TB62701ANG
TOSHIBA Bi−CMOS INTEGRATED CIRCUIT
SILICON MONOLITHIC
TB62701ANG
16BIT SHIFT REGISTER, LATCH & CONSTANT CURRENT DRIVERS
The TB62701ANG is specifically designed for LED and
LED−DISPLAY constant current drivers.
This constant current output circuit is able to set up external
resister (IOUT = 5 to 50mA).
This IC is monolithic integrated circuit designed to be used
together with Bi−CMOS process.
The devices consist of 16bit Shift Register, Latch, AND−GATE
and Constant Current Driver.
FEATURES
Weight: 1.22 g (typ.)
z OUTPUT CURRENT : Set−up at 50mA maximum with an
external resister.
z A LITTLE CHANGE OF OUTPUT CURRENT (Ta = 25°C, VDD = 5.0 V)
OUTPUT−GND VOLTAGE
A LITTLE CHANGE OF
CHANNEL
IOUT [mA]
±7%
5 ~ 50 mA
≥ 0.4 V
≥ 0.7 V
z 5V CMOS Compatible Input
z PACKAGE
:
z MAXIMUM CLOCK FREQUENCY :
SDIP−24 (SDIP24−P−300)
fMAX = 2.5 MHz (cascade operation, Ta = 25°C)
PIN CONNECTION (TOP VIEW)
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TB62701ANG
BLOCK DIAGRAM
TIMING DIAGRAM
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TB62701ANG
TERMINAL DESCRIPTION
PIN No.
PIN NAME
FUNCTION
1
GND
2
SERIAL−IN
3
CLOCK
Clock input terminal for data shift to up−edge
"H" Level : data through, "L" Level : data hold
GND terminal for control logic driver
Serial data input terminal for shift register
4
LATCH
24
VDD
5~12
13~20
OUTn
21
ENABLE
22
SERIAL−OUT
23
R−EXT
Supply voltage terminal
Output terminals
"H" Level output off, "L" Level : latch data = "H" Level then output on, latch data = "L" Level
then output off
Serial data output terminal for shift register
The register which connects between R−EXT and GND sets the constant output current.
TRUTH TABLE
INPUT
CLOCK
LATCH
ENABLE
SERIAL−IN
H
L
Dn
L
L
Dn
H
Dn
(Note)
(Note)
Note:
OUTPUT OUTn (t = n)
(Note)
OUT0 ··· OUT7 ··· OUT15
Dn
Dn−7
Dn−15
No change
OFF
Dn
OFF
SERIAL−OUT
Dn−15
Dn−15
OFF
No change
Dn−15
No change
Dn~Dn−15 = "H" then OUTn is ON, "L" then OUTn is OFF.
EQUIVALENT CIRCUIT OF INPUTS AND OUTPUTS
1. ΕΝΑΒLΕ terminal
2. LATCH terminal
3. CLOCK, SERIAL−IN terminal
4. SERIAL−OUT terminal
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TB62701ANG
ABSOLUTE MAXIMUM RATINGS (Ta = 25°C)
CHARACTERISTIC
SYMBOL
RATING
UNIT
Supply Voltage
VDD
0~7.0
V
Output Voltage
VCE
−0.5~30
V
Output Current
IOUT
50
mA
Input Voltage
VIN
−0.4~VDD + 0.4
V
IGND
800
mA
fCK
2.5
MHz
PD
1.78
W
Operating Temperature
Topr
−40~85
°C
Storage Temperature
Tstg
−55~150
°C
GND Terminal Current
Clock Frequency
Power Dissipation
Note:
(Note)
Ambient temperature delated above 25°C in the proportion of 14.2 mW / °C.
RECOMMENDED OPERATING CONDITION (Ta = −40~85°C unless otherwise noted)
CHARACTERISTIC
SYMBOL
TEST CONDITION
MIN
TYP.
MAX
UNIT
Supply Voltage
VDD
―
4.5
5.0
5.5
V
Output Voltage
VOUT
―
―
―
30.0
V
―
―
45
OUTn
Output Current
IOUT
DC 1 circuit
mA
IOH
―
―
―
−1.0
IOL
―
―
―
1.0
VIN
―
0
―
VDD
V
Data Set Up Time
tsetup (D)
―
100
―
―
ns
Data Hold Time
thold (D)
―
20
―
―
ns
Data Set Up Time
tsetup (L)
―
300
―
―
ns
Data Hold Time
thold (L)
―
100
―
―
ns
tW CLK
―
100
tW CLK
―
100
―
―
tW LAT
―
300
tW LAT
―
300
―
―
Input Voltage
Clock Pulse Width
Latch Pulse Width
S−OUT
ns
ns
ns
ns
Clock Frequency
fCK
Cascade operation
―
―
2.0
MHz
Power Dissipation
PD
Ta = 85°C
―
―
0.72
W
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TB62701ANG
ELECTRICAL CHARACTERISTICS (VDD = 5.0 V, Ta = 25°C unless otherwise noted)
SYMBOL
TEST
CIR−
CUIT
TEST CONDITION
MIN
TYP.
MAX
“H” level
VIH
―
―
70%
VDD
―
VDD
“L” level
VIL
―
―
GND
―
IOH
―
VOH = 30V
―
―
10
VOL
―
IOL = +1.0 mA
―
―
0.4
VOH
―
IOH = −1.0 mA
4.6
―
―
IOL1
―
35.2
41.5
47.7
IOL2
―
VCE = 0.7 V R
EXT = 560 Ω
V = 0.4 V (included ∆IOL1 )
33.1
39.0
44.9
∆IOL1
―
REXT = 560 Ω
IOUT = 40 mA, VCE = 0.4 V
―
±3.0
±7.0
%
% / VDD
―
REXT = 560 Ω
―
18
―
%/V
Reference Voltage
Vref
―
REXT = 560 Ω, Ta = −40~85°C
―
1.26
―
V
Pull Up / Down Resister
RIN
―
―
100
200
400
kΩ
IDD (off) 1
―
REXT = OPEN, OUTn = Off
―
0.4
0.6
IDD (off) 2
―
REXT = 560 Ω, OUTn = Off
―
6.5
10.0
IDD (on)
―
REXT = 560 Ω, All output on
―
13.5
20.0
CHARACTERISTIC
Input Leakage
Current
Output Leakage Current
Output Votltage
S−OUT
Output Current 1
Delta IOUT
Supply Voltage Regulation
Supply Current
“OFF”
“ON”
CE
5
30%V
UNIT
V
DD
µA
V
mA
mA
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TB62701ANG
SWITCHING CHARACTERISTICS (Ta = 25°C unless otherwise noted)
CHARACTERISTIC
SYMBOL
TEST CONDITION
MIN
TYP.
MAX
―
95
500
―
130
500
―
130
500
EN - OUTn
―
130
500
CLK−S−OUT
―
95
720
―
130
500
―
130
500
―
130
500
2.0
―
2.5
―
45
80
―
10
50
―
17
50
―
−7
10
―
70
200
―
70
200
―
−70
50
―
−70
50
CLK−S−OUT
Propagation Delay
Time (“L” to “H”)
Propagation Delay
Time (“H” to “L”)
CLK- OUTn
LATCH - OUTn
CLK- OUTn
LATCH - OUTn
tpLH
tpHL
EN - OUTn
Maximum Clock Frequency
Minimum Pulse
Width
CLK
LATCH
Data Set Up Time
Data Hold Time
Latch Set Up Time
Latch Hold Time
LH
HL
LH
HL
fMAX (Note 1) V
DD = 5.0 V
VCE = 1.0 V
tW CLK
VIH = VDD
VIL = GNK
tW
LAT
fCK = 2 MHz
tsetup (D)
REXT = 560 Ω
IOUT = 30 mA
thold (D)
t LAT setup
t LAT hold
Maximum Clock Rise Time
tr
―
―
10
Maximum Clock Fall Time
tf
―
―
10
Maximum Output Rise Time
tor
―
35
80
Maximum Output Fall Time
tof
―
40
80
UNIT
ns
ns
MHz
ns
ns
ns
ns
µs
ns
Note 1: Cascade operation
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TB62701ANG
DC CHARACTERISTIC TEST CIRCUIT
TB62701ANG
AC CHARACTERISTIC TEST CIRCUIT
TB62701ANG
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TB62701ANG
TIMING WAVE FORM
1. CLOCK−SERIAL OUT, OUTn
2. CLOCK− LATCH
H
CLOCK
50%
50%
L
H
DATA
L
tsetup
thold
H
LATCH
50%
L
50%
t w LAT
on
OUTn
off
3.
ENABLE
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TB62701ANG
IOUT (mA) = {1.26 (V)/REXT (Ω)} × 18.4
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TB62701ANG
APPLICATION CIRCUIT
TB62701ANG
TB62701ANG
PRECAUTIONS for USING
Utmost care is necessary in the design of the output line, VCC (VDD) and GND line since IC may be destroyed
due to short−circuit between outputs, air contamination fault, or fault by improper grounding.
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TB62701ANG
Package Dimensions
Weight: 1.22 g (typ.)
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TB62701ANG
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only.
Thorough evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
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TB62701ANG
IC Usage Considerations
Notes on Handling of ICs
(1)
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
(2)
Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of
breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are
required.
(3)
If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.
(4)
Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.
(5)
Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input
withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied
Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
Points to Remember on Handling of ICs
(1)
Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at
any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In
addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral components.
(2)
Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to
the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power
supply is small, the device’s motor power supply and output pins might be exposed to conditions
beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in
system design.
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RESTRICTIONS ON PRODUCT USE
060116EBA
• The information contained herein is subject to change without notice. 021023_D
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others. 021023_C
• The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E
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