Optical Pickup Chipset with Photodetector PDIC for Blue-Violet Laser Diodes CXA2674EM CXA2673EM The age of the blue-violet laser diode has arrived making even higher recording densities possible. Sony has now developed a new photodiode semiconductor wafer process and a new package for photodetector IC for use with blue-violet laser diodes. This article introduces a chipset for use with blueviolet laser diodes; a chipset that concentrates the industry’s leading technologies in a unified system. CXA2674EM The CXA2674EM is a photodetector IC (PDIC) that detects both RF and servo signals and mounted in a record/playback optical pickup that supports the blue-violet laser diode used for Blu-ray and other optical discs. This device is fabricated in a leading-edge process that improves the optoelectronic conversion characteristics in the blue-violet wavelength range to almost the theoretical limits. It also achieves a high signal-to-noise ratio by including a low-noise amplifier. This device features a standby mode function that allows power consumption to be minimized when the device is not being V O I C No rose without a thorn. While the blue laser diode was a miraculous development, and it is an extremely attractive device, it was not easy to develop a PDIC that could receive that light. Revising the fabrication process was, of course, necessary, and we even developed a new package in creating this new product! This is a very friendly product and can be used by almost anyone. It’s good to be able to relax again now that this project is done. 8 E CXA2674EM RF/Servo PDIC for blue-violet laser diodes ■ Includes a high-sensitivity photodiode (0.3 A/W at 405 nm) ■ Low-noise amplifier ■ Standby mode function ■ Cavity mold glass sealed small package CXA2673EM Laser front monitor PDIC for blue-violet laser diodes ■ Two-channel structure (Vin1, Vin2) ■ Standby mode function ■ Cavity mold glass sealed small package operated. (Operating mode: 30 mA, standby mode: 2 mA) This product is provided in a newly-developed package that is appropriate for photodetection in the wavelength range of the blue-violet laser. CXA2673EM The CXA2673EM is a photodetector IC (PDIC) developed for use as a laser power monitor and mounted in a record/playback optical pickup that uses the blue-violet laser diode used for Blu-ray and other optical discs. This device adopts the same leading-edge process used for the CXA2674EM and the same package. It provides excellent performance as a front monitor for blue-violet laser diodes. Newly-Developed Package for Blue-Violet Laser Diodes Sony has developed a new cavity mold glass sealed package for blue-violet laser diodes. Conventional transparent plastic packages have low transparency in the wavelength range of the blue-violet laser diode, and furthermore, it has been shown that long-term exposure to blue-violet laser diode light degrades plastic package material. Therefore, Sony developed this new package that mounts the silicon chips in a molded cavity area and seals them in that area with glass that has antireflection coating on both sides, thus resolving both these problems. Ao Eo Fo Do SW RF– RF+ 17 Vout EHo 2 18 17 16 15 14 13 12 11 10 900 Ω ×1 3 15 SW 200 Ω 5 Ao Bo Co Do 4 Vc ×1 16 SLEEP Eo Ho 14 Vin1 Ao Bo Co Do Vcc 18 GND 5.4 kΩ 1 Fo Go 200 Ω 6 13 Vin2 1.75 kΩ 12 2 ■ Figure 1 CXA2673EM Block Diagram SLEEP Vcc 1 3 4 5 6 7 8 9 GND 10 Go 9 ×1 Vc 11 IV_OUT Ho ×1 8 Bo GND FGo PD Co 7 ■ Figure 2 CXA2674EM Block Diagram 0.160 0.005 0.160 0.030 Photosensitive area position: At the package center 0.005 0.130 0.130 0.240 0.130 F A D 0.005 E B C H G φ0.7 mm 0.005 0.130 Unit: mm ■ Figure 3 CXA2673EM Acceptance Pattern Dimensions ■ Figure 4 CXA2674EM Acceptance Pattern Dimensions +0.09 0.14 –0.03 5.0V 0.05 M 0.4 ×4 EHo 17 S A B 3 Bo Ao 16 4 Ho Eo 15 18 φ0.2 0.5 ±0.05 φ0.5 2.1V 5 Vref F E 3.3 C B D A 0.4 ±0.05 5.0 B 0.05 M (0.18) 10 Fo 14 PIN 1 INDEX 9 0.1 ±0.1 1 9 PIN 1 INDEX 2 SLEEP S A B A 10 4.4 18 0.8 GND 18 G H 1.1 ±0.1 5.8 5.2 1.0 ±0.1 +0.09 0.25 –0.03 1 Vcc 0.5 0.02 MAX 0.05 S A B 1 (0.23) +0.09 0.35 –0.03 +0.09 0.24 –0.03 S 0.05 M 0.05 M S A B 6 Go Do 13 7 Co SW 12 8 FGo RF– 11 9 GND RF+ 10 S A B S Gold plating 0.05 S Terminal section ■ Figure 6 CXA2673/74EM Package Dimensions Unit: mm * Load conditions: 1 kΩ//10 pF The photosensitive area position is at the package center. ■ Figure 5 CXA2674EM Pin Configuration 9