UCC5618 18-Line SCSI Terminator FEATURES DESCRIPTION • Complies with SCSI, SCSI-2, SCSI-3, SPI and FAST-20 Standards The UCC5618 provides 18 lines of active termination for a SCSI (Small Computers Systems Interface) parallel bus. The SCSI standard recommends and Fast-20 (Ultra) requires active termination at both ends of the cable. • 2pF Channel Capacitance During Disconnect • 50µA Supply Current in Disconnect Mode • 110Ω Termination • SCSI Hot Plugging Compliant, 10nA Typical • +400mA Sinking Current for Active Negation • –650mA Sourcing Current for Termination • Trimmed Impedance to 5% • Thermal Shutdown • Current Limit BLOCK DIAGRAM Patented Circuit Design 6/98 Pin for pin compatible with the UC5601 and UC5608, the UCC5618 is ideal for high performance 5V SCSI systems, Termpwr 4.0-5.25V. During disconnect the supply current is only 50µA typical, which makes the IC attractive for lower powered systems. The UCC5618 is designed with a low channel capacitance of 2pF, which eliminates effects on signal integrity from disconnected terminators at interim points on the bus. The power amplifier output stage allows the UCC5618 to source full termination current and sink active negation current when all termination lines are actively negated. The UCC5618, as with all Unitrode terminators, is completely hot pluggable and appears as high impedance at the terminating channels with TRMPWR=0V or open. Internal circuit trimming is utilized, first to trim the 110Ω impedance, and then most importantly, to trim the output current as close to the max SCSI-3 spec as possible, which maximizes noise margin in fast SCSI operation. This device is offered in low thermal resistance versions of the industry standard 28 pin wide body SOIC, TSSOP and PLCC. UDG-96005-1 UCC5618 ABSOLUTE MAXIMUM RATINGS TEMPWR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7V Signal Line Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +7V Regulator Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 1A Storage Temperature . . . . . . . . . . . . . . . . . . . –65°C to +150°C Operating Junction Temperature . . . . . . . . . . –55°C to +150°C Lead Temperature (Soldering, 10 Seconds) . . . . . . . . . . 300°C All currents are positive into, negative out of the specified terminal. Consult Packaging Section of Databook for thermal limitations and considerations of packages. CONNECTION DIAGRAMS PLCC-28 (Top View) QP Package TSSOP-28 (Top View) PWP Package * DWP package pins 12–18 serve as both heatsink and signal ground. * PWP package pin 23 serves as signal ground; pins 7, 8, 9, 20, 21, and 22 serve as heatsink ground. DIL-24 (Top View) N Package SOIC-28 (Top View) DWP Package * DWP package pin 28 serves as signal ground; pins 7, 8, 9, 20, 21, 22 serve as heatsink/ground. Note: Drawings are not to scale. 2 UCC5618 ELECTRICAL CHARACTERISTICS: Unless otherwise stated these specifications apply for TA = 0°C to 70°C, TRMPWR = 4.75V, DISCNCT = 0V, TA = TJ. PARAMETER TEST CONDITIONS MIN TYP MAX UNITS Supply Current Section TERMPWR Supply Current Power Down Mode All Termination Lines = Open 1 2 mA All Termination Lines = 0.2V DISCNCT = TRMPWR 420 440 mA 50 100 µA 110 115.5 Ω Output Section (Termination Lines) Termination Impedance See Figure 1 104.5 Output High Voltage VTRMPWR = 4V (Note 1) 2.6 2.8 3 V Max Output Current VLINE = 0.2V, TJ = 25°C –22.1 –23.3 –24 mA VLINE = 0.2V –20.7 –23.3 –24 mA VLINE = 0.2V, TERMPWR = 4V, TJ = 25°C (Note 1) –21 –23.3 –24 mA VLINE = 0.2V, TRMPWR = 4V (Note 1) –20 –23 –24 mA –22.4 mA Output Leakage VLINE = 0.5V DISCNCT = 2.4V, TRMPWR = 0V to 5.25V, REG = 0.2V, VLINE = 5.25V 10 400 nA Output Capacitance DISCNCT = 2.4V (Note 2) 2 3.5 pF 2.6 2.8 3 V Regulator Section Regulator Output Voltage Drop Out Voltage All Termination Lines = 0.2V 0.4 0.8 V Short Circuit Current VREG = 0V –475 –650 –950 mA Sinking Current Capability VREG = 3.5V 200 400 800 mA Thermal Shutdown 170 °C Thermal Shutdown Hysteresis 10 °C Disconnect Section Disconnect Threshold 0.8 Input Current DISCNCT = 0V 1.5 2 V –10 –30 µA Note 1: Measuring each termination line while other 17 are low (0.2V). Note 2: Guaranteed by design. Not 100% tested in production. Procedure: 1) Measure VREG N.L. 2) Set VL = 0.2V 3) Measure IMAX at 0.2V V 4) Impedance = REG N. L. 0.2V I MAX UDG-96102-1 Figure 1. Termline Impedance Measurement Circuit 3 UCC5618 PIN DESCRIPTIONS DISCNCT: Taking this pin high or leaving it open causes the 18 channels to become high impedance and the chip to go into low-power mode; a low state allows the channels to provide normal termination. LINE1–LINE18: 110Ω termination channels. REG: Output of the internal 2.8V regulator. TRMPWR: Power for the IC. GND: Ground reference for the IC. APPLICATION INFORMATION UDG-96012-1 UNITRODE CORPORATION 7 CONTINENTAL BLVD. • MERRIMACK, NH 03054 TEL. (603) 424-2410 • FAX (603) 424-3460 4 PACKAGE OPTION ADDENDUM www.ti.com 24-Jan-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) (3) Top-Side Markings (4) UCC5618DWP ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC5618DWP UCC5618DWPG4 ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC5618DWP UCC5618DWPTR ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC5618DWP UCC5618DWPTRG4 ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC5618DWP UCC5618PWP ACTIVE TSSOP PW 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC5618PWP UCC5618PWPG4 ACTIVE TSSOP PW 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC5618PWP UCC5618PWPTR ACTIVE TSSOP PW 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC5618PWP UCC5618PWPTRG4 ACTIVE TSSOP PW 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UCC5618PWP UCC5618QP ACTIVE PLCC FN 28 37 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR 0 to 70 UCC5618QP (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 24-Jan-2013 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Only one of markings shown within the brackets will appear on the physical device. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 5-Feb-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device UCC5618DWPTR Package Package Pins Type Drawing SOIC DW 28 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 1000 330.0 32.4 Pack Materials-Page 1 11.35 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 18.67 3.1 16.0 32.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Feb-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) UCC5618DWPTR SOIC DW 28 1000 367.0 367.0 55.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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