3Northway Lane North Latham,New York 12110. Tollfree:1.800.984.5337 Phone:1.518.956.2980 Fax:1.518.785.4725 Http://www.marktechopto.com SPECIFICATION PART NO. : MT4194-HR-A 1.0×4.8mm RECTANGULAR LAMP(STEP TYPE) ATTENTION OBSERVE PRECAUTION FOR HANDLING ELECTRO STATIC SENSITIVE DEVICES 1.0×4.8mm RECTANGULAR LAMP(STEP TYPE) MT4194-HR-A Description This Hi-Effect red lamp is made with GaAsP/GaP chip and red diffused epoxy resin. 0.5 MAX. 2.54±0.1 A K Notes: 1. All dimensions are in mm. 2. Tolerance is ± 0.25mm unless otherwise noted. Description LED Chip Part No. MT4194-HR-A Material Emitting Color GaAsP/GaP Hi-Effect Red VER.: 01 Lens Color Red diffused Date: 2007/11/02 Page: 1/5 MT4194-HR-A 1.0×4.8mm RECTANGULAR LAMP(STEP TYPE) Absolute Maximum Ratings at Ta=25℃ Parameter Symbol Rating Unit Power Dissipation PD 78 mW Reverse Voltage VR 5 V D.C. Forward Current If 30 mA Reverse (Leakage) Current Ir 100 μA If(Peak) 100 mA Operating Temperature Range Topr. -40 to +95 ℃ Storage Temperature Range Tstg. -40 to +100 ℃ Soldering Temperature(1.6mm from body) Tsol Peak Current(1/10Duty Cycle,0.1ms Pulse Width.) Dip Soldering : 260℃ for 5 sec. Hand Soldering : 350℃ for 3 sec. Electrical and Optical Characteristics: Parameter Symbol Condition Min. Typ. Max. Unit Luminous Intensity IV If=20mA 3.0 8.0 13.7 mcd Forward Voltage Vf If=20mA 2.1 2.6 V Peak Wavelength λp If=20mA 642 Dominant Wavelength λd If=20mA Reverse (Leakage) Current Ir Vr=5V 2θ1/2 If=20mA 120 deg ∆λ If=20mA 35 nm Viewing Angle Spectrum Line Halfwidth 624 629 nm 636 nm 100 µA Notes:1. The datas tested by IS tester. 2. Customer’s special requirements are also welcome. VER.: 01 Date: 2007/11/02 Page: 2/5 1.0×4.8mm RECTANGULAR LAMP(STEP TYPE) MT4194-HR-A Typical Electrical / Optical Characteristics Curves : 10.0 Relative Luminous Intensity Forward Current IF(mA) 50 40 30 20 10 1.2 1.6 2.0 2.4 2.8 8.0 6.0 4.0 2.0 0 3.2 Applied Voltage (V) 20.0 10.0 0.0 30.0 Forward Current (mA) FORWARD CURRENT VS.APPLIED VOLTAGE FORWARD CURRENT VS. LUMINOUS INTENSITY 0° 10° 20° Forward Current IF(mA) 50 30° 40 40° 30 1.0 20 60° 0.8 10 0 50° 0.9 20 40 60 Temperature (℃) 80 100 FORWARD CURRENT VS. AMBIENT TEMPERATURE 70° 80° 90° 0.7 0.5 0.3 0.1 0.2 0.4 0.6 RADIATION DIAGRAM VER.: 01 Date: 2007/11/02 Page: 3/5 MT4194-HR-A 1.0×4.8mm RECTANGULAR LAMP(STEP TYPE) Specifications for Bin Grading: Iv(mcd) BIN MIN. MAX. A 3.0 5.0 B 5.0 7.0 C 7.0 9.8 D 9.8 13.7 Specifications for Vf Group: Vf(V) Group MIN. MAX. V1 1.6 1.8 V2 1.8 2.0 V3 2.0 2.2 V4 2.2 2.4 V5 2.4 2.6 *Majority VF bins are highlighted in Yellow. Specifications for Wavelength Group: λD(nm) @20mA Group MIN. MAX. X3 624 627 X4 627 630 X5 630 633 X6 633 636 VER.: 01 Date: 2007/11/02 Page: 4/5 MT4194-HR-A 1.0×4.8mm RECTANGULAR LAMP(STEP TYPE) Precautions: TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130℃. At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), <Same for products with terminal leads> (1) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) Solder dip: Preheat: 90℃ max. (Backside of PCB), Within 60 seconds Solder bath: 260±5℃ (Solder temperature), Within 5 seconds (3) Soldering iron : 350℃ max. (Temperature of soldering iron tip), Within 3 seconds 3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same 4. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120℃ max. Baking time: Within 60 seconds If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature. VER.: 01 Date: 2007/11/02 Page: 5/5