LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only ROUND TYPE LED LAMPS Pb Lead-Free Parts LHR2640/P1/TRS-X DATA SHEET DOC. NO : QW0905- LHR2640/P1/TRS-X REV. : A DATE : 22 - Jul. - 2008 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHR2640/P1/TRS-X Page 1/6 Package Dimensions ΔH P2 H2 H1 W2 L W0 W1 P1 F - + D P T LHR2640/P1-PF 2.9 3.1 3.3 4.3 10.05±0.5 1.5MAX □0.5 TYP 25.0MIN 1.0MIN 2.54TYP + Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. W3 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/6 PART NO. LHR2640/P1/TRS-X Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT HR Forward Current IF 30 mA Peak Forward Current Duty 1/10@10KHz IFP 100 mA Power Dissipation PD 100 mW Reverse Current @5V Ir 10 μA Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Soldering Temperature Tsol Max 260 ℃ for 5 sec Max Typical Electrical & Optical Characteristics (Ta=25 ℃) COLOR PART NO LHR2640/P1/TRS-X MATERIAL GaAlAs Emitted Lens Red Red Diffused Peak wave length λPnm 660 Spectral halfwidth △λnm 20 Forward voltage @20mA(V) Luminous intensity @20mA(mcd) Min. Max. Min. Typ. 1.5 2.4 65 120 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Viewing angle 2θ1/2 (deg) 50 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHR2640/P1/TRS-X Page 3/6 •Dimensions Symbol Information SPECIFICATIONS OPTION SYMBOL CODE SYMBOL ITEMS Minimum Maximum mm inch mm inch Tape Feed Hole Diameter ------- D 3.8 0.15 4.2 0.17 Component Lead Pitch ------- F 2.3 0.09 3.0 0.12 Front-To-Rear Deflection ------- △H ------- ------- 2.0 0.08 TRS-1 TRS-2 TRS-3 TRS-4 TRS-5 TRS-6 TRS-7 TRS-8 TRS-9 TRS-10 H1 17.5 21.5 25.5 27.5 22.5 19.9 24.0 24.5 19.0 18.4 0.69 0.85 1.0 1.08 0.89 0.78 0.94 0.96 0.75 0.72 ------- H2 ------- ------- 18.5 22.5 26.5 28.5 23.5 20.9 25.0 25.5 20.0 19.4 36 0.73 0.89 1.04 1.12 0.93 0.82 0.98 1.0 0.79 0.76 1.42 Lead Length After Component Height ------- L 11.0 0.43 Feed Hole Pitch ------- P 12.4 0.49 13.0 0.51 Lead Location ------- P1 4.4 0.17 5.8 0.23 Center Of Component Location ------- P2 5.1 0.2 7.7 0.3 Overall Taped Package Thickness ------- T ------- ------- 1.42 0.06 Feed Hole Location ------- W0 8.5 0.33 9.75 0.38 Adhesive Tape Width ------- W1 14.5 0.57 15.5 0.61 Adhesive Tape Position ------- W2 0 0 4.0 0.16 Tape Width ------- W3 17.5 0.69 19.0 0.75 Feed Hole To Bottom Of Component Feed Hole To Overall Component Height W0 REMARK:TRS=Tape And Reel Straight Leads • Package Dimensions • Dimensions Symbol Information Specification Description Symbol minimum maxmum D3 mm inch mm inch Reel Diameter D 78.2 3.08 380 14.96 Core Diameter D1 34.9 1.37 102 4.02 Hub Recess Inside Diameter D2 28.6 1.13 88.0 3.46 Arbor Hole Diameter D3 13.8 0.54 38.1 1.5 Overall Reel Thickness T2 57.2 2.25 Iside Reel Flange Thickness T1 50.0 1.97 Quantity/Reel 30.0 1.18 500PCS MARKING D2 D1 T1 T2 D LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page4/6 PART NO. LHR2640/P1/TRS-X Typical Electro-Optical Characteristics Curve HR CHIP Fig.1 Forward current vs. Forward Voltage 3.0 Relative Intensity@20mA 1000 Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current 100 10 1.0 0.1 1.0 2.0 3.0 4.0 2.5 2.0 1.5 1.0 0.5 0 5.0 1.0 10 Fig.4 Relative Intensity vs. Temperature 1.2 Relative Intensity@20mA Forward Voltage@20mA Fig.3 Forward Voltage vs. Temperature 1.1 1.0 0.9 0.8 -20 -0 20 40 60 80 3.0 2.5 2.0 1.5 1.0 0.5 0 -40 100 -20 -0 20 40 60 80 100 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 1000 Forward Current(mA) Forward Voltage(V) -40 100 Directivity Radiation 0° 1.0 -30 ° 30° -60 ° 0.5 0 600 650 700 Wavelength (nm) 750 100% 75% 50% 60 ° 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHR2640/P1/TRS-X Page 5/6 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 2° /sec max 0 Preheat 60 Seconds Max 50 100 Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHR2640/P1/TRS-X Page 6/6 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11