LGH1000 - CONTENTS - 1. Features 2. Outline dimensions 3. Package material 4. Absolute Maximum Ratings 5. Electrical Optical Characteristics 6. Ranks 7. Taping 8. Packing Structure 9. Characteristic Diagrams 10. Precautions to taken 11. Reliability 12. Precautions in use 13. Revision history sheet Different and Better 1/15 LGH1000 1. Features • Package : SMD package1000 • Colorless transparency • 1.6×0.8×0.4 mm(L×W×H) small size surface mount type • Wavelength : 525nm(P-Green) • Viewing angle : extremely wide(160˚) • Technology : InGaN • Soldering methods : IR reflow soldering • Taping : 8 mm conductive black carrier tape & antistatic clear cover tape. 5000pcs/reel, Φ180 mm wheel 2. Outline dimensions (unit : mm) Different and Better 2/15 LGH1000 3. Package material (1) Material construction Number Item Material 1 PCB C3965 2 Die adhesive Epoxy 3 LED chip GaN/Sapphire 4 Au wire Wire 5 Mold epoxy Epoxy Different and Better 3/15 LGH1000 4. Absolute Maximum Ratings (Ta= 25℃) Parameter Symbol Value Unit Power dissipation PD 70 mW Forward Current IF 20 mA IFP 100 mA Reverse Voltage VR 5 V Operating Temperature Topr -30∼+85 ℃ Storage Temperature Tstg -40∼+100 ℃ *2Soldering Temperature Tsol *1Peak Forward Current 245℃ for 5 seconds *1.Duty ratio ≦ 1/10, Pulse Width ≦ 10msec. *2.Mounted on PC board FR4(pad size ≥ 16 ㎟) 5. Electrical Optical Characteristics Characteristic Forward Voltage Symbol Test Condition Min. Typ. Max. IF= 3mA 2.6 - 3.0 IF= 20mA 3.0 - 3.6 IF= 10㎂ 1.8 - - V 534 - 546 nm 28 - 80 mcd VF ESD Check Forward Voltage VF2 Dominant Wavelength Wd (Ta = 25℃) IF= 3mA Unit V Luminous intensity Iv Spectrum Bandwidth Δλ - 20 - nm Dominant Wavelength Wd 520 - 530 nm 110 - 300 mcd - 20 - nm IF= 20mA Luminous intensity Iv Spectrum Bandwidth Δλ Reverse Current IR VR=5V - - 50 uA θ1/2 IF= 20mA - ±80 - deg *6Half Angle *6. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Different and Better 4/15 LGH1000 6. Ranks (1) Dominant Wavelength WD RANK (Ta=25℃) Test Condition A Min. Typ. Max. 534 - 540 540 - 546 520 - 525 525 - 530 IF= 3mA B C nm IF= 20mA D Unit nm * Wavelength are tested at a current pulse duration 25ms and an accuracy of ±1 nm. * Wavelength(at IF=20mA) are only for reference. (2) Luminous intensity ranks Iv RANK Test Condition (Ta=25℃) Min. Typ. Max. 28 - 40 40 - 56 F 56 - 80 H 110 - 150 150 - 210 210 - 300 D E IF= 3mA Unit mcd J IF= 20mA K * Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ±11%. Intensity Measured : 0.01sr(CIE. LED_B) * Luminous intensity(at IF=20mA) are only for reference. Different and Better 5/15 LGH1000 (3) Forward Voltage VF RANK (Ta=25℃) Test Condition Min. Typ. Max. 2.60 - 2.70 2.70 - 2.80 2 2.80 - 2.90 3 2.90 - 3.00 4 3.00 - 3.15 3.15 - 3.30 6 3.30 - 3.45 7 3.45 - 3.60 0 1 Unit IF= 3mA V 5 IF= 20mA * Voltages are tested at a current pulse duration of 1 ms and an accuracy of ±0.1V. * Voltages(at IF=20mA) are only for reference (4) Precautions On LED using * To avoid optical difference, Please do not mix differently-ranked product. Different and Better 6/15 LGH1000 7. Taping (1) Dimension of wheel((Material : PS Conductive, 10E9~12Ω) (2) Dimension of tape(Material : PS Conductive, 10E4~5Ω) (Unit : mm) (Unit : mm) Different and Better 7/15 LGH1000 (3) Details of CHIP LEDs loading on tape (End) more than 40mm (Start) mounted with LED unloaded tape more than 40mm 150 ~ 380mm unloaded tape leading part (4) Loading quantity per reel : 5,000pcs 8. Packing Structure Different and Better 8/15 LGH1000 ■ Characteristic Diagrams Fig.2 IV-IF Fig.1 IF-VF Relative Luminous Intensity vs Forward Current Max. Permissible Forward Current Ta=25℃ Ta=25℃ Forward Current IF[mA] Relative Luminous Intensity 30 0 5 10 15 20 25 30 20 10 -25 Forward Current IF[mA] 0 20 40 60 80 100 Ambient Temperature Ta[℃] Fig.3 Forward Current vs. Forward Voltage Fig. 4 Spectrum Distribution Ta=25℃ Ta=25℃ Relative Intensity[%] Forward Current IF[mA] 50 10 1 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4 Wavelength λ [nm] Forward Voltage VF[V] Different and Better 9/15 LGH1000 Fig. 5 Relative Spectral Emission TA=25℃ , IF = 20mA 1.0 0.8 0.6 0.4 0.2 0 20 40 60 80 100 120 Fig.6 Recommended Solder Pad Different and Better 10/15 LGH1000 10. Precautions to taken (1) Reflow soldering (2) For manual solder Not more than 5sec @max300℃, under soldering iron (3) Recommendable soldering pattern(For reflow soldering) Different and Better 11/15 LGH1000 11. Reliability (1) The Reliability criteria of SMD LED ITEM Symbol Test Condition Forward Voltage VF Reverse Current Luminous intensity * I : Initial Value Limit Min. Max. IF = 20mA I.V × 0.8 I.V × 1.2 IR VR = 5V LSL - Iv IF = 20mA I.V × 0.7 I.V × 1.3 U : Upper Spec Limit L : Lower Spec Limit (2) Results of reliability Test Test NO Item Test Conditions Hours /Cycle H : +100℃ 30min 1 Temperature Cycle ∫ 5min L : -30℃ 30min 200 cycle Sample Size Ac/Re 45 pcs 0/1 2 High Temperature Storage TEMP : 80℃ 1000HR’s 45 pcs 0/1 3 Low Temperature Storage TEMP : -30℃ 1000HR’s 45 pcs 0/1 4 DC Operating Life IF : 20mA 1000HR’s 45 pcs 0/1 85℃/85% RH 1000HR’s 45 pcs 0/1 5 High Temperature/ High Humidity Different and Better 12/15 LGH1000 12. Precautions in use (1) Soldering Conditions 1) When soldering, leave minimum clearance between the resin and the soldering point. 2) Maximum allowable soldering conditions Soldering dipping : 260 degrees C max., 5 seconds max., 1 time. Soldering iron : 350 degrees C max., 5 seconds max., 1 time, power 40w max. 3) Contact between molten solder and the resin must be avoided. 4) Correction the soldered position after soldering must be avoided. 5) In soldering, do not apply any stress to the lead frame, particularly when heated. 6) When other SMD parts on the same circuit board and adhesive is to be cured, maximum allowable conditions are : 120 degrees C max., 60 seconds max. (2) Lead forming and cut 1) Lead forming must be done below the tie bar cutting portion. 2) When forming a lead, do not stress the resin case. 3) Lead forming must be done before soldering. 4) Cutting the lead frame at high temperature may result in personal injury. Cut the lead frame at room temperature. (3) Assembly 1) Do not apply any stress to the lead frame while assembling. 2) When mounting products onto PCBs, the pitch between the mounting holes must match the pitch of the LEDs. (4) Static Electricity 1) These products are sensitive, a high standard of care must be used. Particularly if an overcurrent and over-voltage which exceeds the Absolute Maximum Rating of Products is applied, the overflow in energy may cause damage to, or possibly result in destruction of, the Products. Customer shall take absolutely secure countermeasures against static electricity and surge when handling Products. 2) A protection device should be installed in the LED driving circuit, which dose not exceed the max. rating for surge current during on/off switching. 3) Proper grounding of Products, use of conductive mat, semiconductive working uniform and shoes, and semiconductive containers are considered to be effective as countermeasures against static electricity and surge. Different and Better 13/15 LGH1000 4) A soldering iron with a grounded tip is recommended. An ionizer should also be installed where risk of static generation is high. (5) Safety Precautions 1) Users must comply with the laws and public regulations concerning safety. The light output of the products may cause injuries to human eyes in circumstances where the products are viewed directly with unshielded eyes for more than a few seconds. Different and Better 14/15 LGH1000 13. Revision history sheet Spec NO. Title Specification for Approval Times Date Summary of revision 1 2002. 02. 08 신규제정 2 2002. 05. 28 Iv, WD, VF 수정 및 추가 3 2004. 04. 19 VF 수정 Remarks Different and Better 15/15