Freescale Semiconductor Technical Data Document Number: MPXV7002 Rev 0, 09/2005 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPXV7002 SERIES INTEGRATED PRESSURE SENSOR -2 to 2 kPa (-0.3 to 0.3 psi) 0.5 to 4.5 V OUTPUT The MPXV7002 series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. SMALL OUTLINE PACKAGE Features • • • • • • • 2.5% Typical Error over +10°C to +60°C with Auto Zero 6.25% Maximum Error over +10°C to +60°C without Auto Zero Ideally Suited for Microprocessor or Microcontroller-Based Systems Thermoplastic (PPS) Surface Mount Package Temperature Compensated over +10° to +60°C Patented Silicon Shear Stress Strain Gauge Available in Differential and Gauge Configurations MPXV7002GC6U CASE 482A-01 Typical Applications • • • • MPXV7002GP CASE 1369-01 Hospital Beds HVAC Respiratory Systems Process Control SMALL OUTLINE PACKAGE PIN NUMBERS(1) ORDERING INFORMATION Device Type MPXV7002DP CASE 1351-01 Options Case No. MPX Series Order No. Packing Options Device Marking SMALL OUTLINE PACKAGE (MPXV7002 SERIES) Ported Gauge, Axial Port, SMT Elements Gauge, Axial Port, SMT 482A MPXV7002GC6U 482A MPXV7002GC6T1 Tape & MPXV7002G Reel Rails MPXV7002G Gauge, Side Port, SMT 1369 MPXV7002GP Trays MPXV7002G Differential, Dual Port, SMT 1351 MPXV7002DP Trays MPXV7002G Differential, Dual Port, SMT 1351 MPXV7002DPT1 1 N/C 5 N/C 2 VS 6 N/C 3 Gnd 7 N/C 4 Vout 8 N/C 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. Tape & MPXV7002G Reel VS Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND Gain Stage #2 and Ground Reference Shift Circuitry Pins 1 and 5 through 8 are NO CONNECTS for surface mount package © Freescale Semiconductor, Inc., 2005. All rights reserved. Vout Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 8.0 kPa Storage Temperature Tstg –30 to +100 °C Operating Temperature TA 10 to +60 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted. Decoupling circuit shown in Figure 3 required to meet specification.) Characteristic Pressure Range(1) Supply Voltage (2) Supply Current Symbol Min Typ Max Unit POP –2.0 — 2.0 kPa VS 4.75 5.0 5.25 Vdc Io — — 10 mAdc Pressure Offset(3) @ VS = 5.0 Volts (10 to 60°C) Voff 2.25 2.5 2.75 Vdc Full Scale Output(4) @ VS = 5.0 Volts (10 to 60°C) VFSO 4.25 4.5 4.75 Vdc Full Scale Span(5) @ VS = 5.0 Volts (10 to 60°C) VFSS 3.5 4.0 4.5 V Vdc Accuracy(6) (10 to 60°C) — — ±2.5(7) ±6.25 %VFSS V/P — 1.0 —- V/kPa tR — 1.0 —- ms Output Source Current at Full Scale Output IO+ — 0.1 —- mAdc Warm-Up Time(9) — — 20 —- ms Sensitivity Response Time(8) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation over the temperature range of 10° to 60°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10° to 60°C, relative to 25°C. • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 7. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV7002 Series, external mechanical stresses and mounting position can affect the zero pressure output reading. Autozero is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of ± 5°C between autozero and measurement. 8. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 9. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. MPXV7002 2 Sensors Freescale Semiconductor ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482). A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPXV7002 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor Fluoro Silicone Gel Die Coat performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 3 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 10° to 60°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range. Stainless Steel Cap Die +5 V P1 Thermoplastic Case Wire Bond Vout OUTPUT Vs Lead Frame IPS 1.0 µF P2 GND 470 pF Die Bond Differential Sensing Element Figure 2. Cross-Sectional Diagram SOP (not to scale) 5.0 Figure 3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.) Transfer Function: Vout = VS × (0.2 × P(kPa)+0.5) ± 6.25% VFSS VS = 5.0 Vdc TA = 10 to 60°C 4.0 Output Voltage (V) 0.01 µF 3.0 TYPICAL MAX 2.0 MIN 1.0 0 -2 -1 0 1 2 Differential Pressure (kPa) Figure 4. Output versus Pressure Differential MPXV7002 Sensors Freescale Semiconductor 3 PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing a gel die coat which protects the die from harsh media. Part Number The Pressure (P1) side may be identified by using the table below: Pressure (P1) Side Identifier Case Type MPXV7002GC6U/GC6T1 482A-01 Vertical Port Attached MPXV7002GP 1369-01 Side with Port Attached MPXV7002DP 1351-01 Side with Dual Port Attached MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.100 TYP 8X 2.54 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm SCALE 2:1 Figure 5. Small Outline Package Footprint MPXV7002 4 Sensors Freescale Semiconductor PACKAGE DIMENSIONS -A- D 4 0.25 (0.010) 5 N 8 PL M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S W V C H J -TK M PIN 1 IDENTIFIER DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 SEATING PLANE CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MPXV7002 Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPXV7002 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPXV7002 Sensors Freescale Semiconductor 7 PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPXV7002 8 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPXV7002 Sensors Freescale Semiconductor 9 How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 [email protected] Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) [email protected] Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 [email protected] Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 [email protected] For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. 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