LUXPIA LWH1000

LWH1000
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CONTENTS
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1. Features
2. Outline dimensions
3. Package material
4. Absolute Maximum Ratings
5. Electrical Optical Characteristics
6. Ranks
7. Taping
8. Packing Structure
9. Characteristic Diagrams
10. Precautions to taken
11. Reliability
12. Precautions in use
13. Revision history sheet
Different and Better
1/15
LWH1000
1. Features
• Package : SMD package1000
• 1.6×0.8×0.4 mm(L×W×H) small size surface mount type
• Color Coordinates : X = 0.30, Y = 0.30 acc. to CIE 1931, at IF=3mA
• Viewing angle : extremely wide(160˚)
• Technology : InGaN
• Soldering methods : IR reflow soldering
• Taping : 8 mm conductive black carrier tape & antistatic clear cover tape.
5000pcs/reel, Φ180 mm wheel
2. Outline dimensions
(unit : mm)
Different and Better
2/15
LWH1000
3. Package material
(1) Material construction
Number
Item
Material
1
PCB
C3965
2
Die adhesive
Epoxy
3
LED chip
GaN/Sapphire
4
Au wire
1.0mil
5
Mold epoxy
Clear Epoxy + Phosphor
Different and Better
3/15
LWH1000
4. Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Power dissipation
PD
70
mW
Forward Current
IF
20
mA
IFP
100
mA
Reverse Voltage
VR
5
V
Operating Temperature
Topr
-30∼+85
℃
Storage Temperature
Tstg
-40∼+100
℃
*2Soldering Temperature
Tsol
*1Peak Forward Current
240℃ for 5 seconds
*1.Duty ratio ≦ 1/10, Pulse Width ≦ 10msec.
*2.Mounted on PC board FR4(pad size ≥ 16 ㎟)
5. Electrical Optical Characteristics
Characteristic
ESD Check Forward Voltage
Reverse Current
*6Half Angle
(Ta = 25℃)
Symbol
Test Condition
Min.
Typ.
Max.
Unit
VF2
IF= 10uA
2.0
-
3.0
V
IR
VR=5V
-
-
10
uA
θ1/2
IF= 20mA
-
±80
-
deg
*6. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity
Different and Better
4/15
LWH1000
6. Ranks
(1) Chromaticity Coordinates ranks
(Ta=25℃)
Rank A
Rank B
Rank C
x
0.28
0.28
0.30
0.30
0.30
0.30
0.32
0.32
0.32
0.32
0.34
0.34
y
0.26
0.30
0.29
0.33
0.29
0.33
0.32
0.36
0.32
0.36
0.35
0.39
C
B
A
Different and Better
5/15
LWH1000
(2) Luminous intensity ranks
Iv RANK
Test Condition
C
D
IF= 3mA
E
(Ta=25℃)
Min.
Typ.
Max.
18
-
28
28
-
40
40
-
56
Unit
mcd
* Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ±11%.
* Intensity Measured : 0.01sr(CIE. LED_B)
(3) Forward Voltage
VF RANK
(Ta=25℃)
Min.
Typ.
Max.
0
2.60
-
2.70
1
2.70
-
2.80
2.80
-
2.90
3
2.90
-
3.00
4
3.00
-
3.10
2
Test Condition
IF= 3mA
Unit
V
* Voltages are tested at a current pulse duration of 1 ms and an accuracy of ±0.1V.
(4) Precautions On LED using
* To avoid optical difference, Please do not mix differently-ranked product.
Different and Better
6/15
LWH1000
7. Taping
(1) Dimension of wheel((Material : PS Conductive, 10E9~12Ω)
(Unit : mm)
(2) Dimension of tape(Material : PS Conductive, 10E4~5Ω)
(Unit : mm)
Different and Better
7/15
LWH1000
(3) Details of CHIP LEDs loading on tape
(End)
more than 40mm
unloaded tape
(Start)
mounted with LED
more than 40mm
unloaded tape
150 ~ 380mm
leading part
(4) Loading quantity per reel : 5,000pcs
8. Packing Structure
Different and Better
8/15
LWH1000
9. Characteristic Diagrams
(1) IF-VF Relative Luminous Intensity
(2) IV-IF
vs Forward Current
Max. Permissible Forward Current
Ta=25℃
Ta=25℃
30
Forward Current IF[mA]
Relative Luminous Intensity
1.5
1.0
0.5
20
10
mA
0
5
10
15
20
25
-25
30
0
20
40
60
80
100
Ambient Temperature Ta[℃]
(℃)
Forward Current IF[mA]
(3) Forward Current vs Forward Voltage
Ta=25℃
Ta=25℃
5.0
4.0
Forward Current IF[mA]
Forward Current IF[mA]
5.0
3.0
2.0
1.0
4.0
3.0
2.0
1.0
0
1.0
2.0
3.0
4.0
5.0V
VF RANK “0”
0
1.0
2.0
3.0
4.0
5.0V
VF RANK “1”
Different and Better
9/15
LWH1000
Ta=25℃
5.0
5.0
4.0
4.0
Forward Current IF[mA]
Forward Current IF[mA]
Ta=25℃
3.0
2.0
1.0
0
1.0
2.0
3.0
4.0
3.0
2.0
1.0
0
5.0V
VF RANK “2”
1.0
2.0
3.0
4.0
5.0V
VF RANK “3”
Different and Better
10/15
LWH1000
(4) Relative Spectral Emission
V(λ) = Standard eye response curve
TA=25℃ , IF = 3mA
(5) Radiation Characteristic
TA=25℃ , IF = 20mA
1.0
Relative Intensity(%)
0.8
0.6
0.4
0.2
0
20
40
60
80
100
120
Angular Displacement(˚)
Different and Better
11/15
LWH1000
10. Precautions to taken
(1) Reflow soldering
(2) For manual solder
Not more than 5sec @max300℃, under soldering iron
(3) Recommendable soldering pattern(For reflow soldering)
Different and Better
12/15
LWH1000
11. Reliability
(1) The Reliability criteria of SMD LED
ITEM
Symbol
Limit
Test Condition
Min.
Max.
Forward Voltage
VF
IF = 20mA
I.V × 0.8
I.V × 1.2
Reverse Current
IR
VR = 5V
-
50uA
Luminous intensity
Iv
IF = 20mA
I.V × 0.5
I.V × 1.5
* I : Initial Value
U : Upper Spec Limit
L : Lower Spec Limit
(2) Results of reliability Test
NO
Item
Test Conditions
Test
Hours
/Cycle
1
Steady state Operating
Life Test(OLT)
TA = 25℃
IF=20mA
1000HR’s
45 pcs
0/1
2
Steady state Operating
Life of Low Temperature
(LTOL)
TA = -30℃
IF=20mA
1000HR’s
45 pcs
0/1
3
Steady state Operating
Life of High Temperature
(HTOL)
TA = 85℃
IF=5mA
1000HR’s
45 pcs
0/1
4
Steady state Operating
Life of High Humidity Heat
(H3TOL)
TA = 60℃, RH=90%
IF=10mA
1000HR’s
45 pcs
0/1
5
Temperature Cycle
(T/C)
TA=-40℃/room/100℃
(30min/5min/30min
100
cycle
45 pcs
0/1
Sample
Size
Ac/Re
Different and Better
13/15
LWH1000
12. Precautions in use
(1) Soldering Conditions
1) When soldering, leave minimum clearance between the resin and the soldering point.
2) Maximum allowable soldering conditions
Soldering dipping : 260 degrees C max., 5 seconds max., 1 time.
Soldering iron : 350 degrees C max., 5 seconds max., 1 time, power 40w max.
3) Contact between molten solder and the resin must be avoided.
4) Correction the soldered position after soldering must be avoided.
5) In soldering, do not apply any stress to the lead frame, particularly when heated.
6) When other SMD parts on the same circuit board and adhesive is to be cured, maximum
allowable conditions are : 120 degrees C max., 60 seconds max.
(2) Lead forming and cut
1)
2)
3)
4)
Lead forming must be done below the tie bar cutting portion.
When forming a lead, do not stress the resin case.
Lead forming must be done before soldering.
Cutting the lead frame at high temperature may result in personal injury.
Cut the lead frame at room temperature.
(3) Assembly
1) Do not apply any stress to the lead frame while assembling.
2) When mounting products onto PCBs, the pitch between the mounting holes must match the
pitch of the LEDs.
(4) Static Electricity
1) These products are sensitive, a high standard of care must be used. Particularly if an overcurrent and over-voltage which exceeds the Absolute Maximum Rating of Products is applied,
the overflow in energy may cause damage to, or possibly result in destruction of, the Products.
Customer shall take absolutely secure countermeasures against static electricity and surge
when handling Products.
2) A protection device should be installed in the LED driving circuit, which dose not exceed the
max. rating for surge current during on/off switching.
3) Proper grounding of Products, use of conductive mat, semiconductive working uniform and
shoes, and semiconductive containers are considered to be effective as countermeasures
against static electricity and surge.
4) A soldering iron with a grounded tip is recommended. An ionizer should also be installed where
risk of static generation is high.
(5) Safety Precautions
1) Users must comply with the laws and public regulations concerning safety.
The light output of the products may cause injuries to human eyes in circumstances where
the products are viewed directly with unshielded eyes for more than a few seconds.
Different and Better
14/15
LWH1000
13. Revision history sheet
Spec NO.
Title
Times
1
2
3
4
Specification for Approval
Date
2002.
2003.
2003.
2004.
02.
02.
11.
04.
Summary of revision
08
26
17
22
Remarks
신규 제정
자재 변경
특성 변경
VF, Iv 변경
Different and Better
15/15