HM5112805FTD-5, HM5113805FTD-5 E0174H10 (Ver. 1.0) (Previous ADE-203-1052B (Z)) Jul. 16, 2001 L EO 128M EDO DRAM (16-Mword × 8-bit) 8k refresh/4k refresh Description Features Pr The HM5112805F Series, HM5113805F Series are 128M-bit dynamic RAMs organized as 16,777,216-word × 8-bit. The y have re alize d high per forma nce and low powe r by employing C MOS proc ess tec hnology. HM5112805F S erie s, HM5113805F S erie s off er Extende d Da ta Out (ED O) P age Mode as a high spee d access mode. They are packaged in 32-pin plastic TSOPII. od • Single 3.3 V supply: 3.3 V ± 0.15 V • Access time: 50 ns (max) • Power dissipation ⎯ Active: 759 mW (max) (HM5112805F Series) 897 mW (max) (HM5113805F Series) ⎯ Standby : 3.5 mW (max) (CMOS interface) • EDO page mode capability • Refresh cycles ⎯ RAS-only refresh 8192 cycles/64 ms (HM5112805F) 4096 cycles/64 ms (HM5113805F) ⎯ CBR/Hidden refresh 4096 cycles/64 ms (HM5112805F, HM5113805F) • 3 variations of refresh ⎯ RAS-only refresh ⎯ CAS-before-RAS refresh ⎯ Hidden refresh t uc This product became EOL in December, 2006. Elpida Memory, Inc. is a joint venture DRAM company of NEC Corporation and Hitachi, Ltd. HM5112805FTD-5, HM5113805FTD-5 Ordering Information Type No. Access time Package HM5112805FTD-5 50 ns 400-mil 32-pin plastic TSOP II (TTP-32DF) HM5113805FTD-5 50 ns L EO od Pr t uc Data Sheet E0174H10 2 HM5112805FTD-5, HM5113805FTD-5 Pin Arrangement (HM5112805F Series) 32-pin TSOP L EO VCC 1 32 VSS I/O0 2 31 I/O7 I/O1 3 30 I/O6 I/O2 4 29 I/O5 I/O3 5 28 I/O4 NC 6 27 VSS VCC 7 26 CAS WE 8 25 OE RAS 9 24 A12 A0 10 23 A11 A1 11 22 A10 A2 12 21 A9 Pr A3 13 20 A8 A4 14 19 A7 A5 15 18 A6 VCC 16 17 VSS od (Top view) Pin Description Function A0 to A12 Address input — Row/Refresh address A0 to A12 — Column address A0 to A10 I/O0 to I/O7 Data input/output RAS Row address strobe CAS Column address strobe WE Write enable OE Output enable VCC Power supply VSS Ground NC No connection t uc Pin name Data Sheet E0174H10 3 HM5112805FTD-5, HM5113805FTD-5 Pin Arrangement (HM5113805F Series) 32-pin TSOP L EO 1 32 VSS I/O0 2 31 I/O7 I/O1 3 30 I/O6 I/O2 4 29 I/O5 I/O3 5 28 I/O4 NC 6 27 VSS VCC 7 26 CAS WE 8 25 OE RAS 9 24 NC A0 10 23 A11 A1 11 22 A10 A2 12 21 A9 A3 13 20 A8 A4 14 19 A7 A5 15 18 A6 VCC 16 17 VSS od Pr VCC (Top view) Pin Description Function A0 to A11 Address input — Row/Refresh address A0 to A11 — Column address A0 to A11 I/O0 to I/O7 Data input/output RAS Row address strobe CAS Column address strobe WE Write enable OE Output enable VCC Power supply VSS Ground NC No connection Data Sheet E0174H10 4 t uc Pin name HM5112805FTD-5, HM5113805FTD-5 Block Diagram (HM5112805F Series) A0 EO A1 to Upper pellet Column decoder • • • Column address buffers 16M array A10 Row decoder I/O buffers 16M array I/O1 I/O3 I/O4 I/O6 16M array Pr Timing and control RAS CAS WE OE Lower pellet od Timing and control Column decoder Column address buffers Row address buffers 16M array t uc • • • 16M array Row decoder A12 Row address buffers L A11 16M array I/O buffers 16M array 16M array I/O0 I/O2 I/O5 I/O7 Data Sheet E0174H10 5 HM5112805FTD-5, HM5113805FTD-5 Block Diagram (HM5113805F Series) A1 to A10 Column address buffers 16M array Row address buffers L A11 • • • Upper pellet Column decoder 16M array Row decoder EO A0 I/O buffers 16M array I/O1 I/O3 I/O4 I/O6 16M array Pr Timing and control RAS CAS WE OE od Lower pellet Timing and control Column decoder Column address buffers Row decoder Row address buffers 16M array I/O buffers 16M array 16M array Data Sheet E0174H10 6 t uc • • • 16M array I/O0 I/O2 I/O5 I/O7 HM5112805FTD-5, HM5113805FTD-5 Operation Table CAS WE OE I/O 0 to I/O 7 Operation H × × × High-Z Standby L L H EO RAS L L L Dout Read cycle L* 2 × Din Early write cycle 2 H Din Delayed write cycle L L L* L L H to L L to H Dout/Din Read-modify-write cycle L H × × High-Z RAS-only refresh cycle H to L L H × High-Z CAS-before-RAS refresh cycle L L H H High-Z Read cycle (Output disabled) L Notes: 1. H: VIH (inactive), L: VIL (active), ×: VIH or VIL 2. t WCS ≥ 0 ns: Early write cycle t WCS < 0 ns: Delayed write cycle Parameter Pr Absolute Maximum Ratings Symbol Value Unit Terminal voltage on any pin relative to VSS VT –0.5 to VCC + 0.5 (≤ 4.6 V (max)) V Power supply voltage relative to VSS VCC –0.5 to +4.6 V Short circuit output current Iout 50 mA od Power dissipation PT Storage temperature Tstg DC Operating Conditions 1.0 W –55 to +125 °C Symbol Min Typ Supply voltage VCC 3.15 3.3 VSS 0 0 Input high voltage VIH 2.0 — Input low voltage VIL –0.3 — Ambient temperature range Ta 0 — Max Unit Notes t uc Parameter 3.45 V 1, 2 0 V 2 VCC + 0.3 V 1 0.8 V 1 70 ˚C Notes: 1. All voltage referred to VSS . 2. The supply voltage with all VCC pins must be on the same level. The supply voltage with all VSS pins must be on the same level. Data Sheet E0174H10 7 HM5112805FTD-5, HM5113805FTD-5 DC Characteristics (HM5112805F Series) HM5112805F -5 Symbol Min Max Unit Test conditions I CC1 — 220 mA t RC = min I CC2 — 4 mA TTL interface RAS, CAS = VIH Dout = High-Z — 1 mA CMOS interface RAS, CAS ≥ VCC – 0.2 V Dout = High-Z I CC3 — 220 mA t RC = min I CC5 — 10 mA RAS = VIH, CAS = VIL Dout = enable CAS-before-RAS refresh current I CC6 — 220 mA t RC = min — 220 mA RAS = VIL , CAS cycle, t HPC = t HPC min EO Parameter 1, Operating current* * 2 Standby current L RAS-only refresh current* 2 Standby current* 1 1, EDO page mode current* * Output leakage current Output high voltage Output low voltage I CC7 Pr Input leakage current 3 I LI –5 5 µA 0 V ≤ Vin ≤ VCC + 0.3 V I LO –5 5 µA 0 V ≤ Vout ≤ VCC Dout = disable VOH 2.4 VCC V High Iout = –2 mA VOL 0 0.4 V Low Iout = 2 mA od Notes: 1. I CC depends on output load condition when the device is selected. I CC max is specified at the output open condition. 2. Address can be changed once or less while RAS = VIL. 3. Measured with one sequential address change per EDO cycle, t HPC . t uc Data Sheet E0174H10 8 HM5112805FTD-5, HM5113805FTD-5 DC Characteristics (HM5113805F Series) HM5113805F -5 Symbol Min Max Unit Test conditions I CC1 — 260 mA t RC = min I CC2 — 4 mA TTL interface RAS, CAS = VIH Dout = High-Z — 1 mA CMOS interface RAS, CAS ≥ VCC – 0.2 V Dout = High-Z I CC3 — 260 mA t RC = min I CC5 — 10 mA RAS = VIH, CAS = VIL Dout = enable CAS-before-RAS refresh current I CC6 — 260 mA t RC = min — 220 mA RAS = VIL , CAS cycle, t HPC = t HPC min EO Parameter 1, Operating current* * 2 Standby current L RAS-only refresh current* 2 Standby current* 1 1, EDO page mode current* * Output leakage current Output high voltage Output low voltage I CC7 Pr Input leakage current 3 I LI –5 5 µA 0 V ≤ Vin ≤ VCC + 0.3 V I LO –5 5 µA 0 V ≤ Vout ≤ VCC Dout = disable VOH 2.4 VCC V High Iout = –2 mA VOL 0 0.4 V Low Iout = 2 mA od Notes: 1. I CC depends on output load condition when the device is selected. I CC max is specified at the output open condition. 2. Address can be changed once or less while RAS = VIL. 3. Measured with one sequential address change per EDO cycle, t HPC . Capacitance (Ta = 25˚C, VCC = 3.3 V ± 0.15 V) Symbol Typ Input capacitance (Address) CI1 — Input capacitance (Clocks) CI2 — Output capacitance (Data-in, Data-out) CI/O — t uc Parameter Max Unit Notes 7 pF 1 7 pF 1 8 pF 1, 2 Notes : 1. Capacitance measured with Boonton Meter or effective capacitance measuring method. 2. RAS and CAS = VIH to disable Dout. Data Sheet E0174H10 9 HM5112805FTD-5, HM5113805FTD-5 AC Characteristics (Ta = 0 to +70˚C, VCC = 3.3 V ± 0.15 V, VSS = 0 V) *1, *2, *19 Test Conditions Input rise and fall time: 2 ns Input pulse levels: VIL = 0 V, VIH = 3.0 V Input timing reference levels: 0.8 V, 2.0 V Output timing reference levels: 0.8 V, 2.0 V Output load: 1 TTL gate + C L (100 pF) (Including scope and jig) EO • • • • • Read, Write, Read-Modify-Write and Refresh Cycles (Common parameters) L HM5112805F/HM5113805F -5 Symbol Min Max Unit Random read or write cycle time t RC 84 — ns RAS precharge time t RP 30 — ns t CP 8 — ns t RAS 50 10000 ns t CAS 8 10000 ns t ASR 0 — ns t RAH 8 — ns CAS precharge time RAS pulse width CAS pulse width Row address setup time Row address hold time t ASC Column address hold time t CAH RAS to CAS delay time t RCD RAS to column address delay time t RAD RAS hold time t RSH CAS hold time t CSH CAS to RAS precharge time Notes 0 — ns 8 — ns 12 37 ns 3 10 25 ns 4 13 — ns 38 — ns t CRP 5 — ns OE to Din delay time t OED 13 — ns 5 OE delay time from Din t DZO 0 — ns 6 CAS delay time from Din t DZC 0 — ns 6 Transition time (rise and fall) tT 2 50 ns 7 Data Sheet E0174H10 10 t uc Column address setup time od Pr Parameter HM5112805FTD-5, HM5113805FTD-5 Read Cycle HM5112805F/HM5113805F -5 Symbol Min Max Unit Notes Access time from RAS t RAC — 50 ns 8, 9 Access time from CAS t CAC — 13 ns 9, 10, 17 Access time from address t AA — 25 ns 9, 11, 17 Access time from OE t OEA — 13 ns 9 Read command setup time t RCS 0 — ns Read command hold time to CAS t RCH 0 — ns Read command hold time from RAS t RCHR 50 — ns Read command hold time to RAS t RRH 0 — ns Column address to RAS lead time t RAL 25 — ns Column address to CAS lead time t CAL 15 — ns CAS to output in low-Z t CLZ 0 — ns t OH 3 — ns Output data hold time from OE t OHO 3 — ns Output buffer turn-off time t OFF — 13 ns 13, 21 Output buffer turn-off to OE t OEZ — 13 ns 13 CAS to Din delay time t CDD 13 — ns 5 L EO Parameter Output data hold time from RAS t OHR Output buffer turn-off to RAS t OFR Output buffer turn-off to WE t WEZ WE to Din delay time t WED RAS to Din delay time t RDD od Pr Output data hold time 12 12 21 3 — ns 21 — 13 ns 13, 21 — 13 ns 13 13 — ns 13 — ns t uc Data Sheet E0174H10 11 HM5112805FTD-5, HM5113805FTD-5 Write Cycle HM5112805F/HM5113805F -5 Symbol Min Max Unit Notes Write command setup time t WCS 0 — ns 14 Write command hold time t WCH 8 — ns Write command pulse width t WP 8 — ns Write command to RAS lead time t RWL 13 — ns Write command to CAS lead time t CWL 8 — ns Data-in setup time t DS 0 — ns 15 Data-in hold time t DH 8 — ns 15 Notes L EO Parameter Read-Modify-Write Cycle Pr HM5112805F/HM5113805F -5 Parameter Min Max Unit t RWC 116 — ns RAS to WE delay time t RWD 67 — ns 14 t CWD 30 — ns 14 42 — ns 14 13 — ns CAS to WE delay time Column address to WE delay time t AWD OE hold time from WE t OEH Refresh Cycle od Symbol Read-modify-write cycle time -5 t uc HM5112805F/HM5113805F Parameter Symbol Min Max Unit CAS setup time (CBR refresh cycle) t CSR 5 — ns CAS hold time (CBR refresh cycle) t CHR 8 — ns WE setup time (CBR refresh cycle) t WRP 0 — ns WE hold time (CBR refresh cycle) t WRH 8 — ns RAS precharge to CAS hold time t RPC 5 — ns Data Sheet E0174H10 12 Notes HM5112805FTD-5, HM5113805FTD-5 EDO Page Mode Cycle HM5112805F/HM5113805F -5 Symbol Min Max Unit Notes EDO page mode cycle time t HPC 20 — ns 20 EDO page mode RAS pulse width t RASP — 100000 ns 16 Access time from CAS precharge t CPA — 28 ns 9, 17 RAS hold time from CAS precharge t CPRH 28 — ns Output data hold time from CAS low t DOH 3 — ns CAS hold time referred OE t COL 8 — ns CAS to OE setup time t COP 5 — ns Read command hold time from CAS precharge t RCHC 28 — ns Write pulse width during CAS precharge t WPE 8 — ns OE precharge time 8 — ns L EO Parameter t OEP 9, 22 Pr EDO Page Mode Read-Modify-Write Cycle HM5112805F/HM5113805F -5 od Parameter Symbol EDO page mode read-modify-write cycle t HPRWC time WE delay time from CAS precharge t CPW Max Unit 57 — ns 45 — ns Parameter Symbol Max Refresh period t REF 64 Parameter Symbol Max Refresh period t REF 64 Refresh(HM5113805F Series) Notes 14 t uc Refresh(HM5112805F Series) Min Unit Notes ms 8192 cycles Unit Notes ms 4096 cycles Data Sheet E0174H10 13 HM5112805FTD-5, HM5113805FTD-5 L EO Notes: 1. AC measurements assume t T = 2 ns. 2. An initial pause of 200 µs is required after power up followed by a minimum of eight initialization cycles (any combination of cycles containing RAS-only refresh or CAS-before-RAS refresh). 3. Operation with the t RCD (max) limit insures that t RAC (max) can be met, t RCD (max) is specified as a reference point only; if t RCD is greater than the specified t RCD (max) limit, than the access time is controlled exclusively by t CAC . 4. Operation with the t RAD (max) limit insures that t RAC (max) can be met, t RAD (max) is specified as a reference point only; if t RAD is greater than the specified t RAD (max) limit, then access time is controlled exclusively by t AA . 5. Either t OED or t CDD must be satisfied. 6. Either t DZO or t DZC must be satisfied. 7. VIH (min) and VIL (max) are reference levels for measuring timing of input signals. Also, transition times are measured between VIH (min) and VIL (max). 8. Assumes that t RCD ≤ t RCD (max) and t RAD ≤ t RAD (max). If t RCD or t RAD is greater than the maximum recommended value shown in this table, t RAC exceeds the value shown. 9. Measured with a load circuit equivalent to 1 TTL loads and 100 pF. 10. Assumes that t RCD ≥ t RCD (max) and t RCD + t CAC (max) ≥ t RAD + t AA (max). 11. Assumes that t RAD ≥ t RAD (max) and t RCD + t CAC (max) ≤ t RAD + t AA (max). 12. Either t RCH or t RRH must be satisfied for a read cycles. 13. t OFF (max), t OEZ (max), t WEZ (max) and t OFR (max) define the time at which the outputs achieve the open circuit condition and are not referred to output voltage levels. 14. t WCS , t RWD, t CWD, t AWD and t CPW are not restrictive operating parameters. They are included in the data sheet as electrical characteristics only; if t WCS ≥ t WCS (min), the cycle is an early write cycle and the data out pin will remain open circuit (high impedance) throughout the entire cycle; if t RWD ≥ t RWD (min), t CWD ≥ t CWD (min), and t AWD ≥ t AWD (min), or t CWD ≥ t CWD (min), t AWD ≥ t AWD (min) and t CPW ≥ t CPW (min), the cycle is a read-modify-write and the data output will contain data read from the selected cell; if neither of the above sets of conditions is satisfied, the condition of the data out (at access time) is indeterminate. 15. t DS and t DH are referred to CAS leading edge in early write cycles and to WE leading edge in delayed write or read-modify-write cycles. 16. t RASP defines RAS pulse width in EDO page mode cycles. 17. Access time is determined by the longest among t AA , t CAC and t CPA. 18. In delayed write or read-modify-write cycles, OE must disable output buffer prior to applying data to the device. 19. When output buffers are enabled once, sustain the low impedance state until valid data is obtained. When output buffer is turned on and off within a very short time, generally it causes large VCC/V SS line noise, which causes to degrade VIH min/VIL max level. 20. t HPC (min) can be achieved during a series of EDO page mode write cycles or EDO page mode read cycles. If both write and read operation are mixed in a EDO page mode RAS cycle (EDO page mode mix cycle (1), (2)), minimum value of CAS cycle (tCAS + t CP + 2 t T) becomes greater than the specified t HPC (min) value. The value of CAS cycle time of mixed EDO page mode is shown in EDO page mode mix cycle (1) and (2). 21. Data output turns off and becomes high impedance from later rising edge of RAS and CAS. Hold time and turn off time are specified by the timing specifications of later rising edge of RAS and CAS between t OHR and t OH and between t OFR and t OFF. od Pr t uc Data Sheet E0174H10 14 HM5112805FTD-5, HM5113805FTD-5 L EO 22. t DOH defines the time at which the output level go cross. VOL = 0.8 V, VOH = 2.0 V of output timing reference level. 23. XXX: H or L (H: VIH (min) ≤ VIN ≤ VIH (max), L: VIL (min) ≤ VIN ≤ VIL (max)) ///////: Invalid Dout When the address, clock and input pins are not described on timing waveforms, their pins must be applied VIH or VIL. od Pr t uc Data Sheet E0174H10 15 HM5112805FTD-5, HM5113805FTD-5 Timing Waveforms*23 Read Cycle EO tRC tRAS tRP RAS tCSH tT tASR tRAD tRAH tRAL tCAL tASC tCAH Pr Address tRSH tCAS L CAS tCRP tRCD Column Row tRRH tRCHR tRCS od WE tRCH tDZC tCDD tWED tRDD High-Z tDZO tOEA OE tCAC tAA tRAC tCLZ t uc ; Din tOED tOEZ tOHO tOFF tOH tOFR tOHR tWEZ Dout Dout Data Sheet E0174H10 16 HM5112805FTD-5, HM5113805FTD-5 Early Write Cycle tRC tRAS tRP EO RAS tCSH tCRP tRCD tRSH tCAS tT CAS L tASR tASC tCAH Pr Address tRAH Row Column tWCS tDS tDH Din High-Z* Dout t uc Din od WE tWCH * t WCS t WCS (min) Data Sheet E0174H10 17 HM5112805FTD-5, HM5113805FTD-5 Delayed Write Cycle*18 tRC tRAS tRP EO RAS tCSH tCRP tRCD tRSH tCAS tT CAS L tRAH tASR Address tASC Row tCAH Column Pr tRCS WE High-Z tDS tDH Din tOED tDZO tOEH tOEP OE tOEZ tCLZ High-Z Dout Invalid Dout Data Sheet E0174H10 18 t uc ; Din tRWL tWP od tDZC tCWL HM5112805FTD-5, HM5113805FTD-5 Read-Modify-Write Cycle*18 tRWC tRAS tRP EO RAS tT tRCD L CAS tASR Address tCAS tCRP tRAD tASC tRAH Row tCAH Column Pr tCWL tCWD tRCS tRWL tWP tAWD tRWD WE od tDZC tDH tDS High-Z Din ; Din tOED tOEH tOEA tOEP OE tCAC tAA tOEZ tRAC tOHO Dout t uc tDZO Dout High-Z tCLZ Data Sheet E0174H10 19 HM5112805FTD-5, HM5113805FTD-5 RAS-Only Refresh Cycle tRC tRAS tRP EO RAS tT tRPC tCRP tCRP CAS L tASR Address tRAH Row tOFR High-Z od Data Sheet E0174H10 20 t uc ; Dout Pr tOFF HM5112805FTD-5, HM5113805FTD-5 CAS-Before-RAS Refresh Cycle tRC tRP tRC tRP EO tRAS tRAS tRP RAS tT tRPC tCP tRPC tCSR tCHR tCP tCRP tCSR tCHR L CAS tWRP tWRH tWRP tWRH WE Pr Address tOFR od tOFF High-Z t uc ; Dout Data Sheet E0174H10 21 HM5112805FTD-5, HM5113805FTD-5 Hidden Refresh Cycle tRC tRAS tRP tRC tRAS tRC tRP tRAS tRP EO RAS tT tRSH tCHR tCRP tRCD CAS tRAL L tRAD tASR Address tRAH tASC Row tCAH Column Pr tRRH tRCS WE tWED od tDZC tRCH tCDD tRDD High-Z Din tDZO OE tCAC tAA tRAC t uc tOEA tOFF ; tCLZ tOH Dout Dout Data Sheet E0174H10 22 tOED tOFR tOHR tOEZ tWEZ tOHO HM5112805FTD-5, HM5113805FTD-5 EDO Page Mode Read Cycle (1) t RP t HPC t RASP EO RAS tT t CSH t CP t HPC t CAS CAS t HPC t CPRH t CP t t CRP RSH t CAS t RCHR t RCS t CP tCAS tCAS t RCHC t RCH t RCS t RRH t RCH WE Address tRAH tASC tCAH L tASR Row Column 1 t WPE t ASC t CAH t ASC t CAH Column 2 Column 3 t CAL t CAL t RAL t CAH tASC t WED Column 4 t CAL t CAL tRDD tCDD tDZC Pr High-Z Din tCOL tDZO tCOP t OEP OE tCPA tOEA tOEZ tOHO tAA tOEZ ; tCAC tAA tOFR tOHR tOEZ tCPA tCPA tAA tCAC od tAA tCAC tOED tOEP tWEZ tRAC Dout tOEA tDOH Dout 1 Dout 2 Dout 2 tOHO Dout 3 tCAC tOHO tOFF tOH tOEA Dout 4 t uc Data Sheet E0174H10 23 HM5112805FTD-5, HM5113805FTD-5 EDO Page Mode Read Cycle (2) t RP t RASP EO RAS tT t CSH t CP t HPC t CAS CAS tHPC t CP t HPC t CP t CAS t CAS t CRP tRSH tCAS t RCHC t RRH t RCH t RCS WE Address tRAH tASC tCAH L tASR Row Column 1 t ASC t CAH t ASC t CAH Column 2 t CAL t RAL t CAH tASC Column 3 t CAL t WED Column 4 t CAL tRDD t CAL tDZC tCDD Pr High-Z Din tCOL tDZO tCOP t OEP OE tOEA tCPA tOEZ tOFR tOHR tOEZ tCPA tAA ; tCAC tAA tCPA tAA tCAC od tAA tCAC tOED tOEP tDOH tRAC Dout tOHO tOEA tOEZ tDOH tOHO Dout 1 Dout 2 Dout 2 Dout 3 tCAC tOHO tOFF tOH tOEA Dout 4 t uc Data Sheet E0174H10 24 HM5112805FTD-5, HM5113805FTD-5 EDO Page Mode Early Write Cycle tRP tRASP EO RAS tT tCSH tHPC tCAS tRCD tCP tRSH tCAS tCP tCAS tCRP CAS L tASR Address Row tRAH tASC Column 1 Column 2 tWCH tDH Din 1 tWCS tWCH tASC tCAH Column N tWCS tWCH tDS tDH Din 2 High-Z* tDS tDH Din N t uc Dout tCAH od tDS Din tASC Pr tWCS WE tCAH * t WCS t WCS (min) Data Sheet E0174H10 25 HM5112805FTD-5, HM5113805FTD-5 EDO Page Mode Delayed Write Cycle*18 tRASP EO tRP RAS tT tCP tRCD tCRP tCP tCSH tHPC tCAS tCAS tRSH tCAS CAS L tRAD tASR tASC tCAH tASC tCAH Column 1 Column 2 tRAH Address Row tASC tCAH tWP tDZC tDS tRCS Din 1 tDZO tOED tDH Din 2 tDZO tOED tOEP tOEH tDZO tDH Din N tOED tOEP tOEH t uc ; tOEP tOEH tWP tDZC tDS od tWP tDZC tDS tDH Din tCWL tRWL tRCS tRCS WE tCWL Pr tCWL Column N OE tCLZ tCLZ tOEZ tCLZ tOEZ Dout Invalid Dout Invalid Dout Data Sheet E0174H10 26 tOEZ Invalid Dout High-Z HM5112805FTD-5, HM5113805FTD-5 EDO Page Mode Read-Modify-Write Cycle*18 t RASP EO t RP RAS tT t HPRWC t CP t RCD t RSH t CP t CAS t CAS t CRP t CAS CAS L t ASR Address t RAD t ASC t RAH Row t ASC t CAH t CAH Column 1 Column 2 Column N Pr t RWD t CWL t AWD t RCS t CPW t AWD t CWD Din 1 t OED t OEP t OEH t RWL t CWD t WP t t DZC DS t DH Din 2 t OED t DZO t OEP t OEH t OED t DZO t OHO Din N t OEP t OEH t OHO ; ; t OHO t DH t uc OE t CWL t AWD t RCS t WP t t DZC DS t DH t DZO t CWL od t WP t t DZC DS Din t CPW t RCS t CWD WE t ASC t CAH t OEA t CAC t OEA t CAC t AA t OEA t CAC t AA t CPA t RAC t OEZ t CLZ t AA t CPA t OEZ t CLZ t OEZ t CLZ High-Z Dout Dout 1 Dout 2 Dout N Data Sheet E0174H10 27 HM5112805FTD-5, HM5113805FTD-5 EDO Page Mode Mix Cycle (1)* 20 t RP t RASP EO RAS tT t CAS CAS t CRP t CP t CP t CP t CAS tCAS t CSH tCAS tCWL tRSH t RCD t WCS tCPW tAWD WE L t ASC tRAH tASR Address Row tASC t CAH Column 2 Column 3 tASC t RAL t CAH Column 4 t CAL tRDD tCDD t CAL t DH Din 1 tWP t DH t DS High-Z Din 3 tOED ; Din Column 1 t ASC t CAH Pr t DS tCAH t RRH t RCH t RCS t RCS t WCH OE tCPA tAA tOEA tAA tCAC Dout tWED t DOH Dout 2 tOFR tWEZ tCPA od tCPA tOEP t OEZ tCAC t OHO Dout 3 tAA tOEZ tCAC tOHO tOEA tOFF tOH Dout 4 t uc Data Sheet E0174H10 28 HM5112805FTD-5, HM5113805FTD-5 EDO Page Mode Mix Cycle (2) *20 t RP t RASP RAS EO tT CAS t CSH t CAS t RCD t CAS tCAS t RCHR t RCS t RCH tWCS t WCH tCWL t ASC tRAH Row tCAH Column 1 t ASC t CAH t ASC t CAH Column 2 Column 3 tRSH t RCS t RRH t RCH tWP tCPW L Address tCAS t RCS WE tASR t CRP t CP t CP t CP t RAL t CAH tASC Column 4 t CAL t CAL t DS t DH Pr t DS High-Z Din Din 2 Din 3 t OEP t OEP tOED tOED tCOP tWED tCOL OE t OEA tOEA tCAC tOEZ tCPA tAA tCAC tRAC t OHO Dout 1 tOFR tWEZ tCPA od tAA Dout tRDD tCDD t DH tOEZ t OHO Dout 3 tAA tCAC tOEZ tOEA tOFF tOH tOHO Dout 4 t uc Data Sheet E0174H10 29 HM5112805FTD-5, HM5113805FTD-5 Package Dimensions HM5112805FTD Series HM5113805FTD Series (TTP-32DF) Unit: mm 17 10.16 32 L 1.27 1.20 Max M 0.80 11.76 ± 0.20 Pr 1.15 Max 0.21 0.10 Hitachi Code JEDEC EIAJ Mass (reference value) TTP-32DF — — 0.54 g od *Dimension including the plating thickness Base material dimension 0° – 5° 0.50 ± 0.10 0.45 *0.42 ± 0.08 0.40 ± 0.06 16 *0.12 ± 0.05 0.10 ± 0.04 1 0.05 ± 0.05 EO As of January, 2001 20.95 21.35 Max t uc Data Sheet E0174H10 30 HM5112805FTD-5, HM5113805FTD-5 Cautions L EO 1. Elpida Memory, Inc. neither warrants nor grants licenses of any rights of Elpida Memory, Inc.’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Elpida Memory, Inc. bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Elpida Memory, Inc. makes every attempt to ensure that its products are of high quality and reliability. However, contact Elpida Memory, Inc. before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Elpida Memory, Inc. particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Elpida Memory, Inc. bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Elpida Memory, Inc. product does not cause bodily injury, fire or other consequential damage due to operation of the Elpida Memory, Inc. product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Elpida Memory, Inc.. 7. Contact Elpida Memory, Inc. for any questions regarding this document or Elpida Memory, Inc. semiconductor products. od Pr t uc Data Sheet E0174H10 31