GULFSEMI RGPB30J

RGPB30J
SINTERED GLASS JUNCTION
FAST SWITCHING PLASTIC RECTIFIER
VOLTAGE:600V
CURRENT: 3.0A
PACKAGE
FEATURE
High temperature metallurgically bonded construction
Sintered glass cavity free junction
Capability of meeting environmental standard of
MIL-S-19500
High temperature soldering guaranteed
350°C /10sec/0.375”lead length at 5 lbs tension
Operate at Ta =55°C with no thermal run away
Typical Ir<0.1µA
MECHANICAL DATA
Terminal: Plated axial leads solderable per
MIL-STD 202E, method 208C
Case: Molded with UL-94 Class V-0 recognized Flame
Retardant Epoxy
Polarity: color band denotes cathode
Mounting position: any
Dimensions in millimeters
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(single-phase, half-wave, 60HZ, resistive or inductive load rating at 25°C, unless otherwise stated)
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC blocking Voltage
Maximum Average Forward Rectified
Current 3/8”lead length at Ta =55°C
Peak Forward Surge Current 8.3ms single
half sine-wave superimposed on rated load
Maximum Forward Voltage at rated Forward
Current and 25°C
IF=3A
Maximum full load reverse current full cycle
average at 55°C Ambient
Maximum DC Reverse Current
Ta =25°C
at rated DC blocking voltage
Ta =150°C
Maximum Reverse Recovery Time (Note 1)
Typical Junction Capacitance
(Note 2)
Typical Thermal Resistance
(Note 3)
Storage and Operating Junction Temperature
SYMBOL
RGPB30J
units
Vrrm
Vrms
Vdc
600
420
600
V
V
V
If(av)
3.0
A
Ifsm
125
A
Vf
1.1
V
Ir(av)
100
µA
Ir
5.0
100
µA
µA
Trr
Cj
150
60
nS
pF
R(ja)
20
Tstg, Tj
-65 to +175
°C /W
°C
Note:
1. Reverse Recovery Condition If =0.5A, Ir =1.0A, Irr =0.25A
2. Measured at 1.0 MHz and applied reverse voltage of 4.0Vdc
3. Thermal Resistance from Junction to Ambient at 3/8”lead length, P.C. Board Mounted
Rev.A1
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RATINGS AND CHARACTERISTIC CURVES RGPB30J
1
1
Rev.A1
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