TI TMX320C6204GLW

TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
D High-Performance Fixed-Point Digital
D
D
D
D
D
Signal Processor (DSP) -- TMS320C6204
-- 5-ns Instruction Cycle Time
-- 200-MHz Clock Rate
-- Eight 32-Bit Instructions/Cycle
-- 1600 MIPS
C6204 GLW Ball Grid Array (BGA) Package
is Pin-Compatible With the C6202/02B/03
GLS BGA Package†
VelociTI™ Advanced Very-Long-InstructionWord (VLIW) TMS320C62x™ DSP Core
-- Eight Highly Independent Functional
Units:
-- Six ALUs (32-/40-Bit)
-- Two 16-Bit Multipliers (32-Bit Result)
-- Load-Store Architecture With 32 32-Bit
General-Purpose Registers
-- Instruction Packing Reduces Code Size
-- All Instructions Conditional
Instruction Set Features
-- Byte-Addressable (8-, 16-, 32-Bit Data)
-- 8-Bit Overflow Protection
-- Saturation
-- Bit-Field Extract, Set, Clear
-- Bit-Counting
-- Normalization
1M-Bit On-Chip SRAM
-- 512K-Bit Internal Program/Cache
(16K 32-Bit Instructions)
-- 512K-Bit Dual-Access Internal Data
(64K Bytes)
-- Organized as Two 32K-Byte Blocks for
Improved Concurrency
32-Bit External Memory Interface (EMIF)
-- Glueless Interface to Synchronous
Memories: SDRAM or SBSRAM
-- Glueless Interface to Asynchronous
Memories: SRAM and EPROM
-- 52M-Byte Addressable External Memory
Space
D Four-Channel Bootloading
D
D
D
D
D
D
D
D
D
Direct-Memory-Access (DMA) Controller
With an Auxiliary Channel
32-Bit Expansion Bus (XB)
-- Glueless/Low-Glue Interface to Popular
PCI Bridge Chips
-- Glueless/Low-Glue Interface to Popular
Synchronous or Asynchronous
Microprocessor Buses
-- Master/Slave Functionality
-- Glueless Interface to Synchronous FIFOs
and Asynchronous Peripherals
Two Multichannel Buffered Serial Ports
(McBSPs)
-- Direct Interface to T1/E1, MVIP, SCSA
Framers
-- ST-Bus-Switching Compatible
-- Up to 256 Channels Each
-- AC97-Compatible
-- Serial-Peripheral Interface (SPI)
Compatible (Motorola™)
Two 32-Bit General-Purpose Timers
Flexible Phase-Locked-Loop (PLL) Clock
Generator
IEEE-1149.1 (JTAG‡)
Boundary-Scan-Compatible
288-Pin MicroStar BGA™ Package (GHK)
340-Pin BGA Package (GLW)
0.15-μm/5-Level Metal Process
-- CMOS Technology
3.3-V I/Os, 1.5-V Internal
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
VelociTI, TMS320C62x, and MicroStar BGA are trademarks of Texas Instruments.
Motorola is a trademark of Motorola, Inc.
† For more details, see the GLW BGA package bottom view.
‡ IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
Copyright © 2004, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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1
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
Table of Contents
GHK and GLW BGA packages (bottom view) . . . . . . . . . . 3
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
device characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
C62x device compatibility . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
functional and CPU (DSP core) block diagram . . . . . . . . . 7
CPU (DSP core) description . . . . . . . . . . . . . . . . . . . . . . . . 8
memory map summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
peripheral register descriptions . . . . . . . . . . . . . . . . . . . . . 11
DMA channel synchronization events . . . . . . . . . . . . . . . 16
interrupt sources and interrupt selector . . . . . . . . . . . . . . 17
signal groups description . . . . . . . . . . . . . . . . . . . . . . . . . . 18
signal descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
development support . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
documentation support . . . . . . . . . . . . . . . . . . . . . . . . . . . .
clock PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
power-down mode logic . . . . . . . . . . . . . . . . . . . . . . . . . . .
power-supply sequencing . . . . . . . . . . . . . . . . . . . . . . . . .
absolute maximum ratings over operating case
temperature ranges . . . . . . . . . . . . . . . . . . . . . . . . . .
recommended operating conditions . . . . . . . . . . . . . . . . .
electrical characteristics over recommended
ranges of supply voltage and operating
case temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2
21
31
34
35
36
38
39
39
parameter measurement information . . . . . . . . . . . . . . . 41
input and output clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
asynchronous memory timing . . . . . . . . . . . . . . . . . . . . . 45
synchronous-burst memory timing . . . . . . . . . . . . . . . . . 48
synchronous DRAM timing . . . . . . . . . . . . . . . . . . . . . . . 50
HOLD/HOLDA timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
reset timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
external interrupt timing . . . . . . . . . . . . . . . . . . . . . . . . . . 57
expansion bus synchronous FIFO timing . . . . . . . . . . . 58
expansion bus asynchronous peripheral timing . . . . . . 60
expansion bus synchronous host-port timing . . . . . . . . 63
expansion bus asynchronous host-port timing . . . . . . . 69
XHOLD/XHOLDA timing . . . . . . . . . . . . . . . . . . . . . . . . . . 71
multichannel buffered serial port timing . . . . . . . . . . . . . 73
DMAC, timer, power-down timing . . . . . . . . . . . . . . . . . . 85
JTAG test-port timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
thermal/mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . 89
40
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
GHK and GLW BGA packages (bottom view)
GHK 288-PIN BALL GRID ARRAY (BGA) PACKAGE (BOTTOM VIEW)
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1
2
3
4
5
6
7
9
8
10
11
12
13
14
15
16
17
18
19
GLW 340-PIN BGA PACKAGE (BOTTOM VIEW)
AB
Y
V
T
P
M
K
H
F
D
B
AA
W
U
R
N
L
J
G
E
C
A
3
1
2
5
4
9
7
6
8
10
11 13 15 17 19 21
12 14 16 18 20 22
The C6204 GLW BGA package is pin-compatible with the C6202/02B/03 GLS package except that the
inner row of balls (which are additional power and ground pins) are removed for the C6204 GLW package.
These balls are NOT applicable for the C6204 devices 340-pin GLW BGA package.
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3
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
description
The TMS320C62x™ DSPs (including the TMS320C6204 device) compose the fixed-point DSP generation in
the TMS320C6000™ DSP platform. The TMS320C6204 (C6204) device is based on the high-performance,
advanced VelociTI™ very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI),
making the C6204 an excellent choice for multichannel and multifunction applications.
With performance of up to 1600 million instructions per second (MIPS) at a clock rate of 200 MHz, the C6204
offers cost-effective solutions to high-performance DSP-programming challenges. The C6204 DSP possesses
the operational flexibility of high-speed controllers and the numerical capability of array processors. This
processor has 32 general-purpose registers of 32-bit word length and eight highly independent functional units.
The eight functional units provide six arithmetic logic units (ALUs) for a high degree of parallelism and two 16-bit
multipliers for a 32-bit result. The C6204 can produce two multiply-accumulates (MACs) per cycle for a total of
400 million MACs per second (MMACS). The C6204 DSP also has application-specific hardware logic, on-chip
memory, and additional on-chip peripherals.
The C6204 includes a large bank of on-chip memory and has a powerful and diverse set of peripherals. Program
memory consists of a 64K-byte block that is user-configurable as cache or memory-mapped as program space.
Data memory consists of two 32K-byte blocks of RAM. The peripheral set includes two multichannel buffered
serial ports (McBSPs), two general-purpose timers, a 32-bit expansion bus (XB) that offers ease of interface
to synchronous or asynchronous industry-standard host bus protocols, and a glueless 32-bit external memory
interface (EMIF) capable of interfacing to SDRAM or SBSRAM and asynchronous peripherals.
The C6204 has a complete set of development tools which includes: a new C compiler, an assembly optimizer
to simplify programming and scheduling, and a Windows™ debugger interface for visibility into source code
execution.
device characteristics
Table 1 provides an overview of the TMS320C6204, TMS320C6202/02B, and the TMS320C6203
pin-compatible C62x™ DSPs. The table shows significant features of each device, including the capacity of
on-chip RAM, the peripherals, the execution time, and the package type with pin count, etc. This data sheet
primarily focuses on the functionality of the TMS320C6204 device although it also identifies to the user the
pin-compatibility of the 6204 GLW and the C6202/02B and C6203 GLS BGA packages. For the functionality
information on the TMS320C6202/02B devices, see the TMS320C6202, TMS320C6202B Fixed-Point Digital
Signal Processors Data Sheet (literature number SPRS104). For the functionality information on the
TMS320C6203 device, see the TMS320C6203 Fixed-Point Digital Signal Processor Data Sheet (literature
number SPRS086). And for more details on the C6000™ DSP device part numbers and part numbering, see
Table 14 and Figure 4.
TMS320C6000, C62x, and C6000 are trademarks of Texas Instruments.
Windows is a registered trademark of Microsoft Corporation.
4
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
device characteristics (continued)
Table 1. Characteristics of the Pin-Compatible TMS320C6204 and C6202/02B/03B/03C DSPs
HARDWARE FEATURES
C6204
C6202
C6202B
C6203B/C
EMIF
√
√
√
√
DMA
4-Channel With
Throughput
Enhancements
4-Channel
4-Channel With
Throughput
Enhancements
4-Channel With
Throughput
Enhancements
Expansion Bus
√
√
√
√
McBSPs
2
3
3
3
32-Bit Timers
2
2
2
2
Size (Bytes)
64K
256K
256K
384K
Organization
1 Block:
64K-Byte
Cache/Mapped
Program
Block 0:
128K-Byte Mapped
Program
Block 1:
128K-Byte
Cache/Mapped
Program
Block 0:
128K-Byte Mapped
Program
Block 1:
128K-Byte
Cache/Mapped
Program
Block 0:
256K-Byte Mapped
Program
Block 1:
128K-Byte
Cache/Mapped Program
Size (Bytes)
64K
128K
128K
512K
Internal Data
Memory
Organization
2 Blocks:
Four 16-Bit Banks
per Block
50/50 Split
2 Blocks:
Four 16-Bit Banks
per Block
50/50 Split
2 Blocks:
Four 16-Bit Banks
per Block
50/50 Split
2 Blocks:
Four 16-Bit Banks per
Block
50/50 Split
CPU ID +
Rev ID
Control Status Register
(CSR.[31:16])
0x0003
0x0002
0x0003
0x0003
Frequency
MHz
200
200, 250
250
250, 300 (03B)
300 (03C)
Cycle Time
ns
5 ns (C6204-200)
4 ns (C6202-250)
5 ns (C6202-200)
4 ns (C6202B-250)
3.33 ns (C6203C-300)
3.33 ns (C6203B-300)
4 ns (C6203B-250)
Core (V)
1.5
1.8
1.5
1.2 (C6203C)
1.5 (C6203B)
1.7 (C6203BGLS Only)
I/O (V)
3.3
3.3
3.3
3.3
x1, x4, x8, x10
(GJL Pkg)
x1, x4, x8, x10
(GJL Pkg)
All PLL Options
(GLS Pkg)
All PLL Options
(GLS Pkg)
Peripherals
Internal
Program
Memory
Voltage
PLL Options
BGA
Packages
CLKIN frequency multiplier
[Bypass (x1), x4, x6, x7,
x8, x9, x10, and x11]
x1, x4 (Both Pkgs)
x1, x4 (Both Pkgs)
27 x 27 mm
--
352-pin GJL
352-pin GJL
352-pin GNZ
18 x 18 mm
340-pin GLW
384-pin GLS
384-pin GLS
384-pin GLS
384-pin GNY
16 x 16 mm
288-pin GHK
--
--
--
0.15 μm
0.18 μm
0.15 μm
0.15 μm
PD
PD
PP
PD
Process
Technology
μm
Product
Status
Product Preview (PP)
Advance Information (AI)
Production Data (PD)
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5
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
C62x™ device compatibility
The TMS320C6202, C6202B, C6203, and C6204 devices are pin-compatible; thus, making new system
designs easier and providing faster time to market. The following list summarizes the C62x™ DSP device
characteristic differences:
D Core Supply Voltage (1.8 V versus 1.7 V, 1.5 V, 1.2 V)
The C6202 device core supply voltage is 1.8 V while the C6202B, C6203B, C6204 devices have core supply
voltages of 1.5 V. The C6203B device (GLS package only) has a 1.7-V core supply voltage, and the C6203C
device has a core supply voltage of 1.2 V.
D PLL Options Availability
Table 1 identifies the available PLL multiply factors [e.g., CLKIN x1 (PLL bypassed), x4, etc.] for each of the
C62x™ DSP devices. For additional details on the PLL clock module and specific options for the C6204
device, see the Clock PLL section of this data sheet.
For additional details on the PLL clock module and specific options for the C6202/02B/03 devices, see the
Clock PLL sections of the TMS320C6202, TMS320C6202B Fixed-Point Digital Signal Processors Data
Sheet (literature number SPRS104) and the TMS320C6203 Fixed-Point Digital Signal Processor Data
Sheet (literature number SPRS086).
D On-Chip Memory Size
The C6202/02B, C6203, and C6204 devices have different on-chip program memory and data memory
sizes (see Table 1).
D McBSPs
The C6204 device has two McBSPs on-chip while the C6202, C6202B, C6203 devices have three McBSPs
on-chip.
For a more detailed discussion on migration concerns, and similarities/differences between the C6202,
C6202B, C6203, and C6204 devices, see the How to Begin Development and Migrate Across the
TMS320C6202/6202B/6203/6204 DSPs Application Report (literature number SPRA603).
6
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
functional and CPU (DSP core) block diagram
C6204 Digital Signal Processor
SDRAM or
SBSRAM
SRAM
Program
Access/Cache
Controller
32
External Memory
Interface (EMIF)
ROM/FLASH
Internal Program Memory
64K
I/O Devices
C62x CPU (DSP Core)
Timer 0
Instruction Fetch
Timer 1
I/O Devices
HOST CONNECTION
Master /Slave
TI PCI2040
Power PC
683xx
960
32
Expansion
Bus (XB)
32-Bit
Control
Logic
Instruction Decode
Data Path B
Data Path A
A Register File
Multichannel
Buffered Serial
Port 1
.L1
DMA Bus
Interrupt
Selector
Synchronous
FIFOs
Instruction Dispatch
Multichannel
Buffered Serial
Port 0
Framing Chips:
H.100, MVIP,
SCSA, T1, E1
AC97 Devices,
SPI Devices,
Codecs
Control
Registers
.S1 .M1 .D1
Test
B Register File
.D2 .M2
.S2
In-Circuit
Emulation
.L2
Interrupt
Control
Peripheral Control Bus
DMA
4-Ch With
Throughput
PLL
(x1, x4)
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Access
Controller
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Logic
• HOUSTON, TEXAS 77251--1443
Internal Data
Memory
64K
Boot Configuration
7
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
CPU (DSP core) description
The CPU fetches VelociTI™ advanced very-long instruction words (VLIW) (256 bits wide) to supply up to eight
32-bit instructions to the eight functional units during every clock cycle. The VelociTI™ VLIW architecture
features controls by which all eight units do not have to be supplied with instructions if they are not ready to
execute. The first bit of every 32-bit instruction determines if the next instruction belongs to the same execute
packet as the previous instruction, or whether it should be executed in the following clock as a part of the next
execute packet. Fetch packets are always 256 bits wide; however, the execute packets can vary in size. The
variable-length execute packets are a key memory-saving feature, distinguishing the C62x CPU from other
VLIW architectures.
The CPU features two sets of functional units. Each set contains four units and a register file. One set contains
functional units .L1, .S1, .M1, and .D1; the other set contains units .D2, .M2, .S2, and .L2. The two register files
each contain 16 32-bit registers for a total of 32 general-purpose registers. The two sets of functional units, along
with two register files, compose sides A and B of the CPU [see the functional and CPU (DSP core) block diagram
and Figure 1]. The four functional units on each side of the CPU can freely share the 16 registers belonging to
that side. Additionally, each side features a single data bus connected to all the registers on the other side, by
which the two sets of functional units can access data from the register files on the opposite side. While register
access by functional units on the same side of the CPU as the register file can service all the units in a single
clock cycle, register access using the register file across the CPU supports one read and one write per cycle.
Another key feature of the C62x CPU is the load/store architecture, where all instructions operate on registers
(as opposed to data in memory). Two sets of data-addressing units (.D1 and .D2) are responsible for all data
transfers between the register files and the memory. The data address driven by the .D units allows data
addresses generated from one register file to be used to load or store data to or from the other register file. The
C62x CPU supports a variety of indirect addressing modes using either linear- or circular-addressing modes
with 5- or 15-bit offsets. All instructions are conditional, and most can access any one of the 32 registers. Some
registers, however, are singled out to support specific addressing or to hold the condition for conditional
instructions (if the condition is not automatically “true”). The two .M functional units are dedicated for multiplies.
The two .S and .L functional units perform a general set of arithmetic, logical, and branch functions with results
available every clock cycle.
The processing flow begins when a 256-bit-wide instruction fetch packet is fetched from a program memory.
The 32-bit instructions destined for the individual functional units are “linked” together by “1” bits in the least
significant bit (LSB) position of the instructions. The instructions that are “chained” together for simultaneous
execution (up to eight in total) compose an execute packet. A “0” in the LSB of an instruction breaks the chain,
effectively placing the instructions that follow it in the next execute packet. If an execute packet crosses the
256-bit-wide fetch-packet boundary, the assembler places it in the next fetch packet, while the remainder of the
current fetch packet is padded with NOP instructions. The number of execute packets within a fetch packet can
vary from one to eight. Execute packets are dispatched to their respective functional units at the rate of one per
clock cycle and the next 256-bit fetch packet is not fetched until all the execute packets from the current fetch
packet have been dispatched. After decoding, the instructions simultaneously drive all active functional units
for a maximum execution rate of eight instructions every clock cycle. While most results are stored in 32-bit
registers, they can be subsequently moved to memory as bytes or half-words as well. All load and store
instructions are byte-, half-word, or word-addressable.
8
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
CPU (DSP core) description (continued)
src1
src2
.L1
dst
long dst
long src
ST1
long src
long dst
dst
.S1
src1
Data Path A
8
8
32
8
Register
File A
(A0--A15)
src2
.M1
dst
src1
src2
LD1
DA1
.D1
dst
src1
src2
2X
1X
DA2
.D2
src2
src1
dst
LD2
src2
.M2
src1
dst
src2
Data Path B
src1
dst
long dst
long src
Register
File B
(B0--B15)
.S2
ST2
long src
long dst
dst
.L2
src2
8
32
8
8
src1
Control
Register
File
Figure 1. TMS320C62x CPU (DSP Core) Data Paths
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9
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
memory map summary
Table 2 shows the memory map address ranges of the C6204 device. The C6204 device has the capability of
a MAP 0 or MAP 1 memory block configuration. The maps differ in that MAP 0 has external memory mapped
at address 0x0000 0000 and MAP 1 has internal memory mapped at address 0x0000 0000. These memory
block configurations are set up at reset by the boot configuration pins (generically called BOOTMODE[4:0]). For
the C6204 device, the BOOTMODE configuration is handled, at reset, by the expansion bus module (specifically
XD[4:0] pins). For more detailed information on the C6204 device settings, which include the device boot mode
configuration at reset and other device-specific configurations, see TMS320C6201/C670x DSP Boot Modes
and Configuration (literature number SPRU642).
Table 2. TMS320C6204 Memory Map Summary
MEMORY BLOCK DESCRIPTION
BLOCK SIZE
(BYTES)
HEX ADDRESS RANGE
MAP 0
MAP 1
External Memory Interface (EMIF) CE0
Internal Program RAM
64K
0000 0000 – 0000 FFFF
EMIF CE0
Reserved
4M – 64K
0001 0000 – 003F FFFF
EMIF CE0
EMIF CE0
12M
0040 0000 – 00FF FFFF
EMIF CE1
EMIF CE0
4M
0100 0000 – 013F FFFF
Internal Program RAM
EMIF CE1
64K
0140 0000 – 0140 FFFF
EMIF CE1
Reserved
10
4M – 64K
0141 0000 – 017F FFFF
EMIF Registers
256K
0180 0000 – 0183 FFFF
DMA Controller Registers
256K
0184 0000 – 0187 FFFF
Expansion Bus (XBus) Registers
256K
0188 0000 – 018B FFFF
McBSP 0 Registers
256K
018C 0000 – 018F FFFF
McBSP 1 Registers
256K
0190 0000 – 0193 FFFF
Timer 0 Registers
256K
0194 0000 – 0197 FFFF
Timer 1 Registers
256K
0198 0000 – 019B FFFF
Interrupt Selector Registers
256K
019C 0000 – 019F FFFF
Reserved
6M
01A0 0000 – 01FF FFFF
EMIF CE2
16M
0200 0000 – 02FF FFFF
EMIF CE3
16M
0300 0000 – 03FF FFFF
Reserved
1G – 64M
0400 0000 – 3FFF FFFF
XBus XCE0
256M
4000 0000 – 4FFF FFFF
XBus XCE1
256M
5000 0000 – 5FFF FFFF
XBus XCE2
256M
6000 0000 – 6FFF FFFF
XBus XCE3
256M
7000 0000 – 7FFF FFFF
Internal Data RAM
64K
8000 0000 – 8000 FFFF
Reserved
2G – 64K
8001 0000 – FFFF FFFF
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
peripheral register descriptions
Table 3 through Table 11 identify the peripheral registers for the C6204 device by their register names,
acronyms, and hex address or hex address range. For more detailed information on the register contents, bit
names, and their descriptions, see the peripheral reference guide referenced in TMS320C6000 Peripherals
Reference Guide (literature number SPRU190).
Table 3. EMIF Registers
HEX ADDRESS RANGE
ACRONYM
0180 0000
GBLCTL
EMIF global control
REGISTER NAME
COMMENTS
0180 0004
CECTL1
EMIF CE1 space control
External or internal; dependant on MAP0 or MAP1
configuration (selected byt the MAP bit in the EMIF GBLCTL
register
0180 0008
CECTL0
EMIF CE0 space control
External or internal; dependant on MAP0 or MAP1
configuration (selected byt the MAP bit in the EMIF GBLCTL
register
0180 000C
--
0180 0010
CECTL2
EMIF CE2 space control
Corresponds to EMIF CE2 memory space:
[0200 0000 -- 02FF FFFF]
0180 0014
CECTL3
EMIF CE3 space control
Corresponds to EMIF CE3 memory space:
[0300 0000 -- 03FF FFFF]
0180 0018
SDCTL
EMIF SDRAM control
EMIF SDRAM refresh control
Reserved
0180 001C
SDTIM
0180 0020 -- 0180 0054
--
Reserved
0180 0058 -- 0183 FFFF
–
Reserved
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11
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
peripheral register descriptions (continued)
Table 4. DMA Registers
12
HEX ADDRESS RANGE
ACRONYM
0184 0000
PRICTL0
DMA channel 0 primary control
REGISTER NAME
0184 0004
PRICTL2
DMA channel 2 primary control
0184 0008
SECCTL0
DMA channel 0 secondary control
0184 000C
SECCTL2
DMA channel 2 secondary control
0184 0010
SRC0
DMA channel 0 source address
0184 0014
SRC2
DMA channel 2 source address
0184 0018
DST0
DMA channel 0 destination address
0184 001C
DST2
DMA channel 2 destination address
0184 0020
XFRCNT0
DMA channel 0 transfer counter
0184 0024
XFRCNT2
DMA channel 2 transfer counter
0184 0028
GBLCNTA
DMA global count reload register A
0184 002C
GBLCNTB
DMA global count reload register B
0184 0030
GBLIDXA
DMA global index register A
0184 0034
GBLIDXB
DMA global index register B
0184 0038
GBLADDRA
DMA global address register A
0184 003C
GBLADDRB
DMA global address register B
0184 0040
PRICTL1
DMA channel 1 primary control
0184 0044
PRICTL3
DMA channel 3 primary control
0184 0048
SECCTL1
DMA channel 1 secondary control
0184 004C
SECCTL3
DMA channel 3 secondary control
0184 0050
SRC1
DMA channel 1 source address
0184 0054
SRC3
DMA channel 3 source address
0184 0058
DST1
DMA channel 1 destination address
0184 005C
DST3
DMA channel 3 destination address
0184 0060
XFRCNT1
DMA channel 1 transfer counter
0184 0064
XFRCNT3
DMA channel 3 transfer counter
0184 0068
GBLADDRC
DMA global address register C
0184 006C
GBLADDRD
DMA global address register D
0184 0070
AUXCTL
DMA auxiliary control register
0184 0074 -- 0187 FFFF
–
Reserved
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
peripheral register descriptions (continued)
Table 5. Expansion Bus (XBUS) Registers
HEX ADDRESS RANGE
ACRONYM
0188 0000
XBGC
REGISTER NAME
COMMENTS
0188 0004
XCECTL1
XCE1 space control register
Corresponds to XBus XCE0 memory
space: [4000 0000 -- 4FFF FFFF]
0188 0008
XCECTL0
XCE0 space control register
Corresponds to XBus XCE1 memory
space: [5000 0000 -- 5FFF FFFF]
0188 000C
XBHC
Expansion bus host port interface control register
DSP read/write access only
0188 0010
XCECTL2
XCE2 space control register
Corresponds to XBus XCE2 memory
space: [6000 0000 -- 6FFF FFFF]
0188 0014
XCECTL3
XCE3 space control register
Corresponds to XBus XCE3 memory
space: [7000 0000 -- 7FFF FFFF]
Expansion bus global control register
0188 0018
--
Reserved
0188 001C
--
Reserved
0188 0020
XBIMA
Expansion bus internal master address register
DSP read/write access only
0188 0024
XBEA
Expansion bus external address register
DSP read/write access only
0188 0028 -- 018B FFFF
--
--
XBISA
--
XBD
Reserved
Expansion bus internal slave address
Expansion bus data
Table 6. Interrupt Selector Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
COMMENTS
019C 0000
MUXH
Interrupt multiplexer high
Selects which interrupts drive CPU interrupts
10--15 (INT10--INT15)
019C 0004
MUXL
Interrupt multiplexer low
Selects which interrupts drive CPU interrupts 4--9
(INT04--INT09)
019C 0008
EXTPOL
External interrupt polarity
Sets the polarity of the external interrupts
(EXT_INT4--EXT_INT7)
019C 000C -- 019C 01FF
--
019C 0200
PDCTL
019C 0204 -- 019F FFFF
--
Reserved
Peripheral power-down control register
Reserved
Table 7. Peripheral Power-Down Control Register
HEX ADDRESS RANGE
ACRONYM
019C 0200
PDCTL
REGISTER NAME
Peripheral power-down control register
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13
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
peripheral register descriptions (continued)
Table 8. McBSP 0 Registers
HEX ADDRESS RANGE
018C 0000
ACRONYM
REGISTER NAME
DRR0
McBSP0 data receive register
018C 0004
DXR0
McBSP0 data transmit register
018C 0008
SPCR0
018C 000C
RCR0
McBSP0 receive control register
018C 0010
XCR0
McBSP0 transmit control register
018C 0014
SRGR0
018C 0018
MCR0
McBSP0 multichannel control register
018C 001C
RCER0
McBSP0 receive channel enable register
018C 0020
XCER0
McBSP0 transmit channel enable register
018C 0024
PCR0
018C 0028 -- 018F FFFF
–
COMMENTS
The CPU and DMA/EDMA controller can
only read this register; they cannot write to it.
McBSP0 serial port control register
McBSP0 sample rate generator register
McBSP0 pin control register
Reserved
Table 9. McBSP 1 Registers
14
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
0190 0000
DRR1
Data receive register
0190 0004
DXR1
McBSP1 data transmit register
0190 0008
SPCR1
0190 000C
RCR1
McBSP1 receive control register
0190 0010
XCR1
McBSP1 transmit control register
0190 0014
SRGR1
McBSP1 serial port control register
McBSP1 sample rate generator register
0190 0018
MCR1
McBSP1 multichannel control register
0190 001C
RCER1
McBSP1 receive channel enable register
0190 0020
XCER1
McBSP1 transmit channel enable register
0190 0024
PCR1
0190 0028 -- 0193 FFFF
–
McBSP1 pin control register
Reserved
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COMMENTS
The CPU and DMA/EDMA controller can
only read this register; they cannot write to it.
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
peripheral register descriptions (continued)
Table 10. Timer 0 Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
COMMENTS
0194 0000
CTL0
Timer 0 control register
Determines the operating mode of the timer, monitors the
timer status, and controls the function of the TOUT pin.
0194 0004
PRD0
Timer 0 period register
Contains the number of timer input clock cycles to count.
This number controls the TSTAT signal frequency.
0194 0008
CNT0
Timer 0 counter register
Contains the current value of the incrementing counter.
0194 000C -- 0197 FFFF
--
Reserved
Table 11. Timer 1 Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
COMMENTS
0198 0000
CTL1
Timer 1 control register
Determines the operating mode of the timer, monitors the
timer status, and controls the function of the TOUT pin.
0198 0004
PRD1
Timer 1 period register
Contains the number of timer input clock cycles to count.
This number controls the TSTAT signal frequency.
0198 0008
CNT1
Timer 1 counter register
Contains the current value of the incrementing counter.
0198 000C -- 019B FFFF
--
Reserved
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15
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
DMA channel synchronization events
The C6204 DMA supports up to four independent programmable DMA channels. The four main DMA channels
can be read/write synchronized based on the events shown in Table 12. Selection of these events is done via
the RSYNC and WSYNC fields in the Primary Control registers (PRICTLx) of the specific DMA channel. The
default setting is “no synchronization” for all four DMA channels. For more detailed information on the DMA
module, associated channels, and event-synchronization, see TMS320C620x/C670x DSP Program and Data
Memory Controller / Direct Memory Access (DMA) Controller Reference Guide (literature number SPRU190).
Table 12. TMS320C6204 DMA Synchronization Events†
†
DMA EVENT
NUMBER
(BINARY)
EVENT NAME
00000
None
No Synchronization (default)
00001
TINT0
Timer 0 interrupt
00010
TINT1
Timer 1 interrupt
EVENT DESCRIPTION
00011
SD_INT
00100
EXT_INT4
EMIF SDRAM timer interrupt
External interrupt pin 4
00101
EXT_INT5
External interrupt pin 5
00110
EXT_INT6
External interrupt pin 6
00111
EXT_INT7
External interrupt pin 7
01000
DMA_INT0
DMA channel 0 interrupt
01001
DMA_INT1
DMA channel 1 interrupt
01010
DMA_INT2
DMA channel 2 interrupt
01011
DMA_INT3
DMA channel 3 interrupt
01100
XEVT0
McBSP0 transmit event
01101
REVT0
McBSP0 receive event
01110
XEVT1
McBSP1 transmit event
01111
REVT1
McBSP1 receive event
10000
DSP_INT
Host processor-to-DSP interrupt
10001 -- 11111
Reserved
Reserved. Not used.
For synchronization event selection, the PRICTLx register for the specific DMA channel needs to be programmed with a binary event number
identified in this table. The default setting is “no synchronization” for all four DMA channels.
16
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
interrupt sources and interrupt selector
The C62x DSP core supports 16 prioritized interrupts, which are listed in Table 13. The highest-priority interrupt
is INT_00 (dedicated to RESET) while the lowest-priority interrupt is INT_15. The first four interrupts
(INT_00--INT_03) are non-maskable and fixed. The remaining interrupts (INT_04--INT_15) are maskable and
default to the interrupt source specified in Table 13. The interrupt source for interrupts 4--15 can be programmed
by modifying the selector value (binary value) in the corresponding fields of the Interrupt Selector Control
registers: MUXH (address 0x019C0000) and MUXL (address 0x019C0004).
Table 13. C6204 DSP Interrupts
CPU
INTERRUPT
NUMBER
INTERRUPT
SELECTOR
CONTROL
REGISTER
SELECTOR
VALUE
(BINARY)
INTERRUPT
EVENT
INT_00†
--
--
RESET
INT_01†
--
--
NMI
INT_02†
--
--
Reserved
Reserved. Do not use.
INT_03†
--
--
Reserved
Reserved. Do not use.
INT_04‡
MUXL[4:0]
00100
EXT_INT4
External interrupt pin 4
INT_05‡
MUXL[9:5]
00101
EXT_INT5
External interrupt pin 5
INT_06‡
MUXL[14:10]
00110
EXT_INT6
External interrupt pin 6
INT_07‡
MUXL[20:16]
00111
EXT_INT7
External interrupt pin 7
INT_08‡
MUXL[25:21]
01000
DMA_INT0
DMA channel 0 interrupt
INT_09‡
MUXL[30:26]
01001
DMA_INT1
DMA channel 1 interrupt
INT_10‡
MUXH[4:0]
00011
SD_INT
INT_11‡
MUXH[9:5]
01010
DMA_INT2
DMA channel 2 interrupt
INT_12‡
MUXH[14:10]
01011
DMA_INT3
DMA channel 3 interrupt
INT_13‡
MUXH[20:16]
00000
DSP_INT
INT_14‡
MUXH[25:21]
00001
TINT0
Timer 0 interrupt
INT_15‡
MUXH[30:26]
00010
TINT1
Timer 1 interrupt
--
--
01100
XINT0
McBSP0 transmit interrupt
--
--
01101
RINT0
McBSP0 receive interrupt
--
--
01110
XINT1
McBSP1 transmit interrupt
--
--
01111
RINT1
McBSP1 receive interrupt
--
--
10000 -- 11111
Reserved
INTERRUPT SOURCE
EMIF SDRAM timer interrupt
Host-port interface (HPI)-to-DSP interrupt
Reserved. Do not use.
†
Interrupts INT_00 through INT_03 are non-maskable and fixed.
‡ Interrupts INT_04 through INT_15 are programmable by modifying the binary selector values in the Interrupt Selector Control registers fields.
Table 13 shows the default interrupt sources for Interrupts INT_04 through INT_15. For more detailed information on interrupt sources and
selection, see TMS320C6000 DSP Interrupt Selector Reference Guide (literature number SPRU646).
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
signal groups description
CLKIN
CLKOUT2
CLKOUT1
CLKMODE0
CLKMODE1
CLKMODE2
PLLV
PLLG
PLLF
TMS
TDO
TDI
TCK
TRST
EMU1
EMU0
Clock/PLL
Reset and
Interrupts
IEEE Standard
1149.1
(JTAG)
Emulation
RESET
NMI
EXT_INT7
EXT_INT6
EXT_INT5
EXT_INT4
IACK
INUM3
INUM2
INUM1
INUM0
DMA Status
DMAC3
DMAC2
DMAC1
DMAC0
Power-Down
Status
PD
RSV11
RSV10
RSV9
RSV8
RSV7
RSV6
RSV5
Reserved
RSV4
RSV3
RSV2
RSV1
RSV0
Control/Status
Figure 2. CPU (DSP Core) Signals
18
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
signal groups description (continued)
ED[31:0]
32
CE3
CE2
CE1
CE0
EA[21:2]
BE3
BE2
BE1
BE0
TOUT1
TINP1
Asynchronous
Memory
Control
Data
Memory Map
Space Select
20
Synchronous
Memory
Control
Word Address
HOLD/
HOLDA
Byte Enables
ARE
AOE
AWE
ARDY
SDA10
SDRAS/SSOE
SDCAS/SSADS
SDWE/SSWE
HOLD
HOLDA
EMIF
(External Memory Interface)
Timer 1
Timer 0
TOUT0
TINP0
Timers
McBSP1
McBSP0
CLKX1
FSX1
DX1
Transmit
Transmit
CLKX0
FSX0
DX0
CLKR1
FSR1
DR1
Receive
Receive
CLKR0
FSR0
DR0
CLKS1
Clock
Clock
CLKS0
McBSPs
(Multichannel Buffered Serial Ports)
Figure 3. Peripheral Signals
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19
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
signal groups description (continued)
XD[31:0]
XBE3/XA5
XBE2/XA4
XBE1/XA3
XBE0/XA2
XRDY
32
Data
Byte-Enable
Control/
Address
Control
Clocks
I/O Port
Control
XHOLD
XHOLDA
XFCLK
XOE
XRE
XWE/XWAIT
XCE3
XCE2
XCE1
XCE0
Arbitration
Expansion Bus
Host
Interface
Control
Figure 3. Peripheral Signals (Continued)
20
XCLKIN
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XCS
XAS
XCNTL
XW/R
XBLAST
XBOFF
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
Signal Descriptions
SIGNAL
NAME
PIN NO.
GHK
GLW†
TYPE‡
DESCRIPTION
CLOCK/PLL
CLKIN
J3
B10
I
Clock Input
CLKOUT1
T18
Y18
O
Clock output at full device speed
CLKOUT2
T19
AB19
O
CLKMODE0
L3
B12
I
Clock output at half of device speed
-
Used for synchronous memory interface
Clock mode selects
Selects what multiply factors of the input clock frequency the CPU frequency
equals.
For more details on CLKMODE pins and the PLL multiply factors, see the Clock PLL
section of this data sheet.
sheet
Note: For the C6204 GLW package, the CLKMODE2 (A14) and CLKMODE1 (A9) pins are
internally unconnected.
CLKMODE1
--
A9
I
CLKMODE2
--
A14
I
PLLV§
K5
C11
A¶
PLL analog VCC connection for the low-pass filter
PLLG§
L2
C12
A¶
PLL analog GND connection for the low-pass filter
A11
A¶
PLL low-pass filter connection to external components and a bypass capacitor
PLLF§
L1
JTAG EMULATION
TMS
E17
Y5
I
TDO
D19
AA4
O/Z
JTAG test-port mode select (features an internal pullup)
TDI
D18
Y4
I
JTAG test-port data in (features an internal pullup)
TCK
D17
AB2
I
JTAG test-port clock
TRST
C19
AA3
I
JTAG test-port reset (features an internal pulldown)
EMU1
E18
AA5
I/O/Z
Emulation pin 1, pullup with a dedicated 20-kΩ resistor#
EMU0
F15
AB4
I/O/Z
Emulation pin 0, pullup with a dedicated 20-kΩ resistor#
JTAG test-port data out
RESET AND INTERRUPTS
†
‡
§
¶
#
RESET
E8
J3
I
NMI
A8
K2
I
EXT_INT7
B15
U2
EXT_INT6
C15
U3
EXT_INT5
A16
W1
EXT_INT4
B16
V2
IACK
A15
V1
INUM3
F12
R3
INUM2
A14
T1
INUM1
B14
T2
INUM0
C14
T3
Device reset
Nonmaskable interrupt
-
Edge-driven (rising edge)
External interrupts
I
O
-
Edge-driven
-
Polarity independently selected via the external interrupt polarity register bits
(EXTPOL.[3:0])
Interrupt acknowledge for all active interrupts serviced by the CPU
A ti interrupt
Active
i t
t id
identification
tifi ti number
b
O
-
Valid during IACK for all active interrupts (not just external)
Encoding order follows the interrupt-service
interrupt service fetch-packet
fetch packet ordering
The C6204 GLW BGA package is a subset of the GLS package (C6202/02B/03), with the inner row of core supply voltage (CVDD) and ground
(VSS) pins removed (see the GLW BGA package bottom view).
I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
PLLV, PLLG, and PLLF are not part of external voltage supply or ground. See the clock PLL section for information on how to connect these pins.
A = Analog Signal (PLL Filter)
For emulation and normal operation, pull up EMU1 and EMU0 with a dedicated 20-kΩ resistor. For boundary scan, pull down EMU1 and EMU0
with a dedicated 20-kΩ resistor.
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
Signal Descriptions (Continued)
SIGNAL
NAME
PIN NO.
GHK
GLW†
TYPE‡
DESCRIPTION
POWER-DOWN STATUS
PD
B18
Y2
O
Power-down modes 2 or 3 (active if high)
XCLKIN
H5
C8
I
Expansion bus synchronous host interface clock input
O
Expansion bus FIFO interface clock output
EXPANSION BUS
XFCLK
G2
A8
XD31
M1
C13
XD30
M2
A13
XD29
M3
C14
XD28
N1
B14
XD27
N2
B15
XD26
N3
C15
XD25
P1
A15
XD24
P2
B16
XD23
N5
C16
XD22
R1
A17
XD21
R2
B17
Expansion
p
bus data
XD20
P5
C17
-
Used for transfer of data, address, and control
XD19
T1
B18
-
XD18
T2
A19
XD17
U1
C18
Also controls initialization of DSP modes and expansion bus at reset via pullup/
pulldown resistors
p
(Note: Reserved boot configuration fields should be pulled down.)
XD16
T3
B19
XD15
U2
C19
XD14
V1
B20
XD13
V2
A21
XD12
W2
C21
XD11
U4
D20
XD10
W3
B22
XD9
V4
D21
XD8
W4
E20
XD7
U5
E21
XD6
V5
D22
XD5
W5
F20
XD4
U6
F21
XD3
V6
E22
XD2
V3
G20
XD1
W6
G21
XD0
U7
G22
I/O/Z
XD[30:16]
XD13
XD12
XD11
XD10
XD9
XD8
XD[4:0]
Others
----------
XCE[3:0] memory type
XBLAST polarity
p
y
XW/R polarity
l i
Asynchronous or synchronous host operation
Arbitration mode (internal or external)
FIFO mode
Littl
Little endian/big
di /bi endian
di
Boot mode
Reserved
†
The C6204 GLW BGA package is a subset of the GLS package (C6202/02B/03), with the inner row of core supply voltage (CVDD) and ground
(VSS) pins removed (see the GLW BGA package bottom view).
‡ I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
22
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
Signal Descriptions (Continued)
SIGNAL
NAME
PIN NO.
TYPE‡
DESCRIPTION
GHK
GLW†
XCE3
B4
D2
XCE2
A3
B1
XCE1
C4
D3
XCE0
B3
C2
XBE3/XA5
E3
C5
XBE2/XA4
E2
A4
XBE1/XA3
E1
B5
XBE0/XA2
F3
C6
XOE
F5
A6
O/Z
Expansion bus I/O port output-enable
XRE
F1
C7
O/Z
Expansion bus I/O port read-enable
XWE/XWAIT
G3
B7
O/Z
Expansion bus I/O port write-enable and host-port wait signals
XCS
H1
C9
I
XAS
F2
B6
I/O/Z
XCNTL
H2
B9
I
XW/R
H3
B8
I/O/Z
Expansion bus host-port write/read enable. XW/R polarity is selected at reset.
XRDY
D2
C4
I/O/Z
Expansion bus host-port ready (active low) and I/O port ready (active high)
XBLAST
D1
B4
I/O/Z
Expansion bus host-port burst last-polarity selected at reset
XBOFF
J1
A10
I
XHOLD
C2
A2
I/O/Z
Expansion bus hold request
XHOLDA
C1
B3
I/O/Z
Expansion bus hold acknowledge
EXPANSION BUS (CONTINUED)
E
Expansion
i bus
b I/O portt memory space enables
bl
O/Z
-
Enabled by bits 28, 29, and 30 of the word address
Only one asserted during any I/O port data access
E
Expansion
i bus
b multiplexed
lti l
d byte-enable
b t
bl control/address
t l/ dd
signals
i
l
I/O/Z
-
Act as byte-enable for host port operation
Act as address for I/O port operation
Expansion bus host-port chip-select input
Expansion bus host-port address strobe
Expansion bus host control. XCNTL selects between expansion bus address or data register.
Expansion bus back off
EMIF -- CONTROL SIGNALS COMMON TO ALL TYPES OF MEMORY
CE3
V18
Y21
CE2
U17
W20
CE1
W18
AA22
CE0
V17
W21
BE3
U16
V20
BE2
W17
V21
BE1
V16
W22
BE0
W16
U20
M
Memory
space enables
bl
O/Z
-
Enabled by bits 24 and 25 of the word address
Only one asserted during any external data access
Byte-enable control
O/Z
-
Decoded from the two lowest bits of the internal address
Byte-write
Byte write enables for most types of memory
Can be directly connected to SDRAM read and write mask signal (SDQM)
†
The C6204 GLW BGA package is a subset of the GLS package (C6202/02B/03), with the inner row of core supply voltage (CVDD) and ground
(VSS) pins removed (see the GLW BGA package bottom view).
‡ I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
Signal Descriptions (Continued)
SIGNAL
NAME
PIN NO.
GHK
GLW†
EA21
V7
H20
EA20
W7
H21
EA19
U8
H22
EA18
V8
J20
EA17
W8
J21
EA16
W9
K21
EA15
V9
K20
EA14
U9
K22
EA13
W10
L21
EA12
V10
L20
EA11
U10
L22
EA10
W11
M20
EA9
V11
M21
EA8
U11
N22
EA7
R11
N20
EA6
W12
N21
EA5
U12
P21
TYPE‡
DESCRIPTION
EMIF -- ADDRESS
EA4
R12
P20
EA3
W13
R22
EA2
V13
R21
ED31
F14
Y6
ED30
E19
AA6
ED29
F17
AB6
ED28
G15
Y7
ED27
F18
AA7
ED26
F19
AB8
ED25
G17
Y8
ED24
G18
AA8
ED23
G19
AA9
ED22
H17
Y9
ED21
H18
AB10
ED20
H19
Y10
ED19
J18
AA10
ED18
J19
AA11
ED17
K15
Y11
ED16
K17
AB12
ED15
K18
Y12
ED14
K19
AA12
O/Z
External address (word address)
EMIF -- DATA
I/O/Z
External data
†
The C6204 GLW BGA package is a subset of the GLS package (C6202/02B/03), with the inner row of core supply voltage (CVDD) and ground
(VSS) pins removed (see the GLW BGA package bottom view).
‡ I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
24
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
Signal Descriptions (Continued)
SIGNAL
NAME
PIN NO.
TYPE‡
DESCRIPTION
GHK
GLW†
ED13
L17
AA13
ED12
L18
Y13
ED11
L19
AB13
ED10
M19
Y14
ED9
M18
AA14
ED8
M17
AA15
ED7
N19
Y15
ED6
P19
AB15
ED5
N15
AA16
ED4
P18
Y16
ED3
P17
AB17
ED2
R19
AA17
ED1
R18
Y17
ED0
R17
AA18
ARE
U14
T21
O/Z
Asynchronous memory read-enable
AOE
W14
R20
O/Z
Asynchronous memory output-enable
AWE
V14
T22
O/Z
Asynchronous memory write-enable
ARDY
W15
T20
I
Asynchronous memory ready input
EMIF -- DATA (CONTINUED)
I/O/Z
External data
EMIF -- ASYNCHRONOUS MEMORY CONTROL
EMIF -- SYNCHRONOUS DRAM (SDRAM)/SYNCHRONOUS BURST SRAM (SBSRAM) CONTROL
SDA10
U19
AA19
O/Z
SDRAM address 10 (separate for deactivate command)
SDCAS/SSADS
V19
AB21
O/Z
SDRAM column-address strobe/SBSRAM address strobe
SDRAS/SSOE
U18
Y19
O/Z
SDRAM row-address strobe/SBSRAM output-enable
SDWE/SSWE
T17
AA20
O/Z
SDRAM write-enable/SBSRAM write-enable
EMIF -- BUS ARBITRATION
HOLD
P14
V22
I
Hold request from the host
HOLDA
V15
U21
O
Hold-request-acknowledge to the host
TOUT0
E5
D1
O
Timer 0 or general-purpose output
TINP0
C5
E2
I
Timer 0 or general-purpose input
TOUT1
A5
F2
O
Timer 1 or general-purpose output
TINP1
B5
F3
I
Timer 1 or general-purpose input
DMAC3
A17
V3
TIMER 0
TIMER 1
DMA ACTION COMPLETE STATUS
DMAC2
B17
W2
DMAC1
C16
AA1
DMAC0
A18
W3
O
DMA action complete
†
The C6204 GLW BGA package is a subset of the GLS package (C6202/02B/03), with the inner row of core supply voltage (CVDD) and ground
(VSS) pins removed (see the GLW BGA package bottom view).
‡ I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
Signal Descriptions (Continued)
SIGNAL
NAME
PIN NO.
GHK
GLW†
TYPE‡
DESCRIPTION
MULTICHANNEL BUFFERED SERIAL PORT 0 (McBSP0)
CLKS0
A12
K3
I
CLKR0
B9
L2
I/O/Z
External clock source (as opposed to internal)
Receive clock
CLKX0
C9
K1
I/O/Z
Transmit clock
DR0
A10
M2
I
Receive data
DX0
B10
M3
O/Z
Transmit data
FSR0
E10
M1
I/O/Z
Receive frame sync
FSX0
A9
L3
I/O/Z
Transmit frame sync
MULTICHANNEL BUFFERED SERIAL PORT 1 (McBSP1)
CLKS1
C6
E1
I
CLKR1
B6
G2
I/O/Z
External clock source (as opposed to internal)
Receive clock
CLKX1
E6
G3
I/O/Z
Transmit clock
DR1
A7
H1
I
Receive data
DX1
B7
H2
O/Z
Transmit data
FSR1
C7
H3
I/O/Z
Receive frame sync
FSX1
A6
G1
I/O/Z
Transmit frame sync
RESERVED FOR TEST
RSV0
C8
J2
I
Reserved for testing, pullup with a dedicated 20-kΩ resistor
RSV1
A4
E3
I
Reserved for testing, pullup with a dedicated 20-kΩ resistor
RSV2
K3
B11
I
Reserved for testing, pullup with a dedicated 20-kΩ resistor
RSV3
L5
B13
O
Reserved (leave unconnected, do not connect to power or ground)
RSV4
B19
C10
O
Reserved (leave unconnected, do not connect to power or ground)
RSV5
C17
N1
I
Reserved (leave unconnected)
RSV6
D3
N2
I/O
Reserved (leave unconnected)
RSV7
K2
N3
I/O
Reserved (leave unconnected)
RSV8
J17
R2
I
Reserved (leave unconnected)
RSV9
N18
R1
O
Reserved (leave unconnected)
RSV10
C11
P3
I/O
Reserved (leave unconnected)
RSV11
--
P2
I/O
Reserved (leave unconnected) [For C6204 GLW packages only]
†
The C6204 GLW BGA package is a subset of the GLS package (C6202/02B/03), with the inner row of core supply voltage (CVDD) and ground
(VSS) pins removed (see the GLW BGA package bottom view).
‡ I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
26
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
Signal Descriptions (Continued)
SIGNAL
NAME
PIN NO.
GHK
GLW†
A2
A3
TYPE‡
DESCRIPTION
SUPPLY VOLTAGE PINS
DVDD
B1
A7
B2
A16
C3
A20
E7
D4
E9
D6
E11
D7
E13
D9
F6
D10
G1
D13
H14
D14
J6
D16
K14
D17
L6
D19
L15
F1
M14
F4
P3
F19
P15
F22
R3
G4
R6
G19
R7
J4
R8
J19
R9
K4
R10
K19
R13
L1
R14
M22
U3
N4
U15
N19
--
P4
--
P19
--
T4
--
T19
--
U1
--
U4
--
U19
--
U22
--
W4
--
W6
--
W7
S
3.3-V
3.3
V supply voltage (I/O)
†
The C6204 GLW BGA package is a subset of the GLS package (C6202/02B/03), with the inner row of core supply voltage (CVDD) and ground
(VSS) pins removed (see the GLW BGA package bottom view).
‡ I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
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27
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
Signal Descriptions (Continued)
SIGNAL
NAME
PIN NO.
GHK
GLW†
--
W9
--
W10
--
W13
--
W14
--
W16
--
W17
--
W19
--
AB5
--
AB9
--
AB14
--
AB18
B12
E7
TYPE‡
DESCRIPTION
SUPPLY VOLTAGE PINS (CONTINUED)
DVDD
CVDD
E14
E8
F9
E10
F10
E11
G5
E12
H15
E13
J2
E15
J5
E16
J15
G5
M5
G18
M15
H5
N17
H18
P6
K5
P9
K18
P12
L5
U13
L18
--
M5
--
M18
--
N5
--
N18
--
R5
--
R18
--
T5
--
T18
--
V7
--
V8
--
V10
--
V11
S
3.3-V
3.3
V supply voltage (I/O)
S
1 5 V supply voltage (core)
1.5-V
†
The C6204 GLW BGA package is a subset of the GLS package (C6202/02B/03), with the inner row of core supply voltage (CVDD) and ground
(VSS) pins removed (see the GLW BGA package bottom view).
‡ I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
28
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
Signal Descriptions (Continued)
SIGNAL
NAME
PIN NO.
GHK
GLW†
--
V12
--
V13
--
V15
--
V16
A11
A1
TYPE‡
DESCRIPTION
SUPPLY VOLTAGE PINS (CONTINUED)
CVDD
S
1 5 V supply voltage (core)
1.5-V
GROUND PINS
VSS
A13
A5
B8
A12
B11
A18
B13
A22
C10
B2
C12
B21
C13
C1
C18
C3
E12
C20
G7
C22
G8
D5
G9
D8
G10
D11
G11
D12
G12
D15
G13
D18
H7
E4
H8
E5
H9
E6
H10
E9
H11
E14
H12
E17
H13
E18
J7
E19
J8
F5
J9
F18
J10
H4
J11
H19
J12
J1
J13
J5
K1
J18
K7
J22
GND
Ground pins
†
The C6204 GLW BGA package is a subset of the GLS package (C6202/02B/03), with the inner row of core supply voltage (CVDD) and ground
(VSS) pins removed (see the GLW BGA package bottom view).
‡ I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
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29
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
Signal Descriptions (Continued)
SIGNAL
NAME
PIN NO.
GHK
GLW†
K8
L4
TYPE‡
DESCRIPTION
GROUND PINS (CONTINUED)
VSS
K9
L19
K10
M4
K11
M19
K12
P1
K13
P5
L7
P18
L8
P22
L9
R4
L10
R19
L11
U5
L12
U18
L13
V4
M7
V5
M8
V6
M9
V9
M10
V14
M11
V17
M12
V18
M13
V19
N7
W5
N8
W8
N9
W11
N10
W12
N11
W15
N12
W18
N13
Y1
V12
Y3
--
Y20
--
Y22
--
AA2
--
AA21
--
AB1
--
AB3
--
AB7
--
AB11
--
AB16
--
AB20
--
AB22
GND
Ground pins
†
The C6204 GLW BGA package is a subset of the GLS package (C6202/02B/03), with the inner row of core supply voltage (CVDD) and ground
(VSS) pins removed (see the GLW BGA package bottom view).
‡ I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
30
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
development support
TI offers an extensive line of development tools for the TMS320C6000™ DSP platform, including tools to
evaluate the performance of the processors, generate code, develop algorithm implementations, and fully
integrate and debug software and hardware modules.
The following products support development of C6000™ DSP-based applications:
Software Development Tools:
Code Composer Studio™ Integrated Development Environment (IDE) including Editor
C/C++/Assembly Code Generation, and Debug plus additional development tools
Scalable, Real-Time Foundation Software (DSP BIOS), which provides the basic run-time target software
needed to support any DSP application.
Hardware Development Tools:
Extended Development System (XDS™) Emulator (supports C6000™ DSP multiprocessor system debug)
EVM (Evaluation Module)
The TMS320 DSP Development Support Reference Guide (SPRU011) contains information about
development-support products for all TMS320™ DSP family member devices, including documentation. See
this document for further information on TMS320™ DSP documentation or any TMS320™ DSP support products
from Texas Instruments. An additional document, the TMS320 Third-Party Support Reference Guide
(SPRU052), contains information about TMS320™ DSP-related products from other companies in the industry.
To receive TMS320™ DSP literature, contact the Literature Response Center at 800/477-8924.
For a complete listing of development-support tools for the TMS320C6000 DSP platform, visit the Texas
Instruments web site on the Worldwide Web at http://www.ti.com uniform resource locator (URL) and select
“Find Development Tools”. For device-specific tools, under “Semiconductor Products” select “Digital Signal
Processors”, choose a product family, and select the particular DSP device. For information on pricing and
availability, contact the nearest TI field sales office or authorized distributor.
Code Composer Studio, XDS, and TMS320 are trademarks of Texas Instruments.
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
device and development-support tool nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
TMS320™ DSP devices and support tools. Each TMS320™ DSP commercial family member has one of three
prefixes: TMX, TMP, or TMS. Texas Instruments recommends two of three possible prefix designators for
support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from
engineering prototypes (TMX/TMDX) through fully qualified production devices/tools (TMS/TMDS).
Device development evolutionary flow:
TMX
Experimental device that is not necessarily representative of the final device’s electrical
specifications
TMP
Final silicon die that conforms to the device’s electrical specifications but has not completed
quality and reliability verification
TMS
Fully qualified production device
Support tool development evolutionary flow:
TMDX
Development-support product that has not yet completed Texas Instruments internal qualification
testing.
TMDS
Fully qualified development-support product
TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:
“Developmental product is intended for internal evaluation purposes.”
TMS devices and TMDS development-support tools have been characterized fully, and the quality and reliability
of the device have been demonstrated fully. TI’s standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system because their
expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type
(for example, GLW), the temperature range (for example, blank is the default commercial temperature range),
and the device speed range in megahertz (for example, -200 is 200 MHz).
Table 14 lists the device orderable part numbers (P/Ns) and Figure 4 provides a legend for reading the complete
device name for any TMS320C6000™ DSP family member. For more information on the C6204 device
orderable P/Ns, visit the Texas Instruments web site on the Worldwide web at http://www.ti.com URL, or contact
the nearest TI field sales office or authorized distributor.
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
device and development-support tool nomenclature (continued)
Table 14. TMS320C6204 Device Part Numbers (P/Ns) and Ordering Information
DEVICE ORDERABLE P/N
DEVICE SPEED
CVDD
(CORE VOLTAGE)
DVDD
(I/O VOLTAGE)
OPERATING CASE
TEMPERATURE
RANGE
TMS320C6204GHK
200 MHz/1600 MIPS
1.5 V
3.3 V
0_C to 90_C
TMS320C6204GLW
200 MHz/1600 MIPS
1.5 V
3.3 V
0_C to 90_C
TMS 320
C
6204
PREFIX
TMX = Experimental device
TMP = Prototype device
TMS = Qualified device
SMX= Experimental device, MIL
SMJ = MIL-PRF-38535, QML
SM = High Rel (non-38535)
GLW
( )
200
DEVICE SPEED RANGE
100 MHz
120 MHz
150 MHz
167 MHz
PACKAGE TYPE†
GFN = 256-pin plastic BGA
GGP = 352-pin plastic BGA
GJC = 352-pin plastic BGA
GJL = 352-pin plastic BGA
GLS = 384-pin plastic BGA
GLW = 340-pin plastic BGA
GNY = 384-pin plastic BGA
GNZ = 352-pin plastic BGA
GLZ = 532-pin plastic BGA
GHK = 288-pin plastic MicroStar BGAt
TECHNOLOGY
C = CMOS
DEVICE
C6000 DSP:
6201
6202
6202B
6203B
6203C
BGA =
QFP =
400 MHz
500 MHz
600 MHz
TEMPERATURE RANGE (DEFAULT: 0°C TO 90°C)
Blank = 0°C to 90°C, commercial temperature
A
= --40°C to 105°C, extended temperature
DEVICE FAMILY
320 = TMS320t DSP family
†
200 MHz
233 MHz
250 MHz
300 MHz
6204
6205
6211
6211B
6414
6415
6416
6701
6711
6711B
6712
6713
Ball Grid Array
Quad Flatpack
Figure 4. TMS320C6000™ DSP Platform Device Nomenclature (Including the TMS320C6204)
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
documentation support
Extensive documentation supports all TMS320™ DSP family devices from product announcement through
applications development. The types of documentation available include: data sheets, such as this document,
with design specifications; complete user’s reference guides for all devices and tools; technical briefs;
development-support tools; on-line help; and hardware and software applications. The following is a brief,
descriptive list of support documentation specific to the C6000™ DSP devices:
The TMS320C6000 CPU and Instruction Set Reference Guide (literature number SPRU189) describes the
C6000™ DSP core (CPU) architecture, instruction set, pipeline, and associated interrupts.
The TMS320C6000 DSP Peripherals Overview Reference Guide (literature number SPRU190) briefly
describes the functionality of the peripherals available on the C6000™ DSP platform of devices, such as the
64-/32-/16-bit external memory interfaces (EMIFs), 32-/16-bit host-port interfaces (HPIs), multichannel buffered
serial ports (McBSPs), direct memory access (DMA), enhanced direct-memory-access (EDMA) controller,
expansion bus (XB), peripheral component interconnect (PCI), clocking and phase-locked loop (PLL); and
power-down modes.
The TMS320C6000 Technical Brief (literature number SPRU197) gives an introduction to the C62x™/C67x™
devices, associated development tools, and third-party support.
The tools support documentation is electronically available within the Code Composer Studio™ IDE. For a
complete listing of the latest C6000™ DSP documentation, visit the Texas Instruments web site on the
Worldwide Web at http://www.ti.com uniform resource locator (URL).
The How to Begin Development and Migrate Across the TMS320C6202/6202B/6203/6204 DSPs application
report (literature number SPRA603) describes the migration concerns and identifies the similarities and
differences between the C6202, C6202B, C6203, and C6204 C6000™ DSP devices.
C67x is a trademark of Texas Instruments.
34
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
clock PLL
Most of the internal C6204 clocks are generated from a single source through the CLKIN pin. This source clock
either drives the PLL, which multiplies the source clock in frequency to generate the internal CPU clock, or
bypasses the PLL to become the internal CPU clock.
To use the PLL to generate the CPU clock, the external PLL filter circuit must be properly designed. Figure 5,
Table 15, and Table 16 show the external PLL circuitry for either x1 (PLL bypass) or x4 PLL multiply modes.
Figure 6 shows the external PLL circuitry for a system with ONLY x1 (PLL bypass) mode.
To minimize the clock jitter, a single clean power supply should power both the C6204 device and the external
clock oscillator circuit. Noise coupling into PLLF directly impacts PLL clock jitter. The minimum CLKIN rise and
fall times should also be observed. For the input clock timing requirements, see the input and output clocks
electricals section.
3.3V
EMI Filter
PLLV
C3
10 mF
C4
Internal to C6204
PLL
CLKMODE0
CLKMODE1†
CLKMODE2†
PLLMULT
PLLCLK
0.1 mF
CLKIN
CLKIN
LOOP FILTER
1
PLLF
(For the PLL Options
and CLKMODE pins setup,
see Table 15 and Table 16)
C2
C1
CPU
CLOCK
PLLG
0
R1
† CLKMODE1 and CLKMODE2 pins are not applicable to the GHK package.
NOTES: A. Keep the lead length and the number of vias between pin PLLF, pin PLLG, R1, C1, and C2 to a minimum. In addition, place all PLL
components (R1, C1, C2, C3, C4, and EMI Filter) as close to the C6000™ DSP device as possible. Best performance is achieved
with the PLL components on a single side of the board without jumpers, switches, or components other than the ones shown.
B. For reduced PLL jitter, maximize the spacing between switching signals and the PLL external components (R1, C1, C2, C3, C4,
and the EMI Filter).
C. The 3.3-V supply for the EMI filter must be from the same 3.3-V power plane supplying the I/O voltage, DVDD.
D. EMI filter manufacturer: TDK part number ACF451832-333, 223, 153, 103. Panasonic part number EXCCET103U.
Figure 5. External PLL Circuitry for Either PLL Multiply Modes or x1 (Bypass) Mode
3.3V
PLLV
CLKMODE0
CLKMODE1†
CLKMODE2†
Internal to C6204
PLLMULT
PLL
PLLCLK
CLKIN
CLKIN
LOOP FILTER
1
CPU
CLOCK
PLLG
PLLF
0
† CLKMODE1 and CLKMODE2 pins are not applicable to the GHK package.
NOTES: A. For a system with ONLY PLL x1 (bypass) mode, short the PLLF to PLLG.
B. The 3.3-V supply for PLLV must be from the same 3.3-V power plane supplying the I/O voltage, DVDD.
Figure 6. External PLL Circuitry for x1 (Bypass) PLL Mode Only
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
clock PLL (continued)
Table 15. GHK/GLW Packages PLL Multiply and Bypass (x1) Options†
GHK PACKAGE -- 16 X 16 MM MICROSTAR BGA™
GLW PACKAGE -- 18 X 18 MM BGA
BIT (PIN NO.)
Value
CLKMODE2 (A14)
[GLW ONLY]
CLKMODE1 (A9)
[GLW ONLY]
CLKMODE0 (L3) [GHK]
CLKMODE0 (B12) [GLW]
PLL MULTIPLY
FACTOR‡
X (Don’t Cares)
X
0
Bypass (x1)
X
X
1
x4
†
For the GLW package only, the CLKMODE2 (A14) and CLKMODE1 (A9) pins are internally unconnected. These pins are not applicable to the
GHK package.
‡ f(CPU Clock) = f(CLKIN) x (PLL mode)
Table 16. PLL Component Selection Table§
§
CLKMODE
CLKIN
RANGE
(MHz)
CPU CLOCK
FREQUENCY
(CLKOUT1)
RANGE (MHz)
CLKOUT2
RANGE
(MHz)
R1 [±1%]
(Ω)
C1 [±10%]
(nF)
C2 [±10%]
(pF)
TYPICAL
LOCK TIME
(μs)
x4
32.5--50
130--200
65--100
60.4
27
560
75
Under some operating conditions, the maximum PLL lock time may vary by as much as 150% from the specified typical value. For example, if
the typical lock time is specified as 100 μs, the maximum value may be as long as 250 μs.
power-down mode logic
Figure 7 shows the power-down mode logic on the C6204.
CLKOUT1
TMS320C6204
Internal Clock Tree
PD1
PD2
PD
PowerDown
Logic
Clock
PLL
(pin)
IFR
IER
PWRD
Internal
Peripheral
CSR
CPU
PD3
CLKIN
RESET
Figure 7. Power-Down Mode Logic†
36
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Internal
Peripheral
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
triggering, wake-up, and effects
The power-down modes and their wake-up methods are programmed by setting the PWRD field (bits 15--10)
of the control status register (CSR). The PWRD field of the CSR is shown in Figure 8 and described in Table 17.
When writing to the CSR, all bits of the PWRD field should be set at the same time. Logic 0 should be used when
“writing” to the reserved bit (bit 15) of the PWRD field. The CSR is discussed in detail in the TMS320C6000 CPU
and Instruction Set Reference Guide (literature number SPRU189).
31
16
15
14
13
12
11
10
Reserved
Enable or
Non-Enabled
Interrupt Wake
Enabled
Interrupt Wake
PD3
PD2
PD1
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
7
9
8
0
Legend: R/W--x = Read/write reset value
NOTE: The shadowed bits are not part of the power-down logic discussion and therefore are not covered here. For information on these other
bit fields in the CSR register, see the TMS320C6000 CPU and Instruction Set Reference Guide (literature number SPRU189).
Figure 8. PWRD Field of the CSR Register
Power-down mode PD1 takes effect eight to nine clock cycles after the instruction that sets the PWRD bits in the
CSR.
If PD1 mode is terminated by a non-enabled interrupt, the program execution returns to the instruction where PD1
took effect. If PD1 mode is terminated by an enabled interrupt, the interrupt service routine will be executed first,
then the program execution returns to the instruction where PD1 took effect. The GIE bit in CSR and the NMIE
bit in the interrupt enable register (IER) must also be set in order for the interrupt service routine to execute;
otherwise, execution returns to the instruction where PD1 took effect upon PD1 mode termination by an enabled
interrupt.
PD2 and PD3 modes can only be aborted by device reset. Table 17 summarizes all the power-down modes.
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
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triggering, wake-up, and effects (continued)
Table 17. Characteristics of the Power-Down Modes
PRWD FIELD
(BITS 15--10)
POWER-DOWN
MODE
WAKE-UP METHOD
000000
No power-down
—
†
—
001001
PD1
Wake by an enabled interrupt
010001
PD1
Wake by an enabled or
non-enabled interrupt
011010
PD2†
011100
PD3†
All others
Reserved
EFFECT ON CHIP’S OPERATION
CPU halted (except for the interrupt logic)
Power-down
Power
down mode blocks the internal clock inputs at the
boundary of the CPU, preventing most of the CPU’s logic from
switching. During PD1, DMA transactions can proceed between
peripherals and internal memory.
Wake by a device reset
Output clock from PLL is halted, stopping the internal clock
structure from switching and resulting in the entire chip being
halted. All register and internal RAM contents are preserved. All
functional I/O “freeze” in the last state when the PLL clock is
turned off.
Wake by a device reset
Input clock to the PLL stops generating clocks. All register and
internal RAM contents are preserved. All functional I/O “freeze” in
the last state when the PLL clock is turned off. Following reset, the
PLL needs time to re-lock, just as it does following power-up.
Wake-up from PD3 takes longer than wake-up from PD2 because
the PLL needs to be re-locked.
—
—
When entering PD2 and PD3, all functional I/O remains in the previous state. However, for peripherals which are asynchronous in nature or
peripherals with an external clock source, output signals may transition in response to stimulus on the inputs. Under these conditions,
peripherals will not operate according to specifications.
power-supply sequencing
TI DSPs do not require specific power sequencing between the core supply and the I/O supply. However,
systems should be designed to ensure that neither supply is powered up for extended periods of time if the other
supply is below the proper operating voltage.
system-level design considerations
System-level design considerations, such as bus contention, may require supply sequencing to be
implemented. In this case, the core supply should be powered up at the same time as, or prior to (and powered
down after), the I/O buffers. This is to ensure that the I/O buffers receive valid inputs from the core before the
output buffers are powered up, thus, preventing bus contention with other chips on the board.
power-supply design considerations
For systems using the C6000™ DSP platform of devices, the core supply may be required to provide in excess
of 2 A per DSP until the I/O supply is powered up. This extra current condition is a result of uninitialized logic
within the DSP(s) and is corrected once the CPU sees an internal clock pulse. With the PLL enabled, as the
I/O supply is powered on, a clock pulse is produced stopping the extra current draw from the supply. With the
PLL disabled, as many as five external clock cycle pulses may be required to stop this extra current draw. A
normal current state returns once the I/O power supply is turned on and the CPU sees a clock pulse. Decreasing
the amount of time between the core supply power up and the I/O supply power up can minimize the effects
of this current draw.
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
power-supply design considerations (continued)
A dual-power supply with simultaneous sequencing, such as available with TPS563xx controllers or PT69xx
plug-in power modules, can be used to eliminate the delay between core and I/O power up [see the Using the
TPS56300 to Power DSPs application report (literature number SLVA088)]. A Schottky diode can also be used
to tie the core rail to the I/O rail, effectively pulling up the I/O power supply to a level that can help initialize the
logic within the DSP.
Core and I/O supply voltage regulators should be located close to the DSP (or DSP array) to minimize
inductance and resistance in the power delivery path. Additionally, when designing for high-performance
applications utilizing the C6000™ platform of DSPs, the PC board should include separate power planes for
core, I/O, and ground, all bypassed with high-quality low-ESL/ESR capacitors.
absolute maximum ratings over operating case temperature ranges (unless otherwise noted)†
Supply voltage range, CVDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -- 0.3 V to 2.3 V
Supply voltage range, DVDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . --0.3 V to 4 V
Input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . --0.3 V to 4 V
Output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . --0.3 V to 4 V
Operating case temperature ranges, TC:(default) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0_C to 90_C
(A version) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . --40_C to105_C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . --65_C to 150_C
Temperature cycle range, (1000-cycle performance): (GHK package) . . . . . . . . . . . . . . . . . . . --55_C to 125_C
(GLW package) . . . . . . . . . . . . . . . . . . . . --40_C to125_C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values are with respect to VSS.
recommended operating conditions
MIN
NOM
MAX
UNIT
CVDD
Supply voltage, Core
1.43
1.5
1.57
V
DVDD
Supply voltage, I/O
3.14
3.3
3.46
V
VSS
Supply ground
0
0
0
V
VIH
High-level input voltage
2
VIL
Low-level input voltage
0.8
V
IOH
High-level output current
--8
mA
IOL
Low-level output current
8
mA
TC
Operating case temperature
0
90
_C
--40
105
_C
(default)
(A version)
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
electrical characteristics over recommended ranges of supply voltage and operating case
temperature (unless otherwise noted)
PARAMETER
‡
§
TEST CONDITIONS
MIN
TYP
MAX
High-level output voltage
DVDD = MIN,
IOH = MAX
VOL
Low-level output voltage
DVDD = MIN,
IOL = MAX
0.6
V
II
Input current‡
VI = VSS to DVDD
±10
uA
IOZ
Off-state output current
VO = DVDD or 0 V
±10
uA
IDD2V
Supply current, CPU + CPU memory
IDD2V
Supply current, peripherals§
pins§
access§
2.4
UNIT
VOH
V
CVDD = NOM, CPU clock = 200 MHz
290
mA
CVDD = NOM, CPU clock = 200 MHz
240
mA
DVDD = NOM, CPU clock = 200 MHz
100
IDD3V
Supply current, I/O
Ci
Input capacitance
10
mA
pF
Co
Output capacitance
10
pF
TMS and TDI are not included due to internal pullups. TRST is not included due to internal pulldown.
Measured with average activity (50% high / 50% low power). For more details on CPU, peripheral, and I/O activity, see the TMS320C6000 Power
Consumption Summary application report (literature number SPRA486).
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
PARAMETER MEASUREMENT INFORMATION
IOL
Tester Pin
Electronics
50 Ω
Vcomm
Output
Under
Test
CT
IOH
Where:
IOL
IOH
Vcomm
CT
=
=
=
=
2 mA
2 mA
1.5 V
15--30-pF typical load-circuit capacitance
Figure 9. Test Load Circuit for AC Timing Measurements
signal transition levels
All input and output timing parameters are referenced to 1.5 V for both “0” and “1” logic levels.
Vref = 1.5 V
Figure 10. Input and Output Voltage Reference Levels for ac Timing Measurements
All rise and fall transition timing parameters are referenced to VIL MAX and VIH MIN for input clocks, and
VOL MAX and VOH MIN for output clocks.
Vref = VIH MIN (or VOH MIN)
Vref = VIL MAX (or VOL MAX)
Figure 11. Rise and Fall Transition Time Voltage Reference Levels
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
INPUT AND OUTPUT CLOCKS
timing requirements for CLKIN†‡§ (see Figure 12)
-200
PLL Mode x4
NO.
MIN
MAX
PLL Mode x1
(BYPASS)
MIN
UNIT
MAX
1
tc(CLKIN)
Cycle time, CLKIN
5*M
5
ns
2
tw(CLKINH)
Pulse duration, CLKIN high
0.4C
0.45C
ns
3
tw(CLKINL)
Pulse duration, CLKIN low
0.4C
4
tt(CLKIN)
Transition time, CLKIN
0.45C
ns
5
0.6
ns
†
The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
M = the PLL multiplier factor (x4). For more details, see the Clock PLL section of this data sheet.
§ C = CLKIN cycle time in ns. For example, when CLKIN frequency is 50 MHz, use C = 20 ns.
‡
1
4
2
CLKIN
3
4
Figure 12. CLKIN Timings
timing requirements for XCLKIN¶ (see Figure 13)
-200
NO
NO.
¶
MIN
UNIT
1
tc(XCLKIN)
Cycle time, XCLKIN
4P
ns
2
tw(XCLKINH)
Pulse duration, XCLKIN high
1.8P
ns
3
tw(XCLKINL)
Pulse duration, XCLKIN low
1.8P
ns
P = 1/CPU clock frequency in nanoseconds (ns).
1
2
XCLKIN
3
Figure 13. XCLKIN Timings
42
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FIXED-POINT DIGITAL SIGNAL PROCESSOR
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INPUT AND OUTPUT CLOCKS (CONTINUED)
switching characteristics over recommended operating conditions for CLKOUT1†‡§
(see Figure 14)
-200
NO.
CLKMODE = X4
PARAMETER
CLKMODE = X1
UNIT
MIN
MAX
MIN
MAX
P -- 0.7
P + 0.7
P -- 0.7
P + 0.7
ns
1
tc(CKO1)
Cycle time, CLKOUT1
2
tw(CKO1H)
Pulse duration, CLKOUT1 high
(P/2) -- 0.7
(P/2 ) + 0.7
PH -- 0.7
PH + 0.7
ns
3
tw(CKO1L)
Pulse duration, CLKOUT1 low
(P/2) -- 0.7
(P/2 ) + 0.7
PL -- 0.7
PL + 0.7
ns
4
tt(CKO1)
Transition time, CLKOUT1
0.6
ns
0.6
†
The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
PH is the high period of CLKIN in ns and PL is the low period of CLKIN in ns.
§ P = 1/CPU clock frequency in ns.
‡
1
4
2
CLKOUT1
3
4
Figure 14. CLKOUT1 Timings
switching characteristics over recommended operating conditions for CLKOUT2†§ (see Figure 15)
NO
NO.
-200
PARAMETER
MIN
MAX
UNIT
2
tw(CKO2H)
Pulse duration, CLKOUT2 high
P -- 0.7
P + 0.7
ns
3
tw(CKO2L)
Pulse duration, CLKOUT2 low
P -- 0.7
P + 0.7
ns
4
tt(CKO2)
Transition time, CLKOUT2
0.6
ns
†
The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
§ P = 1/CPU clock frequency in ns.
1
4
2
CLKOUT2
3
4
Figure 15. CLKOUT2 Timings
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
INPUT AND OUTPUT CLOCKS (CONTINUED)
switching characteristics over recommended operating conditions for XFCLK†‡ (see Figure 16)
NO
NO.
-200
PARAMETER
MAX
D * P -- 0.7
D * P + 0.7
ns
1
tc(XFCK)
Cycle time, XFCLK
2
tw(XFCKH)
Pulse duration, XFCLK high
(D/2) * P -- 0.7
(D/2) * P + 0.7
ns
3
tw(XFCKL)
Pulse duration, XFCLK low
(D/2) * P -- 0.7
(D/2) * P + 0.7
ns
4
tt(CKO2)
Transition time, XFCLK
0.6
ns
†
P = 1/CPU clock frequency in ns.
‡ D = 8, 6, 4, or 2; FIFO clock divide ratio, user-programmable
1
4
2
XFCLK
3
4
Figure 16. XFCLK Timings
44
UNIT
MIN
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FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
ASYNCHRONOUS MEMORY TIMING
timing requirements for asynchronous memory cycles†‡§¶ (see Figure 17 -- Figure 20)
-200
NO
NO.
MIN
MAX
UNIT
3
tsu(EDV-AREH)
Setup time, EDx valid before ARE high
1.5
ns
4
th(AREH-EDV)
Hold time, EDx valid after ARE high
3.5
ns
6
tsu(ARDYH-AREL)
Setup time, ARDY high before ARE low
--[(RST -- 3) * P -- 6]
ns
7
th(AREL-ARDYH)
Hold time, ARDY high after ARE low
(RST -- 3) * P + 3
ns
--[(RST -- 3) * P -- 6]
ns
(RST -- 3) * P + 3
ns
2P
ns
--[(WST -- 3) * P -- 6]
ns
(WST -- 3) * P + 3
ns
--[(WST -- 3) * P -- 6]
ns
(WST -- 3) * P + 3
ns
9
tsu(ARDYL-AREL)
Setup time, ARDY low before ARE low
10
th(AREL-ARDYL)
Hold time, ARDY low after ARE low
11
tw(ARDYH)
Pulse width, ARDY high
15
tsu(ARDYH-AWEL)
Setup time, ARDY high before AWE low
16
th(AWEL-ARDYH)
Hold time, ARDY high after AWE low
18
tsu(ARDYL-AWEL)
Setup time, ARDY low before AWE low
19
th(AWEL-ARDYL)
Hold time, ARDY low after AWE low
†
To ensure data setup time, simply program the strobe width wide enough. ARDY is internally synchronized. If ARDY does meet setup or hold
time, it may be recognized in the current cycle or the next cycle. Thus, ARDY can be an asynchronous input.
‡ RS = Read Setup, RST = Read Strobe, RH = Read Hold, WS = Write Setup, WST = Write Strobe, WH = Write Hold. These parameters are
programmed via the EMIF CE space control registers.
§ P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
¶ The sum of RS and RST (or WS and WST) must be a minimum of 4 in order to use ARDY input to extend strobe width.
switching characteristics over recommended operating conditions for asynchronous memory
cyclesद# (see Figure 17 -- Figure 20)
NO
NO.
-200
PARAMETER
MIN
TYP
MAX
UNIT
1
tosu(SELV-AREL)
Output setup time, select signals valid to ARE low
RS * P -- 2
ns
2
toh(AREH-SELIV)
Output hold time, ARE high to select signals invalid
RH * P -- 2
ns
5
tw(AREL)
Pulse width, ARE low
8
td(ARDYH-AREH)
Delay time, ARDY high to ARE high
12
tosu(SELV-AWEL)
Output setup time, select signals valid to AWE low
WS * P -- 2
13
toh(AWEH-SELIV)
Output hold time, AWE high to select signals invalid
WH * P -- 2
14
tw(AWEL)
Pulse width, AWE low
17
td(ARDYH-AWEH)
Delay time, ARDY high to AWE high
RST * P
3P
ns
4P + 5
ns
ns
WST * P
3P
ns
ns
4P + 5
ns
‡
RS = Read Setup, RST = Read Strobe, RH = Read Hold, WS = Write Setup, WST = Write Strobe, WH = Write Hold. These parameters are
programmed via the EMIF CE space control registers.
§ P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
¶ The sum of RS and RST (or WS and WST) must be a minimum of 4 in order to use ARDY input to extend strobe width.
# Select signals include: CEx, BE[3:0], EA[21:2], AOE; and for writes, include ED[31:0], with the exception that CEx can stay active for an additional
7P ns following the end of the cycle.
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
ASYNCHRONOUS MEMORY TIMING (CONTINUED)
Setup = 2
Strobe = 3
Hold = 2
CLKOUT1
1
2
1
2
1
2
CEx
BE[3:0]
EA[21:2]
3
4
ED[31:0]
1
2
AOE
6
7
ARE
5
AWE
ARDY
Figure 17. Asynchronous Memory Read Timing (ARDY Not Used)
Setup = 2
Strobe = 3
Not Ready
Hold = 2
CLKOUT1
CEx
BE[3:0]
EA[21:2]
1
2
1
2
1
2
3
4
ED[31:0]
1
2
AOE
8
10
9
ARE
AWE
11
ARDY
Figure 18. Asynchronous Memory Read Timing (ARDY Used)
46
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FIXED-POINT DIGITAL SIGNAL PROCESSOR
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ASYNCHRONOUS MEMORY TIMING (CONTINUED)
Setup = 2 Strobe = 3
Hold = 2
CLKOUT1
CEx
12
13
12
13
12
13
12
13
BE[3:0]
EA[21:2]
ED[31:0]
AOE
15
ARE
16
14
AWE
ARDY
Figure 19. Asynchronous Memory Write Timing (ARDY Not Used)
Setup = 2 Strobe = 3
Not Ready
Hold = 2
CLKOUT1
12
13
12
13
12
13
12
13
CEx
BE[3:0]
EA[21:2]
ED[31:0]
AOE
ARE
17
18
19
AWE
11
ARDY
Figure 20. Asynchronous Memory Write Timing (ARDY Used)
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
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SYNCHRONOUS-BURST MEMORY TIMING
timing requirements for synchronous-burst SRAM cycles (see Figure 21)
-200
NO
NO.
MIN
MAX
UNIT
7
tsu(EDV-CKO2H)
Setup time, read EDx valid before CLKOUT2 high
2.5
ns
8
th(CKO2H-EDV)
Hold time, read EDx valid after CLKOUT2 high
1.5
ns
switching characteristics over recommended operating conditions for synchronous-burst SRAM
cycles†‡ (see Figure 21 and Figure 22)
NO
NO.
PARAMETER
1
tosu(CEV-CKO2H)
Output setup time, CEx valid before CLKOUT2 high
2
toh(CKO2H-CEV)
Output hold time, CEx valid after CLKOUT2 high
3
tosu(BEV-CKO2H)
Output setup time, BEx valid before CLKOUT2 high
4
toh(CKO2H-BEIV)
Output hold time, BEx invalid after CLKOUT2 high
5
tosu(EAV-CKO2H)
Output setup time, EAx valid before CLKOUT2 high
6
toh(CKO2H-EAIV)
Output hold time, EAx invalid after CLKOUT2 high
9
tosu(ADSV-CKO2H)
Output setup time, SDCAS/SSADS valid before CLKOUT2 high
10
toh(CKO2H-ADSV)
Output hold time, SDCAS/SSADS valid after CLKOUT2 high
-200
MIN
MAX
UNIT
P -- 0.8
ns
P -- 4
ns
P -- 0.8
ns
P -- 4
ns
P -- 0.8
ns
P -- 4
ns
P -- 0.8
ns
P -- 4
ns
11
tosu(OEV-CKO2H)
Output setup time, SDRAS/SSOE valid before CLKOUT2 high
P -- 0.8
ns
12
toh(CKO2H-OEV)
Output hold time, SDRAS/SSOE valid after CLKOUT2 high
P -- 4
ns
13
tosu(EDV-CKO2H)
Output setup time, EDx valid before CLKOUT2 high§
P -- 1
ns
14
toh(CKO2H-EDIV)
Output hold time, EDx invalid after CLKOUT2 high
15
tosu(WEV-CKO2H)
Output setup time, SDWE/SSWE valid before CLKOUT2 high
16
toh(CKO2H-WEV)
Output hold time, SDWE/SSWE valid after CLKOUT2 high
†
P -- 4
ns
P -- 0.8
ns
P -- 4
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
‡ SDCAS/SSADS, SDRAS/SSOE, and SDWE/SSWE operate as SSADS, SSOE, and SSWE, respectively, during SBSRAM accesses.
§ For the first write in a series of one or more consecutive adjacent writes, the write data is generated one CLKOUT2 cycle early to accommodate
the ED enable time.
48
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
SYNCHRONOUS-BURST MEMORY TIMING (CONTINUED)
CLKOUT2
1
2
CEx
BE[3:0]
3
BE1
BE2
BE3
BE4
4
EA[21:2]
5
A1
A2
A3
A4
6
7
Q1
ED[31:0]
8
Q2
Q3
9
Q4
10
SDCAS/SSADS†
11
12
SDRAS/SSOE†
SDWE/SSWE†
†
SDCAS/SSADS, SDRAS/SSOE, and SDWE/SSWE operate as SSADS, SSOE, and SSWE, respectively, during SBSRAM accesses.
Figure 21. SBSRAM Read Timing
CLKOUT2
1
2
CEx
BE[3:0]
3
BE1
BE2
BE3
BE4
4
EA[21:2]
5
A1
A2
A3
A4
Q1
Q2
Q3
Q4
6
13
ED[31:0]
14
9
10
15
16
SDCAS/SSADS†
SDRAS/SSOE†
SDWE/SSWE†
†
SDCAS/SSADS, SDRAS/SSOE, and SDWE/SSWE operate as SSADS, SSOE, and SSWE, respectively, during SBSRAM accesses.
Figure 22. SBSRAM Write Timing
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49
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
SYNCHRONOUS DRAM TIMING
timing requirements for synchronous DRAM cycles (see Figure 23)
-200
NO
NO.
MIN
7
tsu(EDV-CKO2H)
Setup time, read EDx valid before CLKOUT2 high
8
th(CKO2H-EDV)
Hold time, read EDx valid after CLKOUT2 high
MAX
UNIT
1.25
ns
3
ns
switching characteristics over recommended operating conditions for synchronous DRAM
cycles†‡ (see Figure 23--Figure 28)
NO
NO.
-200
PARAMETER
MIN
1
tosu(CEV-CKO2H)
Output setup time, CEx valid before CLKOUT2 high
2
toh(CKO2H-CEV)
Output hold time, CEx valid after CLKOUT2 high
3
tosu(BEV-CKO2H)
Output setup time, BEx valid before CLKOUT2 high
4
toh(CKO2H-BEIV)
Output hold time, BEx invalid after CLKOUT2 high
5
tosu(EAV-CKO2H)
Output setup time, EAx valid before CLKOUT2 high
6
toh(CKO2H-EAIV)
Output hold time, EAx invalid after CLKOUT2 high
9
tosu(CASV-CKO2H)
Output setup time, SDCAS/SSADS valid before CLKOUT2 high
10
toh(CKO2H-CASV)
Output hold time, SDCAS/SSADS valid after CLKOUT2 high
high§
11
tosu(EDV-CKO2H)
Output setup time, EDx valid before CLKOUT2
12
toh(CKO2H-EDIV)
Output hold time, EDx invalid after CLKOUT2 high
13
tosu(WEV-CKO2H)
Output setup time, SDWE/SSWE valid before CLKOUT2 high
14
toh(CKO2H-WEV)
Output hold time, SDWE/SSWE valid after CLKOUT2 high
15
tosu(SDA10V-CKO2H)
Output setup time, SDA10 valid before CLKOUT2 high
16
toh(CKO2H-SDA10IV)
Output hold time, SDA10 invalid after CLKOUT2 high
17
tosu(RASV-CKO2H)
Output setup time, SDRAS/SSOE valid before CLKOUT2 high
18
toh(CKO2H-RASV)
Output hold time, SDRAS/SSOE valid after CLKOUT2 high
†
MAX
UNIT
P -- 1
ns
P -- 3.5
ns
P -- 1
ns
P -- 3.5
ns
P -- 1
ns
P -- 3.5
ns
P -- 1
ns
P -- 3.5
ns
P -- 3
ns
P -- 3.5
ns
P -- 1
ns
P -- 3.5
ns
P -- 1
ns
P -- 3.5
ns
P -- 1
ns
P -- 3.5
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
SDCAS/SSADS, SDRAS/SSOE, and SDWE/SSWE operate as SDCAS, SDRAS, and SDWE, respectively, during SDRAM accesses.
§ For the first write in a series of one or more consecutive adjacent writes, the write data is generated one CLKOUT2 cycle early to accommodate
the ED enable time.
‡
50
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
SYNCHRONOUS DRAM TIMING (CONTINUED)
READ
READ
READ
CLKOUT2
1
2
CEx
3
BE[3:0]
5
EA[15:2]
4
BE1
BE2
CA2
CA3
BE3
6
CA1
7
8
D1
ED[31:0]
15
16
9
10
D2
D3
SDA10
SDRAS/SSOE†
SDCAS/SSADS†
SDWE/SSWE†
†
SDCAS/SSADS, SDRAS/SSOE, and SDWE/SSWE operate as SDCAS, SDRAS, and SDWE, respectively, during SDRAM accesses.
Figure 23. Three SDRAM READ Commands
WRITE
WRITE
WRITE
CLKOUT2
1
2
CEx
3
BE[3:0]
4
BE1
5
EA[15:2]
BE3
CA2
CA3
D2
D3
6
CA1
11
D1
ED[31:0]
BE2
12
15
16
9
10
13
14
SDA10
SDRAS/SSOE†
SDCAS/SSADS†
SDWE/SSWE†
†
SDCAS/SSADS, SDRAS/SSOE, and SDWE/SSWE operate as SDCAS, SDRAS, and SDWE, respectively, during SDRAM accesses.
Figure 24. Three SDRAM WRT Commands
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51
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
SYNCHRONOUS DRAM TIMING (CONTINUED)
ACTV
CLKOUT2
1
2
CEx
BE[3:0]
5
Bank Activate/Row Address
EA[15:2]
ED[31:0]
15
Row Address
SDA10
17
18
SDRAS/SSOE†
SDCAS/SSADS†
SDWE/SSWE†
†
SDCAS/SSADS, SDRAS/SSOE, and SDWE/SSWE operate as SDCAS, SDRAS, and SDWE, respectively, during SDRAM accesses.
Figure 25. SDRAM ACTV Command
DCAB
CLKOUT2
1
2
15
16
17
18
CEx
BE[3:0]
EA[15:2]
ED[31:0]
SDA10
SDRAS/SSOE†
SDCAS/SSADS†
13
14
SDWE/SSWE†
†
SDCAS/SSADS, SDRAS/SSOE, and SDWE/SSWE operate as SDCAS, SDRAS, and SDWE, respectively, during SDRAM accesses.
Figure 26. SDRAM DCAB Command
52
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
SYNCHRONOUS DRAM TIMING (CONTINUED)
REFR
CLKOUT2
1
2
CEx
BE[3:0]
EA[15:2]
ED[31:0]
SDA10
17
18
SDRAS/SSOE†
9
10
SDCAS/SSADS†
SDWE/SSWE†
†
SDCAS/SSADS, SDRAS/SSOE, and SDWE/SSWE operate as SDCAS, SDRAS, and SDWE, respectively, during SDRAM accesses.
Figure 27. SDRAM REFR Command
MRS
CLKOUT2
1
2
5
6
CEx
BE[3:0]
EA[15:2]
MRS Value
ED[31:0]
SDA10
17
18
9
10
13
14
SDRAS/SSOE†
SDCAS/SSADS†
SDWE/SSWE†
†
SDCAS/SSADS, SDRAS/SSOE, and SDWE/SSWE operate as SDCAS, SDRAS, and SDWE, respectively, during SDRAM accesses.
Figure 28. SDRAM MRS Command
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53
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
HOLD/HOLDA TIMING
timing requirements for the HOLD/HOLDA cycles† (see Figure 29)
-200
NO
NO.
3
†
MIN
toh(HOLDAL-HOLDL)
Output hold time, HOLD low after HOLDA low
MAX
P
UNIT
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
switching characteristics over recommended operating conditions for the HOLD/HOLDA cycles†‡
(see Figure 29)
NO
NO.
-200
PARAMETER
1
td(HOLDL-EMHZ)
Delay time, HOLD low to EMIF Bus high impedance
2
td(EMHZ-HOLDAL)
Delay time, EMIF Bus high impedance to HOLDA low
4
td(HOLDH-EMLZ)
Delay time, HOLD high to EMIF Bus low impedance
5
td(EMLZ-HOLDAH)
Delay time, EMIF Bus low impedance to HOLDA high
UNIT
MIN
MAX
4P
§
ns
0
2P
ns
3P
7P
ns
0
2P
ns
†
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
EMIF Bus consists of CE[3:0], BE[3:0], ED[31:0], EA[21:2], ARE, AOE, AWE, SDCAS/SSADS, SDRAS/SSOE, SDWE/SSWE, and SDA10.
§ All pending EMIF transactions are allowed to complete before HOLDA is asserted. The worst case for this is an asynchronous read or write with
external ARDY used or a minimum of eight consecutive SDRAM reads or writes when RBTR8 = 1. If no bus transactions are occurring, then the
minimum delay time can be achieved. Also, bus hold can be indefinitely delayed by setting NOHOLD = 1.
‡
External Requestor
Owns Bus
DSP Owns Bus
DSP Owns Bus
3
HOLD
2
5
HOLDA
EMIF Bus†
†
1
4
C6204
C6204
EMIF Bus consists of CE[3:0], BE[3:0], ED[31:0], EA[21:2], ARE, AOE, AWE, SDCAS/SSADS, SDRAS/SSOE, SDWE/SSWE, and SDA10.
Figure 29. HOLD/HOLDA Timing
54
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
RESET TIMING
timing requirements for reset† (see Figure 30)
-200
NO
NO.
MIN
1
tw(RST)
10
tsu(XD)
11
th(XD)
MAX
UNIT
Width of the RESET pulse (PLL stable)‡
10P
ns
Width of the RESET pulse (PLL needs to sync up)§
250
μs
Setup time, XD configuration bits valid before RESET high¶
5P
ns
Hold time, XD configuration bits valid after RESET high¶
5P
ns
†
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
This parameter applies to CLKMODE x1 when CLKIN is stable, and applies to CLKMODE x4 when CLKIN and PLL are stable.
§ This parameter applies to CLKMODE x4 only (it does not apply to CLKMODE x1). The RESET signal is not connected internally to the Clock
PLL circuit. The PLL requires a minimum of 250 μs to stabilize following device power up or after PLL configuration has been changed. During
that time, RESET must be asserted to ensure proper device operation. See the clock PLL section for PLL lock times.
¶ XD[31:0] are the boot configuration pins during device reset.
‡
switching characteristics over recommended operating conditions during reset†# (see Figure 30)
NO
NO.
PARAMETER
2
td(RSTL-CKO2IV)
Delay time, RESET low to CLKOUT2 invalid
3
td(RSTH-CKO2V)
Delay time, RESET high to CLKOUT2 valid
4
td(RSTL-HIGHIV)
Delay time, RESET low to high group invalid
5
td(RSTH-HIGHV)
Delay time, RESET high to high group valid
6
td(RSTL-LOWIV)
Delay time, RESET low to low group invalid
7
td(RSTH-LOWV)
Delay time, RESET high to low group valid
8
td(RSTL-ZHZ)
Delay time, RESET low to Z group high impedance
9
td(RSTH-ZV)
Delay time, RESET high to Z group valid
-200
MIN
MAX
P
UNIT
ns
4P
P
ns
ns
4P
P
ns
ns
4P
P
ns
ns
4P
ns
†
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
# High group consists of:
XFCLK, HOLDA
Low group consists of:
IACK, INUM[3:0], DMAC[3:0], PD, TOUT0, and TOUT1.
Z group consists of:
EA[21:2], ED[31:0], CE[3:0], BE[3:0], ARE, AWE, AOE, SDCAS/SSADS, SDRAS/SSOE, SDWE/SSWE,
SDA10, CLKX0, CLKX1, FSX0, FSX1, DX0, DX1, CLKR0, CLKR1, FSR0, FSR1, XCE[3:0], XBE[3:0]/XA[5:2],
XOE, XRE, XWE/XWAIT, XAS, XW/R, XRDY, XBLAST, XHOLD, and XHOLDA.
POST OFFICE BOX 1443
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55
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
RESET TIMING (CONTINUED)
CLKOUT1
1
10
RESET
11
2
3
4
5
6
7
8
9
CLKOUT2
HIGH
GROUP†
LOW GROUP†
Z
GROUP†
Boot Configuration
XD[31:0]‡
†
High group consists of:
Low group consists of:
Z group consists of:
XFCLK, HOLDA
IACK, INUM[3:0], DMAC[3:0], PD, TOUT0, and TOUT1.
EA[21:2], ED[31:0], CE[3:0], BE[3:0], ARE, AWE, AOE, SDCAS/SSADS, SDRAS/SSOE, SDWE/SSWE,
SDA10, CLKX0, CLKX1, FSX0, FSX1, DX0, DX1, CLKR0, CLKR1, FSR0, FSR1, XCE[3:0], XBE[3:0]/XA[5:2],
XOE, XRE, XWE/XWAIT, XAS, XW/R, XRDY, XBLAST, XHOLD, and XHOLDA.
‡ XD[31:0] are the boot configuration pins during device reset.
Figure 30. Reset Timing
56
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
EXTERNAL INTERRUPT TIMING
timing requirements for interrupt response cycles† (see Figure 31)
-200
NO
NO.
†
MIN
MAX
UNIT
2
tw(ILOW)
Width of the interrupt pulse low
2P
ns
3
tw(IHIGH)
Width of the interrupt pulse high
2P
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
switching characteristics over recommended operating conditions during interrupt response
cycles† (see Figure 31)
NO
NO.
†
-200
PARAMETER
MIN
MAX
9P
UNIT
1
tR(EINTH -- IACKH)
Response time, EXT_INTx high to IACK high
4
td(CKO2L-IACKV)
Delay time, CLKOUT2 low to IACK valid
0
10
ns
ns
5
td(CKO2L-INUMV)
Delay time, CLKOUT2 low to INUMx valid
0
10
ns
6
td(CKO2L-INUMIV)
Delay time, CLKOUT2 low to INUMx invalid
0
10
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
1
CLKOUT2
2
3
EXT_INTx, NMI
Intr Flag
4
4
IACK
6
5
INUMx
Interrupt Number
Figure 31. Interrupt Timing
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57
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
EXPANSION BUS SYNCHRONOUS FIFO TIMING
timing requirements for synchronous FIFO interface (see Figure 32, Figure 33, and Figure 34)
-200
NO
NO.
MIN
5
tsu(XDV-XFCKH)
Setup time, read XDx valid before XFCLK high
6
th(XFCKH-XDV)
Hold time, read XDx valid after XFCLK high
MAX
UNIT
3.5
ns
2
ns
switching characteristics over recommended operating conditions for synchronous FIFO
interface (see Figure 32, Figure 33, and Figure 34)
NO
NO.
1
-200
PARAMETER
td(XFCKH-XCEV)
Delay time, XFCLK high to XCEx valid
valid†
MAX
1
7
ns
2
td(XFCKH-XAV)
Delay time, XFCLK high to XBE[3:0]/XA[5:2]
1
7
ns
3
td(XFCKH-XOEV)
Delay time, XFCLK high to XOE valid
1
7
ns
4
td(XFCKH-XREV)
Delay time, XFCLK high to XRE valid
1
7
ns
7
td(XFCKH-XWEV)
Delay time, XFCLK high to XWE/XWAIT‡ valid
1
7
ns
8
td(XFCKH-XDV)
Delay time, XFCLK high to XDx valid
9
ns
9
td(XFCKH-XDIV)
Delay time, XFCLK high to XDx invalid
1
ns
†
XBE[3:0]/XA[5:2] operate as address signals XA[5:2] during synchronous FIFO accesses.
‡ XWE/XWAIT operates as the write-enable signal XWE during synchronous FIFO accesses.
XFCLK
1
1
XCE3†
2
XBE[3:0]/XA[5:2]‡
2
XA1
XA2
XA3
XA4
3
3
XOE
4
4
XRE
XWE/XWAIT§
6
5
XD[31:0]
D1
D2
D3
†
FIFO read (glueless) mode only available in XCE3.
XBE[3:0]/XA[5:2] operate as address signals XA[5:2] during synchronous FIFO accesses.
§ XWE/XWAIT operates as the write-enable signal XWE during synchronous FIFO accesses.
‡
Figure 32. FIFO Read Timing (Glueless Read Mode)
58
UNIT
MIN
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• HOUSTON, TEXAS 77251--1443
D4
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
EXPANSION BUS SYNCHRONOUS FIFO TIMING (CONTINUED)
XFCLK
1
1
XCEx
2
XBE[3:0]/XA[5:2]†
2
XA1
XA2
XA3
XA4
3
3
XOE
4
4
XRE
XWE/XWAIT‡
6
5
XD[31:0]
†
‡
D1
D2
D3
D4
XBE[3:0]/XA[5:2] operate as address signals XA[5:2] during synchronous FIFO accesses.
XWE/XWAIT operates as the write-enable signal XWE during synchronous FIFO accesses.
Figure 33. FIFO Read Timing
XFCLK
1
1
XCEx
2
XBE[3:0]/XA[5:2]†
2
XA1
XA2
XA3
XA4
XOE
XRE
7
7
XWE/XWAIT‡
9
8
XD[31:0]
†
‡
D1
D2
D3
D4
XBE[3:0]/XA[5:2] operate as address signals XA[5:2] during synchronous FIFO accesses.
XWE/XWAIT operates as the write-enable signal XWE during synchronous FIFO accesses.
Figure 34. FIFO Write Timing
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59
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
EXPANSION BUS ASYNCHRONOUS PERIPHERAL TIMING
timing requirements for asynchronous peripheral cycles†‡§¶ (see Figure 35--Figure 38)
-200
NO
NO.
MIN
3
tsu(XDV-XREH)
Setup time, XDx valid before XRE high
4
th(XREH-XDV)
Hold time, XDx valid after XRE high
6
tsu(XRDYH-XREL)
Setup time, XRDY high before XRE low
7
th(XREL-XRDYH)
Hold time, XRDY high after XRE low
9
tsu(XRDYL-XREL)
Setup time, XRDY low before XRE low
10
th(XREL-XRDYL)
Hold time, XRDY low after XRE low
11
tw(XRDYH)
Pulse width, XRDY high
15
tsu(XRDYH-XWEL)
Setup time, XRDY high before XWE low
16
th(XWEL-XRDYH)
Hold time, XRDY high after XWE low
18
tsu(XRDYL-XWEL)
Setup time, XRDY low before XWE low
19
th(XWEL-XRDYL)
Hold time, XRDY low after XWE low
MAX
UNIT
8.5
ns
1
ns
--[(RST -- 3) * P -- 10]
ns
(RST -- 3) * P + 2
ns
--[(RST -- 3) * P -- 6]
ns
(RST -- 3) * P + 2
ns
2P
ns
--[(WST -- 3) * P -- 10]
ns
(WST -- 3) * P + 2
ns
--[(WST -- 3) * P -- 6]
ns
(WST -- 3) * P + 2
ns
†
To ensure data setup time, simply program the strobe width wide enough. XRDY is internally synchronized. If XRDY does meet setup or hold
time, it may be recognized in the current cycle or the next cycle. Thus, XRDY can be an asynchronous input.
‡ RS = Read Setup, RST = Read Strobe, RH = Read Hold, WS = Write Setup, WST = Write Strobe, WH = Write Hold. These parameters are
programmed via the XBUS XCE space control registers.
§ P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
¶ The sum of RS and RST (or WS and WST) must be a minimum of 4 in order to use XRDY input to extend strobe width.
switching characteristics over recommended operating conditions for asynchronous peripheral
cyclesद# (see Figure 35--Figure 38)
NO
NO.
-200
PARAMETER
MIN
TYP
MAX
UNIT
1
tosu(SELV-XREL)
Output setup time, select signals valid to XRE low
RS * P -- 2
ns
2
toh(XREH-SELIV)
Output hold time, XRE low to select signals invalid
RH * P -- 2
ns
5
tw(XREL)
Pulse width, XRE low
8
td(XRDYH-XREH)
Delay time, XRDY high to XRE high
12
tosu(SELV-XWEL)
Output setup time, select signals valid to XWE low
WS * P -- 2
13
toh(XWEH-SELIV)
Output hold time, XWE low to select signals invalid
WH * P -- 2
14
tw(XWEL)
Pulse width, XWE low
17
td(XRDYH-XWEH)
Delay time, XRDY high to XWE high
RST * P
3P
ns
4P + 5
ns
ns
WST * P
‡
3P
ns
ns
4P + 5
ns
RS = Read Setup, RST = Read Strobe, RH = Read Hold, WS = Write Setup, WST = Write Strobe, WH = Write Hold. These parameters are
programmed via the XBUS XCE space control registers.
§ P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
¶ The sum of RS and RST (or WS and WST) must be a minimum of 4 in order to use XRDY input to extend strobe width.
# Select signals include: XCEx, XBE[3:0]/XA[5:2], XOE; and for writes, include XD[31:0], with the exception that XCEx can stay active for an
additional 7P ns following the end of the cycle.
60
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
EXPANSION BUS ASYNCHRONOUS PERIPHERAL TIMING (CONTINUED)
Setup = 2
Strobe = 3
Hold = 2
CLKOUT1
1
2
1
2
XCEx
XBE[3:0]/
XA[5:2]†
3
4
XD[31:0]
1
2
XOE
6
7
XRE
5
XWE/XWAIT‡
XRDY§
†
XBE[3:0]/XA[5:2] operate as address signals XA[5:2] during expansion bus asynchronous peripheral accesses.
XWE/XWAIT operates as the write-enable signal XWE during expansion bus asynchronous peripheral accesses.
§ XRDY operates as active-high ready input during expansion bus asynchronous peripheral accesses.
‡
Figure 35. Expansion Bus Asynchronous Peripheral Read Timing (XRDY Not Used)
Setup = 2
Strobe = 3
Not Ready
Hold = 2
CLKOUT1
1
2
1
2
XCEx
XBE[3:0]/
XA[5:2]†
3
4
XD[31:0]
1
2
XOE
8
10
9
XRE
XWE/XWAIT‡
11
XRDY§
†
XBE[3:0]/XA[5:2] operate as address signals XA[5:2] during expansion bus asynchronous peripheral accesses.
XWE/XWAIT operates as the write-enable signal XWE during expansion bus asynchronous peripheral accesses.
§ XRDY operates as active-high ready input during expansion bus asynchronous peripheral accesses.
‡
Figure 36. Expansion Bus Asynchronous Peripheral Read Timing (XRDY Used)
POST OFFICE BOX 1443
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61
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
EXPANSION BUS ASYNCHRONOUS PERIPHERAL TIMING (CONTINUED)
Setup = 2
Strobe = 3
Hold = 2
CLKOUT1
12
13
12
13
12
13
XCEx
XBE[3:0]/
XA[5:2]†
XD[31:0]
XOE
XRE
15
16
14
XWE/XWAIT‡
XRDY§
†
XBE[3:0]/XA[5:2] operate as address signals XA[5:2] during expansion bus asynchronous peripheral accesses.
XWE/XWAIT operates as the write-enable signal XWE during expansion bus asynchronous peripheral accesses.
§ XRDY operates as active-high ready input during expansion bus asynchronous peripheral accesses.
‡
Figure 37. Expansion Bus Asynchronous Peripheral Write Timing (XRDY Not Used)
Setup = 2 Strobe = 3
Not Ready
Hold = 2
CLKOUT1
12
13
12
13
12
13
XCEx
XBE[3:0]/
XA[5:2]†
XD[31:0]
XOE
XRE
17
18
19
XWE/XWAIT‡
11
XRDY§
†
XBE[3:0]/XA[5:2] operate as address signals XA[5:2] during expansion bus asynchronous peripheral accesses.
XWE/XWAIT operates as the write-enable signal XWE during expansion bus asynchronous peripheral accesses.
§ XRDY operates as active-high ready input during expansion bus asynchronous peripheral accesses.
‡
Figure 38. Expansion Bus Asynchronous Peripheral Write Timing (XRDY Used)
62
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
EXPANSION BUS SYNCHRONOUS HOST-PORT TIMING
timing requirements with external device as bus master (see Figure 39 and Figure 40)
-200
NO
NO.
MIN
MAX
UNIT
1
tsu(XCSV-XCKIH)
Setup time, XCS valid before XCLKIN high
3.5
ns
2
th(XCKIH-XCS)
Hold time, XCS valid after XCLKIN high
2.8
ns
3
tsu(XAS-XCKIH)
Setup time, XAS valid before XCLKIN high
3.5
ns
4
th(XCKIH-XAS)
Hold time, XAS valid after XCLKIN high
2.8
ns
5
tsu(XCTL-XCKIH)
Setup time, XCNTL valid before XCLKIN high
3.5
ns
6
th(XCKIH-XCTL)
Hold time, XCNTL valid after XCLKIN high
2.8
ns
7
tsu(XWR-XCKIH)
Setup time, XW/R valid before XCLKIN high†
3.5
ns
2.8
ns
3.5
ns
2.8
ns
3.5
ns
2.8
ns
high†
8
th(XCKIH-XWR)
Hold time, XW/R valid after XCLKIN
9
tsu(XBLTV-XCKIH)
Setup time, XBLAST valid before XCLKIN high‡
high‡
10
th(XCKIH-XBLTV)
Hold time, XBLAST valid after XCLKIN
16
tsu(XBEV-XCKIH)
Setup time, XBE[3:0]/XA[5:2] valid before XCLKIN high§
high§
17
th(XCKIH-XBEV)
Hold time, XBE[3:0]/XA[5:2] valid after XCLKIN
18
tsu(XD-XCKIH)
Setup time, XDx valid before XCLKIN high
3.5
ns
19
th(XCKIH-XD)
Hold time, XDx valid after XCLKIN high
2.8
ns
†
XW/R input/output polarity selected at boot.
‡ XBLAST input polarity selected at boot.
§ XBE[3:0]/XA[5:2] operate as byte-enables XBE[3:0] during host-port accesses.
switching characteristics over recommended operating conditions with external device as bus
master¶ (see Figure 39 and Figure 40)
NO
NO.
-200
PARAMETER
MIN
11
td(XCKIH-XDLZ)
Delay time, XCLKIN high to XDx low impedance
12
td(XCKIH-XDV)
Delay time, XCLKIN high to XDx valid
13
td(XCKIH-XDIV)
Delay time, XCLKIN high to XDx invalid
14
td(XCKIH-XDHZ)
Delay time, XCLKIN high to XDx high impedance
invalid#
td(XCKIH-XRY)
Delay time, XCLKIN high to XRDY
td(XCKIH-XRYLZ)
Delay time, XCLKIN high to XRDY low impedance
Delay time, XCLKIN high to XRDY high
impedance#
UNIT
ns
16.5
20
td(XCKIH-XRYHZ)
0
5
15
21
MAX
ns
ns
4P
ns
5
16.5
ns
5
16.5
ns
2P + 5
3P + 16.5
ns
¶
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
# XRDY operates as active-low ready input/output during host-port accesses.
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63
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
EXPANSION BUS SYNCHRONOUS HOST-PORT TIMING (CONTINUED)
XCLKIN
2
1
XCS
4
3
XAS
6
5
XCNTL
8
7
XW/R†
8
7
XW/R†
XBE[3:0]/XA[5:2]‡
10
9
XBLAST§
10
9
XBLAST§
11
D1
XD[31:0]
20
13
14
12
D2
15
XRDY¶
†
XW/R input/output polarity selected at boot
XBE[3:0]/XA[5:2] operate as byte-enables XBE[3:0] during host-port accesses.
§ XBLAST input polarity selected at boot
¶ XRDY operates as active-low ready input/output during host-port accesses.
‡
Figure 39. External Host as Bus Master—Read
64
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D3
D4
15
21
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
EXPANSION BUS SYNCHRONOUS HOST-PORT TIMING (CONTINUED)
XCLKIN
2
1
XCS
4
3
XAS
6
5
XCNTL
8
7
XW/R†
8
7
XW/R†
17
16
XBE[3:0]/XA[5:2]‡
XBE1
XBE2
XBE3
XBE4
10
9
XBLAST§
10
9
XBLAST§
19
18
D1
XD[31:0]
20
D2
D3
D4
15
15
21
XRDY¶
†
XW/R input/output polarity selected at boot
XBE[3:0]/XA[5:2] operate as byte-enables XBE[3:0] during host-port accesses.
§ XBLAST input polarity selected at boot
¶ XRDY operates as active-low ready input/output during host-port accesses.
‡
Figure 40. External Host as Bus Master—Write
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65
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
EXPANSION BUS SYNCHRONOUS HOST-PORT TIMING (CONTINUED)
timing requirements with C62x™ as bus master (see Figure 41, Figure 42, and Figure 43)
-200
NO
NO.
†
MIN
MAX
UNIT
9
tsu(XDV-XCKIH)
Setup time, XDx valid before XCLKIN high
3.5
ns
10
th(XCKIH-XDV)
Hold time, XDx valid after XCLKIN high
2.8
ns
11
tsu(XRY-XCKIH)
Setup time, XRDY valid before XCLKIN high†
3.5
ns
high†
12
th(XCKIH-XRY)
Hold time, XRDY valid after XCLKIN
2.8
ns
14
tsu(XBFF-XCKIH)
Setup time, XBOFF valid before XCLKIN high
3.5
ns
15
th(XCKIH-XBFF)
Hold time, XBOFF valid after XCLKIN high
2.8
ns
XRDY operates as active-low ready input/output during host-port accesses.
switching characteristics over recommended operating conditions with C62x™ as bus master
(see Figure 41, Figure 42, and Figure 43)
NO
NO.
-200
PARAMETER
MAX
UNIT
1
td(XCKIH-XASV)
Delay time, XCLKIN high to XAS valid
5
16.5
ns
2
td(XCKIH-XWRV)
Delay time, XCLKIN high to XW/R valid‡
5
16.5
ns
valid§
3
td(XCKIH-XBLTV)
Delay time, XCLKIN high to XBLAST
5
16.5
ns
4
td(XCKIH-XBEV)
Delay time, XCLKIN high to XBE[3:0]/XA[5:2] valid¶
5
16.5
ns
5
td(XCKIH-XDLZ)
Delay time, XCLKIN high to XDx low impedance
0
6
td(XCKIH-XDV)
Delay time, XCLKIN high to XDx valid
7
td(XCKIH-XDIV)
Delay time, XCLKIN high to XDx invalid
8
td(XCKIH-XDHZ)
Delay time, XCLKIN high to XDx high impedance
13
td(XCKIH-XWTV)
Delay time, XCLKIN high to XWE/XWAIT valid#
‡
XW/R input/output polarity selected at boot.
XBLAST output polarity is always active low.
¶ XBE[3:0]/XA[5:2] operate as byte-enables XBE[3:0] during host-port accesses.
# XWE/XWAIT operates as XWAIT output signal during host-port accesses.
§
66
MIN
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251--1443
ns
16.5
5
5
ns
ns
4P
ns
16.5
ns
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
EXPANSION BUS SYNCHRONOUS HOST-PORT TIMING (CONTINUED)
XCLKIN
1
1
XAS
2
2
XW/R†
XW/R†
3
3
XBLAST‡
4
4
XBE[3:0]/XA[5:2]§
5
6
AD
XD[31:0]
7
BE
9
8
D1
10
D2
D3
D4
11
12
XRDY
13
13
XWE/XWAIT¶
†
XW/R input/output polarity selected at boot
XBLAST output polarity is always active low.
§ XBE[3:0]/XA[5:2] operate as byte-enables XBE[3:0] during host-port accesses.
¶ XWE/XWAIT operates as XWAIT output signal during host-port accesses.
‡
Figure 41. C62x™ as Bus Master—Read
XCLKIN
1
1
XAS
XW/R†
2
2
XW/R†
3
3
XBLAST‡
4
4
6
7
XBE[3:0]/XA[5:2]§
5
XD[31:0]
Addr
D1
D2
D3
11
XRDY
8
D4
12
13
13
XWE/XWAIT¶
†
XW/R input/output polarity selected at boot
XBLAST output polarity is always active low.
§ XBE[3:0]/XA[5:2] operate as byte-enables XBE[3:0] during host-port accesses.
¶ XWE/XWAIT operates as XWAIT output signal during host-port accesses.
‡
Figure 42. C62x™ as Bus Master—Write
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67
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
EXPANSION BUS SYNCHRONOUS HOST-PORT TIMING (CONTINUED)
XCLKIN
1
1
XAS
XW/R†
2
2
4
4
XW/R†
XBLAST‡
XBE[3:0]/XA[5:2]§
6
5
XD[31:0]
8
Addr
D1
11
D2
12
XRDY
15
14
XBOFF
XHOLD¶
XHOLDA¶
XHOLD#
XHOLDA#
†
‡
§
¶
#
||
XW/R input/output polarity selected at boot
XBLAST output polarity is always active low.
XBE[3:0]/XA[5:2] operate as byte-enables XBE[3:0] during host-port accesses.
Internal arbiter enabled
External arbiter enabled
This diagram illustrates XBOFF timing. Bus arbitration timing is shown in Figure 46 and Figure 47.
Figure 43. C62x™ as Bus Master—BOFF Operation||
68
7
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
EXPANSION BUS ASYNCHRONOUS HOST-PORT TIMING
timing requirements with external device as asynchronous bus master† (see Figure 44 and
Figure 45)
-200
NO
NO.
MIN
MAX
UNIT
1
tw(XCSL)
Pulse duration, XCS low
4P
ns
2
tw(XCSH)
Pulse duration, XCS high
4P
ns
3
tsu(XSEL-XCSL)
Setup time, expansion bus select signals‡ valid before XCS low
1
ns
4
th(XCSL-XSEL)
Hold time, expansion bus select signals‡ valid after XCS low
3
ns
10
th(XRYL-XCSL)
Hold time, XCS low after XRDY low
P + 1.5
ns
11
tsu(XBEV-XCSH)
Setup time, XBE[3:0]/XA[5:2] valid before XCS high§
1
ns
12
th(XCSH-XBEV)
Hold time, XBE[3:0]/XA[5:2] valid after XCS high§
3
ns
13
tsu(XDV-XCSH)
Setup time, XDx valid before XCS high
1
ns
14
th(XCSH-XDV)
Hold time, XDx valid after XCS high
3
ns
†
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
Expansion bus select signals include XCNTL and XR/W.
§ XBE[3:0]/XA[5:2] operate as byte-enables XBE[3:0] during host-port accesses.
‡
switching characteristics over recommended operating conditions with external device as
asynchronous bus master† (see Figure 44 and Figure 45)
NO
NO.
†
PARAMETER
-200
MIN
5
td(XCSL-XDLZ)
Delay time, XCS low to XDx low impedance
0
6
td(XCSH-XDIV)
Delay time, XCS high to XDx invalid
0
7
td(XCSH-XDHZ)
Delay time, XCS high to XDx high impedance
8
td(XRYL-XDV)
Delay time, XRDY low to XDx valid
9
td(XCSH-XRYH)
Delay time, XCS high to XRDY high
0
MAX
UNIT
ns
12
ns
4P
ns
1
ns
12
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
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69
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
EXPANSION BUS ASYNCHRONOUS HOST-PORT TIMING (CONTINUED)
1
10
XCS
3
1
2
3
4
10
4
XCNTL
XBE[3:0]/XA[5:2]†
3
3
4
4
XR/W‡
3
3
4
4
XR/W‡
5
7
6
8
5
7
6
8
Word
XD[31:0]
9
9
XRDY
†
‡
XBE[3:0]/XA[5:2] operate as byte-enables XBE[3:0] during host-port accesses.
XW/R input/output polarity selected at boot
Figure 44. External Device as Asynchronous Master—Read
10
1
XCS
3
XBE[3:0]/XA[5:2]†
XR/W‡
XR/W‡
XD[31:0]
3
4
XCNTL
11
3
3
1
2
11
3
3
4
13
4
12
4
10
4
4
14
13
9
‡
XBE[3:0]/XA[5:2] operate as byte-enables XBE[3:0] during host-port accesses.
XW/R input/output polarity selected at boot
Figure 45. External Device as Asynchronous Master—Write
70
14
word
Word
XRDY
†
12
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9
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
XHOLD/XHOLDA TIMING
timing requirements for expansion bus arbitration (internal arbiter enabled)† (see Figure 46)
-200
NO
NO.
3
†
MIN
toh(XHDAH-XHDH)
Output hold time, XHOLD high after XHOLDA high
MAX
P
UNIT
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
switching characteristics over recommended operating conditions for expansion bus arbitration
(internal arbiter enabled)†‡ (see Figure 46)
NO
NO.
-200
PARAMETER
1
td(XHDH-XBHZ)
Delay time, XHOLD high to XBus high impedance
2
td(XBHZ-XHDAH)
Delay time, XBus high impedance to XHOLDA high
4
td(XHDL-XHDAL)
Delay time, XHOLD low to XHOLDA low
5
td(XHDAL-XBLZ)
Delay time, XHOLDA low to XBus low impedance
UNIT
MIN
MAX
3P
§
ns
0
2P
ns
3P
0
ns
2P
ns
†
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
‡ XBus consists of XBE[3:0]/XA[5:2], XAS, XW/R, and XBLAST.
§ All pending XBus transactions are allowed to complete before XHOLDA is asserted.
External Requestor
Owns Bus
DSP Owns Bus
DSP Owns Bus
3
XHOLD (input)
2
4
XHOLDA (output)
1
XBus†
†
5
C6204
C6204
XBus consists of XBE[3:0]/XA[5:2], XAS, XW/R, and XBLAST.
Figure 46. Expansion Bus Arbitration—Internal Arbiter Enabled
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
XHOLD/XHOLDA TIMING (CONTINUED)
switching characteristics over recommended operating conditions for expansion bus arbitration
(internal arbiter disabled)† (see Figure 47)
NO
NO.
†
‡
-200
PARAMETER
MIN
1
td(XHDAH-XBLZ)
Delay time, XHOLDA high to XBus low impedance‡
2
td(XBHZ-XHDL)
Delay time, XBus high impedance to XHOLD low‡
2P 2P + 10
0
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
XBus consists of XBE[3:0]/XA[5:2], XAS, XW/R, and XBLAST.
2
XHOLD (output)
XHOLDA (input)
1
XBus†
†
C6204
XBus consists of XBE[3:0]/XA[5:2], XAS, XW/R, and XBLAST.
Figure 47. Expansion Bus Arbitration—Internal Arbiter Disabled
72
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MAX
2P
UNIT
ns
ns
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING
timing requirements for McBSP†‡ (see Figure 48)
-200
NO
NO.
MIN
MAX
UNIT
2
tc(CKRX)
Cycle time, CLKR/X
CLKR/X ext
2P§
ns
3
tw(CKRX)
Pulse duration, CLKR/X high or CLKR/X low
CLKR/X ext
P--1¶
ns
5
tsu(FRH-CKRL)
Setup time,
time external FSR high before CLKR low
6
th(CKRL-FRH)
Hold time,
time external FSR high after CLKR low
7
tsu(DRV-CKRL)
Setup time
time, DR valid before CLKR low
8
th(CKRL-DRV)
Hold time
time, DR valid after CLKR low
10
tsu(FXH-CKXL)
Setup time,
time external FSX high before CLKX low
11
th(CKXL-FXH)
Hold time,
time external FSX high after CLKX low
CLKR int
9
CLKR ext
2
CLKR int
6
CLKR ext
3
CLKR int
8
CLKR ext
0.5
CLKR int
4
CLKR ext
3
CLKX int
9
CLKX ext
2
CLKX int
6
CLKX ext
3
ns
ns
ns
ns
ns
ns
†
CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that signal are also inverted.
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
§ The maximum bit rate for the C6204 devices is 100 Mbps or CPU/2 (the slower of the two). Care must be taken to ensure that the AC timings
specified in this data sheet are met. The maximum bit rate for McBSP-to-McBSP communications is 100 MHz; therefore, the minimum CLKR/X
clock cycle is either twice the CPU cycle time (2P), or 10 ns (100 MHz), whichever value is larger. For example, when running parts at 200 MHz
(P = 5 ns), use 10 ns as the minimum CLKR/X clock cycle (by setting the appropriate CLKGDV ratio or external clock source). When running
parts at 100 MHz (P = 10 ns), use 2P = 20 ns (50 MHz) as the minimum CLKR/X clock cycle. The maximum bit rate for McBSP-to-McBSP
communications applies when the serial port is a master of the clock and frame syncs (with CLKR connected to CLKX, FSR connected to FSX,
CLKXM = FSXM = 1, and CLKRM = FSRM = 0) in data delay 1 or 2 mode (R/XDATDLY = 01b or 10b) and the other device the McBSP
communicates to is a slave.
¶ The minimum CLKR/X pulse duration is either (P--1) or 4 ns, whichever is larger. For example, when running parts at 200 MHz (P = 5 ns), use
4 ns as the minimum CLKR/X pulse duration. When running parts at 100 MHz (P = 10 ns), use (P--1) = 9 ns as the minimum CLKR/X pulse
duration.
‡
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73
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
switching characteristics over recommended operating conditions for McBSP†‡ (see Figure 48)
NO
NO.
-200
PARAMETER
1
td(CKSH-CKRXH)
Delay time, CLKS high to CLKR/X high for internal
CLKR/X generated from CLKS input
2
tc(CKRX)
Cycle time, CLKR/X
MIN
MAX
3
12
CLKR/X int
2P--2§¶
2#
tw(CKRX)
Pulse duration, CLKR/X high or CLKR/X low
CLKR/X int
4
td(CKRH-FRV)
Delay time, CLKR high to internal FSR valid
CLKR int
--3
3
CLKX int
--3
3
CLKX ext
3
9
CLKX int
--1
5
CLKX ext
2
9
td(CKXH-FXV)
Dela time,
Delay
time CLKX high to internal FSX valid
alid
12
tdis(CKXH-DXHZ)
Disable time, DX high impedance following last data bit from
CLKX high
13
td(CKXH-DXV)
Dela time,
Delay
time CLKX high to DX valid
alid
14
td(FXH-DXV)
Delay time, FSX high to DX valid
ONLY applies when in data delay 0 (XDATDLY = 00b) mode.
†
ns
ns
3
9
C --
UNIT
C+
2#
CLKX int
--1
4
CLKX ext
2
11
FSX int
--1
5
FSX ext
2
12
ns
ns
ns
ns
ns
ns
CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that signal are also inverted.
Minimum delay times also represent minimum output hold times.
§ P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
¶ The maximum bit rate for the C6204 devices is 100 Mbps or CPU/2 (the slower of the two). Care must be taken to ensure that the AC timings
specified in this data sheet are met. The maximum bit rate for McBSP-to-McBSP communications is 100 MHz; therefore, the minimum CLKR/X
clock cycle is either twice the CPU cycle time (2P), or 10 ns (100 MHz), whichever value is larger. For example, when running parts at 200 MHz
(P = 5 ns), use 10 ns as the minimum CLKR/X clock cycle (by setting the appropriate CLKGDV ratio or external clock source). When running
parts at 100 MHz (P = 10 ns), use 2P = 20 ns (50 MHz) as the minimum CLKR/X clock cycle. The maximum bit rate for McBSP-to-McBSP
communications applies when the serial port is a master of the clock and frame syncs (with CLKR connected to CLKX, FSR connected to FSX,
CLKXM = FSXM = 1, and CLKRM = FSRM = 0) in data delay 1 or 2 mode (R/XDATDLY = 01b or 10b) and the other device the McBSP
communicates to is a slave.
# C = H or L
S = sample rate generator input clock = P if CLKSM = 1 (P = 1/CPU clock frequency)
= sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
CLKGDV should be set appropriately to ensure the McBSP bit rate does not exceed the 100-MHz limit.
‡
74
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
CLKS
1
2
3
3
CLKR
4
FSR (int)
4
5
6
FSR (ext)
7
DR
2
3
8
Bit(n-1)
(n-2)
(n-3)
3
CLKX
9
FSX (int)
10
11
FSX (ext)
FSX (XDATDLY=00b)
12
DX
Bit 0
14
13
Bit(n-1)
13
(n-2)
(n-3)
Figure 48. McBSP Timings
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75
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
timing requirements for FSR when GSYNC = 1 (see Figure 49)
-200
NO
NO.
MIN
UNIT
1
tsu(FRH-CKSH)
Setup time, FSR high before CLKS high
4
ns
2
th(CKSH-FRH)
Hold time, FSR high after CLKS high
4
ns
CLKS
1
FSR external
2
CLKR/X (no need to resync)
CLKR/X (needs resync)
Figure 49. FSR Timing When GSYNC = 1
76
MAX
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
timing requirements for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 0†‡ (see Figure 50)
-200
MASTER
NO.
MIN
4
tsu(DRV-CKXL)
Setup time, DR valid before CLKX low
5
th(CKXL-DRV)
Hold time, DR valid after CLKX low
SLAVE
MAX
MIN
UNIT
MAX
12
2 -- 3P
ns
4
6 + 6P
ns
†
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
‡ For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
switching characteristics over recommended operating conditions for McBSP as SPI master or
slave: CLKSTP = 10b, CLKXP = 0†‡ (see Figure 50)
-200
NO.
†
‡
§
¶
#
MASTER§
PARAMETER
MIN
MAX
SLAVE
MIN
UNIT
MAX
1
th(CKXL-FXL)
Hold time, FSX low after CLKX low¶
T -- 3
T+5
ns
2
td(FXL-CKXH)
Delay time, FSX low to CLKX high#
L -- 4
L+5
ns
3
td(CKXH-DXV)
Delay time, CLKX high to DX valid
--4
5
6
tdis(CKXL-DXHZ)
Disable time, DX high impedance following last data bit from
CLKX low
L -- 2
L+3
7
tdis(FXH-DXHZ)
Disable time, DX high impedance following last data bit from
FSX high
P+3
3P + 17
ns
8
td(FXL-DXV)
Delay time, FSX low to DX valid
2P + 2
4P + 17
ns
3P + 3
5P + 17
ns
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
S = sample rate generator input clock = P if CLKSM = 1 (P = 1/CPU clock frequency)
= sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
CLKGDV should be set appropriately to ensure the McBSP bit rate does not exceed the 100-MHz limit.
FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX
and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(CLKX).
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
CLKX
1
2
FSX
7
6
DX
8
3
Bit 0
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
(n-4)
5
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 50. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0
78
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
timing requirements for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 0†‡ (see Figure 51)
-200
MASTER
NO.
MIN
4
tsu(DRV-CKXH)
Setup time, DR valid before CLKX high
5
th(CKXH-DRV)
Hold time, DR valid after CLKX high
SLAVE
MAX
MIN
UNIT
MAX
12
2 -- 3P
ns
4
5 + 6P
ns
†
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
‡ For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
switching characteristics over recommended operating conditions for McBSP as SPI master or
slave: CLKSTP = 11b, CLKXP = 0†‡ (see Figure 51)
-200
NO.
MASTER§
PARAMETER
MIN
MAX
SLAVE
MIN
UNIT
MAX
1
th(CKXL-FXL)
Hold time, FSX low after CLKX low¶
L -- 2
L+3
ns
2
td(FXL-CKXH)
Delay time, FSX low to CLKX high#
T -- 2
T+3
ns
3
td(CKXL-DXV)
Delay time, CLKX low to DX valid
--2
4
3P + 4
5P + 17
ns
6
tdis(CKXL-DXHZ)
Disable time, DX high impedance following last data bit from
CLKX low
--2
4
3P + 3
5P + 17
ns
7
td(FXL-DXV)
Delay time, FSX low to DX valid
H -- 2
H+4
2P + 2
4P + 17
ns
†
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
§ S = sample rate generator input clock = P if CLKSM = 1 (P = 1/CPU clock frequency)
= sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
CLKGDV should be set appropriately to ensure the McBSP bit rate does not exceed the 100-MHz limit.
¶ FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX
and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
# FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(CLKX).
‡
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
CLKX
1
2
6
Bit 0
7
FSX
DX
3
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
(n-4)
5
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 51. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0
80
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
timing requirements for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 1†‡ (see Figure 52)
-200
MASTER
NO.
MIN
4
tsu(DRV-CKXH)
Setup time, DR valid before CLKX high
5
th(CKXH-DRV)
Hold time, DR valid after CLKX high
SLAVE
MAX
MIN
UNIT
MAX
12
2 -- 3P
ns
4
5 + 6P
ns
†
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
‡ For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
switching characteristics over recommended operating conditions for McBSP as SPI master or
slave: CLKSTP = 10b, CLKXP = 1†‡ (see Figure 52)
-200
NO.
MASTER§
PARAMETER
MIN
MAX
SLAVE
MIN
UNIT
MAX
1
th(CKXH-FXL)
Hold time, FSX low after CLKX high¶
T -- 2
T+3
ns
2
td(FXL-CKXL)
Delay time, FSX low to CLKX low#
H -- 2
H+3
ns
3
td(CKXL-DXV)
Delay time, CLKX low to DX valid
--2
4
6
tdis(CKXH-DXHZ)
Disable time, DX high impedance following last data bit from
CLKX high
H -- 2
H+3
7
tdis(FXH-DXHZ)
Disable time, DX high impedance following last data bit from
FSX high
P+3
3P + 17
ns
8
td(FXL-DXV)
Delay time, FSX low to DX valid
2P + 2
4P + 17
ns
3P + 4
5P + 17
ns
ns
†
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
§ S = sample rate generator input clock = P if CLKSM = 1 (P = 1/CPU clock frequency)
= sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
CLKGDV should be set appropriately to ensure the McBSP bit rate does not exceed the 100-MHz limit.
¶ FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX
and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
# FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(CLKX).
‡
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
CLKX
1
2
FSX
7
6
DX
8
3
Bit 0
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
(n-4)
5
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 52. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1
82
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
timing requirements for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 1†‡ (see Figure 53)
-200
MASTER
NO.
MIN
4
tsu(DRV-CKXL)
Setup time, DR valid before CLKX low
5
th(CKXL-DRV)
Hold time, DR valid after CLKX low
SLAVE
MAX
MIN
UNIT
MAX
12
2 -- 3P
ns
4
5 + 6P
ns
†
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
‡ For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
switching characteristics over recommended operating conditions for McBSP as SPI master or
slave: CLKSTP = 11b, CLKXP = 1†‡ (see Figure 53)
-200
NO.
MASTER§
PARAMETER
MIN
MAX
SLAVE
MIN
UNIT
MAX
1
th(CKXH-FXL)
Hold time, FSX low after CLKX high¶
H -- 2
H+3
ns
2
td(FXL-CKXL)
Delay time, FSX low to CLKX low#
T -- 2
T+1
ns
3
td(CKXH-DXV)
Delay time, CLKX high to DX valid
--2
4
3P + 4
5P + 17
ns
6
tdis(CKXH-DXHZ)
Disable time, DX high impedance following last data bit from
CLKX high
--2
4
3P + 3
5P + 17
ns
7
td(FXL-DXV)
Delay time, FSX low to DX valid
L -- 2
L+4
2P + 2
4P + 17
ns
†
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
§ S = sample rate generator input clock = P if CLKSM = 1 (P = 1/CPU clock frequency)
= sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
CLKGDV should be set appropriately to ensure the McBSP bit rate does not exceed the 100-MHz limit.
¶ FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX
and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
# FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(CLKX).
‡
POST OFFICE BOX 1443
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83
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
CLKX
1
2
FSX
7
6
DX
3
Bit 0
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
(n-4)
5
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 53. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1
84
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
DMAC, TIMER, POWER-DOWN TIMING
switching characteristics over recommended operating conditions for DMAC outputs†
(see Figure 54)
NO
NO.
1
†
-200
PARAMETER
tw(DMACH)
MIN
Pulse duration, DMAC high
MAX
2P--3
UNIT
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
1
DMAC[3:0]
Figure 54. DMAC Timing
timing requirements for timer inputs† (see Figure 55)
-200
NO
NO.
†
MIN
MAX
UNIT
1
tw(TINPH)
Pulse duration, TINP high
2P
ns
2
tw(TINPL)
Pulse duration, TINP low
2P
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
switching characteristics over recommended operating conditions for timer outputs†
(see Figure 55)
NO
NO.
†
-200
PARAMETER
MIN
MAX
UNIT
3
tw(TOUTH)
Pulse duration, TOUT high
2P--3
ns
4
tw(TOUTL)
Pulse duration, TOUT low
2P--3
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
2
1
TINPx
4
3
TOUTx
Figure 55. Timer Timing
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
DMAC, TIMER, POWER-DOWN TIMING (CONTINUED)
switching characteristics over recommended operating conditions for power-down outputs†
(see Figure 56)
NO
NO.
1
†
-200
PARAMETER
tw(PDH)
MIN
Pulse duration, PD high
2P
P = 1/CPU clock frequency in ns. For example, when running parts at 200 MHz, use P = 5 ns.
1
PD
Figure 56. Power-Down Timing
86
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MAX
UNIT
ns
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
JTAG TEST-PORT TIMING
timing requirements for JTAG test port (see Figure 57)
-200
NO
NO.
MIN
MAX
UNIT
1
tc(TCK)
Cycle time, TCK
35
ns
3
tsu(TDIV-TCKH)
Setup time, TDI/TMS/TRST valid before TCK high
11
ns
4
th(TCKH-TDIV)
Hold time, TDI/TMS/TRST valid after TCK high
9
ns
switching characteristics over recommended operating conditions for JTAG test port
(see Figure 57)
NO
NO.
2
-200
PARAMETER
td(TCKL-TDOV)
Delay time, TCK low to TDO valid
MIN
MAX
--4.5
12
UNIT
ns
1
TCK
2
2
TDO
3
4
TDI/TMS/TRST
Figure 57. JTAG Test-Port Timing
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TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
REVISION HISTORY
This data sheet revision history highlights the technical changes made to the SPR152B device-specific data
sheet to make it an SPRS152C revision.
Scope: Applicable updates to the C62x device family, specifically relating to the C6204 device, have been incorporated.
PAGE(S)
NO.
88
ADDITIONS/CHANGES/DELETIONS
All
Updated the title for literature number SPRU190 to:
TMS320C6000 DSP Peripherals Overview Reference Guide
10
memory map summary:
Changed the document reference in the last sentence of the paragraph.
11
peripheral register descriptions:
Updated the information regarding the document reference.
16
DMA synchronization events:
Updated the information regarding the document reference.
17
Table 13, C6202/02B DSP Interrupts:
Changed the document reference in the second footnote to:
TMS320C6000 DSP Interrupt Selector Reference Guide (literature number SPRU646)
36
Added the power-down mode logic section and accompanying information.
43
switching characteristics over recommended operating conditions for CLKOUT2 table:
Removed NO. 1 (parameter tc(CKO2) ) from the table.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251--1443
TMS320C6204
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS152C -- OCTOBER 2000 -- REVISED MARCH 2004
THERMAL/MECHANICAL DATA
The mechanical package diagrams that follow the tables reflect the most current released mechanical data
available for the designated devices.
thermal resistance characteristics (GHK-288 S-PBGA package)
NO
†
°C/W
Air Flow (m/s†)
1
RΘJC
Junction-to-case
9.5
N/A
2
RΘJA
Junction-to-free air
26.5
0.00
3
RΘJA
Junction-to-free air
23.9
0.50
4
RΘJA
Junction-to-free air
22.6
1.00
5
RΘJA
Junction-to-free air
21.3
2.00
°C/W
Air Flow (m/s†)
m/s = meters per second
thermal resistance characteristics (GLW-340 S-PBGA package)
NO
†
1
RΘJC
Junction-to-case
11.7
N/A
2
RΘJA
Junction-to-free air
14.2
0.00
3
RΘJA
Junction-to-free air
12.3
0.50
4
RΘJA
Junction-to-free air
10.9
1.00
5
RΘJA
Junction-to-free air
9.3
2.00
m/s = meters per second
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251--1443
89
PACKAGE OPTION ADDENDUM
www.ti.com
5-Jun-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
TMS320C6204GHK200
ACTIVE
BGA
MICROSTAR
GHK
288
TMS320C6204GHK200E
OBSOLETE
BGA
MICROSTAR
GHK
288
TMS320C6204GHKA200
ACTIVE
BGA
MICROSTAR
GHK
288
TMS320C6204GLW200
ACTIVE
BGA
GLW
340
TMS320C6204ZHK200
ACTIVE
BGA
MICROSTAR
ZHK
288
TMS320C6204ZHKA200
ACTIVE
BGA
MICROSTAR
ZHK
288
TMX320C6204GHK
OBSOLETE
BGA
MICROSTAR
GHK
TMX320C6204GLW
OBSOLETE
BGA
GLW
90
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
(3)
Device Marking
(4/5)
TBD
SNPB
Level-3-220C-168 HR
TBD
Call TI
Call TI
TBD
SNPB
Level-3-220C-168 HR
TBD
SNPB
Level-4-220C-72 HR
C6204GLW200
TMS320
1
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
320C6204ZHK
200
TMS
90
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
C6204ZHK200
A
TMS320
288
TBD
Call TI
Call TI
0 to 0
340
TBD
Call TI
Call TI
0 to 0
90
320C6204GHK
200
TMS
-40 to 105
C6204GHK200
A
TMS320
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
5-Jun-2013
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
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