TI V62/03669-01XA

SGUS042A − MAY 1998 − REVISED APRIL 2004
D Controlled Baseline
D
D
D
D
D
D
D
D 1M-Bit On-Chip SRAM
− One Assembly/Test Site, One Fabrication
Site
Extended Temperature Performance up to
−40°C to 105°C
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Enhanced Product-Change Notification
Qualification Pedigree†
Highest Performance Floating-Point Digital
Signal Processor (DSP) 320C6701
− 8.3-, 6-ns Instruction Cycle Time
− 120-, 167-MHz Clock Rate
− Eight 32-Bit Instructions/Cycle
− 1 GFLOPS
− 320C6201 Fixed-Point DSP
Pin-Compatible
VelociTI Advanced Very Long Instruction
Word (VLIW) C67x CPU Core
− Eight Highly Independent Functional
Units:
− Four ALUs (Floating- and Fixed-Point)
− Two ALUs (Fixed-Point)
− Two Multipliers (Floating- and
Fixed-Point)
− Load-Store Architecture With 32 32-Bit
General-Purpose Registers
− Instruction Packing Reduces Code Size
− All Instructions Conditional
Instruction Set Features
− Hardware Support for IEEE
Single-Precision Instructions
− Hardware Support for IEEE
Double-Precision Instructions
− Byte-Addressable (8-, 16-, 32-Bit Data)
− 8-Bit Overflow Protection
− Saturation
− Bit-Field Extract, Set, Clear
− Bit-Counting
− Normalization
D
D
D
D
D
D
D
D
D
D
D
D
− 512K-Bit Internal Program/Cache
(16K 32-Bit Instructions)
− 512K-Bit Dual-Access Internal Data
(64K Bytes)
32-Bit External Memory Interface (EMIF)
− Glueless Interface to Synchronous
Memories: SDRAM and SBSRAM
− Glueless Interface to Asynchronous
Memories: SRAM and EPROM
− 52M-Byte Addressable External Memory
Space
Four-Channel Bootloading
Direct-Memory-Access (DMA) Controller
With an Auxiliary Channel
16-Bit Host-Port Interface (HPI)
− Access to Entire Memory Map
Two Multichannel Buffered Serial Ports
(McBSPs)
− Direct Interface to T1/E1, MVIP, SCSA
Framers
− ST-Bus-Switching Compatible
− Up to 256 Channels Each
− AC97-Compatible
− Serial-Peripheral-Interface (SPI)
Compatible (Motorola)
Two 32-Bit General-Purpose Timers
Flexible Phase-Locked-Loop (PLL) Clock
Generator
IEEE-1149.1 (JTAG‡)
Boundary-Scan-Compatible
352-Pin Ball Grid Array (BGA) Package
(GJC Suffix)
352-Pin Ball Grid Array (BGA) Mechanical
Shock-Tolerant Package (Mech~Shock)
Option (GJC Suffix)
0.18-µm/5-Level Metal Process
− CMOS Technology
3.3-V I/Os, 1.8-V Internal (120-MHz)
3.3-V I/Os, 1.9-V Internal (167-MHz)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
VelociTI is a trademark of Texas Instruments.
Motorola is a trademark of Motorola, Inc.
† Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range.
This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this
component beyond specified performance and environmental limits.
‡ IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
Copyright  2003, Texas Instruments Incorporated
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1
SGUS042A − MAY 1998 − REVISED APRIL 2004
Table of Contents
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
parameter measurement information . . . . . . . . . . . . . . . 27
device characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
signal-transition levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
functional block and CPU diagram . . . . . . . . . . . . . . . . . . . . . 4
input and output clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
CPU description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
asynchronous memory timing . . . . . . . . . . . . . . . . . . . . . 31
signal groups description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
synchronous-burst memory timing . . . . . . . . . . . . . . . . . 33
signal descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
synchronous DRAM timing . . . . . . . . . . . . . . . . . . . . . . . . 37
development support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
HOLD/HOLDA timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
documentation support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
reset timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
clock PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
external interrupt timing . . . . . . . . . . . . . . . . . . . . . . . . . . 44
absolute maximum ratings over operating case
temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
host-port interface timing . . . . . . . . . . . . . . . . . . . . . . . . . 45
recommended operating conditions . . . . . . . . . . . . . . . . . . . 26
DMAC, timer, power-down timing . . . . . . . . . . . . . . . . . . 59
electrical characteristics over recommended ranges of
supply voltage and operating case temperature . . . . 26
JTAG test-port timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
multichannel buffered serial port timing . . . . . . . . . . . . . 48
mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
GJC (352-PIN BGA) PACKAGE
( BOTTOM VIEW )
description
26
1
The 320C67x DSPs are the floating-point DSP
A
family in the TMS320C6000 DSP platform. The
B
SM320C6701-EP and SM320C6701MECH-EP
C
D
(C6701) devices are based on the highE
performance, advanced VelociTI very-longF
G
instruction-word (VLIW) architecture developed
H
J
by Texas Instruments (TI), making this DSP an
K
excellent
choice
for
multichannel
and
L
M
multifunction applications. With performance of
N
P
up to 1 giga floating-point operations per second
R
(GFLOPS) at a clock rate of 167 MHz, the C6701
T
U
offers
cost-effective
solutions
to
highV
W
performance DSP programming challenges. The
Y
C6701 DSP possesses the operational flexibility
AA
AB
of high-speed controllers and the numerical
AC
AD
capability of array processors. This processor has
AE
32 general-purpose registers of 32-bit word length
AF
and eight highly independent functional units. The
eight functional units provide four floating-/fixedpoint ALUs, two fixed-point ALUs, and two
floating-/fixed-point multipliers. The C6701 can produce two multiply-accumulates (MACs) per cycle for a total
of 334 million MACs per second (MMACS). The C6701 DSP also has application-specific hardware logic,
on-chip memory, and additional on-chip peripherals.
The C6701 includes a large bank of on-chip memory and has a powerful and diverse set of peripherals. Program
memory consists of a 64K-byte block that is user-configurable as cache or memory-mapped program space.
Data memory consists of two 32K-byte blocks of RAM. The peripheral set includes two multichannel buffered
serial ports (McBSPs), two general-purpose timers, a host-port interface (HPI), and a glueless external memory
interface (EMIF) capable of interfacing to SDRAM or SBSRAM and asynchronous peripherals.
TMS320C6000 is a trademark of Texas Instruments.
Windows is a registered trademark of Microsoft Corporation.
2
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SGUS042A − MAY 1998 − REVISED APRIL 2004
description (continued)
The C6701 has a complete set of development tools which includes: a new C compiler, an assembly optimizer
to simplify programming and scheduling, and a Windows debugger interface for visibility into source code
execution.
mechanical shock-tolerant package option
Typically, industry-standard non-hermetic plastic ball grid array (PBGA) packages manufactured with a metal
heat spreader/lid for die coverage are not designed to be tolerant of high levels of mechanical shock. For
systems that experience significant mechanical shock, additional board/module design effort is required to allow
for the use of the typical PBGA. Therefore, TI designed the Mech~Shock package for selected C6000 platform
DSPs for use in applications that will encounter high levels of mechanical shock (e.g., missiles and self-guided
projectiles/munitions). The Mech~Shock package is a mechanical-shock package embodiment qualified to
20,000 Gs of mechanical shock. Qualification testing is per MIL-STD-883E, Method 2002.3, Test Condition F.
The Mech~Shock package, while non-hermetic, directly addresses the shock stress-environments of system
applications that experience severe shock profiles during operation. Mech~Shock packages incorporate a
composite (and lighter) heat spreader/lid. The composite heat spreader has equivalent thermal performance
to the heavier, solid copper heat spreaders, but the composite lid is less massive. This composite lid is placed
on a standard-footprint PBGA substrate and attached with adhesives that have unique, shock-tolerant
characteristics. A Mech~Shock package is footprint compatible with the standard commercial package for the
same DSP product.
device characteristics
Table 1 provides an overview of the C6701 DSP. The table shows significant features of each device, including
the capacity of on-chip RAM, the peripherals, the execution time, and the package type with pin count, etc.
Table 1. Characteristics of the C6701 Processors
HARDWARE FEATURES
Peripherals
C6701
EMIF
1
DMA
4-Channel
Host-Port Interface (HPI)
1
McBSPs
2
32-Bit Timers
2
Size (Bytes)
Internal Program Memory
64K
Organization
64K Bytes Cache/Mapped Program
Size (Bytes)
Internal Data Memory
64K
Organization
Frequency
MHz
Cycle Time
ns
2 Blocks: Eight 16-Bit Banks per Block 50/50 Split
120, 167
6 ns (6701-167); 8.3 ns (6701-120)
1.8 (6701-120)
Voltage
Core (V)
1.9 (6701-167)
I/O (V)
3.3
PLL Options
CLKIN frequency multiplier
BGA Package
35 x 35 mm
Process Technology
µm
Product Status
Product Preview (PP)
Advance Information (AI)
Production Data (PD)
Bypass (x1), x4
352-pin GJC
0.18 µm
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PD
3
SGUS042A − MAY 1998 − REVISED APRIL 2004
functional block and CPU diagram
C6701 Digital Signal Processor
Program
Bus
SDRAM
SBSRAM
32
SRAM
External Memory
Interface (EMIF)
ROM/FLASH
Internal Program Memory
1 Block Program/Cache
(64K Bytes)
Program
Access/Cache
Controller
I/O Devices
C67x CPU
Instruction Fetch
Timer 1
Instruction Dispatch
16
Host Port
Interface
(HPI)
Data Bus
DMA Buses
Multichannel
Buffered Serial
Port 1
Control
Logic
Data Path B
A Register File
B Register File
In-Circuit
Emulation
.D2 .M2† .S2† .L2†
Interrupt
Control
.L1† .S1† .M1† .D1
Direct Memory
Access Controller
(DMA)
(4 Channels)
PLL
(x1, x4)
Data Path A
PowerDown
Logic
Data
Access
Controller
† These functional units execute floating-point instructions.
4
Control
Registers
Instruction Decode
Multichannel
Buffered Serial
Port 0
Framing Chips:
H.100, MVIP,
SCSA, T1, E1
AC97 Devices,
SPI Devices,
Codecs
HOST CONNECTION
MC68360 Glueless
MPC860 Glueless
PCI9050 Bridge + Inverter
MC68302 + PAL
MPC750 + PAL
MPC960 (Jx/Rx) + PAL
Timer 0
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Test
Internal Data
Memory
(64K Bytes)
2 Blocks of 8 Banks
Each
SGUS042A − MAY 1998 − REVISED APRIL 2004
CPU description
The CPU fetches VelociTI advanced very-long instruction words (VLIW) (256 bits wide) to supply up to eight
32-bit instructions to the eight functional units during every clock cycle. The VelociTI VLIW architecture features
controls by which all eight units do not have to be supplied with instructions if they are not ready to execute. The
first bit of every 32-bit instruction determines if the next instruction belongs to the same execute packet as the
previous instruction, or whether it should be executed in the following clock as a part of the next execute packet.
Fetch packets are always 256 bits wide; however, the execute packets can vary in size. The variable-length
execute packets are a key memory-saving feature, distinguishing the C67x CPU from other VLIW architectures.
The CPU features two sets of functional units. Each set contains four units and a register file. One set contains
functional units .L1, .S1, .M1, and .D1; the other set contains units .D2, .M2, .S2, and .L2. The two register files
contain 16 32-bit registers each for the total of 32 general-purpose registers. The two sets of functional units,
along with two register files, compose sides A and B of the CPU (see the Functional and CPU Block diagram
and Figure 1). The four functional units on each side of the CPU can freely share the 16 registers belonging to
that side. Additionally, each side features a single data bus connected to all registers on the other side, by which
the two sets of functional units can access data from the register files on opposite sides. While register access
by functional units on the same side of the CPU as the register file can service all the units in a single clock cycle,
register access using the register file across the CPU supports one read and one write per cycle.
The C67x CPU executes all TMS320C62x DSP fixed-point instructions. In addition to the C62x DSP
fixed-point instructions, the six out of eight functional units (.L1, .M1, .D1, .D2, .M2, and .L2) also execute
floating-point instructions. The remaining two functional units (.S1 and .S2) also execute the new LDDW
instruction which loads 64 bits per CPU side for a total of 128 bits per cycle.
Another key feature of the C67x CPU is the load/store architecture, where all instructions operate on registers
(as opposed to data in memory). Two sets of data-addressing units (.D1 and .D2) are responsible for all data
transfers between the register files and the memory. The data address driven by the .D units allows data
addresses generated from one register file to be used to load or store data to or from the other register file. The
C67x CPU supports a variety of indirect-addressing modes using either linear- or circular-addressing modes
with 5- or 15-bit offsets. All instructions are conditional, and most can access any one of the 32 registers. Some
registers, however, are singled out to support specific addressing or to hold the condition for conditional
instructions (if the condition is not automatically “true”). The two .M functional units are dedicated for multiplies.
The two .S and .L functional units perform a general set of arithmetic, logical, and branch functions with results
available every clock cycle.
The processing flow begins when a 256-bit-wide instruction fetch packet is fetched from a program memory.
The 32-bit instructions destined for the individual functional units are “linked” together by “1” bits in the least
significant bit (LSB) position of the instructions. The instructions that are “chained” together for simultaneous
execution (up to eight in total) compose an execute packet. A “0” in the LSB of an instruction breaks the chain,
effectively placing the instructions that follow it in the next execute packet. If an execute packet crosses the
fetch-packet boundary (256 bits wide), the assembler places it in the next fetch packet, while the remainder of
the current fetch packet is padded with NOP instructions. The number of execute packets within a fetch packet
can vary from one to eight. Execute packets are dispatched to their respective functional units at the rate of one
per clock cycle and the next 256-bit fetch packet is not fetched until all the execute packets from the current fetch
packet have been dispatched. After decoding, the instructions simultaneously drive all active functional units
for a maximum execution rate of eight instructions every clock cycle. While most results are stored in 32-bit
registers, they can be subsequently moved to memory as bytes or half-words as well. All load and store
instructions are byte-, half-word, or word-addressable.
TMS320C62x is a trademark of Texas Instruments.
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5
SGUS042A − MAY 1998 − REVISED APRIL 2004
CPU description (continued)
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ÁÁÁÁÁÁÁÁ
src1
.L1† src2
dst
long dst
long src
LD1 32 MSB
ST1
8
8
long src
long dst
dst
.S1†
src1
Data Path A
32
32
8
8
src2
dst
src1
†
.M1
src2
LD1 32 LSB
ÁÁ
ÁÁ
ÁÁ
ÁÁ
DA1
DA2
LD2 32 LSB
.D1
.D2
dst
src1
src2
1X
src2
.M2† src1
dst
src2
ÁÁ
ÁÁ
LD2 32 MSB
ST2
long src
long dst
dst
.L2†
src2
8
8
8
8
src1
† These functional units execute floating-point instructions.
Figure 1. TMS320C67x CPU Data Paths
6
Register
File B
(B0−B15)
.S2†
Data Path B
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Register
File A
(A0−A15)
2X
src2
src1
dst
src1
dst
long dst
long src
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ÁÁÁÁÁ
Á
32
32
Control
Register File
SGUS042A − MAY 1998 − REVISED APRIL 2004
signal groups description
CLKIN
CLKOUT2
CLKOUT1
CLKMODE1
CLKMODE0
Boot Mode
BOOTMODE4
BOOTMODE3
BOOTMODE2
BOOTMODE1
BOOTMODE0
Reset and
Interrupts
RESET
NMI
EXT_INT7
EXT_INT6
EXT_INT5
EXT_INT4
IACK
INUM3
INUM2
INUM1
INUM0
Little ENDIAN
Big ENDIAN
LENDIAN
CLOCK/PLL
PLLFREQ3
PLLFREQ2
PLLFREQ1
PLLV
PLLG
PLLF
TMS
TDO
TDI
TCK
TRST
EMU1
EMU0
IEEE Standard
1149.1
(JTAG)
Emulation
RSV9
RSV8
RSV7
RSV6
RSV5
RSV4
RSV3
RSV2
RSV1
RSV0
DMA Status
DMAC3
DMAC2
DMAC1
DMAC0
Power-Down
Status
PD
Reserved
Control/Status
HD[15:0]
HCNTL0
HCNTL1
16
Data
HPI
(Host-Port Interface)
Register Select
Control
HHWIL
HBE1
HBE0
Half-Word/Byte
Select
HAS
HR/W
HCS
HDS1
HDS2
HRDY
HINT
Figure 2. CPU and Peripheral Signals
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7
SGUS042A − MAY 1998 − REVISED APRIL 2004
signal groups description (continued)
32
ED[31:0]
Data
CE3
CE2
CE1
CE0
EA[21:2]
BE3
BE2
BE1
BE0
HOLD
HOLDA
Asynchronous
Memory
Control
ARE
AOE
AWE
ARDY
Memory Map
Space Select
20
Word Address
SBSRAM
Control
SSADS
SSOE
SSWE
SSCLK
SDRAM
Control
SDA10
SDRAS
SDCAS
SDWE
SDCLK
Byte Enables
HOLD/
HOLDA
EMIF
(External Memory Interface)
TOUT1
Timer 1
Timer 0
TOUT0
TINP0
TINP1
Timers
McBSP1
McBSP0
CLKX1
FSX1
DX1
Receive
Receive
CLKX0
FSX0
DX0
CLKR1
FSR1
DR1
Transmit
Transmit
CLKR0
FSR0
DR0
CLKS1
Clock
Clock
CLKS0
McBSPs
(Multichannel Buffered Serial Ports)
Figure 3. Peripheral Signals
8
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SGUS042A − MAY 1998 − REVISED APRIL 2004
Signal Descriptions
SIGNAL
NAME
NO.
TYPE†
DESCRIPTION
CLOCK/PLL
CLKIN
C10
I
Clock Input
CLKOUT1
AF22
O
Clock output at full device speed
CLKOUT2
AF20
O
Clock output at half of device speed
CLKMODE1
C6
CLKMODE0
C5
PLLFREQ3
A9
PLLFREQ2
D11
PLLFREQ1
PLLV‡
B10
D12
PLLG‡
Clock mode select
I
I
•
Selects whether the output clock frequency = input clock frequency x4 or x1
PLL frequency range (3, 2, and 1)
• The target range for CLKOUT1 frequency is determined by the 3-bit value of the PLLFREQ pins.
PLL analog VCC connection for the low-pass filter
C12
A§
A§
PLLF
A11
A§
PLL low-pass filter connection to external components and a bypass capacitor
TMS
L3
I
TDO
W2
O/Z
TDI
R4
I
JTAG test-port data in (features an internal pullup)
TCK
R3
I
JTAG test-port clock
JTAG test-port reset (features an internal pulldown)
PLL analog GND connection for the low-pass filter
JTAG EMULATION
JTAG test-port mode select (features an internal pullup)
JTAG test-port data out
TRST
T1
I
EMU1
Y1
I/O/Z
EMU0
W3
I/O/Z
RESET
K2
I
Device reset
NMI
L2
I
Nonmaskable interrupt
• Edge-driven (rising edge)
EXT_INT7
U3
I
External interrupts
• Edge-driven (rising edge)
O
Interrupt acknowledge for all active interrupts serviced by the CPU
O
Active interrupt identification number
• Valid during IACK for all active interrupts (not just external)
• Encoding order follows the interrupt-service fetch-packet ordering
I
If high, LENDIAN selects little-endian byte/half-word addressing order within a word
If low, LENDIAN selects big-endian addressing
Emulation pin 1, pullup with a dedicated 20-kΩ resistor¶
Emulation pin 0, pullup with a dedicated 20-kΩ resistor¶
CONTROL
EXT_INT6
V2
EXT_INT5
W1
EXT_INT4
U4
IACK
Y2
INUM3
AA1
INUM2
W4
INUM1
AA2
INUM0
AB1
LENDIAN
H3
PD
D3
O
Power-down mode 3 (active if high)
† I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
‡ PLLV and PLLG are not part of external voltage supply or ground. See the CLOCK/PLL documentation for information on how to connect these
pins.
§ A = Analog Signal (PLL Filter)
¶ For emulation and normal operation, pull up EMU1 and EMU0 with a dedicated 20-kΩ resistor. For boundary scan, pull down EMU1 and EMU0
with a dedicated 20-kΩ resistor.
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Signal Descriptions (Continued)
SIGNAL
NAME
NO.
TYPE†
DESCRIPTION
HOST-PORT INTERFACE (HPI)
HINT
H26
O
Host interrupt (from DSP to host)
HCNTL1
F23
I
Host control − selects between control, address, or data registers
HCNTL0
D25
I
Host control − selects between control, address, or data registers
HHWIL
C26
I
Host half-word select − first or second half-word (not necessarily high or low order)
HBE1
E23
I
Host byte select within word or half-word
HBE0
D24
I
Host byte select within word or half-word
HR/W
C23
I
Host read or write select
HD15
B13
HD14
B14
HD13
C14
HD12
B15
HD11
D15
HD10
B16
HD9
A17
HD8
B17
HD7
D16
HD6
B18
HD5
A19
HD4
C18
HD3
B19
HD2
C19
HD1
B20
I/O/Z
Host-port data (used for transfer of data, address, and control)
HD0
B21
HAS
C22
I
Host address strobe
HCS
B23
I
Host chip select
HDS1
D22
I
Host data strobe 1
HDS2
A24
I
Host data strobe 2
HRDY
J24
O
Host ready (from DSP to host)
BOOTMODE4
D8
BOOTMODE3
B4
BOOT MODE
BOOTMODE2
A3
BOOTMODE1
D5
I
Boot mode
BOOTMODE0
C4
† I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
10
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Signal Descriptions (Continued)
SIGNAL
NAME
NO.
TYPE†
DESCRIPTION
EMIF − CONTROL SIGNALS COMMON TO ALL TYPES OF MEMORY
CE3
AE22
O/Z
CE2
AD26
O/Z
Memory space enables
CE1
AB24
O/Z
•
Enabled by bits 24 and 25 of the word address
CE0
AC26
O/Z
•
Only one asserted during any external data access
BE3
AB25
O/Z
Byte-enable control
BE2
AA24
O/Z
•
Decoded from the two lowest bits of the internal address
BE1
Y23
O/Z
•
Byte-write enables for most types of memory
BE0
AA26
O/Z
•
Can be directly connected to SDRAM read and write mask signal (SDQM)
EA21
J26
EA20
K25
EMIF − ADDRESS
EA19
L24
EA18
K26
EA17
M26
EA16
M25
EA15
P25
EA14
P24
EA13
R25
EA12
T26
EA11
R23
EA10
U26
EA9
U25
EA8
T23
EA7
V26
EA6
V25
EA5
W26
EA4
V24
EA3
W25
O/Z
External address (word address)
EA2
Y26
† I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
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Signal Descriptions (Continued)
SIGNAL
NAME
NO.
TYPE†
DESCRIPTION
EMIF − DATA
ED31
AB2
ED30
AC1
ED29
AA4
ED28
AD1
ED27
AC3
ED26
AD4
ED25
AF3
ED24
AE4
ED23
AD5
ED22
AF4
ED21
AE5
ED20
AD6
ED19
AE6
ED18
AD7
ED17
AC8
ED16
AF7
ED15
AD9
ED14
AD10
ED13
AF9
ED12
AC11
ED11
AE10
ED10
AE11
ED9
AF11
ED8
AE14
ED7
AF15
ED6
AE15
ED5
AF16
ED4
AC15
ED3
AE17
ED2
AF18
ED1
AF19
ED0
AC17
I/O/Z
External data
EMIF − ASYNCHRONOUS MEMORY CONTROL
ARE
Y24
O/Z
Asynchronous memory read enable
AOE
AC24
O/Z
Asynchronous memory output enable
AWE
AD23
O/Z
Asynchronous memory write enable
ARDY
W23
I
Asynchronous memory ready input
† I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
12
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Signal Descriptions (Continued)
SIGNAL
NAME
NO.
TYPE†
DESCRIPTION
EMIF − SYNCHRONOUS BURST SRAM CONTROL
SSADS
AC20
O/Z
SBSRAM address strobe
SSOE
AF21
O/Z
SBSRAM output enable
SSWE
AD19
O/Z
SBSRAM write enable
SSCLK
AD17
O
SBSRAM clock
EMIF − SYNCHRONOUS DRAM CONTROL
SDA10
AD21
O/Z
SDRAM address 10 (separate for deactivate command)
SDRAS
AF24
O/Z
SDRAM row-address strobe
SDCAS
AD22
O/Z
SDRAM column-address strobe
SDWE
AF23
O/Z
SDRAM write enable
SDCLK
AE20
O
SDRAM clock
EMIF − BUS ARBITRATION
HOLD
AA25
I
Hold request from the host
HOLDA
A7
O
Hold-request-acknowledge to the host
TOUT1
H24
O
Timer 1 or general-purpose output
TINP1
K24
I
Timer 1 or general-purpose input
TOUT0
M4
O
Timer 0 or general-purpose output
TINP0
K4
I
Timer 0 or general-purpose input
DMAC3
D2
DMAC2
F4
DMAC1
D1
DMAC0
E2
TIMERS
DMA ACTION COMPLETE
O
DMA action complete
MULTICHANNEL BUFFERED SERIAL PORT 1 (McBSP1)
CLKS1
E25
I
CLKR1
H23
I/O/Z
External clock source (as opposed to internal)
Receive clock
CLKX1
F26
I/O/Z
Transmit clock
DR1
D26
I
Receive data
DX1
G23
O/Z
Transmit data
FSR1
E26
I/O/Z
Receive frame sync
FSX1
F25
I/O/Z
Transmit frame sync
† I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
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Signal Descriptions (Continued)
SIGNAL
NAME
NO.
TYPE†
DESCRIPTION
MULTICHANNEL BUFFERED SERIAL PORT 0 (McBSP0)
CLKS0
L4
I
CLKR0
M2
I/O/Z
External clock source (as opposed to internal)
Receive clock
CLKX0
L1
I/O/Z
Transmit clock
DR0
J1
I
Receive data
DX0
R1
O/Z
Transmit data
FSR0
P4
I/O/Z
Receive frame sync
FSX0
P3
I/O/Z
Transmit frame sync
RESERVED FOR TEST
RSV0
T2
I
Reserved for testing, pullup with a dedicated 20-kΩ resistor
RSV1
G2
I
Reserved for testing, pullup with a dedicated 20-kΩ resistor
RSV2
C11
I
Reserved for testing, pullup with a dedicated 20-kΩ resistor
RSV3
B9
I
Reserved for testing, pullup with a dedicated 20-kΩ resistor
RSV4
A6
I
Reserved for testing, pulldown with a dedicated 20-kΩ resistor
RSV5
C8
O
Reserved (leave unconnected, do not connect to power or ground)
RSV6
C21
I
Reserved for testing, pullup with a dedicated 20-kW resistor
RSV7
B22
I
Reserved for testing, pullup with a dedicated 20-kW resistor
RSV8
A23
I
Reserved for testing, pullup with a dedicated 20-kW resistor
RSV9
E4
O
Reserved (leave unconnected, do not connect to power or ground)
SUPPLY VOLTAGE PINS
A10
A15
A18
A21
A22
B7
C1
D17
F3
G24
DVDD
G25
S
3.3-V supply voltage
H25
J25
L25
M3
N3
N23
R26
T24
U24
W24
† I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
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Signal Descriptions (Continued)
SIGNAL
NAME
NO.
TYPE†
DESCRIPTION
SUPPLY VOLTAGE PINS (CONTINUED)
Y4
AB3
AB4
AB26
AC6
AC10
AC19
AC21
AC22
DVDD
AC25
S
3.3-V supply voltage
S
1.8-V supply voltage (for 6701-120)
1.9-V supply voltage (for 6701-167)
AD11
AD13
AD15
AD18
AE18
AE21
AF5
AF6
AF17
A5
A12
A16
A20
B2
B6
B11
B12
B25
C3
CVDD
C15
C20
C24
D4
D6
D7
D9
D14
D18
D20
† I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
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SGUS042A − MAY 1998 − REVISED APRIL 2004
Signal Descriptions (Continued)
SIGNAL
NAME
NO.
TYPE†
DESCRIPTION
SUPPLY VOLTAGE PINS (CONTINUED)
D23
E1
F1
H4
J4
J23
K1
K23
M1
M24
N4
N25
P2
P23
T3
T4
U1
CVDD
V4
S
1.8-V supply voltage (for 6701-120)
1.9-V supply voltage (for 6701-167)
V23
AC4
AC9
AC12
AC13
AC18
AC23
AD3
AD8
AD14
AD24
AE2
AE8
AE12
AE25
AF12
† I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
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Signal Descriptions (Continued)
SIGNAL
NAME
NO.
TYPE†
DESCRIPTION
GROUND PINS
A1
A2
A4
A13
A14
A25
A26
B1
B3
B5
B24
B26
C2
C7
C13
C16
C17
C25
D13
VSS
D19
GND
Ground pins
E3
E24
F2
F24
G3
G4
G26
J3
L23
L26
M23
N1
N2
N24
N26
P1
P26
R24
T25
† I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
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Signal Descriptions (Continued)
SIGNAL
NAME
NO.
TYPE†
DESCRIPTION
GROUND PINS (CONTINUED)
U2
U23
V1
V3
Y3
Y25
AA3
AA23
AB23
AC2
AC5
AC7
AC14
AC16
AD2
AD12
AD16
AD20
VSS
AD25
GND
Ground pins
AE1
AE3
AE7
AE9
AE13
AE16
AE19
AE23
AE24
AE26
AF1
AF2
AF8
AF10
AF13
AF14
AF25
AF26
† I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
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Signal Descriptions (Continued)
SIGNAL
NAME
NO.
TYPE†
DESCRIPTION
REMAINING UNCONNECTED PINS
A8
B8
C9
D10
D21
NC
G1
Unconnected pins
H1
H2
J2
K3
R2
† I = Input, O = Output, Z = High Impedance, S = Supply Voltage, GND = Ground
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SGUS042A − MAY 1998 − REVISED APRIL 2004
development support
TI offers an extensive line of development tools for the TMS320C6000t DSP platform, including tools to
evaluate the performance of the processors, generate code, develop algorithm implementations, and fully
integrate and debug software and hardware modules.
The following products support development of C6000t DSP-based applications:
Software Development Tools:
Code Composer Studiot Integrated Development Environment (IDE): including Editor
C/C++/Assembly Code Generation, and Debug plus additional development tools
Scalable, Real-Time Foundation Software (DSP BIOS), which provides the basic run-time target software
needed to support any DSP application.
Hardware Development Tools:
Extended Development System (XDS) Emulator (supports C6000t DSP multiprocessor system debug)
EVM (Evaluation Module)
The TMS320 DSP Development Support Reference Guide (SPRU011) contains information about
development-support products for all TMS320t DSP family member devices, including documentation. See
this document for further information on TMS320t DSP documentation or any TMS320t DSP support
products from Texas Instruments. An additional document, the TMS320 Third-Party Support Reference Guide
(SPRU052), contains information about TMS320t DSP-related products from other companies in the industry.
To receive TMS320t DSP literature, contact the Literature Response Center at 800/477-8924.
For a complete listing of development-support tools for the TMS320C6000t DSP platform, visit the Texas
Instruments web site on the Worldwide Web at http://www.ti.com uniform resource locator (URL) and under
“Development Tools”, select “Digital Signal Processors”. For information on pricing and availability, contact the
nearest TI field sales office or authorized distributor.
Code Composer Studio, XDS, and TMS320 are trademarks of Texas Instruments.
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device and development-support tool nomenclature
To designate the stages in the product-development cycle, TI assigns prefixes to the part numbers of all
TMS320 DSP devices and support tools. Each TMS320 DSP family member has one of three prefixes: TMX,
TMP, or TMS. Texas Instruments recommends two of three possible prefix designators for support tools: TMDX
and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes
(TMX / TMDX) through fully qualified production devices/tools (TMS / TMDS).
Device development evolutionary flow:
TMX
Experimental device that is not necessarily representative of the final device’s electrical
specifications
TMP
Final silicon die that conforms to the device’s electrical specifications but has not completed
quality and reliability verification
SM/SMJ
Fully qualified production device
Support tool development evolutionary flow:
TMDX
Development-support product that has not yet completed Texas Instruments internal qualification
testing.
TMDS
Fully qualified development-support product
TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:
“Developmental product is intended for internal evaluation purposes.”
TMS devices and TMDS development-support tools have been characterized fully, and the quality and reliability
of the device have been demonstrated fully. TI’s standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system because their
expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type
(for example, GJC), the temperature range (for example, blank is the default commercial temperature range),
and the device speed range in megahertz (for example, -167 is 167 MHz). Table 2 identifies the available
320C6701 devices by their associated orderable part numbers (P/Ns) and gives device-specific ordering
information (for example, device speeds, core and I/O supply voltage values, and device operating temperature
ranges). Figure 4 provides a legend for reading the complete device name for any TMS320 DSP family
member.
Table 2. 320C6701 Device P/Ns and Ordering Information
OPERATING CASE
TEMPERATURE
RANGE
DEVICE SPEED
CVDD
(CORE VOLTAGE)
DVDD
(I/O VOLTAGE)
SMC6701MECHGJC16EP
167 MHz/1 GFLOPS
1.9 V
3.3 V
0_C to 90_C
SM320C6701GJCA12EP
120 MHz/720 MFLOPS
1.8 V
3.3 V
−40_C to 105_C
DEVICE ORDERABLE P/N
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device and development-support tool nomenclature (continued)
SM
PREFIX
TMX =
TMP =
TMS =
SMJ =
SM =
320
C
6701
GJC
(A)
12
EP
Experimental device
Prototype device
Qualified device
MIL-PRF-38535 (QML)
Commercial processing
ENHANCED PLASTIC
DEVICE SPEED RANGE
12 = 120 MHz
16 = 167 MHz
DEVICE FAMILY
320 = TMS320 DSP family
TEMPERATURE RANGE (DEFAULT: 0°C TO 90°C)
Blank = 0°C to 90°C, commercial temperature
A
= −40°C to 105°C, extended temperature
PACKAGE TYPE†
N
= Plastic DIP
J
= Ceramic DIP
JD = Ceramic DIP side-brazed
GB = Ceramic PGA
FZ = Ceramic CC
FN = Plastic leaded CC
FD = Ceramic leadless CC
PJ = 100-pin plastic EIAJ QFP
PQ = 132-pin plastic bumpered QFP
PZ = 100-pin plastic TQFP
PBK = 128-pin plastic TQFP
PGE = 144-pin plastic TQFP
GFN = 256-pin plastic BGA
GGU = 144-pin plastic BGA
GGP = 352-pin plastic BGA
GJC = 352-pin plastic BGA
MECHGJC = 352-pin mech~shock plastic BGA
GJL = 352-pin plastic BGA
GLS = 384-pin plastic BGA
GLW = 340-pin plastic BGA
GHK = 288-pin plastic MicroStar BGAt
TECHNOLOGY
C = CMOS
E = CMOS EPROM
F = CMOS Flash EEPROM
DEVICE
1x DSP:
10
14
15
16
17
2x DSP:
25
26
2xx DSP:
203
204
206
209
240
3x DSP:
30
31
32
4x DSP:
40
44
5x DSP:
† DIP
PGA
CC
QFP
TQFP
BGA
=
=
=
=
=
=
Dual-In-Line Package
Pin Grid Array
Chip Carrier
Quad Flat Package
Thin Quad Flat Package
Ball Grid Array
50
51
52
53
56
57
541
542
543
545
546
548
6201
6202
6202B
6203
6204
6205
6211
6701
6711
54x DSP:
6x DSP:
Figure 4. TMS320 DSP Device Nomenclature (Including SM320C6701)
MicroStar BGA is a trademark of Texas Instruments.
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documentation support
Extensive documentation supports all TMS320 DSP family generations of devices from product
announcement through applications development. The types of documentation available include: data sheets,
such as this document, with design specifications; complete user’s reference guides for all devices; technical
briefs; development-support tools; and hardware and software applications. The following is a brief, descriptive
list of support documentation specific to the C6x devices:
The TMS320C6000 CPU and Instruction Set Reference Guide (literature number SPRU189) describes the
C6000 DSP CPU architecture, instruction set, pipeline, and associated interrupts.
The TMS320C6000 Peripherals Reference Guide (literature number SPRU190) describes the functionality of
the peripherals available on C6x devices, such as the external memory interface (EMIF), host-port interface
(HPI), multichannel buffered serial ports (McBSPs), direct-memory-access (DMA), enhanced
direct-memory-access (EDMA) controller, expansion bus (XB), clocking and phase-locked loop (PLL); and
power-down modes. This guide also includes information on internal data and program memories.
The TMS320C6000 Technical Brief (literature number SPRU197) gives an introduction to the C62x/C67x
devices, associated development tools, and third-party support.
TMS320C6000 DSP Host−Post Interface (HPI) Reference Guide (literature number SPRU578) describes the
host−port interface (HPI) in the digital signal processors (DSPs) of the TMS320C6000 DSP family that external
processors use to access the memory space.
TMS320C6000 DSP Multichannel Buffered Serial Port (McBSP) Reference Guide (literature number
SPRU580) describes the operation of the multichannel buffered serial port (McBSP) in the digital signal
processors (DSPs) of the TMS320C6000 DSP family.
The tools support documentation is electronically available within the Code Composer Studio Integrated
Development Environment (IDE). For a complete listing of C6000 DSP latest documentation, visit the Texas
Instruments web site on the Worldwide Web at http://www.ti.com uniform resource locator (URL).
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clock PLL
All of the internal C67x clocks are generated from a single source through the CLKIN pin. This source clock
either drives the PLL, which multiplies the source clock in frequency to generate the internal CPU clock, or
bypasses the PLL to become the internal CPU clock.
To use the PLL to generate the CPU clock, the external PLL filter circuit must be properly designed. Table 3,
Table 4, and Figure 5 show the external PLL circuitry for either x1 (PLL bypass) or x4 PLL multiply modes.
Table 3 and Figure 6 show the external PLL circuitry for a system with ONLY x1 (PLL bypass) mode.
To minimize the clock jitter, a single clean power supply should power both the C67x device and the external
clock oscillator circuit. Noise coupling into PLLF will directly impact PLL clock jitter. The minimum CLKIN rise
and fall times should also be observed. For the input clock timing requirements, see the input and output clocks
electricals section.
Table 3. CLKOUT1 Frequency Ranges†
PLLFREQ3
(A9)
PLLFREQ2
(D11)
PLLFREQ1
(B10)
CLKOUT1 Frequency Range
(MHz)
0
0
0
50−140
0
0
1
65−167
0
1
0
130−167
† Due to overlap of frequency ranges when choosing the PLLFREQ, more than one frequency range can contain
the CLKOUT1 frequency. Choose the lowest frequency range that includes the desired frequency. For example,
for CLKOUT1 = 133 MHz, choose PLLFREQ value of 000b. For CLKOUT1 = 167 MHz, choose PLLFREQ value
of 001b. PLLFREQ values other than 000b, 001b, and 010b are reserved.
Table 4. C6701 PLL Component Selection Table
CLKMODE
CLKIN
RANGE
(MHz)
CPU CLOCK
FREQUENCY
(CLKOUT1)
RANGE (MHz)
CLKOUT2
RANGE
(MHz)
R1
(Ω)
C1
(nF)
C2
(pF)
TYPICAL
LOCK TIME
(µs)‡
x4
12.5−41.7
50−167
25−83.5
60.4
27
560
75
‡ Under some operating conditions, the maximum PLL lock time may vary as much as 150% from the specified typical value. For example, if the
typical lock time is specified as 100 µs, the maximum value may be as long as 250 µs.
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clock PLL (continued)
PLLFREQ3
PLLFREQ2
PLLFREQ1
3.3V
(see Table 3)
EMI Filter
PLLV
C3
10 mF
C4
0.1 mF
Internal to C6701
PLL
CLKMODE0
CLKMODE1
PLLMULT
PLLCLK
CLKIN
CLKIN
1
LOOP FILTER
Available Multiply Factors
CPU Clock
Frequency
f(CPUCLOCK)
CLKMODE1
CLKMODE0
PLL Multiply
Factors
0
0
x1(BYPASS)
1 x f(CLKIN)
0
1
Reserved
Reserved
1
0
Reserved
Reserved
1
1
x4
4 x f(CLKIN)
C2
C1
CPU
CLOCK
PLLG
PLLF
0
R1
NOTES: A. Keep the lead length and the number of vias between the PLLF pin, the PLLG pin, and R1, C1, and C2 to a minimum. In addition,
place all PLL external components (R1, C1, C2, C3, C4, and the EMI Filter) as close to the C6000 DSP device as possible. For
the best performance, TI recommends that all the PLL external components be on a single side of the board without jumpers,
switches, or components other than the ones shown.
B. For reduced PLL jitter, maximize the spacing between switching signals and the PLL external components (R1, C1, C2, C3, C4,
and the EMI Filter).
C. The 3.3-V supply for the EMI filter must be from the same 3.3-V power plane supplying the I/O voltage, DVDD.
D. EMI filter manufacturer: TDK part number ACF451832-333, 223, 153, 103. Panasonic part number EXCCET103U.
Figure 5. External PLL Circuitry for Either PLL x4 Mode or x1 (Bypass) Mode
PLLFREQ3
PLLFREQ2
PLLFREQ1
3.3V
(see Table 3)
PLLV
CLKMODE0
CLKMODE1
Internal to C6701
PLLMULT
PLL
PLLCLK
CLKIN
CLKIN
LOOP FILTER
1
CPU
CLOCK
PLLG
PLLF
0
NOTES: A. For a system with ONLY PLL x1 (bypass) mode, short the PLLF terminal to the PLLG terminal.
B. The 3.3-V supply for the EMI filter must be from the same 3.3-V power plane supplying the I/O voltage, DVDD.
Figure 6. External PLL Circuitry for x1 (Bypass) Mode Only
POST OFFICE BOX 1443
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25
SGUS042A − MAY 1998 − REVISED APRIL 2004
absolute maximum ratings over operating case temperature range (unless otherwise noted)†
Supply voltage range, CVDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 2.3 V
Supply voltage range, DVDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 4 V
Input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 4 V
Output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 4 V
Operating case temperature range, TC (Default) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0_C to 90_C
(A Version) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40_C to 105_C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55_C to 150_C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values are with respect to VSS.
recommended operating conditions
MIN
NOM
MAX
UNIT
6701-120
1.71
1.8
1.89
V
6701-167
1.81
1.9
1.99
V
3.14
3.30
3.46
V
0
0
0
V
CVDD
Supply voltage, Core‡
DVDD
Supply voltage, I/O‡
VSS
VIH
Supply ground
VIL
IOH
Low-level input voltage
0.8
V
High-level output current
−12
mA
IOL
Low-level output current
12
mA
90
_C
High-level input voltage
2.0
Default
TC
V
0
Case temperature
A Version
−40
105
_C
‡ TI DSP’s do not require specific power sequencing between the core supply and the I/O supply. However, systems should be designed to ensure
that neither supply is powered up for extended periods of time if the other supply is below the proper operating voltage. Excessive exposure to
these conditions can adversely affect the long term reliability of the device. System-level concerns such as bus contention may require supply
sequencing to be implemented. In this case, the core supply should be powered up at the same time as, or prior to (and powered down after),
the I/O buffers. For additional power supply sequencing information, see the Power Supply Sequencing Solutions For Dual Supply Voltage DSPs
application report (literature number SLVA073).
electrical characteristics over recommended ranges of supply voltage and operating case
temperature (unless otherwise noted)
PARAMETER
VOH
VOL
II
IOZ
TEST CONDITIONS
High-level output voltage
DVDD = MIN,
Low-level output voltage
Input current†
DVDD = MIN,
IOH = MAX
IOL = MAX
MIN
TYP
2.4
UNIT
V
VI = VSS to DVDD
VO = DVDD or 0 V
Off-state output current
MAX
0.6
V
±10
uA
±10
uA
IDD2V
IDD2V
Supply current, CPU + CPU memory access‡
Supply current, peripherals‡
CVDD = NOM, CPU clock = 120 MHz
380
mA
CVDD = NOM, CPU clock = 120 MHz
200
mA
IDD3V
Ci
Supply current, I/O pins‡
DVDD = NOM, CPU clock = 120 MHz
70
Input capacitance
mA
10
pF
Co
Output capacitance
10
pF
† TMS and TDI are not included due to internal pullups.
TRST is not included due to internal pulldown.
‡ Measured with average activity (50% high / 50% low power). For more detailed information on CPU/peripheral/I/O activity, see the TMS320C6000
Power Consumption Summary application report (literature number SPRA486).
26
POST OFFICE BOX 1443
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SGUS042A − MAY 1998 − REVISED APRIL 2004
PARAMETER MEASUREMENT INFORMATION
IOL
Tester Pin
Electronics
50 Ω
Vref
Output
Under
Test
CT = 30 pF†
IOH
† Typical distributed load circuit capacitance.
signal-transition levels
All input and output timing parameters are referenced to 1.5 V for both “0” and “1” logic levels.
Vref = 1.5 V
Figure 7. Input and Output Voltage Reference Levels for ac Timing Measurements
POST OFFICE BOX 1443
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27
SGUS042A − MAY 1998 − REVISED APRIL 2004
INPUT AND OUTPUT CLOCKS
timing requirements for CLKIN†‡ (see Figure 8)
C6701-120
CLKMODE = x4
NO.
MIN
1
C6701-167
CLKMODE = x1
MAX
MIN
MAX
CLKMODE = x4
MIN
MAX
MIN
UNIT
MAX
tc(CLKIN)
Cycle time, CLKIN
33.3
8.3
24
6
ns
2
tw(CLKINH)
Pulse duration,
CLKIN high
0.4C
0.45C
0.4C
0.45C
ns
3
tw(CLKINL)
Pulse duration,
CLKIN low
0.4C
0.45C
0.4C
0.45C
ns
4
tt(CLKIN)
Transition time, CLKIN
5
0.6
† The reference points for the rise and fall transitions are measured at 20% and 80%, respectively, of VIH.
‡ C = CLKIN cycle time in ns. For example, when CLKIN frequency is 10 MHz, use C = 100 ns.
1
5
4
2
CLKIN
3
4
Figure 8. CLKIN Timings
28
CLKMODE = x1
POST OFFICE BOX 1443
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0.6
ns
SGUS042A − MAY 1998 − REVISED APRIL 2004
INPUT AND OUTPUT CLOCKS (CONTINUED)
switching characteristics for CLKOUT1†‡ (see Figure 9)
C6701-120
C6701-167
NO.
1
2
3
4
PARAMETER
CLKMODE = x4
CLKMODE = x1
UNIT
MIN
MAX
MIN
MAX
P − 0.7
P + 0.7
P − 0.7
P + 0.7
ns
Pulse duration, CLKOUT1 high
(P/2) − 0.5
(P/2) + 0.5
PH − 0.5
PH + 0.5
ns
Pulse duration, CLKOUT1 low
(P/2) − 0.5
(P/2) + 0.5
PL − 0.5
PL + 0.5
ns
0.6
ns
tc(CKO1)
tw(CKO1H)
Cycle time, CLKOUT1
tw(CKO1L)
tt(CKO1)
Transition time, CLKOUT1
0.6
† P = 1/CPU clock frequency in nanoseconds (ns).
‡ PH is the high period of CLKIN in ns and PL is the low period of CLKIN in ns.
1
4
2
CLKOUT1
3
4
Figure 9. CLKOUT1 Timings
switching characteristics for CLKOUT2§ (see Figure 10)
NO.
1
2
3
4
C6701-120
C6701-167
PARAMETER
UNIT
MIN
MAX
2P − 0.7
2P + 0.7
ns
tc(CKO2)
tw(CKO2H)
Cycle time, CLKOUT2
Pulse duration, CLKOUT2 high
P − 0.7
P + 0.7
ns
tw(CKO2L)
tt(CKO2)
Pulse duration, CLKOUT2 low
P − 0.7
P + 0.7
ns
0.6
ns
Transition time, CLKOUT2
§ P = 1/CPU clock frequency in ns.
1
4
2
CLKOUT2
3
4
Figure 10. CLKOUT2 Timings
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SGUS042A − MAY 1998 − REVISED APRIL 2004
INPUT AND OUTPUT CLOCKS (CONTINUED)
SDCLK, SSCLK timing parameters
SDCLK timing parameters are the same as CLKOUT2 parameters.
SSCLK timing parameters are the same as CLKOUT1 or CLKOUT2 parameters, depending on SSCLK
configuration.
switching characteristics for the relation of SSCLK, SDCLK, and CLKOUT2 to CLKOUT1
(see Figure 11)
NO.
1
C6701-120
C6701-167
PARAMETER
MAX
UNIT
Delay time, CLKOUT1 edge to SSCLK edge
−0.8
3.4
ns
2
td(CKO1-SSCLK)
td(CKO1-SSCLK1/2)
Delay time, CLKOUT1 edge to SSCLK edge (1/2 clock rate)
−1.0
3.0
ns
3
td(CKO1-CKO2)
Delay time, CLKOUT1 edge to CLKOUT2 edge
−1.5
2.5
ns
4
td(CKO1-SDCLK)
Delay time, CLKOUT1 edge to SDCLK edge
−1.5
1.9
ns
CLKOUT1
1
SSCLK
2
SSCLK (1/2rate)
3
CLKOUT2
4
SDCLK
Figure 11. Relation of CLKOUT2, SDCLK, and SSCLK to CLKOUT1
30
MIN
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SGUS042A − MAY 1998 − REVISED APRIL 2004
ASYNCHRONOUS MEMORY TIMING
timing requirements for asynchronous memory cycles† (see Figure 12 and Figure 13)
C6701-120
C6701-167
NO.
MIN
6
7
10
11
UNIT
MAX
tsu(EDV-CKO1H)
th(CKO1H-EDV)
Setup time, read EDx valid before CLKOUT1 high
4.5
ns
Hold time, read EDx valid after CLKOUT1 high
1.5
ns
tsu(ARDY-CKO1H)
th(CKO1H-ARDY)
Setup time, ARDY valid before CLKOUT1 high
3.5
ns
Hold time, ARDY valid after CLKOUT1 high
1.5
ns
† To ensure data setup time, simply program the strobe width wide enough. ARDY is internally synchronized. If ARDY does meet setup or hold
time, it may be recognized in the current cycle or the next cycle. Thus, ARDY can be an asynchronous input.
switching characteristics for asynchronous memory cycles‡ (see Figure 12 and Figure 13)
NO.
1
2
3
4
5
8
9
12
13
14
PARAMETER
C6701-120
C6701-167
UNIT
MIN
MAX
−1.0
4.5
ns
4.5
ns
td(CKO1H-CEV)
td(CKO1H-BEV)
Delay time, CLKOUT1 high to CEx valid
td(CKO1H-BEIV)
td(CKO1H-EAV)
Delay time, CLKOUT1 high to BEx invalid
td(CKO1H-EAIV)
td(CKO1H-AOEV)
Delay time, CLKOUT1 high to EAx invalid
−1.0
Delay time, CLKOUT1 high to AOE valid
−1.0
4.5
ns
td(CKO1H-AREV)
td(CKO1H-EDV)
Delay time, CLKOUT1 high to ARE valid
−0.5
4.5
ns
4.5
ns
td(CKO1H-EDIV)
td(CKO1H-AWEV)
Delay time, CLKOUT1 high to EDx invalid
−1.0
Delay time, CLKOUT1 high to AWE valid
−1.0
Delay time, CLKOUT1 high to BEx valid
−1.0
Delay time, CLKOUT1 high to EAx valid
ns
4.5
Delay time, CLKOUT1 high to EDx valid
ns
ns
ns
4.5
ns
‡ The minimum delay is also the minimum output hold after CLKOUT1 high.
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SGUS042A − MAY 1998 − REVISED APRIL 2004
ASYNCHRONOUS MEMORY TIMING (CONTINUED)
Setup = 2
Not ready = 2
Strobe = 5
HOLD = 1
CLKOUT1
1
1
2
3
4
5
CEx
BE[3:0]
EA[21:2]
7
6
ED[31:0]
8
8
AOE
9
9
ARE
AWE
11
11
10
10
ARDY
Figure 12. Asynchronous Memory Read Timing
Setup = 2
Not ready = 2
Strobe = 5
HOLD = 1
CLKOUT1
1
1
2
3
4
5
CEx
BE[3:0]
EA[21:2]
12
13
ED[31:0]
AOE
ARE
14
14
AWE
11
10
11
10
ARDY
Figure 13. Asynchronous Memory Write Timing
32
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SYNCHRONOUS-BURST MEMORY TIMING
timing requirements for synchronous-burst SRAM cycles (full-rate SSCLK)
(see Figure 14)
NO.
7
8
tsu(EDV-SSCLKH)
th(SSCLKH-EDV)
C6701-120
C6701-167
MIN
MIN
MAX
MAX
UNIT
Setup time, read EDx valid before SSCLK high
2.0
2.0
ns
Hold time, read EDx valid after SSCLK high
2.9
2.1
ns
switching characteristics for synchronous-burst SRAM cycles† (full-rate SSCLK)
(see Figure 14 and Figure 15)
C6701-120
NO.
1
PARAMETER
MIN
MAX
C6701-167
MIN
MAX
UNIT
tosu(CEV-SSCLKH)
toh(SSCLKH-CEV)
Output setup time, CEx valid before SSCLK high
0.5P − 1.3
0.5P − 1.3
ns
Output hold time, CEx valid after SSCLK high
0.5P − 2.9
0.5P − 2.3
ns
tosu(BEV-SSCLKH)
toh(SSCLKH-BEIV)
Output setup time, BEx valid before SSCLK high
0.5P − 1.3
0.5P − 1.6
ns
Output hold time, BEx invalid after SSCLK high
0.5P − 2.9
0.5P − 2.3
ns
tosu(EAV-SSCLKH)
toh(SSCLKH-EAIV)
Output setup time, EAx valid before SSCLK high
0.5P − 1.3
0.5P − 1.7
ns
Output hold time, EAx invalid after SSCLK high
0.5P − 2.9
0.5P − 2.3
ns
tosu(ADSV-SSCLKH)
toh(SSCLKH-ADSV)
Output setup time, SSADS valid before SSCLK high
0.5P − 1.3
0.5P − 1.3
ns
Output hold time, SSADS valid after SSCLK high
0.5P − 2.9
0.5P − 2.3
ns
tosu(OEV-SSCLKH)
toh(SSCLKH-OEV)
Output setup time, SSOE valid before SSCLK high
0.5P − 1.3
0.5P − 1.3
ns
Output hold time, SSOE valid after SSCLK high
0.5P − 2.9
0.5P − 2.3
ns
tosu(EDV-SSCLKH)
toh(SSCLKH-EDIV)
Output setup time, EDx valid before SSCLK high
0.5P − 1.3
0.5P − 1.3
ns
14
Output hold time, EDx invalid after SSCLK high
0.5P − 2.9
0.5P − 2.3
ns
15
tosu(WEV-SSCLKH)
Output setup time, SSWE valid before SSCLK high
0.5P − 1.3
0.5P − 1.3
ns
2
3
4
5
6
9
10
11
12
13
16
toh(SSCLKH-WEV)
Output hold time, SSWE valid after SSCLK high
0.5P − 2.9
0.5P − 2.3
ns
† When the PLL is used (CLKMODE x4), P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
For CLKMODE x1, 0.5P is defined as PH (pulse duration of CLKIN high) for all output setup times; 0.5P is defined as PL (pulse duration of CLKIN
low) for all output hold times.
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SGUS042A − MAY 1998 − REVISED APRIL 2004
SYNCHRONOUS-BURST MEMORY TIMING (CONTINUED)
SSCLK
1
2
CEx
3
BE[3:0]
BE1
BE2
BE3
4
BE4
A1
A2
A3
6
A4
5
EA[21:2]
8
7
Q1
ED[31:0]
9
Q2
Q3
Q4
10
SSADS
11
12
SSOE
SSWE
Figure 14. SBSRAM Read Timing (Full-Rate SSCLK)
SSCLK
1
2
CEx
3
BE[3:0]
BE1
BE2
BE3
4
BE4
A1
A2
A3
6
A4
D3
14
D4
5
EA[21:2]
13
ED[31:0]
D1
D2
9
10
15
16
SSADS
SSOE
SSWE
Figure 15. SBSRAM Write Timing (Full-Rate SSCLK)
34
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SYNCHRONOUS-BURST MEMORY TIMING (CONTINUED)
timing requirements for synchronous-burst SRAM cycles (half-rate SSCLK) (see Figure 16)
C6701-120
C6701-167
NO.
MIN
7
8
tsu(EDV-SSCLKH)
th(SSCLKH-EDV)
UNIT
MAX
Setup time, read EDx valid before SSCLK high
3.6
ns
Hold time, read EDx valid after SSCLK high
1.5
ns
switching characteristics for synchronous-burst SRAM cycles† (half-rate SSCLK)
(see Figure 16 and Figure 17)
NO.
1
PARAMETER
C6701-120
C6701-167
MIN
MIN
0.5P − 2.5
0.5P − 2
ns
1.5P − 4.5
1.5P − 4.5
ns
Output hold time, BEx invalid after SSCLK high
0.5P − 2.5
0.5P − 2
ns
tosu(EAV-SSCLKH)
toh(SSCLKH-EAIV)
Output setup time, EAx valid before SSCLK high
1.5P − 4.5
1.5P − 4.5
ns
Output hold time, EAx invalid after SSCLK high
0.5P − 2.5
0.5P − 2
ns
tosu(ADSV-SSCLKH)
toh(SSCLKH-ADSV)
Output setup time, SSADS valid before SSCLK high
1.5P − 4.5
1.5P − 4.5
ns
Output hold time, SSADS valid after SSCLK high
0.5P − 2.5
0.5P − 2
ns
tosu(OEV-SSCLKH)
toh(SSCLKH-OEV)
Output setup time, SSOE valid before SSCLK high
1.5P − 4.5
1.5P − 4.5
ns
Output hold time, SSOE valid after SSCLK high
0.5P − 2.5
0.5P − 2
ns
Output setup time, EDx valid before SSCLK high
1.5P − 4.5
1.5P − 4.5
ns
14
tosu(EDV-SSCLKH)
toh(SSCLKH-EDIV)
Output hold time, EDx invalid after SSCLK high
0.5P − 2.5
0.5P − 2
ns
15
tosu(WEV-SSCLKH)
Output setup time, SSWE valid before SSCLK high
1.5P − 4.5
1.5P − 4.5
ns
4
5
6
9
10
11
12
13
1.5P − 4.5
Output hold time, CEx valid after SSCLK high
tosu(BEV-SSCLKH)
toh(SSCLKH-BEIV)
Output setup time, BEx valid before SSCLK high
UNIT
ns
3
Output setup time, CEx valid before SSCLK high
MAX
1.5P − 4.5
2
tosu(CEV-SSCLKH)
toh(SSCLKH-CEV)
MAX
16
toh(SSCLKH-WEV)
Output hold time, SSWE valid after SSCLK high
0.5P − 2.5
0.5P − 2
ns
† When the PLL is used (CLKMODE x4), P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
For CLKMODE x1:
1.5P = P + PH, where P = 1/CPU clock frequency, and PH = pulse duration of CLKIN high.
0.5P = PL, where PL = pulse duration of CLKIN low.
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35
SGUS042A − MAY 1998 − REVISED APRIL 2004
SYNCHRONOUS-BURST MEMORY TIMING (CONTINUED)
SSCLK
1
2
CEx
BE[3:0]
3
BE1
BE2
BE3
BE4
4
EA[21:2]
5
A1
A2
A3
A4
6
7
Q1
ED[31:0]
8
Q2
9
Q3
Q4
10
SSADS
11
12
SSOE
SSWE
Figure 16. SBSRAM Read Timing (1/2 Rate SSCLK)
SSCLK
1
2
CEx
BE[3:0]
3
BE1
BE2
BE3
BE4
4
EA[21:2]
5
A1
A2
A3
A4
ED[31:0]
Q1
Q2
Q3
Q4
6
13
14
9
10
15
16
SSADS
SSOE
SSWE
Figure 17. SBSRAM Write Timing (1/2 Rate SSCLK)
36
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SYNCHRONOUS DRAM TIMING
timing requirements for synchronous DRAM cycles (see Figure 18)
C6701-120
C6701-167
NO.
MIN
7
8
tsu(EDV-SDCLKH)
th(SDCLKH-EDV)
Setup time, read EDx valid before SDCLK high
UNIT
MAX
1.8
ns
3
ns
Hold time, read EDx valid after SDCLK high
switching characteristics for synchronous DRAM cycles† (see Figure 18−Figure 23)
NO.
1
2
3
4
5
6
PARAMETER
tosu(CEV-SDCLKH)
toh(SDCLKH-CEV)
Output setup time, CEx valid before SDCLK high
tosu(BEV-SDCLKH)
toh(SDCLKH-BEIV)
Output setup time, BEx valid before SDCLK high
tosu(EAV-SDCLKH)
toh(SDCLKH-EAIV)
Output setup time, EAx valid before SDCLK high
Output hold time, CEx valid after SDCLK high
Output hold time, BEx invalid after SDCLK high
UNIT
1.5P − 4
1.5P − 4
ns
0.5P − 1.9
0.5P − 1.5
ns
1.5P − 4
1.5P − 4
ns
0.5P − 1.9
0.5P − 1.5
ns
1.5P − 4
ns
ns
Output setup time, SDCAS valid before SDCLK
high
1.5P − 4
1.5P − 4
ns
0.5P − 1.9
0.5P − 1.5
ns
1.5P − 4
1.5P − 4
ns
0.5P − 1.9
0.5P − 1.5
ns
Output hold time, SDCAS valid after SDCLK high
toh(SDCLKH-EDIV)
tosu(SDWE-SDCLKH)
Output hold time, EDx invalid after SDCLK high
Output hold time, SDWE valid after SDCLK high
15
toh(SDCLKH-SDWE)
tosu(SDA10V-SDCLKH)
16
toh(SDCLKH-SDA10IV)
Output hold time, SDA10 invalid after SDCLK high
tosu(SDRAS-SDCLKH)
Output setup time, SDRAS valid before SDCLK
high
17
MAX
0.5P − 1.5
toh(SDCLKH-SDCAS)
tosu(EDV-SDCLKH)
14
MIN
MAX
1.5P − 4
10
13
MIN
0.5P − 1.9
tosu(SDCAS-SDCLKH)
11
C6701-167
Output hold time, EAx invalid after SDCLK high
9
12
C6701-120
Output setup time, EDx valid before SDCLK high
Output setup time, SDWE valid before SDCLK high
Output setup time, SDA10 valid before SDCLK high
1.5P − 4
1.5P − 4
ns
0.5P − 1.9
0.5P − 1.5
ns
1.5P − 4
1.5P − 4
ns
0.5P − 1.9
0.5P − 1.5
ns
1.5P − 4
1.5P − 4
ns
18
toh(SDCLKH-SDRAS)
Output hold time, SDRAS valid after SDCLK high
0.5P − 1.9
0.5P − 1.5
ns
† When the PLL is used (CLKMODE x4), P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
For CLKMODE x1:
1.5P = P + PH, where P = 1/CPU clock frequency, and PH = pulse duration of CLKIN high.
0.5P = PL, where PL = pulse duration of CLKIN low.
POST OFFICE BOX 1443
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37
SGUS042A − MAY 1998 − REVISED APRIL 2004
SYNCHRONOUS DRAM TIMING (CONTINUED)
READ
READ
READ
SDCLK
1
2
CEx
3
BE[3:0]
5
EA[15:2]
4
BE1
BE2
CA2
CA3
BE3
6
CA1
7
8
D1
ED[31:0]
15
16
9
10
D2
D3
SDA10
SDRAS
SDCAS
SDWE
Figure 18. Three SDRAM Read Commands
WRITE
WRITE
WRITE
SDCLK
1
2
CEx
3
4
BE1
BE[3:0]
5
EA[15:2]
BE3
CA2
CA3
D2
D3
6
CA1
11
D1
ED[31:0]
BE2
12
15
16
9
10
13
14
SDA10
SDRAS
SDCAS
SDWE
Figure 19. Three SDRAM Write Commands
38
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SGUS042A − MAY 1998 − REVISED APRIL 2004
SYNCHRONOUS DRAM TIMING (CONTINUED)
ACTV
SDCLK
1
2
CEx
BE[3:0]
5
Bank Activate/Row Address
EA[15:2]
ED[31:0]
15
Row Address
SDA10
17
18
SDRAS
SDCAS
SDWE
Figure 20. SDRAM ACTV Command
DCAB
SDCLK
1
2
15
16
17
18
CEx
BE[3:0]
EA[15:2]
ED[31:0]
SDA10
SDRAS
SDCAS
13
14
SDWE
Figure 21. SDRAM DCAB Command
POST OFFICE BOX 1443
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39
SGUS042A − MAY 1998 − REVISED APRIL 2004
SYNCHRONOUS DRAM TIMING (CONTINUED)
REFR
SDCLK
1
2
CEx
BE[3:0]
EA[15:2]
ED[31:0]
SDA10
17
18
SDRAS
9
10
SDCAS
SDWE
Figure 22. SDRAM REFR Command
MRS
SDCLK
1
2
5
6
CEx
BE[3:0]
MRS Value
EA[15:2]
ED[31:0]
SDA10
17
18
9
10
13
14
SDRAS
SDCAS
SDWE
Figure 23. SDRAM MRS Command
40
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SGUS042A − MAY 1998 − REVISED APRIL 2004
HOLD/HOLDA TIMING
timing requirements for the hold/hold acknowledge cycles† (see Figure 24)
C6701-120
C6701-167
NO.
MIN
1
2
tsu(HOLDH-CKO1H)
th(CKO1H-HOLDL)
Setup time, HOLD high before CLKOUT1 high
5
Hold time, HOLD low after CLKOUT1 high
2
UNIT
MAX
ns
ns
† HOLD is synchronized internally. Therefore, if setup and hold times are not met, it will either be recognized in the current cycle or in the next cycle.
Thus, HOLD can be an asynchronous input.
switching characteristics for the hold/hold acknowledge cycles‡ (see Figure 24)
NO.
C6701-120
C6701-167
PARAMETER
MIN
3
4
5
6
7
8
4P
UNIT
MAX
§
ns
2P
ns
tR(HOLDL-EMHZ)
tR(EMHZ-HOLDAL)
Response time, HOLD low to EMIF high impedance
tR(HOLDH-HOLDAH)
td(CKO1H-HOLDAL)
Response time, HOLD high to HOLDA high
4P
7P
ns
Delay time, CLKOUT1 high to HOLDA valid
1
8
ns
td(CKO1H-BHZ)
td(CKO1H-BLZ)
Delay time, CLKOUT1 high to EMIF Bus high impedance¶
Delay time, CLKOUT1 high to EMIF Bus low impedance¶
1
8
ns
Response time, EMIF high impedance to HOLDA low
1
12
ns
tR(HOLDH-BLZ)
Response time, HOLD high to EMIF Bus low impedance¶
3P
6P
ns
‡ P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
§ All pending EMIF transactions are allowed to complete before HOLDA is asserted. The worst cases for this is an asynchronous read or write
with external ARDY used or a minimum of eight consecutive SDRAM reads or writes when RBTR8 = 1. If no bus transactions are occurring, then
the minimum delay time can be achieved. Also, bus hold can be indefinitely delayed by setting the NOHOLD = 1.
¶ EMIF Bus consists of CE[3:0], BE[3:0], ED[31:0], EA[21:2], ARE, AOE, AWE, SSADS, SSOE, SSWE, SDA10, SDRAS, SDCAS, and SDWE.
9
DSP Owns Bus
External Requester
DSP Owns Bus
5
9
4
3
CLKOUT1
2
2
1
1
HOLD
6
6
HOLDA
7
8
EMIF Bus†
’C6701
Ext Req
’C6701
† EMIF Bus consists of CE[3:0], BE[3:0], ED[31:0], EA[21:2], ARE, AOE, AWE, SSADS, SSOE, SSWE, SDA10, SDRAS, SDCAS, and SDWE.
Figure 24. HOLD/HOLDA Timing
POST OFFICE BOX 1443
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41
SGUS042A − MAY 1998 − REVISED APRIL 2004
RESET TIMING
timing requirements for reset (see Figure 25)
C6701-120
C6701-167
NO.
MIN
1
tw(RESET)
Width of the RESET pulse (PLL stable)†
UNIT
MAX
CLKOUT1
cycles
10
Width of the RESET pulse (PLL needs to sync up)‡
250
µs
† This parameter applies to CLKMODE x1 when CLKIN is stable and applies to CLKMODE x4 when CLKIN and PLL are stable.
‡ This parameter only applies to CLKMODE x4. The RESET signal is not connected internally to the clock PLL circuit. The PLL, however, may
need up to 250 µs to stabilize following device powerup or after PLL configuration has been changed. During that time, RESET must be asserted
to ensure proper device operation. See the clock PLL section for PLL lock times.
switching characteristics during reset§¶ (see Figure 25)
NO.
PARAMETER
C6701-120
C6701-167
MIN
2
tR(RESET)
Response time to change of value in RESET signal
3
td(CKO1H-CKO2IV)
td(CKO1H-CKO2V)
Delay time, CLKOUT1 high to CLKOUT2 invalid
td(CKO1H-SDCLKIV)
td(CKO1H-SDCLKV)
Delay time, CLKOUT1 high to SDCLK invalid
td(CKO1H-SSCKIV)
td(CKO1H-SSCKV)
Delay time, CLKOUT1 high to SSCLK invalid
td(CKO1H-LOWIV)
td(CKO1H-LOWV)
Delay time, CLKOUT1 high to low group invalid
td(CKO1H-HIGHIV)
td(CKO1H-HIGHV)
Delay time, CLKOUT1 high to high group invalid
td(CKO1H-ZHZ)
td(CKO1H-ZV)
Delay time, CLKOUT1 high to Z group high impedance
4
5
6
7
8
9
10
11
12
13
14
§ Low group consists of:
High group consists of:
Z group consists of:
CLKOUT1
cycles
−1
ns
10
−1
Delay time, CLKOUT1 high to SDCLK valid
−1
−1
ns
ns
10
−1
Delay time, CLKOUT1 high to high group valid
ns
ns
10
Delay time, CLKOUT1 high to low group valid
ns
ns
10
Delay time, CLKOUT1 high to SSCLK valid
ns
ns
10
−1
ns
ns
10
ns
IACK, INUM[3:0], DMAC[3:0], PD, TOUT0, and TOUT1.
HINT.
EA[21:2], ED[31:0], CE[3:0], BE[3:0], ARE, AWE, AOE, SSADS, SSOE, SSWE, SDA10, SDRAS, SDCAS,
SDWE, HD[15:0], CLKX0, CLKX1, FSX0, FSX1, DX0, DX1, CLKR0, CLKR1, FSR0, and FSR1.
¶ HRDY is gated by input HCS.
If HCS = 0 at device reset, HRDY belongs to the high group.
If HCS = 1 at device reset, HRDY belongs to the low group.
42
1
Delay time, CLKOUT1 high to CLKOUT2 valid
Delay time, CLKOUT1 high to Z group valid
UNIT
MAX
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SGUS042A − MAY 1998 − REVISED APRIL 2004
RESET TIMING (CONTINUED)
CLKOUT1
1
2
2
RESET
3
4
5
6
7
8
9
10
11
12
13
14
CLKOUT2
SDCLK
SSCLK
LOW GROUP†‡
HIGH GROUP†‡
Z GROUP†‡
† Low group consists of:
High group consists of:
Z group consists of:
IACK, INUM[3:0], DMAC[3:0], PD, TOUT0, and TOUT1.
HINT.
EA[21:2], ED[31:0], CE[3:0], BE[3:0], ARE, AWE, AOE, SSADS, SSOE, SSWE, SDA10, SDRAS, SDCAS,
SDWE, HD[15:0], CLKX0, CLKX1, FSX0, FSX1, DX0, DX1, CLKR0, CLKR1, FSR0, and FSR1.
‡ HRDY is gated by input HCS.
If HCS = 0 at device reset, HRDY belongs to the high group.
If HCS = 1 at device reset, HRDY belongs to the low group.
Figure 25. Reset Timing
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SGUS042A − MAY 1998 − REVISED APRIL 2004
EXTERNAL INTERRUPT TIMING
timing requirements for interrupt response cycles†‡ (see Figure 26)
C6701-120
C6701-167
NO.
MIN
2
3
tw(ILOW)
tw(IHIGH)
Width of the interrupt pulse low
2P
Width of the interrupt pulse high
2P
UNIT
MAX
ns
ns
† Interrupt signals are synchronized internally and are potentially recognized one cycle later if setup and hold times are violated. Thus, they can
be connected to asynchronous inputs.
‡ P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
switching characteristics during interrupt response cycles§ (see Figure 26)
NO.
C6701-120
C6701-167
PARAMETER
MIN
1
tR(EINTH-IACKH)
td(CKO2L-IACKV)
Response time, EXT_INTx high to IACK high
4
5
td(CKO2L-INUMV)
Delay time, CLKOUT2 low to INUMx valid
9P
Delay time, CLKOUT2 low to IACK valid
−0.5P
6
td(CKO2L-INUMIV) Delay time, CLKOUT2 low to INUMx invalid
§ P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
When the PLL is used (CLKMODE x4), 0.5P = 1/(2 × CPU clock frequency).
For CLKMODE x1: 0.5P = PH, where PH is the high period of CLKIN.
ns
13 − 0.5P
ns
10 − 0.5P
ns
−0.5P
ns
1
CLKOUT2
2
3
EXT_INTx, NMI
Intr Flag
4
4
IACK
6
5
Interrupt Number
INUMx
Figure 26. Interrupt Timing
44
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
UNIT
MAX
SGUS042A − MAY 1998 − REVISED APRIL 2004
HOST-PORT INTERFACE TIMING
timing requirements for host-port interface cycles†‡ (see Figure 27, Figure 28, Figure 29, and
Figure 30)
C6701-120
C6701-167
NO.
MIN
1
2
3
4
10
11
12
tsu(SEL-HSTBL)
th(HSTBL-SEL)
Setup time, select signals§ valid before HSTROBE low
Hold time, select signals§ valid after HSTROBE low
tw(HSTBL)
tw(HSTBH)
tsu(SEL-HASL)
th(HASL-SEL)
13
tsu(HDV-HSTBH)
th(HSTBH-HDV)
14
th(HRDYL-HSTBL)
18
tsu(HASL-HSTBL)
th(HSTBL-HASL)
19
UNIT
MAX
4
ns
2
ns
Pulse duration, HSTROBE low
2P
ns
Pulse duration, HSTROBE high between consecutive accesses
Setup time, select signals§ valid before HAS low
2P
ns
4
ns
Hold time, select signals§ valid after HAS low
2
ns
Setup time, host data valid before HSTROBE high
3
ns
Hold time, host data valid after HSTROBE high
2
ns
Hold time, HSTROBE low after HRDY low. HSTROBE should not be inactivated until HRDY is active (low); otherwise, HPI writes will not complete
properly.
1
ns
Setup time, HAS low before HSTROBE low
2
ns
Hold time, HAS low after HSTROBE low
2
ns
† HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
‡ P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
§ Select signals include: HCNTRL[1:0], HR/W, and HHWIL.
switching characteristics during host-port interface cycles†‡ (see Figure 27, Figure 28, Figure 29,
and Figure 30)
NO.
PARAMETER
C6701-120
C6701-167
MIN
5
6
7
8
9
15
16
17
UNIT
MAX
td(HCS-HRDY)
td(HSTBL-HRDYH)
Delay time, HCS to HRDY¶
1
12
ns
Delay time, HSTROBE low to HRDY high#
1
12
ns
td(HSTBL-HDLZ)
td(HDV-HRDYL)
Delay time, HSTROBE low to HD low impedance for an HPI read
4
P+3
ns
toh(HSTBH-HDV)
td(HSTBH-HDHZ)
Output hold time, HD valid after HSTROBE high
3
12
ns
Delay time, HSTROBE high to HD high impedance
3
12
ns
td(HSTBL-HDV)
td(HSTBH-HRDYH)
Delay time, HSTROBE low to HD valid
3
12
ns
Delay time, HSTROBE high to HRDY high||
1
12
ns
Delay time, HD valid to HRDY low
P−3
ns
20
td(HASL-HRDYH)
Delay time, HAS low to HRDY high
3
12
ns
† HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
‡ P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
¶ HCS enables HRDY, and HRDY is always low when HCS is high. The case where HRDY goes high when HCS falls indicates that HPI is busy
completing a previous HPID write or READ with autoincrement.
# This parameter is used during an HPID read. At the beginning of the first half-word transfer on the falling edge of HSTROBE, the HPI sends the
request to the DMA auxiliary channel, and HRDY remains high until the DMA auxiliary channel loads the requested data into HPID.
|| This parameter is used after the second half-word of an HPID write or autoincrement read. HRDY remains low if the access is not an HPID write
or autoincrement read. Reading or writing to HPIC or HPIA does not affect the HRDY signal.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
45
SGUS042A − MAY 1998 − REVISED APRIL 2004
HOST-PORT INTERFACE TIMING (CONTINUED)
HAS
1
1
2
2
HCNTL[1:0]
1
1
2
2
HR/W
1
1
2
2
HHWIL
4
3
HSTROBE†
HCS
15
9
7
15
9
16
HD[15:0] (output)
1st half-word
5
2nd half-word
8
17
5
HRDY (case 1)
6
8
17
5
HRDY (case 2)
† HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 27. HPI Read Timing (HAS Not Used, Tied High)
HAS
19
11
19
10
11
10
HCNTL[1:0]
11
11
10
10
HR/W
11
11
10
10
HHWIL
4
3
HSTROBE†
18
18
HCS
15
7
9
15
16
9
HD[15:0] (output)
1st half-word
5
8
2nd half-word
17
5
17
5
HRDY (case 1)
20
8
HRDY (case 2)
† HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 28. HPI Read Timing (HAS Used)
46
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SGUS042A − MAY 1998 − REVISED APRIL 2004
HOST-PORT INTERFACE TIMING (CONTINUED)
HAS
1
1
2
2
HCNTL[1:0]
12
12
13
13
HBE[1:0]
1
1
2
2
HR/W
1
1
2
2
HHWIL
3
4
14
HSTROBE†
HCS
12
12
13
13
HD[15:0] (input)
1st half-word
5
17
2nd half-word
5
HRDY
† HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 29. HPI Write Timing (HAS Not Used, Tied High)
HAS
12
19
13
12
19
13
HBE[1:0]
11
11
10
10
HCNTL[1:0]
11
11
10
10
HR/W
11
11
10
10
HHWIL
3
14
HSTROBE†
4
18
18
HCS
12
13
12
13
HD[15:0] (input)
5
1st half-word
2nd half-word
17
5
HRDY
† HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Figure 30. HPI Write Timing (HAS Used)
POST OFFICE BOX 1443
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47
SGUS042A − MAY 1998 − REVISED APRIL 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING
timing requirements for McBSP†‡ (see Figure 31)
C6701-120
C6701-167
NO.
2
3
tc(CKRX)
tw(CKRX)
Cycle time, CLKR/X
Pulse duration, CLKR/X high or CLKR/X low
5
tsu(FRH-CKRL)
Setup time, external FSR high before CLKR low
6
th(CKRL-FRH)
Hold time, external FSR high after CLKR low
7
tsu(DRV-CKRL)
Setup time, DR valid before CLKR low
8
th(CKRL-DRV)
Hold time, DR valid after CLKR low
10
tsu(FXH-CKXL)
Setup time, external FSX high before CLKX low
11
th(CKXL-FXH)
Hold time, external FSX high after CLKX low
CLKR/X ext
MIN
2P§
CLKR/X ext
P − 1¶
CLKR int
13
CLKR ext
4
CLKR int
7
CLKR ext
4
CLKR int
10
CLKR ext
1
CLKR int
4
CLKR ext
4
CLKX int
13
CLKX ext
4
CLKX int
7
CLKX ext
3
UNIT
MAX
ns
ns
ns
ns
ns
ns
ns
ns
† P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
‡ CLKRP = CLKXP = FSRP = FSXP = 0. If polarity of any of the signals is inverted, then the timing references of that signal are also inverted.
§ The maximum McBSP bit rate is 50 MHz; therefore, the minimum CLKR/X clock cycle is either twice the CPU cycle time (2P), or 20 ns (50 MHz),
whichever value is larger. For example, when running parts at 167 MHz (P = 6 ns), use 20 ns as the minimum CLKR/X clock cycle (by setting
the appropriate CLKGDV ratio or external clock source). When running parts at 80 MHz (P = 12.5 ns), use 2P = 25 ns (40 MHz) as the minimum
CLKR/X clock cycle. The maximum McBSP bit rate applies when the serial port is a master of clock and frame syncs and the other device the
McBSP communicates to is a slave.
¶ The minimum CLKR/X pulse duration is either (P −1) or 9 ns, whichever is larger. For example, when running parts at 167 MHz (P = 6 ns), use
9 ns as the minimum CLKR/X pulse duration. When running parts at 80 MHz (P = 12.5 ns), use (P −1) = 11.5 ns as the minimum CLKR/X pulse
duration.
48
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SGUS042A − MAY 1998 − REVISED APRIL 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
switching characteristics for McBSP†‡ (see Figure 31)
NO.
C6701-120
C6701-167
PARAMETER
Delay time, CLKS high to CLKR/X high for internal
CLKR/X generated from CLKS input
UNIT
MIN
MAX
3
15
2P§¶
C − 1#
C + 1#
ns
ns
1
td(CKSH-CKRXH)
2
Cycle time, CLKR/X
CLKR/X int
3
tc(CKRX)
tw(CKRX)
Pulse duration, CLKR/X high or CLKR/X low
CLKR/X int
4
td(CKRH-FRV)
Delay time, CLKR high to internal FSR valid
CLKR int
−4
4
CLKX int
−4
5
CLKX ext
3
16
9
td(CKXH-FXV)
Delay time, CLKX high to internal FSX valid
12
tdis(CKXH-DXHZ)
Disable time, DX high impedance following last data bit from
CLKX high
13
td(CKXH-DXV)
Delay time, CLKX high to DX valid.
14
td(FXH-DXV)
Delay time, FSX high to DX valid.
ONLY applies when in data delay 0 (XDATDLY = 00b) mode.
ns
ns
CLKX int
−3
2
CLKX ext
2
9
CLKX int
−2
4
CLKX ext
3
16
FSX int
−2
4
FSX ext
2
10
ns
ns
ns
ns
† CLKRP = CLKXP = FSRP = FSXP = 0. If polarity of any of the signals is inverted, then the timing references of that signal are also inverted.
‡ Minimum delay times also represent minimum output hold times.
§ P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
¶ The maximum McBSP bit rate is 50 MHz; therefore, the minimum CLKR/X clock cycle is either twice the CPU cycle time (2P), or 20 ns (50 MHz),
whichever value is larger. For example, when running parts at 167 MHz (P = 6 ns), use 20 ns as the minimum CLKR/X clock cycle (by setting
the appropriate CLKGDV ratio or external clock source). When running parts at 80 MHz (P = 12.5 ns), use 2P = 25 ns (40 MHz) as the minimum
CLKR/X clock cycle. The maximum McBSP bit rate applies when the serial port is a master of clock and frame syncs and the other device the
McBSP communicates to is a slave.
# C = H or L
S = sample rate generator input clock = P if CLKSM = 1 (P = 1/CPU clock frequency)
= sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
CLKGDV should be set appropriately to ensure the McBSP bit rate does not exceed the 50 MHz limit.
POST OFFICE BOX 1443
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49
SGUS042A − MAY 1998 − REVISED APRIL 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
CLKS
1
2
3
3
CLKR
4
4
FSR (int)
5
6
FSR (ext)
7
DR
8
Bit(n-1)
(n-2)
(n-3)
2
3
3
CLKX
9
FSX (int)
11
10
FSX (ext)
FSX (XDATDLY=00b)
12
DX
Bit 0
14
13
Bit(n-1)
13
(n-2)
Figure 31. McBSP Timing
50
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
(n-3)
SGUS042A − MAY 1998 − REVISED APRIL 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
timing requirements for FSR when GSYNC = 1 (see Figure 32)
C6701-120
C6701-167
NO.
MIN
1
2
tsu(FRH-CKSH)
th(CKSH-FRH)
UNIT
MAX
Setup time, FSR high before CLKS high
4
ns
Hold time, FSR high after CLKS high
4
ns
CLKS
1
2
FSR external
CLKR/X (no need to resync)
CLKR/X(needs resync)
Figure 32. FSR Timing When GSYNC = 1
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
51
SGUS042A − MAY 1998 − REVISED APRIL 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
timing requirements for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 0†‡ (see Figure 33)
C6701-120
C6701-167
NO.
MASTER
MIN
4
tsu(DRV-CKXL)
th(CKXL-DRV)
Setup time, DR valid before CLKX low
UNIT
SLAVE
MAX
12
5
Hold time, DR valid after CLKX low
4
† P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
‡ For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
MIN
MAX
2 − 3P
ns
5 + 6P
ns
switching characteristics for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 0†‡
(see Figure 33)
C6701-120
C6701-167
NO.
PARAMETER
MASTER§
2
th(CKXL-FXL)
td(FXL-CKXH)
Hold time, FSX low after CLKX low¶
Delay time, FSX low to CLKX high#
3
td(CKXH-DXV)
Delay time, CLKX high to DX valid
6
tdis(CKXL-DXHZ)
Disable time, DX high impedance following last data bit from
CLKX low
7
tdis(FXH-DXHZ)
Disable time, DX high impedance following last data bit from FSX
high
1
UNIT
SLAVE
MIN
MAX
T−4
T+4
L−4
L+4
−4
4
L−2
L+3
MIN
MAX
ns
ns
3P + 1
5P + 17
ns
ns
P+4
3P + 17
ns
8
td(FXL-DXV)
Delay time, FSX low to DX valid
2P + 1 4P + 13
ns
† P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
‡ For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
§ S = sample rate generator input clock = P if CLKSM = 1 (P = 1/CPU clock frequency)
= sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
¶ FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX
and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
# FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(CLKX).
52
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
SGUS042A − MAY 1998 − REVISED APRIL 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
CLKX
1
2
FSX
7
6
DX
8
3
Bit 0
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
(n-4)
5
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 33. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
53
SGUS042A − MAY 1998 − REVISED APRIL 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
timing requirements for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 0†‡ (see Figure 34)
C6701-120
C6701-167
NO.
MASTER
MIN
4
tsu(DRV-CKXH)
th(CKXH-DRV)
Setup time, DR valid before CLKX high
UNIT
SLAVE
MAX
12
5
Hold time, DR valid after CLKX high
4
† P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
‡ For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
MIN
MAX
2 − 3P
ns
5 + 6P
ns
switching characteristics for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 0†‡
(see Figure 34)
C6701-120
C6701-167
NO.
PARAMETER
MASTER§
2
th(CKXL-FXL)
td(FXL-CKXH)
Hold time, FSX low after CLKX low¶
Delay time, FSX low to CLKX high#
3
td(CKXL-DXV)
Delay time, CLKX low to DX valid
tdis(CKXL-DXHZ)
Disable time, DX high impedance following last data bit from
CLKX low
1
6
UNIT
SLAVE
MIN
MAX
L−4
L+4
MIN
MAX
T−4
T+4
−4
4
3P + 1
5P + 17
ns
−2
4
3P + 4
5P + 17
ns
ns
ns
7
td(FXL-DXV)
Delay time, FSX low to DX valid
H−2 H+3
2P + 1 4P + 13
ns
† P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
‡ For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
§ S = sample rate generator input clock = P if CLKSM = 1 (P = 1/CPU clock frequency)
= sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
¶ FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX
and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
# FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(CLKX).
CLKX
1
2
6
Bit 0
7
FSX
DX
3
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
(n-4)
5
Bit(n-1)
(n-2)
(n-3)
Figure 34. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0
54
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
(n-4)
SGUS042A − MAY 1998 − REVISED APRIL 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
timing requirements for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 1†‡ (see Figure 35)
C6701-120
C6701-167
NO.
MASTER
MIN
4
tsu(DRV-CKXH)
th(CKXH-DRV)
Setup time, DR valid before CLKX high
UNIT
SLAVE
MAX
12
5
Hold time, DR valid after CLKX high
4
† P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
‡ For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
MIN
MAX
2 − 3P
ns
5 + 6P
ns
switching characteristics for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 1†‡
(see Figure 35)
C6701-120
C6701-167
NO.
PARAMETER
MASTER§
2
th(CKXH-FXL)
td(FXL-CKXL)
Hold time, FSX low after CLKX high¶
Delay time, FSX low to CLKX low#
3
td(CKXL-DXV)
Delay time, CLKX low to DX valid
6
tdis(CKXH-DXHZ)
Disable time, DX high impedance following last data bit from
CLKX high
7
tdis(FXH-DXHZ)
Disable time, DX high impedance following last data bit from
FSX high
1
UNIT
SLAVE
MIN
MAX
T−4
T+4
H−4
H+4
−4
4
H−2
H+3
MIN
MAX
ns
ns
3P + 1
5P + 17
ns
ns
P+4
3P + 17
ns
8
td(FXL-DXV)
Delay time, FSX low to DX valid
2P + 1 4P + 13
ns
† P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
‡ For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
§ S = sample rate generator input clock = P if CLKSM = 1 (P = 1/CPU clock frequency)
= sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
¶ FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX
and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
# FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(CLKX).
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
55
SGUS042A − MAY 1998 − REVISED APRIL 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
CLKX
1
2
FSX
7
6
DX
8
3
Bit 0
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
(n-4)
5
Bit(n-1)
(n-2)
(n-3)
Figure 35. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1
56
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
(n-4)
SGUS042A − MAY 1998 − REVISED APRIL 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
timing requirements for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 1†‡ (see Figure 36)
C6701-120
C6701-167
NO.
MASTER
MIN
4
tsu(DRV-CKXL)
th(CKXL-DRV)
Setup time, DR valid before CLKX low
UNIT
SLAVE
MAX
12
5
Hold time, DR valid after CLKX low
4
† P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
‡ For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
MIN
MAX
2 − 3P
ns
5 + 6P
ns
switching characteristics for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 1†‡
(see Figure 36)
C6701-120
C6701-167
NO.
PARAMETER
MASTER§
2
th(CKXH-FXL)
td(FXL-CKXL)
Hold time, FSX low after CLKX high¶
Delay time, FSX low to CLKX low#
3
td(CKXH-DXV)
Delay time, CLKX high to DX valid
tdis(CKXH-DXHZ)
Disable time, DX high impedance following last data bit from
CLKX high
1
6
UNIT
SLAVE
MIN
MAX
H−4
H+4
MIN
MAX
T−4
T+4
−4
4
3P + 1
5P + 17
ns
−2
4
3P + 4
5P + 17
ns
ns
ns
7
td(FXL-DXV)
Delay time, FSX low to DX valid
L−2 L+3
2P + 1 4P + 13
ns
† P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
‡ For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
§ S = sample rate generator input clock = P if CLKSM = 1 (P = 1/CPU clock frequency)
= sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
= (CLKGDV + 1)/2 * S if CLKGDV is odd or zero
¶ FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX
and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
# FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(CLKX).
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
57
SGUS042A − MAY 1998 − REVISED APRIL 2004
MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED)
CLKX
1
2
FSX
7
6
DX
3
Bit 0
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
5
Bit(n-1)
(n-2)
(n-3)
Figure 36. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1
58
POST OFFICE BOX 1443
(n-4)
• HOUSTON, TEXAS 77251−1443
(n-4)
SGUS042A − MAY 1998 − REVISED APRIL 2004
DMAC, TIMER, POWER-DOWN TIMING
switching characteristics for DMAC outputs (see Figure 37)
NO.
1
C6701-120
C6701-167
PARAMETER
td(CKO1H-DMACV)
Delay time, CLKOUT1 high to DMAC valid
UNIT
MIN
MAX
2
11
ns
CLKOUT1
1
1
DMAC[0:3]
Figure 37. DMAC Timing
timing requirements for timer inputs (see Figure 38)†
C6701-120
C6701-167
NO.
MIN
1
tw(TINPH)
Pulse duration, TINP high
† P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns.
UNIT
MAX
2P
ns
switching characteristics for timer outputs (see Figure 38)
NO.
2
C6701-120
C6701-167
PARAMETER
td(CKO1H-TOUTV)
Delay time, CLKOUT1 high to TOUT valid
UNIT
MIN
MAX
1
10
ns
CLKOUT1
1
TINP
2
2
TOUT
Figure 38. Timer Timing
switching characteristics for power-down outputs (see Figure 39)
NO.
1
C6701-120
C6701-167
PARAMETER
td(CKO1H-PDV)
Delay time, CLKOUT1 high to PD valid
UNIT
MIN
MAX
1
9
ns
CLKOUT1
1
1
PD
Figure 39. Power-Down Timing
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
59
SGUS042A − MAY 1998 − REVISED APRIL 2004
JTAG TEST-PORT TIMING
timing requirements for JTAG test port (see Figure 40)
C6701-120
C6701-167
NO.
MIN
1
UNIT
MAX
tc(TCK)
tsu(TDIV-TCKH)
Cycle time, TCK
35
ns
3
Setup time, TDI/TMS/TRST valid before TCK high
10
ns
4
th(TCKH-TDIV)
Hold time, TDI/TMS/TRST valid after TCK high
9
ns
switching characteristics for JTAG test port (see Figure 40)
NO.
2
C6701-120
C6701-167
PARAMETER
td(TCKL-TDOV)
Delay time, TCK low to TDO valid
MIN
MAX
–3
12
1
TCK
2
2
TDO
4
3
TDI/TMS/TRST
Figure 40. JTAG Test-Port Timing
60
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
UNIT
ns
SGUS042A − MAY 1998 − REVISED APRIL 2004
MECHANICAL DATA
GJC (S-PBGA-N352)
PLASTIC BALL GRID ARRAY
35,20
SQ
34,80
33,20
SQ
32,80
31,75 TYP
1,27
21,00 NOM
0,635
1,27
0,635
21,00 NOM
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1
3
2
Heat Slug
5
4
7
6
9
8
10
11 13 15 17 19 21 23 25
12 14 16 18 20 22 24 26
See Note E
3,50 MAX
1,00 NOM
Seating Plane
0,90
0,60
NOTES: A.
B.
C.
D.
E.
F.
∅ 0,10 M
0,50 MIN
0,15
4173506-2/D 07/99
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Thermally enhanced plastic package with heat slug (HSL).
Flip chip application only
Possible protrusion in this area, but within 3,50 max package height specification
Falls within JEDEC MO-151/BAR-2
thermal resistance characteristics (S-PBGA package)
NO
1
°C/W
Air Flow LFPM†
RΘJC
RΘJA
Junction-to-case
0.74
N/A
Junction-to-free air
11.31
0
RΘJA
RΘJA
Junction-to-free air
9.60
100
Junction-to-free air
8.34
250
5
RΘJA
Junction-to-free air
† LFPM = Linear Feet Per Minute
7.30
500
2
3
4
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
61
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
SM320C6701GJCA12EP
ACTIVE
FCBGA
GJC
352
21
TBD
SNPB
Level-4-220C-72 HR
V62/03669-01XA
ACTIVE
FCBGA
GJC
352
21
TBD
SNPB
Level-4-220C-72 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SM320C6701-EP :
• Catalog: SM320C6701
NOTE: Qualified Version Definitions:
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2012
• Catalog - TI's standard catalog product
Addendum-Page 2
MECHANICAL DATA
MPBG067B – SEPTEMBER 1998 – REVISED JANUARY 2002
GJC (S-PBGA-N352)
PLASTIC BALL GRID ARRAY
35,20
SQ
34,80
33,20
SQ
32,80
31,75 TYP
1,27
21,00 NOM
0,635
1,27
0,635
21,00 NOM
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1
A1 Corner
Heat Slug
3
2
5
4
7
6
9
8
10
11 13 15 17 19 21 23 25
12 14 16 18 20 22 24 26
Bottom View
See Note E
3,50 MAX
1,00 NOM
Seating Plane
0,90
0,60
∅ 0,10 M
0,50 MIN
0,15
4173506-2/E 11/01
NOTES: A.
B.
C.
D.
E.
F.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Thermally enhanced plastic package with heat slug (HSL).
Flip chip application only
Possible protrusion in this area, but within 3,50 max package height specification
Falls within JEDEC MO-151/BAR-2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
Wireless Connectivity
www.ti.com/wirelessconnectivity
TI E2E Community Home Page
e2e.ti.com
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