LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SINGLE DIGIT SMD DISPLAY(0.28") Pb Lead-Free Parts LSSD205/6DGM-XX DATA SHEET DOC. NO : QW0905-LSSD205/6DGM-XX REV. : A DATE : 16 - Jun. - 2009 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/6DGM-XX Page 1/9 Package Dimensions 7.5(0.295") 3.75(0.148") 1.27X5=6.35 (0.25") 12 0.6(0.024") 7 0.98(0.039") 1.0 (0.039") A F 7.0 (0.28") B 10.0 10.8 (0.394") (0.425") G E C D DP 1 6 ψ0.9(0.035") R0.4 Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Recommended Soldering Pad Dimensions 1.0 2.1 8.5 1.27X6=7.62 Note : The tolerances unless mentioned is ± 0.1mm 12.7 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/6DGM-XX Page 2/9 Internal Circuit Diagram LSSD205DGM-XX 3,10 A B C D 11 12 2 4 E F 5 9 G DP 7 1 LSSD206DGM-XX 3,10 A B C D 11 12 2 4 E F 5 9 G DP 7 1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/6DGM-XX Page 3/9 Electrical Connection PIN NO. LSSD205DGM-XX PIN NO. LSSD206DGM-XX 1 Anode DP 1 Cathode DP 2 Anode C 2 Cathode C 3 Common Cathode 3 Common Anode 4 Anode D 4 Cathode D 5 Anode E 5 Cathode E 6 No Pin 6 No Pin 7 Anode G 7 Cathode G 8 Nc 8 Nc 9 Anode F 9 Cathode F 10 Common Cathode 10 Common Anode 11 Anode A 11 Cathode A 12 Anode B 12 Cathode B LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/9 PART NO. LSSD205/6DGM-XX Absolute Maximum Ratings at Ta=25 ℃ Parameter Symbol Ratings UNIT Power Dissipation Per Chip PD 80 mW Peak Forward Current Per Chip Duty 1/10@10KHz IFP 100 mA Forward Current Per Chip IF 20 mA Reverse Current Per Chip @5V Ir 50 μA Electrostatic Discharge ESD 500 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +85 ℃ Part Selection And Application Information(Ratings at 25℃) common cathode or anode Material Emitted CHIP PART NO △λ Vf(v) (nm) IV(mcd) Typ. Max. Min. IV-M Typ. Common Cathode LSSD205DGM-XX InGaN/SiC LSSD206DGM-XX Electrical λD (nm) Green 525 36 3.5 Common Anode Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 4.0 37 68 2:1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/6DGM-XX Page 5/9 Test Condition For Each Parameter Symbol Unit Test Condition Forward Voltage Per Chip Vf volt If=20mA Luminous Intensity Per Chip Iv mcd If=10mA λD nm If=20mA △λ nm If=20mA Ir μA Vr=5V Parameter Dominant Wavelegth Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio IV-M LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/6DGM-XX Page 6/9 Typical Electro-Optical Characteristics Curve DGM CHIP Fig.2 Relative Intensity vs. Forward Current Fig.1 Forward current vs. Forward Voltage 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 2.0 1.0 3.0 4.0 5.0 1.0 10 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 1.2 3.0 Relative Intensity@20mA Normalize @25 ℃ Forward Voltage@20mA Normalize @25 ℃ 1000 Forward Current(mA) Forward Voltage(V) 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 450 500 550 Wavelength (nm) 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA 100 600 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page7/9 PART NO. LSSD205/6DGM-XX Carrier Type Dimensions 4.0 1.5 2.0±0.2 1.75 0.3 11.5 24.0±0.3 11.1 12.0 7.8 4.15 Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm. Package Dimensions 1300PCS / REEL 28.6±0.5 24±0.5 13.5±0.5 99.5±1.5 330±2.0 2.5±0.2 立碁電子工業股份有限公司 LIGITEK ELEC TR ON ICS CO., LTD. PART NO. : L SSD205 DGM-20 LOT NO. : GS 1-96 0034 Q'TY(P CS) : 130 0 PCS BIN/HUE : Z1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/6DGM-XX Page 8/9 Recommended Soldering Conditions 1.Hand Solder : Soldering Iron:30W Max Temperature 280°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case) 2. PB-Free Reflow Solder Temp. (℃) 260°C/10 sec Max 260 rise +5° c/sec cooling -5°c/sec 220 200 180 Preheat 25 Time 120 sec Max 10 sec Max Above 220° C 60 sec Max Reflow Soldering should not be done more than two times. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 9/9 PART NO. LSSD205/6DGM-XX Reliability Test: Classification Test Item Test Condition Operating Life Test 1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) High Temperature High Humidity Storage Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=1000hrs ±2hrs Endurance Test Thermal Shock Test Solderability Test Environmental Test Temperature Cycling IR Reflow 1.Ta=105 ℃±5 ℃&-40 ℃±5℃ (10min) (10min) 2.total 300 cycles 1.T.Sol=235 ℃±5℃ 2.Immersion time 2 ±0.5sec 3.Coverage ≧95% of the dipped surface 1.105 ℃ ~ 25 ℃ ~ -55 ℃ ~ 25 ℃ 30mins 5mins 30mins 5mins 2.10 Cyeles 1.T=260 ° C Max. 10sec.Max. 2. 6 Min