HANBIT HMF4M16J4V

HANBit
HMF4M16J4V
Flash-ROM Module 8MByte (4Mx16bit), 68-pin JLCC type, 3.3V
Design
Part No. HMF4M16J4V
GENERAL DESCRIPTION
The HMF4M16J4V is a high-speed flash read only memory (FROM) module containing 2,097,152 words organized in an
x16bit configuration. The module consists of four 2M x 8bit FROM mounted on a 68-pin, JLCC connector FR4-printed circuit
board.
Commands are written to the command register using standard microprocessor write timings.
Register contents serve as input to an internal state-machine, which controls the erase and programming circuitry. Write
cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the
device is similar to reading from 12.0V flash or EPROM devices.
Output enable (/OE) and write enable (/WE) can set the memory input and output. The host system can detect a program or
erase operation is complete by observing the Ready Pin, or reading the DQ7(Data # Polling) and DQ6(Toggle) status bits.
When FROM module is disable condition the module is becoming power standby mode, system designer can get low -power
design. All module components may be powered from a single + 3V DC power supply and all inputs and outputs are LVTTLcompatible.
FEATURES
PIN ASSIGNMENT
w Part identification
NC
A18
A17
/WE0
/WE1
/CS0
/CS1
NC
Vcc
NC
NC
/OE
NC
A16
A15
A14
DQ15
- HMF4M16J4V
(Bottom boot block configuration)
w Access time: 70, 80, 90, 120ns
w High-density 8MByte design
w High-reliability, low-power design
w Single + 3V to 3.6V power supply
w 68-Pin JLCC Designed
w Minimum 1,000,000 write cycle guarantee
per sector
w 20-year data retention at 125 oC
w Flexible sector architecture
w Embedded algorithms
w Erase suspend / Erase resume
MARKING
w Timing
70ns access
80ns access
- 70
10 9 8
- 90
120ns access
-120
REV.02(August,2002)
5
4
3
2
1
68 67 66 65 64 63 62 61
60
11
59
12
58
13
57
14
56
15
55
16
54
17
53
18
52
19
51
20
50
21
49
22
48
23
47
24
46
25
45
26
44
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
w Packages
URL: www.hbe.co.kr
6
DQ14
DQ13
DQ12
Vss
DQ11
DQ10
DQ9
DQ8
Vcc
DQ7
DQ6
DQ5
DQ4
Vss
DQ3
DQ2
DQ1
- 80
90ns access
68-pin JLCC
7
NC
A6
A5
A4
A3
A2
A1
A0
Vcc
A13
A12
A11
A10
A9
A8
A7
DQ0
OPTIONS
A19
A20
NC
Vss
NC
RY_BY
Reset
NC
Vcc
NC
NC
NC
NC
Vss
NC
NC
NC
68-Pin JLCC TOP View
J
1
HANBit Electronics Co., Ltd.
HANBit
HMF4M16J4V
FUNCTIONAL BLOCK DIAGRAM
A0-20
DQ0-15
DQ0-7
A
/CE0
/CE
/OE
/WE
/Reset
/RY-BY
A
/CE1
/OE
/WE0
/Reset
/Ry-By
/CE
/OE
/WE
/Reset
/RY-BY
DQ8-15
A
D
/CE
/OE
/WE
/Reset
/RY-BY
U1
A
D
/CE
/OE
/WE
/Reset
/RY-BY
U3
D
U2
D
U4
/WE1
TRUTH TABLE
MODE
/CS
/OE
/WE
RESET
DQ
Vcc±0.3V
X
X
Vcc±0.3V
HIGH-Z
RESET
X
X
X
L
HIGH-Z
SECTOR PROTECT
L
H
L
VID
DIN, DOUT
SECTOR UNPROTECT
L
H
L
VID
DIN, DOUT
READ
L
L
H
H
DOUT
WRITE
L
H
L
H
DOUT
STANDBY
Note : X means don't care, WE0* Low byte (D0~7) Write enable, W E1* High byte(D8~15) Write enable.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
Voltage on Any Pin Relative to Vss
-0.5V to Vcc +0.5V
Voltage on Vcc Supply Relative to Vss
-0.5V to +4.0V
Output Short Circuit Current
1,600mA
-65oC to +150oC
Storage Temperature
Operating Temperature
-0oC to +70oC
w Stresses greater than those listed under " Absolute Maximum Ratings" may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at these or any other condi tions above those indicated in
the operating section of this specification is not implied. Exposure to absolute maximum rating conditions for extended
periods may affect reliability.
URL: www.hbe.co.kr
REV.02(August,2002)
2
HANBit Electronics Co., Ltd.
HANBit
HMF4M16J4V
RECOMMENDED OPERATING CONDITIONS
RANGE
PARAMETER
Vcc for regulated Supply Voltage
+3.0V to 3.6V
Vcc for full voltage
+2.7V to 3.6V
DC AND OPERATING CHARACTERISTICS
TEST CONDITIONS
PARAMETER
SYMBOL
MIN
MAX
UNITS
Input Load Current
VIN= VSS to VCC , VCC= VCC max
IL1
±8.0
µA
Output Leakage Current
VOUT= VSS to VCC, VCC= VCC max
IL0
±8.0
µA
Output High Voltage
IOH = -2.0mA, Vcc = Vcc min
VOH
Output Low Voltage
IOL = 4.0mA, Vcc = Vcc min
VOL
0.45
V
Vcc Active Read Current
/CE = VIL, ,/OE=VIH, f=5MHz
ICC1
128
mA
Vcc Active Write Current
/CE = VIL, /OE=VIH
ICC2
240
mA
Vcc Standby Current
/CE, RESET=VCC±0.3V
ICC3
40
µA
Vcc Reset Current
/RESET=Vss±0.3V,
ICC4
40
µA
2.5
V
Low Vcc Lock-Out Voltage
0.85Vcc
VLKO
V
2.3
ERASE AND PROGRAMMING PERFORMANCE
LIMITS
PARAMETER
UNIT
MIN.
TYP.
MAX.
-
0.7
15
COMMENTS
Excludes 00H programming
Sector Erase Time
Sec
prior to erasure
Byte Programming Time
-
9
300
Excludes system-level
µS
overhead
Excludes system-level
Chip Programming Time
-
18
54
sec
overhead
TSOP PIN CAPACITANCE
PARAMETER
SYMBOL
PARAMETER
DESCRIPTION
Input
TEST SETUP
TYP.
MAX
48
60
24
30
VOUT = 0
8.5
12
pF
VIN = 0
7.5
9
pF
Address
CIN
VIN = 0
Capacitance
Data
UNIT
pF
COUT
Output Capacitance
CIN2
Control Pin
/CE
Capacitance
/WE
30
36
/OE
60
72
Notes: Test conditions TA = 25o C, f=1.0 MHz.
URL: www.hbe.co.kr
REV.02(August,2002)
3
HANBit Electronics Co., Ltd.
HANBit
HMF4M16J4V
AC CHARACTERISTICS
u Read Only Operations Characteristics
PARAMETER
SYMBOLS
JEDEC STANDARD
tAVAV
tRC
tAVQV
tACC
DESCRIPTION
-80
(NOTE1)
-90
(NOTE1)
UNIT
Min
80
90
ns
Max
80
90
ns
Max
80
90
ns
TEST SETUP
Read Cycle Time
/CE = V IL
Address to Output Delay
/OE = VIL
tELQV
tCE
Chip Enable to Output Delay
/OE = VIL
tGLQV
tOE
Chip Enable to Output Delay
Max
80
90
ns
tEHQZ
tDF
Chip Enable to Output High-Z
Max
25
30
ns
tGHQZ
tDF
Output Enable to Output High-Z
Max
25
30
ns
tAXQX
tQH
Min
0
0
ns
Output Hold Time From Addresses,
/CE or /OE, Whichever Occurs First
TEST CONDITIONS
Notes : Test Conditions : Output Load : 1TTL gate and 100 pF
Input rise and fall times : 5 ns
Input pulse levels: 0V to 3.0V
Timing measurement reference level
Input : 1.5 V
Output : 1.5V
3.3V
2.7kΩ
IN3064
or Equivalent
Device
Under
Test
CL
6.2kΩ
Diodes = IN3064
or Equivalent
Note : CL = 100pF including jig capacitance
URL: www.hbe.co.kr
REV.02(August,2002)
4
HANBit Electronics Co., Ltd.
HANBit
HMF4M16J4V
u Erase/Program Operations
PARAMETER SYMBOLS
DESCRIPTION
-80
-90
UNIT
Min
80
90
ns
Address Setup Time
Min
0
0
ns
tAH
Address Hold Time
Min
45
45
ns
tDVWH
tDS
Data Setup Time
Min
35
45
ns
tWHDX
tDH
Data Hold Time
Min
0
0
ns
tOES
Output Enable Setup Time
Min
0
0
ns
Read Recover Time Before Write
Min
0
0
ns
JEDEC
STANDARD
tAVAV
tWC
Write Cycle Time
tAVWL
tAS
tWLAX
tGHWL
tGHWL
tELWL
tCS
/CE Setup Time
Min
0
0
ns
tWHEH
tCH
/CE Hold Time
Min
0
0
ns
tWLWH
tWP
Write Pulse Width
Min
35
35
ns
tWHWL
tWPH
Write Pulse Width High
Min
30
30
ns
tWHWH1
tWHWH1
Byte Programming Operation
Typ
9
9
µs
Typ
0.7
0.7
sec
tWHWH2
tWHWH2
Sector Erase Operation
Max
50
50
sec
tVCS
Vcc Setup Time
Min
50
50
µs
tRB
Recovery time from RY/BY
Min
0
0
µs
Program/Erase Valid to RY/BY Delay
Min
90
90
µs
-80
-90
UNIT
tBUSY
u Alternate /CE Controlled Erase/Program Operations
PARAMETER SYMBOLS
DESCRIPTION
JEDEC
STANDARD
tAVAV
tWC
Write Cycle Time
Min
80
90
ns
tAVEL
tAS
Address Setup Time
Min
0
0
ns
tELAX
tAH
Address Hold Time
Min
45
45
ns
tDVEH
tDS
Data Setup Time
Min
35
45
ns
tEHDX
tDH
Data Hold Time
Min
0
0
ns
tOES
Output Enable Setup Time
Read Recover Time Before Write
/OE High to /WE Low
Min
0
0
ns
Min
0
0
ns
tGHEL
tGHEL
tWLEL
tWS
/WE Setup Time
Min
0
0
ns
tEHWH
tWH
/WE Hold Time
Min
0
0
ns
tELEH
tCP
/CE Pulse Width
Min
35
35
ns
tEHEL
tCPH
/CE Pulse Width High
Min
30
30
ns
tWHWH1
tWHWH1
Byte Programming Operation
Typ
9
9
µs
tWHWH2
tWHWH2
Sector Erase Operation
Typ
0.7
0.7
sec
URL: www.hbe.co.kr
REV.02(August,2002)
5
HANBit Electronics Co., Ltd.
HANBit
HMF4M16J4V
u READ OPERATIONS TIMING
u RESET TIMING
URL: www.hbe.co.kr
REV.02(August,2002)
6
HANBit Electronics Co., Ltd.
HANBit
HMF4M16J4V
u PROGRAM OPERATIONS TIMING
u CHIP/SECTOR ERASE OPERATION TIMINGS
URL: www.hbe.co.kr
REV.02(August,2002)
7
HANBit Electronics Co., Ltd.
HANBit
HMF4M16J4V
u DATA# POLLING TIMES(DURING EMBEDDED ALGORITHMS)
u TOGGLE# BIT TIMINGS (DURING EMBEDDED ALGORITHMS)
URL: www.hbe.co.kr
REV.02(August,2002)
8
HANBit Electronics Co., Ltd.
HANBit
HMF4M16J4V
u SECTOR PROTECT UNPROTECT TIMEING DIAGRAM
u ALTERNATE CE# CONTROLLED WRITE OPERATING TIMINGS
URL: www.hbe.co.kr
REV.02(August,2002)
9
HANBit Electronics Co., Ltd.
HANBit
HMF4M16J4V
PACKAGE DIMENSIONS
UNIT: inch(mm)
(TOP Dimension)
0.46±0.20mm
1.278±0.20mm
URL: www.hbe.co.kr
REV.02(August,2002)
10
HANBit Electronics Co., Ltd.
HANBit
HMF4M16J4V
ORDERING INFORMATION
Part Number
Density
Org.
Package
HMF4M16J4V-70
8MByte
x 16
68Pin -JLCC
HMF4M16J4V -80
8MByte
x 16
HMF4M16J4V -90
8MByte
HMF4M16J4V -120
8MByte
URL: www.hbe.co.kr
REV.02(August,2002)
Component
Vcc
SPEED
4EA
3.3V
70ns
68Pin -JLCC
4EA
3.3V
80ns
x 16
68Pin -JLCC
4EA
3.3V
90ns
x 16
68Pin -JLCC
4EA
3.3V
120ns
11
Number
HANBit Electronics Co., Ltd.