCD7100 UCD7100 www.ti.com SLUS651C – MARCH 2005 – REVISED MAY 2010 TYPICAL CHARACTERISTICS (continued) SHUT DOWN BEHAVIOR AT VDD = 12 V (INPUT SHORTED TO GND) OUTPUT RISE AND FALL TIME (VDD = 12 V, CLOAD = 10 NF) Output Voltage − 2 V/div VDD (2 V/div) 3V3 (2 V/div) OUTx (2 V/div) t − Time − 40 ns/div t − Time − 40 µs/div Figure 20. Figure 21. Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated Product Folder Link(s): UCD7100 17 UCD7100 SLUS651C – MARCH 2005 – REVISED MAY 2010 www.ti.com REFERENCES 1. Power Supply Seminar SEM−1400 Topic 2: Design And Application Guide For High Speed MOSFET Gate Drive Circuits, by Laszlo Balogh, Texas Instruments Literature No. SLUP133. 2. Technical Brief, PowerPad Thermally Enhanced Package, Texas Instruments Literature No. SLMA002 3. Application Brief, PowerPAD Made Easy, Texas Instruments Literature No. SLMA004 RELATED PRODUCTS PRODUCT UCD7200 (1) (2) DESCRIPTION FEATURES 3V3, CS (1) Dual Low Side ±4-A Drivers with Independent CS (2) (1) (2) UCD7201 Dual Low Side ±4-A Drivers with Common CS 3V3, CS UCD7230 ±4A Synchronous Buck Driver with CS 3V3, CS (1) UCD9110 Digital Power Controller for High Performance Single-loop Applications (2) 3V3 = 3.3V linear regulator. CS = current sense and current limit function. REVISION HISTORY DATE 18 REVISION CHANGE DESCRIPTION 3/4/05 SLUS651 Initial release 4/29/09 SLUS651B Removed QFN package option and all references. 5/21/10 SLUS651C Removed part numbers, UCD7500, UCD7600, UCD7601 and UCD9501 from Related Products Section. Submit Documentation Feedback Copyright © 2005–2010, Texas Instruments Incorporated Product Folder Link(s): UCD7100 PACKAGE OPTION ADDENDUM www.ti.com 15-May-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty UCD7100PWP ACTIVE HTSSOP PWP 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCD7100PWPG4 ACTIVE HTSSOP PWP 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCD7100PWPR ACTIVE HTSSOP PWP 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCD7100PWPRG4 ACTIVE HTSSOP PWP 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 10-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device UCD7100PWPR Package Package Pins Type Drawing SPQ HTSSOP 2000 PWP 14 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 12.4 Pack Materials-Page 1 6.9 B0 (mm) K0 (mm) P1 (mm) 5.6 1.6 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 10-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UCD7100PWPR HTSSOP PWP 14 2000 346.0 346.0 29.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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