UC3770A UC3770B High Performance Stepper Motor Drive Circuit FEATURES DESCRIPTION • Full-Step, Half-Step and Micro-Step Capability. • Bipolar Output Current up to 2A. • Wide Range of Motor Supply Voltage: 10–50V • Low Saturation Voltage The UC3770A and UC3770B are high-performance full bridge drivers that offer higher current and lower saturation voltage than the UC3717 and the UC3770. Included in these devices are LS-TTL compatible logic inputs, current sense, monostable, thermal shutdown, and a power H-bridge output stage. Two UC3770As or UC3770Bs and a few external components form a complete microprocessor-controllable stepper motor power system. • Wide Range of Current Control: 5mA–2A. • Current Levels Selected in Steps or Varied Continuously. • Thermal Protection and Soft Intervention. Unlike the UC3717, the UC3770A and the UC3770B require external high-side clamp diodes. The UC3770A and UC3770B are identical in all regards except for the current sense thresholds. Thresholds for the UC3770A are identical to those of the older UC3717 permitting drop-in replacement in applications where high-side diodes are not required. Thresholds for the UC3770B are tailored for half stepping applications where 50%, 71%, and 100% current levels are desirable. The UC3770A and UC3770B are specified for operation from 0°C to 70°C ambient. BLOCK DIAGRAM UDG-92039-1 SLUS403A - FEBRUARY 2000 UC3770A UC3770B ABSOLUTE MAXIMUM RATINGS Logic Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Output Supply Voltage, VMM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50V Logic Input Voltage (Pins 7, 8, 9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6V Analog Input Voltage (Pin 10) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC Reference Input Voltage (Pin 11) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15V Logic Input Current (Pins 7, 8, 9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –10mA Analog Input Current (Pins 10, 11) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –10mA Output Current (Pins 1, 15) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 2A Junction Temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C Note 1: All voltages are with respect to Gnd (DIL Pins 4, 5, 12, 13); all currents are positive into, negative out of the specified terminal. Note 2: Consult Unitrode Integrated Circuits databook for thermal limitations and considerations of packages. CONNECTION DIAGRAMS DIL-16 (Top View) J Or N Package PACKAGE PIN FUNCTION PLCC-28 (Top View) Q Package FUNCTION PIN Gnd VM N/C AOUT N/C Emitters Gnd BOUT Timing VM Gnd VCC I1 Phase I0 N/C Current VR N/C Gnd 1-3 4 5 6 7 8 9 10 11 12 13-17 18 19 20 21 22 23 24 25-27 28 ELECTRICAL CHARACTERISTICS: (All tests apply with VM = 36V, VCC = 5V, VR = 5V, No Load, and 0°C<TA<70°C, unless otherwise stated, TA = TJ.) UC3770A PARAMETER TEST CONDITIONS Supply Voltage VM (Pins 3, 14) TYP 10 Logic Supply Voltage VCC (Pin 6) Logic Supply Current ICC (Pin 6) MIN 4.75 UC3770B MAX MIN 45 10 4.75 TYP MAX UNITS 45 V 5 5.3 5 5.3 V IO = I1 = H, IM = 0 15 25 15 25 mA IO = I1 = L, IM = 0 18 28 18 28 mA IO = I1 = H, IM = 1.3A 33 40 33 40 mA Thermal Shutdown Temperature +170 Logic Threshold (Pins 7, 8, 9) 0.8 °C +170 2.0 0.8 2.0 V Input Current Low (Pin 8) VI = 0.4V -100 -100 µA Input Current Low (Pins 7, 9) VI = 0.4V -400 -400 µA Input Current High (Pins 7, 8, 9) VI = 2.4V 10 µA Comparator Threshold (Pin 10) VR = 5V, I0 = L, I1 = L 400 415 430 400 415 430 mV VR = 5V, I0 = H, I1 = L 240 255 265 290 300 315 mV VR = 5V, I0 = L, I1 = H 70 80 90 195 210 225 mV ±20 µA 35 ms 10 ±20 Comparator Input Current (Pin 10) Off Time RT = 56k, CT = 820pF 25 2 30 35 25 30 UC3770A UC3770B ELECTRICAL CHARACTERISTICS (cont.): (All tests apply with VM = 36V, VCC = 5V, VR = 5V, No Load, and 0°C<TA<70°C, unless otherwise stated, TA = TJ.) UC3770A PARAMETER TEST CONDITIONS MIN TYP UC3770B MAX Turn Off Delay Sink Driver Saturation Voltage Source Driver Saturation Voltage Output Leakage Current MIN 2 2 ms 0.8 0.8 V IM = 1.3A 1.3 1.3 V IM = 1.0A 1.3 1.3 V IM = 1.3A 1.6 1.6 V VM = 45V 100 100 µA TA = +25°C 1.8 5.0 1.6 4.5 ICC – mA VCE SAT HIGH – V MAX UNITS IM = 1.0A TA = +25°C 1.4 1.2 4.0 3.5 1.0 3.0 0.8 2.5 0.6 0.2 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 OUTPUT CURRENT – A OUTPUT CURRENT – A Figure 1. Typical source saturation voltages vs. load current Figure 3. Typical supply current vs. load current. POWER DISSIPATION (W) TA = +25°C VCE SAT LOW – V TYP 1.4 1.2 1.0 0.8 0.6 0.4 0.2 5 4 3 2 1 0 0 0.5 1 1.5 OUTPUT CURRENT (A) 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 OUTPUT CURRENT – A Figure 2. Typical sink saturation voltages vs. load current Figure 4. Typical power dissipation vs. output current. UNITRODE CORPORATION 7 CONTINENTAL BLVD. • MERRIMACK, NH 03054 TEL. 603-424-2410 • FAX 603-424-3460 3 2 PACKAGE OPTION ADDENDUM www.ti.com 29-May-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) UC3770AN ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3770AN UC3770ANG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3770AN UC3770AQ ACTIVE PLCC FN 28 37 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR 0 to 70 UC3770AQ UC3770AQTR ACTIVE PLCC FN 28 750 TBD Call TI Call TI 0 to 70 UC3770AQ UC3770BN ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3770BN UC3770BNG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 UC3770BN (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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