LBW1025 - CONTENTS 1. Features 2. Outline dimensions 3. Package material 4. Absolute Maximum Ratings 5. Electrical Optical Characteristics 6. Ranks 7. Taping 8. Packing Structure 9. Characteristic Diagrams 10. Precautions to taken 11. Reliability 12. Precautions in use 1/13 - LBW1025 1. Features • Package : SMD Side View Type • 2.8 × 1.2 × 0.8 mm(L×W×H) small size surface mount type • Color Coordinates : x = 0.20, y = 0.16 acc. to CIE 1931, at If=20mA • Viewing angle : extremely wide(110˚) • Technology : InGaN • Soldering methods : IR reflow soldering • Taping : 8 mm conductive black carrier tape & antistatic clear cover tape. 3,500pcs/reel, Φ180 mm wheel 2. Outline dimensions (unit : mm) General Tolerance : ±0.1 2/13 LBW1025 3. Package material (1) Material construction Number Item Material 1 LED Chip InGaN 2 Wire Au Wire 3 Lead Frame Copper Alloy/Ni/Ag plating 4 Encapsulation Transparent encapsulation + Phosphor 5 Heat-Resistant Polymer NM114WA 3/13 LBW1025 4. Absolute Maximum Ratings Parameter (Ta = 25℃) Symbol Value Unit Power dissipation PD 100 mW Forward Current IF 30 mA IFP 100 mA Reverse Voltage VR 5 V Operating Temperature Topr -30∼+85 ℃ Storage Temperature Tstg -40∼+100 ℃ Soldering Temperature Tsol *1Peak Forward Current 260℃ for 10 seconds *1. IFP Conditions : Pulse Width ≤ 10msec. and Duty ≤ 1/10 5. Electrical Optical Characteristics (Ta = 25℃) Characteristic Symbol Test Condition Min. Typ. Max. Unit Forward Voltage VF IF= 20mA 3.0 - 3.6 V ESD Check Forward Voltage VF2 IF= 10uA 1.8 - - V Reverse Current IR VR=5V - - 10 uA *6Half Angle θ1/2 IF= 20mA - ±55 - deg *6. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity * Voltages are tested at a current pulse duration of 1 ms and an accuracy of ±0.1V. 4/13 LBW1025 6. Ranks (1)Chromaticity Coordinates Ranks (Ta=25℃) Rank A1 Rank B1 x 0.18 0.18 0.20 0.20 x 0.20 0.20 0.22 0.22 y 0.11 0.13 0.16 0.14 y 0.14 0.16 0.19 0.17 Rank A2 Rank B2 x 0.18 0.18 0.20 0.20 x 0.20 0.20 0.22 0.22 y 0.13 0.15 0.18 0.16 y 0.16 0.18 0.21 0.19 * The CIE(1931) standard colorimetric system * Chromaticity Coordinates Measured : 0.01sr(CIE. LED_B) * Measurement Uncertainty of the Color Coordinates : ±0.01 B2 B1 A2 A1 5/13 LBW1025 (2)Luminous Intensity Ranks Iv RANK Test Condition P (Ta=25℃) Min. Typ. Max. 190 - 270 270 - 360 IF= 20mA Q Unit mcd * Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ±11%. * Luminous Intensity Measured : 0.01sr(CIE. LED_B) (3) Forward Voltage VF RANK (Ta=25℃) Test Condition 1 Min. Typ. Max. 3.0 - 3.2 Unit V 2 IF= 20mA 3 3.2 - 3.4 3.4 - 3.6 * Voltages are tested at a current pulse duration of 1 ms and an accuracy of ±0.1V. (4) Precautions On LED using * To avoid optical difference, Please do not mix differently-ranked product. 6/13 LBW1025 7. Taping (1) Dimension of wheel((Material : PS Conductive, 10E9~12Ω) (Unit : mm) (2) Dimension of tape(Material : PS Conductive, 10E4~5Ω) (Unit : mm) 7/13 LBW1025 (3) Details of CHIP LEDs loading on tape (End) more than 40mm unloaded tape (Start) mounted with LED (3,500ea) more than 40mm unloaded tape (4) Loading quantity per reel : 3,500pcs 8. Packing Structure 8/13 150 ~ 380mm leading part LBW1025 9. Characteristic Diagrams (2) Max. Permissible Forward Current (1) Relative Luminous Intensity vs Forward Current (IF-Iv) 35 2.5 30 25 Allowable If(mA) Relative Luminosity 2 1.5 1 20 ` 15 10 0.5 5 0 0 0 20 40 60 80 0 20 60 80 100 Ambient Temp Ta(℃) Forward Current(mA) (3) Forward Current vs Forward Voltage(If-Vf) (4) Ambient Temperature vs Relative Luminosity 10 Relative Luminosity 100 Forward Current If(mA) 40 10 0.1 -40 1 2.5 3 3.5 4 1 4.5 -20 0 20 40 60 Ambient Temp(℃) Forward Voltage(V) 9/13 80 100 LBW1025 (4) Relative Spectral Emission V(λ) = Standard eye response curve (5) Radiation Characteristic Ta=25℃, IF = 20mA Ta=25℃ , IF = 20mA 10/13 LBW1025 10. Precautions to taken (1) Reflow soldering (2) For manual solder Not more than 3sec @max350℃, under soldering iron (3) Recommendable soldering pattern(For reflow soldering) 11/13 LBW1025 11. Reliability (1) The Reliability criteria of SMD LED Limit ITEM Symbol Test Condition Min. Max. Forward Voltage VF IF = 20mA I.V × 0.8 I.V × 1.2 Reverse Voltage VR IR = 10㎂ LSL - Luminous intensity Iv IF = 20mA I.V × 0.7 I.V × 1.3 * I : Initial Value U : Upper Spec Limit L : Lower Spec Limit (2) Results of reliability Test NO Item Test Conditions Test Hours /Cycle Sample Size Ac/Re 1 Temperature Cycle H : +100℃ 30min 25℃ 5min L : -40℃ 30min 100 Cycle 21 pcs 0/1 2 High Temperature Operating Life TEMP : 85℃ (IF=5mA) 1000HR’s 21 pcs 0/1 3 Low Temperature Operating Life TEMP : -30℃ (IF=20mA) 1000HR’s 21 pcs 0/1 4 DC Operating Life TEMP : 24℃ (IF=30mA) 500HR’s 21 pcs 0/1 5 High Humidity Heat Operating Life 60℃/90% RH, (IF=15mA) 500HR’s 21 pcs 0/1 6 Solder Heat Test 260℃, 10sec. 2 Time 21 pcs 0/1 12/13 LBW1025 12. Precautions in use (1) Soldering Conditions 1) When soldering, leave minimum clearance between the resin and the soldering point. 2) Maximum allowable soldering conditions Soldering dipping : 260 degrees C max., 10 seconds max., 2 time. Soldering iron : 350 degrees C max., 3 seconds max., 1 time, power 40w max. 3) Contact between molten solder and the resin must be avoided. 4) Correction the soldered position after soldering must be avoided. 5) In soldering, do not apply any stress to the lead frame, particularly when heated. 6) When other SMD parts on the same circuit board and adhesive is to be cured, maximum allowable conditions are : 120 degrees C max., 60 seconds max. (2) Lead forming and cut 1) 2) 3) 4) Lead forming must be done below the tie bar cutting portion. When forming a lead, do not stress the resin case. Lead forming must be done before soldering. Cutting the lead frame at high temperature may result in personal injury. Cut the lead frame at room temperature. (3) Assembly 1) Do not apply any stress to the lead frame while assembling. 2) When mounting products onto PCBs, the pitch between the mounting holes must match the pitch of the LEDs. (4) Static Electricity 1) These products are sensitive, a high standard of care must be used. Particularly if an overcurrent and over-voltage which exceeds the Absolute Maximum Rating of Products is applied, the overflow in energy may cause damage to, or possibly result in destruction of, the Products. Customer shall take absolutely secure countermeasures against static electricity and surge when handling Products. 2) A protection device should be installed in the LED driving circuit, which dose not exceed the max. rating for surge current during on/off switching. 3) Proper grounding of Products, use of conductive mat, semiconductive working uniform and shoes, and semiconductive containers are considered to be effective as countermeasures against static electricity and surge. 4) A soldering iron with a grounded tip is recommended. An ionizer should also be installed where risk of static generation is high. (5) Safety Precautions 1) Users must comply with the laws and public regulations concerning safety. The light output of the products may cause injuries to human eyes in circumstances where the products are viewed directly with unshielded eyes for more than a few seconds. 13/13