TI TPS62052DGSR

TPS62052, TPS62054
TPS62056, TPS62050, TPS62051
www.ti.com
SLVS432E – SEPTEMBER 2002 – REVISED JUNE 2011
800-mA SYNCHRONOUS STEP-DOWN CONVERTER
Check for Samples: TPS62052, TPS62054, TPS62056, TPS62050, TPS62051
FEATURES
DESCRIPTION
•
The TPS6205x devices are a family of high-efficiency
synchronous step-down dc/dc converters ideally
suited for systems powered from a 1-cell or 2-cell LiIon battery or from a 3-cell to 5-cell NiCd, NiMH, or
alkaline battery.
1
2
•
•
•
•
•
•
•
•
•
•
•
High-Efficiency Synchronous Step-Down
Converter With up to 95% Efficiency
12-µA Quiescent Current (Typ)
2.7-V to 10-V Operating Input Voltage Range
Adjustable Output Voltage Range From 0.7 V
to 6 V
Fixed Output Voltage Options Available in
1.5 V, 1.8 V, and 3.3 V
Synchronizable to External Clock Signal up to
1.2 MHz
High Efficiency Over a Wide Load Current
Range in Power-Save Mode
100% Maximum Duty Cycle for Lowest
Dropout
Low Noise Operation in Forced Fixed
Frequency PWM Operation Mode
Internal Softstart
Overtemperature and Overcurrent Protected
Available in 10-Pin Microsmall Outline
Package MSOP
The TPS62050 is a synchronous PWM converter with
integrated N-channel and P-channel power MOSFET
switches.
Synchronous
rectification
increases
efficiency and reduces external component count. To
achieve highest efficiency over a wide load current
range, the converter enters a power-saving pulsefrequency modulation (PFM) mode at light load
currents. Operating frequency is typically 850 kHz,
allowing the use of small inductor and capacitor
values. The device can be synchronized to an
external clock signal in the range of 600 kHz to 1.2
MHz. For low noise operation, the converter can be
programmed into forced-fixed frequency in PWM
mode. In shutdown mode, the current consumption is
reduced to less than 2 µA. The TPS6205x is
available in the 10-pin (DGS) micro-small outline
package (MSOP) and operates over an free air
temperature range of –40°C to 85°C.
APPLICATIONS
•
•
•
•
Cellular Phones
Organizers, PDAs, and Handheld PCs
Low Power DSP Supply
Digital Cameras and Hard Disks
TYPICAL APPLICATION CIRCUIT
VI = 3.3 V to 10 V
1
8
VIN
SW
EN
FB
TPS62050
9
L1 = 10 µH
EFFICIENCY
vs
OUTPUT CURRENT
VO = 1.5 V / 800 mA
100
90
5
80
TPS62052
6
70
PG
LBI
7
3
Co = 22 µF
2
SYNC
GND
4
LBO
PGND
10
Efficiency – %
Ci = 10 µF
60
50
40
30
20
10
0
0.01
VI = 7.2 V,
VO = 5 V,
SYNC = L
0.1
1
10
100
1k
IO – Output Current – mA
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MATHCAD is a registered trademark of Mathsoft Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2011, Texas Instruments Incorporated
TPS62052, TPS62054
TPS62056, TPS62050, TPS62051
SLVS432E – SEPTEMBER 2002 – REVISED JUNE 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Package/Ordering Information
PACKAGED DEVICES
OUTPUT VOLTAGE
LBI/LBO FUNCTIONALITY
PACKAGE MARKING
TPS62050DGS
Adjustable 0.7 V to 6 V
Standard
BFM
TPS62051DGS
Adjustable 0.7 V to 6 V
Enhanced
BGB
TPS62052DGS
1.5 V
Standard
BGC
TPS62054DGS
1.8 V
Standard
BGE
TPS62056DGS
3.3 V
Standard
BGG
PLASTIC MSOP (1) (DGS)
(1)
The DGS packages are available taped and reeled. Add an R suffix to the device type (i.e., TPS62050DGSR) to order quantities of 2500
devices per reel.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted (1)
TPS6205x
Supply voltage, VI
–0.3 V to 11 V
Voltage at EN, SYNC
–0.3 V to VI
Voltage at LBI, FB, LBO, PG
–0.3 V to 7 V
–0.3 V to 11 V (2)
Voltage at SW
Output current, IO
850 mA
Maximum junction temperature, TJ
150°C
Operating free-air temperature range, TA
–40°C to 85°C
Storage temperature range, Tstg
–65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
(1)
(2)
300°C
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
The voltage at the SW pin is sampled in PFM mode 15 µs after the PMOS has switched off. During this time the voltage at SW is limited
to 7 V maximum. Therefore, the output voltage of the converter is limited to 7 V maximum.
PACKAGE DISSIPATION RATING
(1)
PACKAGE
TA ≤ 25°C
POWER RATING
DERATING FACTOR
TA ≤ 25°C
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
10-PIN MSOP (1)
555 mW
5.56 mW/°C
305 mW
221 mW
The thermal resistance junction to ambient soldered onto a PCB of the 10-pin MSOP is 180°C/W.
RECOMMENDED OPERATING CONDITIONS
MIN
Supply voltage at VI
2.7
Voltage at PG, LBO
Operating junction temperature
2
MAX
10
6
Maximum output current
(1)
NOM
-40
UNIT
V
V
800 (1)
mA
125
°C
Assuming no thermal limitation
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SLVS432E – SEPTEMBER 2002 – REVISED JUNE 2011
ELECTRICAL CHARACTERISTICS
VI = 7.2 V, VO = 3.3 V, IO = 300 mA, EN = VI, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY CURRENT
VI
Input voltage range
I(Q)
Operating quiescent current
I(SD)
Shutdown current
IQ(LBI)
Quiescent current with enhanced LBI comparator
version.
10
V
IO = 0 mA, SYNC = GND, VI = 7.2 V
2.7
12
20
µA
EN = GND
1.5
5
EN = GND, TA=25°C
1.5
3
EN = VI, LBI=GND, TPS62051 only
5
µA
µA
ENABLE
VIH
EN high level input voltage
VIL
EN low level input voltage
1.3
V
0.3
EN trip point hysteresis
100
Ilkg
EN input leakage current
EN = GND or VIN, VI = 7.2 V
I(EN)
EN input current
0.6 V ≤ V(EN)≤ 4 V
V(UVLO)
Undervoltage lockout threshold
0.01
V
mV
0.2
µA
2
µA
1.6
V
POWER SWITCH
rDS(on)
rDS(on)
P-channel MOSFET on-resistance
VI ≥ 5.4 V; IO = 300 mA
400
650
VI = 2.7 V; IO = 300 mA
600
850
1
µA
1200
1400
mA
VI ≥ 5.4 V; IO = 300 mA
300
450
VI = 2.7 V; IO = 300 mA
450
550
P-channel MOSFET leakage current
VDS = 10 V
P-channel MOSFET current limit
VI = 7.2V, VO = 3.3 V
N-channel MOSFET on-resistance
N-channel MOSFET leakage current
1000
VDS = 6 V
1
mΩ
mΩ
µA
POWER GOOD OUTPUT, LBI, LBO
V(PG)
Power good trip voltage
Vml -2%
Power good delay time
VOL
VO ramping positive
50
VO ramping negative
200
PG, LBO output low voltage
V(FB) = 0.8 x VO nominal, I(sink) = 1 mA
PG, LBO output leakage current
V(FB) = VO nominal, V(LBI) = VI
0.01
Minimum supply voltage for valid power good, LBO
signal
V(LBI)
Low battery input trip voltage
µs
0.3
V
0.25
µA
2.3
Input voltage falling
V
1.21
Low battery input trip point accuracy
V(LBI,HY
V
V
1.5%
Low battery input hysteresis
15
mV
S)
Ilkg(LBI)
LBI leakage current
0.01
0.1
µA
850
1000
kHz
1200
kHz
OSCILLATOR
fS
Oscillator frequency
600
f(SYNC)
Synchronization range
600
VIH
SYNC high level input voltage
1.5
VIL
SYNC low level input voltage
Ilkg
SYNC input leakage current
SYNC = GND or VIN
0.01
SYNC trip point hysteresis
Duty cycle of external clock signal
Copyright © 2002–2011, Texas Instruments Incorporated
V
0.3
V
0.1
µA
100
20%
mV
90%
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SLVS432E – SEPTEMBER 2002 – REVISED JUNE 2011
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ELECTRICAL CHARACTERISTICS (continued)
VI = 7.2 V, VO = 3.3 V, IO = 300 mA, EN = VI, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
OUTPUT
VO
Adjustable output voltage
range
TPS62050, TPS62051
V(FB)
Feedback voltage
TPS62050, TPS62051
0.5
FB leakage current
TPS62050, TPS62051
0.02
Feedback voltage tolerance
TPS62050, TPS62051
VI = 2.7 V to 10 V, 0 mA< IO< 600 mA
-3%
3%
TPS62052
VI = 2.7 V to 10 V, 0 mA< IO< 600 mA
-3%
3%
TPS62054
VI = 2.7 V to 10 V, 0 mA< IO< 600 mA
-3%
3%
TPS62056
VI = 3.75 V to 10 V, 0 mA< IO< 600 mA
-3%
3%
Fixed output voltage
tolerance (1)
0.7
Resistance of internal voltage divider for fixed-voltage
versions
η
700
Line regulation
VO = 3.3 V, VI = 5 V to 10 V, IO = 600 mA
Load regulation
Efficiency
1000
0.1
µA
V
1300
kΩ
mV/V
VI = 7.2 V; IO = 10 mA to 600 mA
0.0045
%/mA
VI = 5 V; VO = 3.3 V; IO = 300 mA
93%
VI = 3.6 V; VO = 2.5 V; IO = 200 mA
93%
100%
Minimum ton time for main switch
100
ns
Shutdown temperature
145
°C
1
ms
IO = 200 mA, VI = 5 V, Vo = 3.3 V,
Co = 22 µF, L = 10 µH
Start-up time
4
V
5.2
Duty cycle range for main switches
(1)
6.0
The worst case rDS(on) of the PMOS in 100% mode for an input voltage of 3.3 V is 0.75 Ω. This value can be used to determine the
minimum input voltage if the output current is less than 600 mA with the TPS62056.
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SLVS432E – SEPTEMBER 2002 – REVISED JUNE 2011
PIN ASSIGNMENTS
DGS PACKAGE
(TOP VIEW)
VIN
LBO
GND
PG
FB
1
10
2
9
3
8
4
7
5
6
PGND
SW
EN
SYNC
LBI
Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
EN
8
I
Enable. A logic high enables the converter, logic low forces the device into shutdown mode, reducing the supply
current to less than 2 µA.
FB
5
I
Feedback pin for the fixed output voltage option. For the adjustable version, an external resistive divider is
connected to this pin. The internal voltage divider is disabled for the adjustable version.
GND
3
I
Ground
LBO
2
O
Open drain low battery output. Logic low signal indicates a low battery voltage.
LBI
6
I
Low battery input
PG
4
O
Power good comparator output. This is an open-drain output. A pullup resistor should be connected between PG
and VOUT. The output floats when the output voltage is greater than 95% of the nominal value.
PGND
10
I
Power ground. Connect all power grounds to this pin.
SW
9
O
Connect the inductor to this pin. This pin is the switch pin and connected to the drain of the internal power
MOSFETS.
SYNC
7
I
Input for synchronization to the external clock signal. This input can be connected to an external clock or pulled to
GND or VI. When an external clock signal is applied, the device synchronizes to this external clock and the device
operates in fixed PWM mode. When the pin is pulled to either GND or VI, the internal oscillator is used and the
logic level determines if the device operates in fixed PWM or PWM/PFM mode.SYNC = HIGH: Low-noise mode
enabled, fixed frequency PWM operation is forcedSYNC = LOW (GND): Power-save mode enabled, PFM/PWM
mode enabled.
VIN
1
I
Supply voltage input
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SLVS432E – SEPTEMBER 2002 – REVISED JUNE 2011
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FUNCTIONAL BLOCK DIAGRAM
VI
Current Limit Comparator
+
Undervoltage
Lockout
Bias Supply
–
REF
SYNC
+
Soft Start
I(AVG) Comparator
REF
–
V
I
850 kHz
Oscillator
V(COMP)
P-Channel
Power MOSFET
Comparator
+
Saw Tooth
Generator
S
R
–
Driver
Shoot-Through
Logic
Control
Logic
Comparator High
Comparator Low
Comparator High2
SW
N-Channel
Power MOSFET
Load Comparator
+
SKIP Comparator
PG
–
Error Amp
Comparator High
+
LBO
Compensation
Comparator Low
Comparator Low2
–
VREF = 0.5 V
–
R1
+
_
R2
See Note
+
1.21 V
EN
FB
LBI
PGND
GND
NOTE: For the adjustable versions (TPS62050, TPS62051), the internal feedback driver is disabled and the FB pin is
directly connected to the GM amplifier.
6
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SLVS432E – SEPTEMBER 2002 – REVISED JUNE 2011
PARAMETER MEASUREMENT INFORMATION
All graphs were generated using the circuit as shown unless otherwise noted. For output voltages other than 5 V,
the fixed voltage versions are used. The resistors R1, R2, and the feedforward capacitor (Cff) are removed and
the feedback pin is directly connected to the output.
WE PD 744 777 10
VI
1
R5
130 kΩ
Ci = 10 µF
TDK
C3216X5R1A106M
VIN
SW
EN
FB
5
8
TPS62050
6
R6
100 kΩ
9 L1 = 10 µH
4
LBI
PG
7
R3
1M
VO = 5 V
R4
1M
C(ff) = 6.8 pF
R1 =
820 kΩ
Co = 22 µF
2
SYNC
GND
3
LBO
R2 = 91 kΩ
Taiyo Yuden
JMK316BJ226ML
PGND
10
Quiescent Current Measurements and Efficiency Were Taken
With: R5 = Open, R4 = Open, LBI Connected to GND.
Figure 1. Standard Circuit for Adjustable Version
Copyright © 2002–2011, Texas Instruments Incorporated
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SLVS432E – SEPTEMBER 2002 – REVISED JUNE 2011
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TYPICAL CHARACTERISTICS
Table 1. TABLE OF GRAPHS
FIGURE
1-8
9
10
11
12
13
14
15
Efficiency vs load current
Switching frequency vs temperature
Output voltage ripple in SKIP mode
Output voltage ripple in PWM mode
Line transient response in PWM mode
Load transient
V(switch) and IL (inductor current) in skip mode
Start-up timing
TPS62050
EFFICIENCY
vs
LOAD CURRENT
TPS62052
EFFICIENCY
vs
LOAD CURRENT
100
90
VI = 6.5 V
Efficiency − %
40
VI = 10 V
30
SYNC = L
VO = 5 V
TA = 25°C
10
0.1
1
60
40
VI = 7.2 V
10
100
SYNC = L
VO = 1.5 V
TA = 25°C
VI = 10 V
10
0
0.01
1k
VI = 10 V
0.1
1
10
100
SYNC = L
VO = 1.8 V
TA = 25°C
10
0
0.01
1k
0.1
1
10
100
Figure 4.
TPS62056
EFFICIENCY
vs
LOAD CURRENT
TPS62050
EFFICIENCY
vs
LOAD CURRENT
TPS62052
EFFICIENCY
vs
LOAD CURRENT
100
VI = 5.5 V
90
70
Efficiency − %
70
VI = 7.2 V
50
VI = 10 V
30
70
VI = 7.2 V
VI = 8.4 V
VI = 10 V
40
SYNC = L
VO = 3.3 V
TA = 25°C
10
1
10
100
IL − Load Current − mA
Figure 5.
SYNC = H
VO = 5 V
TA = 25°C
20
10
1k
0
0.01
VI = 5 V
60
VI = 7.2 V
50
40
VI = 10 V
30
30
20
VI = 3.3 V
80
60
50
VI = 2.7 V
90
VI = 6.5 V
80
VI = 5 V
0.1
1
10
100
SYNC = H
VO = 1.5 V
TA = 25°C
20
10
1k
0
0.01
0.1
1
10
100
1k
IL − Load Current − mA
IL − Load Current − mA
Figure 6.
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1k
IL − Load Current − mA
Figure 3.
80
0.1
40
20
100
0
0.01
VI = 7.2 V
Figure 2.
VI = 3.5 V
40
VI = 5 V
50
IL − Load Current − mA
100
60
VI = 3.3 V
60
30
20
IL − Load Current − mA
Efficiency − %
VI = 5 V
50
30
20
0
0.01
70
VI = 3.3 V
Efficiency − %
Efficiency − %
VI = 8.4 V
VI = 2.7 V
80
70
60
50
90
80
VI = 7.2 V
70
VI = 2.7 V
Efficiency − %
80
8
100
100
VI = 5.5 V
90
90
TPS62054
EFFICIENCY
vs
LOAD CURRENT
Figure 7.
Copyright © 2002–2011, Texas Instruments Incorporated
Product Folder Links: TPS62052 TPS62054 TPS62056 TPS62050 TPS62051
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TPS62056, TPS62050, TPS62051
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SLVS432E – SEPTEMBER 2002 – REVISED JUNE 2011
TPS62054
EFFICIENCY
vs
LOAD CURRENT
TPS62056
EFFICIENCY
vs
LOAD CURRENT
100
VI = 2.7 V
90
VI = 3.3 V
80
80
VI = 5 V
60
VI = 7.2 V
50
40
VI = 10 V
VI = 7.2 V
60
50
40
VI = 10 V
30
30
SYNC = H
VO = 1.8 V
TA = 25°C
20
10
0.1
1
10
100
10
0
0.01
1k
0.1
1
10
100
3.6 V
880
870
5V
860
850
7.2 V
840
830
820
810
800
1k
−40
−20 0
20
40
60
80
TA − Free-Air Temperature − °C
IL − Load Current − mA
IL − Load Current − mA
Figure 8.
Figure 9.
Figure 10.
OUTPUT VOLTAGE RIPPLE
IN SKIP MODE
OUTPUT VOLTAGE RIPPLE
IN PWM MODE
LINE TRANSIENT RESPONSE
IN PWM MODE
VI = 7.2 V, VO = 3.3 V
VI = 7.2 V
VO = 3.3 V
IO = 800 mA
Output Voltage
VI = 4.5 V to 5.5 V to 4.5 V
IO = 20 mA
Voltage at SW Pin
VO
10 mV/div
2 V/div
2 V/div
10 mV/div
10 mV/div
Output Voltage
Voltage at SW Pin
10 µs/div
1 µs/div
1 µs/div
Figure 11.
Figure 12.
Figure 13.
LOAD TRANSIENT
V(SWITCH) AND IL
(INDUCTOR CURRENT)
IN SKIP MODE
VI = 5 V
VO = 3.3 V
START-UP TIMING
Voltage at SW Pin
5 V/div
EN
5 V/div
50 mV/div
Output Voltage
100
500 mv/div
0
0.01
SYNC = H
VO = 3.3 V
TA = 25°C
20
2.7 V
890
VI = 5 V
70
Efficiency − %
70
900
VI = 3.5 V
90
Switching Frequency − kHz
100
Efficiency − %
SWITCHING FREQUENCY
vs
FREE-AIR TEMPERATURE
VI = 5 V
IO = 100 mA
VO
50 µs/div
5 µs/div
Figure 14.
Figure 15.
Copyright © 2002–2011, Texas Instruments Incorporated
II
VI = 5 V
RL = 2.7 Ω
100 mA/div
100 mA/div
Load Step = 60 mA to 540 mA
500 mA/div
1 V/div
Inductor Current
200 µs/div
Figure 16.
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SLVS432E – SEPTEMBER 2002 – REVISED JUNE 2011
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APPLICATION INFORMATION
Operation
The TPS6205x is a synchronous step-down converter that operates with a 850-kHz fixed frequency pulse width
modulation (PWM) at moderate to heavy load currents and enters the power-save mode at light load current.
During PWM operation the converter uses a unique fast response voltage mode control scheme with input
voltage feed forward to achieve good line and load regulation with the use of small ceramic input and output
capacitors. At the beginning of each clock cycle initiated by the clock signal (S), the P-channel MOSFET switch
is turned on and the inductor current ramps up until the voltage-comparator trips and the control logic turns the
switch off. Also the switch is turned off by the current limit comparator in case the current limit of the P-channel
switch is exceeded. After the dead time preventing current shoot through, the N-channel MOSFET rectifier is
turned on and the inductor current ramps down. The next cycle is initiated by the clock signal again, turning off
the N-channel rectifier and turning on the P-channel switch.
The error amplifier as well as the input voltage determines the rise time of the saw tooth generator; therefore,
any change in input voltage or output voltage directly controls the duty cycle of the converter giving a very good
line and load transient regulation.
Constant Frequency Mode Operation (SYNC = HIGH)
In the constant frequency mode, the output voltage is regulated by varying the duty cycle of the PWM signal in
the range of 100% to 10%. Connecting the SYNC pin to a voltage greater than 1.5 V forces the converter to
operate permanently in the PWM mode even at light or no load currents. The advantage is the converter
operates with a fixed switching frequency that allows simple filtering of the switching frequency for noise sensitive
applications. In this mode, the efficiency is lower compared to the power-save mode during light loads (see
Figure 17). The N-MOSFET of the devices stays on even when the current into the output drops to zero. This
prevents the device from going into discontinuous mode. The device transfers unused energy back to the input.
Therefore, there is no ringing at the output that usually occurs in the discontinuous mode. The duty cycle range
in constant frequency mode is 100% to 10%.
It is possible to switch from forced PWM mode to the power-save mode during operation by pulling the SYNC pin
low. The flexible configuration of the SYNC pin during operation of the device allows efficient power management
by adjusting the operation of the TPS6205x to the specific system requirements.
Power-Save Mode Operation (SYNC = LOW)
As the load current decreases, the converter enters the power-save mode operation. During power-save mode
the converter operates with reduced switching frequency in PFM and with a minimum quiescent current to
maintain high efficiency. Whenever the average output current goes below the skip threshold, the converter
enters the power-save mode. The average current depends on the input voltage. It is 100 mA at low input
voltages and up to 200 mA with maximum input voltage. The average output current must be below the threshold
for at least 32 clock cycles (tcy) to enter the power-save mode. During the power-save mode the output voltage is
monitored with a comparator. When the output voltage falls below the comp low threshold set to 0.8% above VO
nominal, the P-channel switch turns on. The P-channel switch turns off as the peak switch current of typically 200
mA is reached. The N-channel rectifier turns on and the inductor current ramps down. As the inductor current
approaches zero, the N-channel rectifier is turned off and the switch is turned on starting the next pulse. When
the output voltage can not be reached with a single pulse, the device continues to switch with its normal
operating frequency, until the comparator detects the output voltage to be 1.6% above the nominal output
voltage. The converter wakes up again when the output voltage falls below the comp low threshold. This control
method reduces the quiescent current to typically to 12 µA and the switching frequency to a minimum achieving
the highest converter efficiency. Having these skip current thresholds 0.8% and 1.6% above the nominal output
voltage gives a lower absolute voltage drop during a load transient as anticipated with a standard converter
operating in this mode.
Feedforward Capacitor
The feedforward capacitor, C(ff) shown in Figure 21, improves the performance in SKIP mode. The comparator is
faster, therefore, there is less voltage ripple at the output in SKIP mode. Use the values listed in Table 2. Larger
values decrease stability in fixed frequency PWM mode. If the TPS6205x is only operated in fixed frequency
PWM mode, the feedforward capacitor is not needed.
10
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1.6%
0.8%
VO, nominal
–1.6%
t
Figure 17. Power-Save Mode Output Voltage Thresholds
The converter enters the fixed frequency PWM mode again as soon as the output voltage falls below the comp
low 2 threshold set to 1.6% below VO, nominal.
Soft-Start
The TPS6205x has an internal soft-start circuit that limits the inrush current during start-up. This prevents
possible voltage drops of the input voltage if a battery or a high impedance power source is connected to the
input of the TPS6205x.
The soft-start is implemented as a digital circuit increasing the switch current in steps of 200 mA, 400 mA, 800
mA and then the typical switch current limit of 1.2 A. Therefore the start-up time mainly depends on the output
capacitor and load current. Typical start-up time with a 22-µF output capacitor and a 200-mA load current is 1
ms.
100% Duty Cycle Low Dropout Operation
The TPS6205x offers the lowest possible input to output voltage difference while still maintaining operation with
the use of the 100% duty cycle mode. In this mode, the P-channel switch is constantly turned on. This is
particularly useful in battery powered applications to achieve longest operation time by taking full advantage of
the whole battery voltage range, i.e. The minimum input voltage to maintain regulation depends on the load
current and output voltage and can be calculated as:
V I(min) + V (max) ) I (max)
O
O
ǒrDS(on)(max) ) RLǓ
IO(max) = Maximum output current plus inductor ripple current
rDS(on)(max) = Maximum P-Channel switch rDS(on)
RL = DC resistance of the inductor
VO(max) = Nominal output voltage plus maximum output voltage tolerance
Enable and Overtemperature Protection
Logic low on EN forces the TPS6205x into shutdown. In shutdown, the power switch, drivers, voltage reference,
oscillator, and all other functions are turned off. The supply current is reduced to less than 2 µA in the shutdown
mode. When the device is in thermal shutdown, the bandgap is forced to stay on even if the device is set into
shutdown by pulling EN to GND. As soon as the temperature drops below the threshold, the device automatically
starts again.
If an output voltage is present when the device is disabled, which could be an external voltage source or super
cap, the reverse leakage current is specified under electrical characteristics. Pulling the enable pin high starts up
the TPS6205x with the soft-start as described under the paragraph soft-start. If the EN pin is connected to any
voltage other than VI or GND, an increased leakage current of typically 10 µA and up to 20 µA can occur.
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VIN
VIN
0 µA for VEN < 0.6 V
Typically 0.3 µA to 5 µAfor VEN < 4 V
5V
Vt = 0.7 V
EN
Enable to Internal Circuitry
Figure 18. Internal Circuit of the ENABLE Pin
The EN pin can be used in a pushbutton configuration as shown in Figure 19. The external resistor to GND must
be capable of sinking 0.3 µA with a minimum voltage drop of 1.3 V to keep the system enabled when both
switches are open. When the ON-button is pressed, the device is enabled and the current through the external
resistor keeps the voltage level high to ensure that the device stays on when the ON-button is released. When
the OFF-button is pressed, the device is switched off and the current through the external resistor is zero. The
device therefore stays off even when the OFF-button is released.
VIN
TPS6205x
ON
EN
OFF
0.3 µA, min
R >1.3 V/0.3 µA
Figure 19. Pushbutton Configuration for the EN-Pin
Undervoltage Lockout
The undervoltage lockout circuit prevents the device from misoperation at low input voltages. It prevents the
converter from turning on the switch or rectifier MOSFET under undefined conditions.
Synchronization
If no clock signal is applied, the converter operates with a typical switching frequency of 850 kHz. It is possible to
synchronize the converter to an external clock within a frequency range from 600 kHz to 1200 kHz. The device
automatically detects the rising edge of the first clock and synchronizes to the external clock. If the clock signal is
stopped, the converter automatically switches back to the internal clock and continues operation. The switchover
is initiated if no rising edge on the SYNC pin is detected for a duration of four clock cycles. Therefore, the
maximum delay time can be 8.3 µs if the internal clock has its minimum frequency of 600 kHz. During this time,
there is no clock signal available. The device stops switching until the internal circuitry is switched to the internal
clock source.
When the device is switched between internal synchronization and external synchronization during operation, the
output voltage may show transient over/undershoot during switchover. The voltage transients are minimized by
using 850 kHz as an initial external frequency, and changing the frequency slowly (>1 ms) to the value desired.
The voltage drop at the output when the device is switched from external synchronization to internal
synchronization can be reduced by increasing the output capacitor value.
If the device is synchronized to an external clock, the power-save mode is disabled and the device stays in
forced PWM mode.
12
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SLVS432E – SEPTEMBER 2002 – REVISED JUNE 2011
Connecting the SYNC pin to the GND pin enables the power-save mode. The converter operates in the PWM
mode at moderate to heavy loads and in the PFM mode during light loads maintaining high efficiency over a wide
load current range.
Power Good Comparator
The power good (PG) comparator has an open drain output capable of sinking typically 1 mA. The PG function is
only active when the device is enabled (EN = high). When the device is disabled (EN = low), the PG pin is pulled
to GND.
The PG output is only valid after a 250 µs delay after the device is enabled and the supply voltage is greater
than 2.7 V. Power good is low during the first 250 µs after shutdown and in shutdown.
The PG pin floats high when the output voltage exceeds typically 98.5% of its nominal value. Leave the PG pin
unconnected, or connect to GND when not used.
Low-Battery Detector (Standard Version)
The low-battery output (LBO) is an open drain type which goes low when the voltage at the low battery input
(LBI) falls below the trip point of 1.21 V ±1.5%. The voltage at which the low-battery warning is issued is adjusted
with a resistive divider as shown in Figure 21. The sum of the resistors R1 and R2 is recommended to be in the
100-kΩ to 1-MΩ range for high efficiency at low output current. An external pullup resistor at LBO can either be
connected to OUT, or any other voltage rail in the voltage range of 0 V to 6 V. During start-up, the LBO output
signal is invalid for the first 500 µs. LBO is high impedance when the device is disabled. If the low-battery
comparator function is not used, connect LBI to ground. The low-battery detector is disabled when the device is
disabled. Leave the LBO pin unconnected, or connect to GND when not used.
ENABLE/Low-Battery Detector (Enhanced Version) TPS62051 Only
The TPS62051 offers an enhanced LBI functionality to provide a precise, user programmable undervoltage
shutdown. No additional supply voltage supervisor (SVS) is needed to provide this function.
When the enable (EN) pin is pulled high, only the internal bandgap voltage reference is switched on to provide a
reference source for the LBI comparator. As long as the voltage at LBI is less than the LBI trip point, all other
internal circuits are shut down, reducing the supply current to 5 µA. As soon as input voltage at LBI rises above
the LBI trip point of 1.21 V, the device is completely enabled and starts switching.
VIN
ENABLE
Bandgap
Enable to Internal Circuitry
LBI
LBI
Comparator
LBO
Figure 20. Block Diagram of ENABLE/LBI Functionality for TPS62051
The logic level of the LBO pin is not defined for the first 500 µs after EN is pulled high.
When the enhanced LBI is used to supervise the battery voltage and shut down the TPS62051 at low input
voltages, the battery voltage rises again when the current drops to zero. The implemented hysteresis on the LBI
pin may not be sufficient for all types of batteries. Figure 21 shows how an additional external hysteresis can be
implemented.
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1
8
VIN
SW
EN
FB
L1 = 10 µH
VO = 2.5 V / 600 mA
5
R3
R4
R1
C(ff) =
6.8 pF
TPS62051
R5
6
Ci = 10 µF
1 Cell Li-lon
9
PG 4
LBI
7
SYNC
R6
GND
3
LBO
R2
2
Co = 22 µF
PGND
10
R7
Figure 21. Enhanced LBI With Increased Hysteresis
A MATHCAD® file to calculate R7 can be downloaded from the product folder on the TI web.
No Load Operation
If the converter operates in the forced PWM mode and there is no load connected to the output, the converter
regulates the output voltage by allowing the inductor current to reverse for a short period of time.
STANDARD CIRCUIT FOR ADJUSTABLE VERSION
WE PD 744 777 10
VI
1
R5
130 kΩ
Ci = 10 µF
VIN
SW
EN
FB
5
8
R6
100 kΩ
R3
1M
VO = 5 V
R4
1M
C(ff) = 6.8 pF
TPS62050
6
TDK
C3216X5R1A106M
9 L1 = 10 µH
R1 =
820 kΩ
4
LBI
PG
7
Co = 22 µF
2
SYNC
GND
3
LBO
Taiyo Yuden
JMK316BJ226ML
R2 = 91 kΩ
PGND
10
Quiescent Current Measurements and Efficiency Were Taken
With: R5 = Open, R4 = Open, LBI Connected to GND.
V
14
O
+V
FB
R1 ) R2
R2
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ǒ Ǔ
V
R1 + R2
O –R2
V FB
V
FB
+ 0.5V
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SLVS432E – SEPTEMBER 2002 – REVISED JUNE 2011
Table 2. Values
NOMINAL OUTPUT VOLTAGE
EQUATION
POSSIBLE RESISTOR COMBINATION TYPICAL FEEDBACK CAPACITOR
0.7 V
R1 = 0.4 x R2
R1 = 270 k, R2 = 680 k
C(ff) = 22 pF
1.2 V
R1 = 1.4 x R2
R1 = 510 k, R2 = 360 k (1.21 V)
C(ff) = 6.8 pF
1.5 V
R1 = 2 x R2
R1 = 300 k, R2 = 150 k (1.50 V)
C(ff) = 6.8 pF
1.8 V
R1 = 2.6 x R2
R1 = 390 k, R2 = 150 k (1.80 V)
C(ff) = 6.8 pF
2.5 V
R1 = 4 x R2
R1 = 680 k, R2 = 169 k (2.51 V)
C(ff) = 6.8 pF
3.3 V
R1 = 5.6 x R2
R1 = 560 k, R2 = 100 k (3.30 V)
C(ff) = 6.8 pF
5V
R1 = 9 x R2
R1 = 820 k, R2 = 91 k (5.0 V)
C(ff) = 6.8 pF
STANDARD CIRCUIT FOR FIXED VOLTAGE VERSION
VI = 2.7 V to 10 V
1
R5
VIN
SW
EN
FB
9
L1 = 10 µH
5
8
R3
VO = 1.8 V / 600 mA
R4
TPS62054
Ci = 10 µF
6
4
R6
PG
LBI
7
SYNC
LBO
Co = 22 µF
2
PGND
GND
3
10
CONVERTER FOR 0.7-V OUTPUT VOLTAGE
VI = 2.7 V to 7 V
1
SW
VIN
R1 = 270 kΩ
8
EN
Ci = 10 µF
9 L1 = 10 µH
FB
5
VO = 0.7 V / 600 mA
C(ff) = 22 pF
TPS62050
6
4
LBI
PG
7
R2 = 680 kΩ
Co = 47 µF
2
SYNC
GND
3
LBO
PGND
10
The TPS62050 is used to generate output voltages as low as 0.7 V. With such low output voltages, the inductor
discharges very slowly. This leads to a high output voltage ripple in power-save mode (SYNC = GND). It is
therefore recommended to use a larger output capacitor to keep the output ripple low. With an output capacitor of
47 µF, the output voltage ripple is less than 40 mVPP.
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LAYOUT AND BOARD SPACE
All capacitors should be soldered as close as possible to the IC.
For information on the PCB layout see the user's guideSLVU081.
Keep the feedback track as short as possible. Any coupling to the FB pin may cause additional output voltage
ripple.
INDUCTOR SELECTION
A 10-µH minimum inductor should be used with the TPS6205x. Values larger than 22 µH or smaller than 10 µH
may cause stability problems due to the internal compensation of the regulator. After choosing the inductor value
of typically 10 µH, two additional inductor parameter should be considered: the current rating of the inductor and
the dc resistance. The dc resistance of the inductance directly influences the efficiency of the converter.
Therefore, an inductor with lowest dc resistance should be selected for highest efficiency. In order to avoid
saturation of the inductor, the inductor should be rated at least for the maximum output current plus half the
inductor ripple current which is calculated as:
DI L + V
O
V
1* O
V
I
L f
I L(max) + I (max) ) DIL
O
2
f = Switching frequency (850 kHz typical)
L = Inductor value
∆IL = Peak-to-peak inductor ripple current
IL(max) = Maximum inductor current
The highest inductor current occurs at maximum VIN . A more conservative approach is to select the inductor
current rating just for the maximum switch current of the TPS6205x which is 1.4 A maximum. See Table 3 for
inductors that have been tested for operation with the TPS6205x.
Table 3. Inductors
MANUFACTURER
TYPE
INDUCTANCE
DC RESISTANCE
SATURATION CURRENT
TDK
SLF7032T100M1R4SLF7032T220M96SLF7045T100M1R3SLF7045T100MR90
10 µH ±20%
22 µH ±20%
10 µH ±20%
22 µH ±20%
53 mΩ ±20%
110 mΩ ±20%
36 mΩ ±20%
61 mΩ ±20%
1.4 A
0.96 A
1.3 A
0.9 A
CDR74B
10 µH
70 mΩ
1.65 A
CDR74B
22 µH
130 mΩ
1.12 A
CDH74
10 µH
49 mΩ
1.8 A
CDH74
22 µH
110 mΩ
1.23 A
CDR63B
10 µH
140 mΩ
1A
CDRH4D28
10 µH
128 mΩ
1A
CDRH5D28
10 µH
48 mΩ
1.3 A
CDRH5D18
10 µH
92 mΩ
1.2 A
DT3316P-153
15 µH
60 mΩ
1.8 A
DT3316P-223
22 µH
84 mΩ
1.5 A
WE-PD 744 778 10
10 µH
72 mΩ
1.68 A
1.84 A
Sumida
Coilcraft
Wuerth
16
WE-PD 744 777 10
10 µH
49 mΩ
WE-PD 744 778 122
22 µH
190 mΩ
1.07A
WE-PD 744 777 122
22 µH
110 mΩ
1.23 A
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SLVS432E – SEPTEMBER 2002 – REVISED JUNE 2011
OUTPUT CAPACITOR SELECTION
The output capacitor should have a minimum value of 22µF. For best performance, a low ESR ceramic output
capacitor is needed.
For completeness, the RMS ripple current is calculated as:
I
RMS(Co)
+V
O
V
1– O
V
I
L f
1
Ǹ3
2
The overall output ripple voltage is the sum of the voltage spike caused by the output capacitor ESR plus the
voltage ripple caused by charge and discharging the output capacitor:
DV
O
+V
O
V
1* O
V
I
L f
ǒ
8
1
Co
f
)R
ESR
Ǔ
The highest output voltage ripple occurs at the highest input voltage VI.
INPUT CAPACITOR SELECTION
Because the buck converter has a pulsating input current, a low ESR input capacitor is required for best input
voltage filtering and minimizing the interference with other circuits caused by high input voltage spikes. The input
capacitor should have a minimum value of 10 µF and can be increased without any limit for better input voltage
filtering. The input capacitor should be rated for the maximum input ripple current calculated as:
Ǹ ǒ Ǔ
V
I
+ I (max)
RMS
O
O
V
I
V
1* O
V
I
The worst case RMS ripple current occurs at D = 0.5 and is calculated as: IRMS = IO/2. Ceramic capacitors have a
good performance because of their low ESR value and they are less sensitive to voltage transients compared to
tantalum capacitors. Place the input capacitor as close as possible to the input pin of the IC for best
performance.
Table 4. Capacitors
MANUFACTURER
Taiyo Yuden
Kemet
TDK
(1)
PART NUMBER
SIZE
VOLTAGE
CAPACITANCE
TYPE
JMK212BJ106MG
0805
6.3 V
10 µF
Ceramic
JMK316BJ106ML
1206
6.3 V
10 µF
Ceramic
JMK316BJ226ML
1206
6.3 V
22 µF
Ceramic
LMK316BJ475ML
1206
10 V
4.7 µF (1)
Ceramic
(1)
Ceramic
EMK316BJ475ML
1206
16 V
EMK325BJ106KN-T
1210
16 V
4.7 µF
10 µF
Ceramic
C1206C106M9PAC
1206
6.3 V
10 µF
Ceramic
C2012X5R0J106M
0805
6.3 V
10 µF
Ceramic
C3216X5R0J226M
1206
6.3 V
22 µF
Ceramic
C3216X5R1A106M
1206
10 V
10 µF
Ceramic
Connect two in parallel.
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SLVS432E – SEPTEMBER 2002 – REVISED JUNE 2011
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Table 5. Capacitor Manufacturers
18
MANUFACTURER
CAPACITOR TYPE
INTERNET
Taiyo Yuden
X7R/X5R ceramic
www.t-yuden.com
TDK
X7R/X5R ceramic
www.component.tdk.com
Vishay
X7R/X5R ceramic
www.vishay.com
Kemet
X7R/X5R ceramic
www.kemet.com
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SLVS432E – SEPTEMBER 2002 – REVISED JUNE 2011
REVISION HISTORY
Note: Page numbers of current version may differ from previous versions.
Changes from Revision D (October 2003) to Revision E
Page
•
Changed to Revision E, June 2011 ...................................................................................................................................... 1
•
Changed formatting. ............................................................................................................................................................. 1
•
Changed "goes active high" to "floats" in Terminal Functions table, row PG, description. .................................................. 5
•
Changed "becomes active" to "floats" in last paragraph of Power Good Comparator section. .......................................... 13
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PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
TPS62050DGS
ACTIVE
VSSOP
DGS
10
80
Green (RoHS CU NIPDAUAG
& no Sb/Br)
Level-1-260C-UNLIM
-40 to 85
BFM
TPS62050DGSG4
ACTIVE
VSSOP
DGS
10
80
Green (RoHS CU NIPDAUAG
& no Sb/Br)
Level-1-260C-UNLIM
-40 to 85
BFM
TPS62050DGSR
ACTIVE
VSSOP
DGS
10
2500
Green (RoHS CU NIPDAUAG
& no Sb/Br)
Level-1-260C-UNLIM
-40 to 85
BFM
TPS62050DGSRG4
ACTIVE
VSSOP
DGS
10
2500
Green (RoHS CU NIPDAUAG
& no Sb/Br)
Level-1-260C-UNLIM
-40 to 85
BFM
TPS62051DGS
ACTIVE
VSSOP
DGS
10
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
BGB
TPS62051DGSG4
ACTIVE
VSSOP
DGS
10
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
BGB
TPS62051DGSR
ACTIVE
VSSOP
DGS
10
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
BGB
TPS62051DGSRG4
ACTIVE
VSSOP
DGS
10
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
BGB
TPS62052DGS
ACTIVE
VSSOP
DGS
10
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
BGC
TPS62052DGSG4
ACTIVE
VSSOP
DGS
10
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
BGC
TPS62052DGSR
ACTIVE
VSSOP
DGS
10
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
BGC
TPS62052DGSRG4
ACTIVE
VSSOP
DGS
10
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
BGC
TPS62054DGS
ACTIVE
VSSOP
DGS
10
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
BGE
TPS62054DGSG4
ACTIVE
VSSOP
DGS
10
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
BGE
TPS62054DGSR
ACTIVE
VSSOP
DGS
10
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
BGE
TPS62054DGSRG4
ACTIVE
VSSOP
DGS
10
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
BGE
TPS62056DGS
ACTIVE
VSSOP
DGS
10
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
BGG
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
11-Apr-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
TPS62056DGSG4
ACTIVE
VSSOP
DGS
10
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
BGG
TPS62056DGSR
ACTIVE
VSSOP
DGS
10
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
BGG
TPS62056DGSRG4
ACTIVE
VSSOP
DGS
10
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
BGG
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Nov-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TPS62050DGSR
VSSOP
DGS
10
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
TPS62051DGSR
VSSOP
DGS
10
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
TPS62052DGSR
VSSOP
DGS
10
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
TPS62054DGSR
VSSOP
DGS
10
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
TPS62056DGSR
VSSOP
DGS
10
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Nov-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS62050DGSR
VSSOP
DGS
10
2500
367.0
367.0
35.0
TPS62051DGSR
VSSOP
DGS
10
2500
367.0
367.0
35.0
TPS62052DGSR
VSSOP
DGS
10
2500
367.0
367.0
35.0
TPS62054DGSR
VSSOP
DGS
10
2500
367.0
367.0
35.0
TPS62056DGSR
VSSOP
DGS
10
2500
367.0
367.0
35.0
Pack Materials-Page 2
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