LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only FOUR DIGIT LED DISPLAY(0.39Inch) LFD4H5/62M-XX/RP9 DATA SHEET DOC. NO : QW0905-LFD4H5/62M-XX/RP9 REV. : A DATE : 28 - Sep. - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/7 PART NO. LFD4H5/62M-XX/RP9 Package Dimensions 6.4 (0.252") 39.2(1.543") 10.16 (0.4") DIG.1 DIG.2 DP1 DIG.3 DIG.4 12.9 (0.508") 10.28 (0.405") DP2 ψ1.4 (0.055") ψ0.45TYP A LFD4H5/62M-XX/RP9 LIGITEK F G B E C D DP 9.0±0.5 2.54*4 =10.16 PIN 1 PIN 5 10.16 2.54*4 =10.16 PIN 6 PIN 10 PIN NO.1 Note : 1.All dimension are in millimeters and (lnch) tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD4H5/62M-XX/RP9 Page 2/7 Internal Circuit Diagram LFD4H52M-XX/RP9 20 5 15 DIG.2 DIG.1 A B C D E F G DIG.3 A B C D E F G DP1 17 16 4 1 3 18 19 2 10 DIG.4 A B C D E F G A B C D E F G DP2 12 11 9 6 8 13 14 7 LFD4H62M-XX/RP9 20 DIG.1 A B C D E F G 17 16 4 1 3 18 19 5 15 DIG.2 DIG.3 A B C D E F G DP1 2 A B C D E F G 12 11 9 6 8 13 14 10 DIG.4 A B C D E F G DP2 7 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/7 PART NO. LFD4H5/62M-XX/RP9 Electrical Connection PIN NO LFD4H52M-XX/RP9 PIN NO LFD4H62M-XX/RP9 1 Anode D (Dig.1,Dig.2) 1 Cathode D (Dig.1,Dig.2) 2 Anode 1 2 Cathode DP1 3 Anode E (Dig.1,Dig.2) 3 Cathode E (Dig.1,Dig.2) 4 Anode C (Dig.1,Dig.2) 4 Cathode C (Dig.1,Dig.2) 5 Common Cathode Dig.2 5 Common Anode Dig.2 6 Anode D (Dig.3,Dig.4) 6 Cathode D (Dig.3,Dig.4) 7 Anode DP2 7 Cathode DP2 8 Anode E (Dig.3,Dig.4) 8 Cathode E (Dig.3,Dig.4) 9 Anode C (Dig.3,Dig.4) 9 Cathode C (Dig.3,Dig.4) 10 Common Cathode Dig.4 10 Common Anode Dig.4 11 Anode B (Dig.3,Dig.4) 11 Cathode B (Dig.3,Dig.4) 12 Anode A (Dig.3,Dig.4) 12 Cathode A (Dig.3,Dig.4) 13 Anode F (Dig.3,Dig.4) 13 Cathode F (Dig.3,Dig.4) 14 Anode G (Dig.3,Dig.4) 14 Cathode G (Dig.3,Dig.4) 15 Common Cathode Dig.3 15 Common Anode Dig.3 16 Anode B (Dig.1,Dig.2) 16 Cathode B (Dig.1,Dig.2) 17 Anode A (Dig.1,Dig.2) 17 Cathode A (Dig.1,Dig.2) 18 Anode F (Dig.1,Dig.2) 18 Cathode F (Dig.1,Dig.2) 19 Anode G (Dig.1,Dig.2) 19 Cathode G (Dig.1,Dig.2) 20 Common Cathode Dig.1 20 Common Anode Dig.1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/7 PART NO. LFD4H5/62M-XX/RP9 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT MG Forward Current Per Chip IF 30 mA Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) IFP 120 mA Power Dissipation Per Chip PD 100 mW Ir 10 μA Operating Temperature Topr -25 ~ +85 ℃ Storage Temperature Tstg -25 ~ +85 ℃ Reverse Current Per Any Chip Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Part Selection And Application Information(Ratings at 25℃) Electrical common λP λD △λ Vf(v) Iv(mcd) IV-M cathode (nm) (nm) (nm) Material Emitted or anode Min. Typ. Max. Min. Typ. CHIP PART NO Common Cathode LFD4H52M-XX/RP9 GaP LFD4H62M-XX/RP9 564 Green 568 30 1.7 2.1 Common Anode Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 2.6 1.75 3.05 2:1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/7 PART NO. LFD4H5/62M-XX/RP9 Test Condition For Each Parameter Symbol Unit Test Condition Forward Voltage Per Chip Vf volt If=20mA Luminous Intensity Per Chip Iv mcd If=10mA Peak Wavelength λP nm If=20mA Dominant Wavelength λD nm If=20mA △λ nm If=20mA Ir μA Vr=5V Parameter Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio IV-M LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD4H5/62M-XX/RP9 Page 6/7 Typical Electro-Optical Characteristics Curve MG CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 1.0 2.0 3.0 4.0 5.0 1.0 10 1.2 1.1 1.0 0.9 0.8 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 600 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity @20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature -20 1000 Forward Current(mA) Forward Voltage(V) -40 100 650 Fig.6 Directive Radiation 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/7 PART NO. LFD4H5/62M-XX/RP9 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. Thermal Shock Test 1.Ta=105 ℃±5 ℃&-40 ℃±5 ℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 PACKING SPECIFICATION 1. 12PCS / TUBE 2. 56 TUBES / INNER BOX SIZE : L X W X H 55cm X 22.5cm X 10cm L W H 3. 4 INNER BOXES / CARTON SIZE : L X W X H 56.5cm X 47.5cm X 24cm L W H C/NO: MADE IN CHINA