ESMT M24L416256SA

ESMT
PSRAM
M24L416256SA
4-Mbit (256K x 16) Pseudo Static RAM
Features
The input/output pins (I/O0through I/O15) are placed in a
high-impedance state when : deselected ( CE HIGH), outputs
• Wide voltage range: 2.7V–3.6V
are disabled ( OE HIGH), both Byte High Enable and Byte
• Access time: 55 ns, 60 ns and 70 ns
Low Enable are disabled ( BHE , BLE HIGH), or during a write
• Ultra-low active power
operation ( CE LOW and WE LOW).
Writing to the device is accomplished by taking Chip
— Typical active current: 1 mA @ f = 1 MHz
— Typical active current: 8 mA @ f = fmax (70-ns speed)
• Ultra low standby power
• Automatic power-down when deselected
• CMOS for optimum speed/power
Enable( CE LOW) and Write Enable ( WE ) input LOW. If Byte
Low Enable ( BLE ) is LOW, then data from I/O pins (I/O0
through I/O7) is written into the location specified on the
address pins(A0 through A17). If Byte High Enable ( BHE ) is
LOW, then data from I/O pins (I/O8 through I/O15) is written into
the location specified on the address pins (A0 through A17).
Reading from the device is accomplished by taking Chip
Enable ( CE LOW) and Output Enable ( OE ) LOW while
Functional Description
The M24L416256SA is a high-performance CMOS Pseudo
static RAM organized as 256K words by 16 bits that supports
an asynchronous memory interface. This device features
advanced circuit design to provide ultra-low active current.
This is ideal for portable applications such as cellular
telephones. The device can be put into standby mode when
forcing the Write Enable ( WE ) HIGH. If Byte Low Enable
( BLE ) is LOW, then data from the memory location specified
by the address pins will appear on I/O0 to I/O7. If Byte High
Enable( BHE ) is LOW, then data from memory will appear on
I/O8 toI/O15. Refer to the truth table for a complete description
of read and write modes.
deselected ( CE HIGH or both BHE and BLE are HIGH).
Logic Block Diagram
Elite Semiconductor Memory Technology Inc.
Publication Date: Jul. 2008
Revision: 1.4
1/14
ESMT
M24L416256SA
Pin Configuration[2, 3, 4]
44-pin TSOPII
Top View
A4
A3
A2
A1
A0
CE
I/O0
I/O1
I/O2
I/O3
V CC
V SS
I/O4
I/O5
I/O6
I/O7
WE
A16
A15
A14
A13
A12
Elite Semiconductor Memory Technology Inc.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A5
A6
A7
OE
BHE
BL E
I/O 1 5
I/O 1 4
I/O 1 3
I/O 1 2
V SS
V CC
I/ O1 1
I/ O1 0
I/ O9
I/ O8
NC
A8
A9
A1 0
A11
A1 7
Publication Date: Jul. 2008
Revision: 1.4
2/14
ESMT
M24L416256SA
Product Portfolio
Power Dissipation
VCC Range(V)
Product
Min.
Typ.[5]
Speed
(ns)
Max.
Operating, ICC (mA)
f = 1 MHz
Typ.[5]
Max.
1
5
55
M24L416256SA
2.7
3.0
3.6
60
70
Standby, ISB2 (µA)
f = fmax
Typ.[5]
Max.
14
22
8
15
Typ.[5]
Max.
17
40
Notes:
2. Ball H1, G2 and ball H6 for the VFBGA package can be used to upgrade to an 8-Mbit, 16-Mbit and 32-Mbit density, respectively.
3. NC “no connect” – not connected internally to the die.
4. DNU (Do Not Use) pins have to be left floating or tied to Vss to ensure proper application.
5. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC(typ.),
TA = 25°C.
Elite Semiconductor Memory Technology Inc.
Publication Date: Jul. 2008
Revision: 1.4
3/14
ESMT
M24L416256SA
Maximum Ratings
(Above which the useful life may be impaired. For user
guide-lines, not tested.)
Storage Temperature .................................–65°C to +150°C
Ambient Temperature with
Power Applied ..............................................–55°C to +125°C
Supply Voltage to Ground Potential ................−0.4V to 4.6V
DC Voltage Applied to Outputs
in High-Z State[6, 7, 8] .......................................−0.4V to 3.7V
DC Input Voltage[6, 7, 8] ....................................−0.4V to 3.7V
Output Current into Outputs (LOW) ............................20 mA
Static Discharge Voltage ......................................... > 2001V
(per MIL-STD-883, Method 3015)
Latch-up Current ....................................................> 200 mA
Operating Range
Range
Ambient Temperature (TA)
VCC
Extended
−25°C to +85°C
2.7V to 3.6V
Industrial
−40°C to +85°C
2.7V to 3.6V
DC Electrical Characteristics (Over the Operating Range)
Parameter
VCC
VOH
VOL
VIH
VIL
IIX
IOZ
ICC
Description
Test Conditions
Supply Voltage
Output HIGH
Voltage
Output LOW
Voltage
Input HIGH
Voltage
Input LOW
Voltage
Input Leakage
Current
Output Leakage
Current
IOH = −0.1 mA
VCC = 2.7V
IOL = 0.1 mA
VCC = 2.7V
ISB1
ISB2
Automatic CE
Power-down
Current —CMOS
Inputs
Thermal Resistance[9]
Parameter
VCC – 0.4
Unit
V
V
V
0.8 * VCC
VCC + 0.4
V
-0.4
0.6
V
GND ≤ VIN ≤ Vcc
-1
+1
µA
GND ≤ VOUT ≤ Vcc, Output
Disabled
-1
+1
µA
14 for –55
14 for –60
8 for –70
1 for all speeds
22 for –55
22 for –60
15 for –70
5 for all speeds
mA
150
250
µA
17
40
µA
f = 1 MHz
Automatic CE
Power-down
Current —CMOS
Inputs
Max.
3.6
0.4
f = fMAX = 1/tRC
VCC Operating
Supply Current
Min.
2.7
-55, 60, 70
Typ.[5]
3.0
VCC = VCCmax,
IOUT = 0 mA,
CMOS level
CE ≥ VCC − 0.2V, VIN ≥ VCC −
0.2V, VIN ≤ 0.2V, f = fMAX(Address
and Data Only),f = 0
( OE , WE , BHE and BLE ), VCC =
3.6V
CE ≥ VCC − 0.2V,
VIN ≥ VCC − 0.2V or VIN ≤ 0.2V,
f = 0, VCC = 3.6V
Description
θJA
Thermal Resistance (Junction to Ambient)
θJC
Thermal Resistance (Junction to Case)
Capacitance[9]
Parameter
Test Conditions
VFBGA
Unit
Test conditions follow standard test
methods and procedures for measuring
thermal impedance, per EIA/JESD51.
55
°C/W
17
°C/W
Description
Test Conditions
Max.
CIN
Input Capacitance
TA = 25°C, f = 1 MHz
8
VCC = VCC(typ)
COUT
Output Capacitance
8
Notes:
6.VIL(MIN) = –0.5V for pulse durations less than 20 ns.
7.VIH(Max) = VCC + 0.5V for pulse durations less than 20 ns.
8.Overshoot and undershoot specifications are characterized and are not 100% tested.
9.Tested initially and after any design or process changes that may affect these parameters.
Elite Semiconductor Memory Technology Inc.
Unit
pF
pF
Publication Date: Jul. 2008
Revision: 1.4
4/14
ESMT
M24L416256SA
AC Test Loads and Waveforms
Parameters
R1
R2
RTH
VTH
Unit
Ω
Ω
Ω
V
3.0V VCC
22000
22000
11000
1.50
Switching Characteristics (Over the Operating Range)[10]
Prameter
Description
–55
Min.
–60
Max.
Min.
–70
Max.
Min.
Max.
Unit
Read Cycle
tRC
tAA
tOHA
tACE
Read Cycle Time
Address to Data Valid
Data Hold from Address Change
CE LOW to Data Valid
55
60
70
ns
ns
ns
ns
tDOE
OE LOW to Data Valid
25
25
35
ns
tLZOE
OE LOW to Low Z[11, 13]
tHZOE
OE HIGH to High Z[11, 13]
tLZCE
CE LOW to Low Z[11, 13]
tHZCE
tDBE
tLZBE
CE HIGH to High Z[11, 13]
BLE / BHE LOW to Data Valid
BLE / BHE LOW to Low Z[11, 13]
tHZBE
BLE / BHE HIGH to High-Z[11, 13]
[14]
tSK
Address Skew
Write Cycle[12]
tWC
Write Cycle Time
tSCE
CE LOW to Write End
tAW
Address Set-up to Write End
tHA
Address Hold from Write End
tSA
Address Set-up to Write Start
tPWE
WE Pulse Width
55
60
55
5
8
5
25
5
25
2
25
55
5
70
10
5
2
5
25
70
60
55
0
0
45
ns
ns
25
70
ns
ns
ns
25
10
ns
ns
5
10
5
60
45
45
0
0
40
ns
5
25
60
10
0
55
45
45
0
0
40
70
60
ns
ns
ns
ns
ns
ns
Notes:
10. Test conditions for all parameters other than tri-state parameters assume signal transition time of 1 ns/V, timing reference
levels of VCC(typ)/2, input pulse levels of 0V to V CC(typ.), and output loading of the specified IOL/IOH as shown in the “AC Test
Loads and Waveforms” section.
11. tHZOE, tHZCE, tHZBE, and tHZWE transitions are measured when the outputs enter a high impedance state.
12. The internal Write time of the memory is defined by the overlap of WE , CE = VIL, BHE and/or BLE = VIL. All signals
must be ACTIVE to initiate a write and any of these signals can terminate a write by going INACTIVE. The data input set-up
and hold timing should be referenced to the edge of the signal that terminates the write.
13. High-Z and Low-Z parameters are characterized and are not 100% tested.
14. To achieve 55-ns performance, the read access should be CE controlled. In this case tACE is the critical parameter and tSK is
satisfied when the addresses are stable prior to chip enable going active. For the 70-ns cycle, the addresses must be stable
within 10 ns after the start of the read cycle.
Elite Semiconductor Memory Technology Inc.
Publication Date: Jul. 2008
Revision: 1.4
5/14
ESMT
M24L416256SA
Switching Characteristics (Over the Operating Range)[10] (continued)
Prameter
tBW
tSD
tHD
tHZWE
tLZWE
Description
BLE / BHE LOW to Write End
Data Set-up to Write End
Data Hold from Write End
Min.
Max.
Min.
–70
Max.
Min.
Max.
50
55
ns
25
0
25
0
25
0
ns
ns
25
5
25
5
25
5
Switching Waveforms
Read Cycle 1 (Address Transition Controlled)[14, 15, 16]
Read Cycle 2 ( OE Controlled)[14, 16]
Notes:
15.Device is continuously selected. OE , CE = VIL.
16. WE is HIGH for Read Cycle.
Elite Semiconductor Memory Technology Inc.
Unit
50
WE LOW to High Z[11, 13]
WE HIGH to Low Z[11, 13]
–60
–55
Publication Date: Jul. 2008
Revision: 1.4
6/14
ns
ns
ESMT
M24L416256SA
Switching Waveforms (continued)
Write Cycle 1 ( WE Controlled)[12, 13, 17, 18, 19]
Write Cycle 2 ( CE Controlled)[12, 13, 17, 18, 19]
Notes:
17.Data I/O is high-impedance if OE ≥ VIH.
18.If Chip Enable goes INACTIVE with WE = VIH, the output remains in a high-impedance state.
19.During this period in the DATA I/O waveform, the I/Os could be in the output state and input signals should not be applied.
Elite Semiconductor Memory Technology Inc.
Publication Date: Jul. 2008
Revision: 1.4
7/14
ESMT
M24L416256SA
Switching Waveforms (continued)
Write Cycle 3 ( WE Controlled, OE LOW)[18, 19]
Write Cycle 4 ( BHE / BLE Controlled, OE LOW)[18, 19]
Elite Semiconductor Memory Technology Inc.
Publication Date: Jul. 2008
Revision: 1.4
8/14
ESMT
M24L416256SA
Avoid Timing
ESMT Pseudo SRAM has a timing which is not supported at read operation, If your system has multiple invalid address signal
shorter than tRC during over 15μs at read operation shown as in Abnormal Timing, it requires a normal read timing at leat during
15μs shown as in Avoidable timing 1 or toggle CE to high (≧tRC) one time at least shown as in Avoidable Timing 2.
Abnormal Timing
≧15μ s
CE
WE
＜ tRC
Address
Avoidable Timing 1
≧15μ s
CE
WE
≧ tRC
Address
Avoidable Timing 2
≧15μ s
CE
≧ tRC
WE
＜ tRC
Address
Elite Semiconductor Memory Technology Inc.
Publication Date: Jul. 2008
Revision: 1.4
9/14
ESMT
M24L416256SA
Truth Table[20]
CE1
H
X
L
WE
X
X
H
OE
L
X
X
L
BHE
X
H
L
BLE
X
H
L
H
L
H
L
L
H
L
L
H
L
L
L
L
H
H
H
L
H
H
H
X
L
H
L
L
H
L
L
L
L
L
X
H
L
L
L
X
L
H
Inputs/Outputs
Mode
Power
High Z
High Z
Data Out (I/O0–I/O15)
Data Out (I/O0–I/O7);
High Z I/O8–I/O15
High Z I/O0–I/O7 ;
Data Out (I/O8–I/O15)
High Z
High Z
High Z
Data In (I/O0–I/O15)
Data In (I/O0–I/O7);
High Z I/O8–I/O15
High Z I/O0–I/O7;
Data In (I/O8–I/O15)
Deselect/Power-down
Deselect/Power-down
Read
Standby (ISB)
Standby (ISB)
Active (ICC)
Read
Active (ICC)
Read
Active (ICC)
Output Disabled
Output Disabled
Output Disabled
Write
Active (ICC)
Active (ICC)
Active (ICC)
Active (ICC)
Write
Active (ICC)
Write
Active (ICC)
Ordering Information
Speed (ns)
55
60
70
55
60
70
55
60
70
55
60
70
Ordering Code
M24L416256SA-55BEG
M24L416256SA-60BEG
M24L416256SA-70BEG
M24L416256SA-55TEG
M24L416256SA-60TEG
M24L416256SA-70TEG
M24L416256SA-55BIG
M24L416256SA-60BIG
M24L416256SA-70BIG
M24L416256SA-55TIG
M24L416256SA-60TIG
M24L416256SA-70TIG
Package Type
48-ball Very Fine Pitch BGA (6.0 x 8.0 x 1.0 mm) (Pb-Free)
48-ball Very Fine Pitch BGA (6.0 x 8.0 x 1.0 mm) (Pb-Free)
48-ball Very Fine Pitch BGA (6.0 x 8.0 x 1.0 mm) (Pb-Free)
44-pin TSOPII (Pb-Free)
44-pin TSOPII (Pb-Free)
44-pin TSOPII (Pb-Free)
48-ball Very Fine Pitch BGA (6.0 x 8.0 x 1.0 mm) (Pb-Free)
48-ball Very Fine Pitch BGA (6.0 x 8.0 x 1.0 mm) (Pb-Free)
48-ball Very Fine Pitch BGA (6.0 x 8.0 x 1.0 mm) (Pb-Free)
44-pin TSOPII (Pb-Free)
44-pin TSOPII (Pb-Free)
44-pin TSOPII (Pb-Free)
Operating Range
Extended
Extended
Extended
Extended
Extended
Extended
Industrial
Industrial
Industrial
Industrial
Industrial
Industrial
Note :
20. H = Logic HIGH, L = Logic LOW, X = Don’t Care.
Elite Semiconductor Memory Technology Inc.
Publication Date: Jul. 2008
Revision: 1.4
10/14
ESMT
M24L416256SA
Package Diagram
48-ball VFBGA (6 x 8 x 1 mm)
Elite Semiconductor Memory Technology Inc.
Publication Date: Jul. 2008
Revision: 1.4
11/14
ESMT
44-LEAD
M24L416256SA
TSOP(II)
PSRAM(400mil)
Symbol Dimension in mm
Min
Norm
A
Dimension in inch
Max
Min
Norm
1.20
Max
0.047
A1
0.05
0.15
0.002
A2
B
0.95
0.30
1.00
1.05
0.45
0.037
0.012
0.039
0.042
0.018
B1
0.30
0.35
0.40
0.012
0.014
0.016
C
C1
0.12
0.10
0.21
0.16
0.005
0.004
D
18.28
18.54
0.720
ZD
E
E1
11.56
10.03
L
0.40
L1
REF
11.76
10.16
11.96
10.29
0.455
0.395
0.59
0.69
0.016
0.725
0.730
0.463
0.400
0.471
0.4
0.023
0.027
0.031
0.80 BSC
0°
0.008
0.006
0.0317 REF
0.80 REF
e
θ
18.41
0.805
0.006
REF
0.0315 BSC
8°
Elite Semiconductor Memory Technology Inc.
0°
8°
Publication Date: Jul. 2008
Revision: 1.4
12/14
ESMT
M24L416256SA
Revision History
Revision
Date
1.0
2007.07.04
1.1
2007.09.10
Modify Vcc (max) =3.3V to 3.6V
1.2
2008.02.27
1. Add 44-pin TSOPII package
2. Add Avoid timing
1.3
2008.03.24
Add I-grade for TSOPII package
1.4
2008.07.04
1. Move Revision History to the last
2. Add Industrial grade for BGA package
Elite Semiconductor Memory Technology Inc.
Description
Original
Publication Date: Jul. 2008
Revision: 1.4
13/14
ESMT
M24L416256SA
Important Notice
All rights reserved.
No part of this document may be reproduced or duplicated in any form or by any means without
the prior permission of ESMT.
The contents contained in this document are believed to be accurate at the time of publication.
ESMT assumes no responsibility for any error in this document, and reserves the right to change
the products or specification in this document without notice.
The information contained herein is presented only as a guide or examples for the application of
our products. No responsibility is assumed by ESMT for any infringement of patents, copyrights,
or other intellectual property rights of third parties which may result from its use. No license, either
express , implied or otherwise, is granted under any patents, copyrights or other intellectual
property rights of ESMT or others.
Any semiconductor devices may have inherently a certain rate of failure. To minimize risks
associated with customer's application, adequate design and operating safeguards against injury,
damage, or loss from such failure, should be provided by the customer when making application
designs.
ESMT's products are not authorized for use in critical applications such as, but not limited to, life
support devices or system, where failure or abnormal operation may directly affect human lives or
cause physical injury or property damage. If products described here are to be used for such
kinds of application, purchaser must do its own quality assurance testing appropriate to such
applications.
Elite Semiconductor Memory Technology Inc.
Publication Date: Jul. 2008
Revision: 1.4
14/14