LWH1000 - CONTENTS - 1. Features 2. Outline dimensions 3. Package material 4. Absolute Maximum Ratings 5. Electrical Optical Characteristics 6. Ranks 7. Taping 8. Packing Structure 9. Characteristic Diagrams 10. Precautions to taken 11. Reliability 12. Precautions in use 13. Revision history sheet Different and Better 1/15 LWH1000 1. Features • Package : SMD package1000 • 1.6×0.8×0.4 mm(L×W×H) small size surface mount type • Color Coordinates : X = 0.30, Y = 0.30 acc. to CIE 1931, at IF=3mA • Viewing angle : extremely wide(160˚) • Technology : InGaN • Soldering methods : IR reflow soldering • Taping : 8 mm conductive black carrier tape & antistatic clear cover tape. 5000pcs/reel, Φ180 mm wheel 2. Outline dimensions (unit : mm) Different and Better 2/15 LWH1000 3. Package material (1) Material construction Number Item Material 1 PCB C3965 2 Die adhesive Epoxy 3 LED chip GaN/Sapphire 4 Au wire 1.0mil 5 Mold epoxy Clear Epoxy + Phosphor Different and Better 3/15 LWH1000 4. Absolute Maximum Ratings Parameter Symbol Value Unit Power dissipation PD 70 mW Forward Current IF 20 mA IFP 100 mA Reverse Voltage VR 5 V Operating Temperature Topr -30∼+85 ℃ Storage Temperature Tstg -40∼+100 ℃ *2Soldering Temperature Tsol *1Peak Forward Current 240℃ for 5 seconds *1.Duty ratio ≦ 1/10, Pulse Width ≦ 10msec. *2.Mounted on PC board FR4(pad size ≥ 16 ㎟) 5. Electrical Optical Characteristics Characteristic ESD Check Forward Voltage Reverse Current *6Half Angle (Ta = 25℃) Symbol Test Condition Min. Typ. Max. Unit VF2 IF= 10uA 2.0 - 3.0 V IR VR=5V - - 10 uA θ1/2 IF= 20mA - ±80 - deg *6. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity Different and Better 4/15 LWH1000 6. Ranks (1) Chromaticity Coordinates ranks (Ta=25℃) Rank A Rank B Rank C x 0.28 0.28 0.30 0.30 0.30 0.30 0.32 0.32 0.32 0.32 0.34 0.34 y 0.26 0.30 0.29 0.33 0.29 0.33 0.32 0.36 0.32 0.36 0.35 0.39 C B A Different and Better 5/15 LWH1000 (2) Luminous intensity ranks Iv RANK Test Condition C D IF= 3mA E (Ta=25℃) Min. Typ. Max. 18 - 28 28 - 40 40 - 56 Unit mcd * Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ±11%. * Intensity Measured : 0.01sr(CIE. LED_B) (3) Forward Voltage VF RANK (Ta=25℃) Min. Typ. Max. 0 2.60 - 2.70 1 2.70 - 2.80 2.80 - 2.90 3 2.90 - 3.00 4 3.00 - 3.10 2 Test Condition IF= 3mA Unit V * Voltages are tested at a current pulse duration of 1 ms and an accuracy of ±0.1V. (4) Precautions On LED using * To avoid optical difference, Please do not mix differently-ranked product. Different and Better 6/15 LWH1000 7. Taping (1) Dimension of wheel((Material : PS Conductive, 10E9~12Ω) (Unit : mm) (2) Dimension of tape(Material : PS Conductive, 10E4~5Ω) (Unit : mm) Different and Better 7/15 LWH1000 (3) Details of CHIP LEDs loading on tape (End) more than 40mm unloaded tape (Start) mounted with LED more than 40mm unloaded tape 150 ~ 380mm leading part (4) Loading quantity per reel : 5,000pcs 8. Packing Structure Different and Better 8/15 LWH1000 9. Characteristic Diagrams (1) IF-VF Relative Luminous Intensity (2) IV-IF vs Forward Current Max. Permissible Forward Current Ta=25℃ Ta=25℃ 30 Forward Current IF[mA] Relative Luminous Intensity 1.5 1.0 0.5 20 10 mA 0 5 10 15 20 25 -25 30 0 20 40 60 80 100 Ambient Temperature Ta[℃] (℃) Forward Current IF[mA] (3) Forward Current vs Forward Voltage Ta=25℃ Ta=25℃ 5.0 4.0 Forward Current IF[mA] Forward Current IF[mA] 5.0 3.0 2.0 1.0 4.0 3.0 2.0 1.0 0 1.0 2.0 3.0 4.0 5.0V VF RANK “0” 0 1.0 2.0 3.0 4.0 5.0V VF RANK “1” Different and Better 9/15 LWH1000 Ta=25℃ 5.0 5.0 4.0 4.0 Forward Current IF[mA] Forward Current IF[mA] Ta=25℃ 3.0 2.0 1.0 0 1.0 2.0 3.0 4.0 3.0 2.0 1.0 0 5.0V VF RANK “2” 1.0 2.0 3.0 4.0 5.0V VF RANK “3” Different and Better 10/15 LWH1000 (4) Relative Spectral Emission V(λ) = Standard eye response curve TA=25℃ , IF = 3mA (5) Radiation Characteristic TA=25℃ , IF = 20mA 1.0 Relative Intensity(%) 0.8 0.6 0.4 0.2 0 20 40 60 80 100 120 Angular Displacement(˚) Different and Better 11/15 LWH1000 10. Precautions to taken (1) Reflow soldering (2) For manual solder Not more than 5sec @max300℃, under soldering iron (3) Recommendable soldering pattern(For reflow soldering) Different and Better 12/15 LWH1000 11. Reliability (1) The Reliability criteria of SMD LED ITEM Symbol Limit Test Condition Min. Max. Forward Voltage VF IF = 20mA I.V × 0.8 I.V × 1.2 Reverse Current IR VR = 5V - 50uA Luminous intensity Iv IF = 20mA I.V × 0.5 I.V × 1.5 * I : Initial Value U : Upper Spec Limit L : Lower Spec Limit (2) Results of reliability Test NO Item Test Conditions Test Hours /Cycle 1 Steady state Operating Life Test(OLT) TA = 25℃ IF=20mA 1000HR’s 45 pcs 0/1 2 Steady state Operating Life of Low Temperature (LTOL) TA = -30℃ IF=20mA 1000HR’s 45 pcs 0/1 3 Steady state Operating Life of High Temperature (HTOL) TA = 85℃ IF=5mA 1000HR’s 45 pcs 0/1 4 Steady state Operating Life of High Humidity Heat (H3TOL) TA = 60℃, RH=90% IF=10mA 1000HR’s 45 pcs 0/1 5 Temperature Cycle (T/C) TA=-40℃/room/100℃ (30min/5min/30min 100 cycle 45 pcs 0/1 Sample Size Ac/Re Different and Better 13/15 LWH1000 12. Precautions in use (1) Soldering Conditions 1) When soldering, leave minimum clearance between the resin and the soldering point. 2) Maximum allowable soldering conditions Soldering dipping : 260 degrees C max., 5 seconds max., 1 time. Soldering iron : 350 degrees C max., 5 seconds max., 1 time, power 40w max. 3) Contact between molten solder and the resin must be avoided. 4) Correction the soldered position after soldering must be avoided. 5) In soldering, do not apply any stress to the lead frame, particularly when heated. 6) When other SMD parts on the same circuit board and adhesive is to be cured, maximum allowable conditions are : 120 degrees C max., 60 seconds max. (2) Lead forming and cut 1) 2) 3) 4) Lead forming must be done below the tie bar cutting portion. When forming a lead, do not stress the resin case. Lead forming must be done before soldering. Cutting the lead frame at high temperature may result in personal injury. Cut the lead frame at room temperature. (3) Assembly 1) Do not apply any stress to the lead frame while assembling. 2) When mounting products onto PCBs, the pitch between the mounting holes must match the pitch of the LEDs. (4) Static Electricity 1) These products are sensitive, a high standard of care must be used. Particularly if an overcurrent and over-voltage which exceeds the Absolute Maximum Rating of Products is applied, the overflow in energy may cause damage to, or possibly result in destruction of, the Products. Customer shall take absolutely secure countermeasures against static electricity and surge when handling Products. 2) A protection device should be installed in the LED driving circuit, which dose not exceed the max. rating for surge current during on/off switching. 3) Proper grounding of Products, use of conductive mat, semiconductive working uniform and shoes, and semiconductive containers are considered to be effective as countermeasures against static electricity and surge. 4) A soldering iron with a grounded tip is recommended. An ionizer should also be installed where risk of static generation is high. (5) Safety Precautions 1) Users must comply with the laws and public regulations concerning safety. The light output of the products may cause injuries to human eyes in circumstances where the products are viewed directly with unshielded eyes for more than a few seconds. Different and Better 14/15 LWH1000 13. Revision history sheet Spec NO. Title Times 1 2 3 4 Specification for Approval Date 2002. 2003. 2003. 2004. 02. 02. 11. 04. Summary of revision 08 26 17 22 Remarks 신규 제정 자재 변경 특성 변경 VF, Iv 변경 Different and Better 15/15