TI TRPGR30TGC

TRPGR30TGC
SCBS886 – JANUARY 2012
www.ti.com
12-mm LOW-FREQUENCY GLASS-ENCAPSULATED TRANSPONDER, READ ONLY
Check for Samples: TRPGR30TGC
FEATURES
APPLICATIONS
•
•
•
1
•
•
•
Best-in-Class Performance Through Patented
HDX Technology
Patented Transponder Tuning Provides Stable
and High Read Performance
80-Bit UID (64-Bit ID, 16-Bit CRC)
Insensitive to Almost All Nonmetallic Materials
Industrial Automation
Asset tracking
DESCRIPTION
Texas Instruments 12-mm low-frequency (LF) glass transponders provide superior performance and operate at a
resonance frequency of 134.2 kHz. The products are compliant to ISO/IEC 11784/11785 global open standards.
Texas Instruments LF glass transponders are manufactured with TI's patented tuning process to provide
consistent read performance. Prior to delivery, the transponders undergo complete functional and parametric
testing, to provide the high quality customers have come to expect from TI.
ORDERING INFORMATION
PACKAGE (1)
TA
-25°C to 85°C
(1)
Glass encapsulated
Container/Bulk
ORDERABLE PART
NUMBER
QUANTITY
TRPGR30TGC
2000
For the most current package and ordering information, see the TI web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
TRPGR30TGC
TA
Operating temperature
-25°C to 85°C
TSTG
Storage temperature
-40°C to 100°C
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
TRPGR30TGC
SCBS886 – JANUARY 2012
www.ti.com
PARAMETER
TRPGR30TGC
Functionality
Read only
Memory (bits)
80 (64-bit UID + 16-bit CRC)
Memory (pages)
1
Resonance frequency
134.6 kHz
Modulation
FSK (frequency shift keying) 134.2 kHz / 124.2 kHz
Transmission principle
HDX (half duplex)
Power source
Powered from the reader signal (battery-less)
Typical reading range
≤60 cm (1)
Typical reading time
70 ms
Case material
Glass
Protection glass
Hermetically sealed
EMC
Programmed code is not affected by natural electromagnetic interference or x-rays
Signal penetration
Transponder can be read through almost all nonmetallic material
Mechanical shock
IEC 60068-2-32 free-fall drop test, 20 times from 1.5-m height
Dimensions
Ø 2.12 ± 0.05 mm x 12.0 ± 0.5 mm
Weight
0.10 g
(1)
2
Depends on RF regulation in country of use, the reader antenna configuration used, and the environmental conditions.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): TRPGR30TGC
PACKAGE OPTION ADDENDUM
www.ti.com
21-Jan-2012
PACKAGING INFORMATION
Orderable Device
TRPGR30TGC
Status
(1)
ACTIVE
Package Type Package
Drawing
RFIDT
TGC
Pins
Package Qty
0
2000
Eco Plan
TBD
(2)
Lead/
Ball Finish
Call TI
MSL Peak Temp
(3)
Samples
(Requires Login)
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
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continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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