RI-I11-114A-01 RI-I11-114B-01 SCBS828B – DECEMBER 2005 – REVISED SEPTEMBER 2011 www.ti.com Tag-it™ HF-I STANDARD TRANSPONDER INLAYS SQUARE Check for Samples: RI-I11-114A-01, RI-I11-114B-01 FEATURES 1 • 2 • • • • ISO/IEC 15693-2, -3; ISO/IEC 18000-3 Compliant 13.56-MHz Operating Frequency 256-Bit User Memory in 8-Bit × 32-Bit Blocks Application Family Identifier (AFI) Fast Simultaneous Identification (Anti-Collision) APPLICATIONS • • • • • Product Authentication Library Supply-Chain Management Asset Management Ticketing/Stored Value DESCRIPTION Texas Instruments Tag-it™ HF-I standard transponder inlays consist of 13.56-MHz high-frequency (HF) transponders that are compliant with the ISO/IEC 15693 and ISO/IEC 18000-3 global open standards. These products offer a user-accessible memory of 256 bits, organized in eight blocks, and an optimized command set available in five different antenna shapes, with frequency offset for integration into paper, PVC, or other substrates. The Tag-it HF-I standard transponder inlays are manufactured with TI’s patented laser tuning process to provide consistent read performance. Prior to delivery, the transponders undergo complete functional and parametric testing, in order to provide the high quality that customers have come to expect from TI. The Tag-it HF-I standard transponder inlays are well suited for a variety of applications including, but not limited to, product authentication, library, supply-chain management, asset management, and ticketing/stored value applications. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Tag-it is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2011, Texas Instruments Incorporated RI-I11-114A-01 RI-I11-114B-01 SCBS828B – DECEMBER 2005 – REVISED SEPTEMBER 2011 www.ti.com Table 1. Specifications (1) PART NUMBER RI-I11-114A-01 Supported standard RI-I11-114B-01 ISO/IEC 15693-2, -3; ISO/IEC 18000-3 Recommended operating frequency 13.56 MHz Passive resonance frequency (at 25°C) 13.86 MHz ± 200 kHz (includes frequency offset to compensate further integration into paper) 14.2 MHz ± 200 kHz (includes frequency offset to compensate PVC lamination) 98 dBμA/m (2) 98 dBμA/m (3) Typical required activation field strength to read (at 25°C) Typical required activation field strength to write (at 25°C) 101 dBμA/m (2) 101 dBμA/m (3) Factory-programmed read-only number 64 bits 256 bits organized in 8-bit × 32-bit blocks Memory (user programmable) Typical programming cycles (at 25°C) 100,000 >10 years Data retention time (at 55°C) Simultaneous identification of tags Up to 50 tags per second (reader/antenna dependent) 45 mm × 45 mm (~1.77 in × ~1.77 in) Antenna size Foil width 48 mm ± 0.5 mm (1.89 in ± 0.02 in) Foil pitch 50.8 mm +0.1 mm/–0.4 mm (2 in) Thickness Chip area: 0.34 mm ±0.02 Antenna area (Al both sides): 0.085 mm ±0.01 Antenna area (Al one side): 0.075 mm ±0.008 Base material Substrate: PET (polyethylenetherephtalate); Antenna: aluminum –25°C to 70°C Operating temperature –40°C to 85°C (warpage may occur at upper temperature range) Storage temperature (single inlay) –40°C to 40°C Storage temperature (on reel) Single-row tape wound on cardboard reel with 500-mm diameter Reel outer width: approximately 60 mm (~2.36 in) Reel inner width: approximately 50 mm (~1.97 in) Hub diameter: 76.2 mm (3 in) Delivery Typical quantity of good units per reel (1) (2) (3) 5000 For highest possible read-out coverage, operate readers at a modulation depth of 20% or higher. After integration into paper After PVC lamination Table 2. Supported Command Set REQUEST REQUEST MODE (1) REQUEST CODE INVENTORY ADDRESSED NON-ADDRESSED AFI OPT. FLAG ISO 15693 Mandatory and Optional Commands Inventory 0x01 ✓ – – ✓ 0 Stay Quiet 0x02 – ✓ – – 0 Read_Single_Block 0x20 – ✓ ✓ – 1 Write_Single_Block 0x21 – ✓ ✓ – 1 Lock_Block 0x22 – ✓ ✓ – 1 (1) 2 ✓ = Implemented, – = Not applicable Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Product Folder Link(s): RI-I11-114A-01 RI-I11-114B-01 RI-I11-114A-01 RI-I11-114B-01 SCBS828B – DECEMBER 2005 – REVISED SEPTEMBER 2011 www.ti.com Memory Organization 32 bits Block Addr 0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 Lock Bits U U = User Lock User data (256 bits) 0x08 0x09 UID Number (64 bits) 0x0A AFI Copyright © 2005–2011, Texas Instruments Incorporated Product Folder Link(s): RI-I11-114A-01 RI-I11-114B-01 Submit Documentation Feedback 3 PACKAGE OPTION ADDENDUM www.ti.com 7-Sep-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) RI-I11-114A-01 ACTIVE RFIDN TFB 0 5000 Pb-Free (RoHS) Call TI N / A for Pkg Type RI-I11-114B-01 ACTIVE RFIDN TFB 0 5000 Pb-Free (RoHS) Call TI N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connctivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2011, Texas Instruments Incorporated