TOSHIBA TB62705CF

TB62705CP/CF/CFN
TOSHIBA Bi−CMOS INTEGRATED CIRCUIT SILICON MONOLITHIC
TB62705CP,TB62705CF,TB62705CFN
8-BIT SHIFT REGISTER, LATCHES & CONSTANT-CURRENT DRIVERS
The TB62705CP / CF / CFN are specifically designed for LED and
LED DISPLAY constant-current drivers.
These constant-current output circuits can support the set-up of
an external resistor (IOUT = 5~90mA).
This IC is a monolithic integrated circuit designed to be used
together with Bi-CMOS process.
The devices consist of an 8-bit shift register, latch, AND-GATE
and constant-current drivers.
TB62705CP
FEATURES
z Constant-current Output
: current with one resistor for
5 to 90mA.
TB62705CF
z Maximum Clock Frequency : fCLK = 15 (MHz)
(Cascade Connecte Operate,
Topr = 25°C)
z 5V C−MOS Compatible Input
z Package
: DIP16−P−300−2.54A (TB62705CP)
SSOP16−P−225−1.00A (TB62705CF)
SSOP16−P−225−0.65B (TB62705CFN)
TB62705CFN
z Constant Output Current Matching:
OUTPUT-GND
VOLTAGE
CURRENT
MATCHING
OUTPUT
CURRENT
≥ 0.4 V
±6.0%
5~40 mA
≥ 0.7 V
±6.0%
5~90 mA
PIN CONNECTION (Top view)
Weight
DIP16-P-300-2.54A: 1.11 g (typ.)
SSOP16-P-225-1.00A: 0.14 g (typ.)
SSOP16-P-225-0.65B: 0.07 g (typ.)
GND
1
16
VDD
SERIAL-IN
2
15
R-EXT
CLOCK
3
14
SERIAL-OUT
LATCH
4
13
ENABLE
OUTn
5
12
OUTn
OUTn
6
11
OUTn
OUTn
7
10
OUTn
OUTn
8
9
OUTn
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BLOCK DIAGRAM
OUTn
OUTn
OUTn
TIMING DIAGRAM
5V
0V
5V
0V
5V
0V
5V
0V
CLOCK
SERIAL-IN
LATCH
ENABLE
OUT0
Off
On
Off
On
Off
OUT1
OUT3
On
Off
5V
0V
OUT7
SERIAL-OUT
Note:
Latches are level-sensitive, not rising edge-sensitive, and are not synchronized with the CLOCK signal. The
data will pass through the latch circuit if the latch input is set at “H” level, and will be retained if the input is
set at “L”.
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PIN DESCRIPTION
PIN No.
PIN NAME
FUNCTION
1
GND
2
SERIAL−IN
3
CLOCK
Clock input terminal for data shift to up-edge.
4
LATCH
Data strobe input terminal. Latches pass LATCH data with “H” level input and retain data with “L”
level input.
5~12
OUTn
13
ENABLE
14
SERIAL−OUT
15
R−EXT
16
VDD
GND terminal for control logic
Input pin for shift register serial data
Output terminals
Input terminal for output enable. All outputs ( OUTn ) go off with ENABLE data input at "H" level
and go on with data input at "L" level.
Output terminal for serial data for the next SERIAL-IN terminal.
Input terminal for connecting a resistor to regulate all output currents.
5-V supply pin of the IC
TRUTH TABLE
CLOCK
LATCH
ENABLE
SERIAL−IN
OUTn
SERIAL−OUT
UP
H
L
Dn
Dn ··· Dn−5 ··· Dn−7
Dn−7
UP
L
L
Dn+1
No change
Dn−6
UP
H
L
Dn+2
Dn+2 ··· Dn−3 ··· Dn−5
Dn−5
DOWN
X
L
Dn+3
Dn+2 ··· Dn−3 ··· Dn−5
Dn−5
DOWN
X
H
Dn+3
Off
Dn−5
Note:
OUTn = on if Dn = H level, and OUTn = off if Dn = L level.
An external resistor is connected with R−EXT and GND. Be sure to administer the correct power supply
voltage.
INPUT/OUTPUT EQUIVALENT CIRCUITS
1. ENABLE terminal
2. LATCH terminal
3. CLOCK, SERIAL−IN terminal
4. SERIAL−OUT terminal
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ABSOLUTE MAXIMUM RATINGS (Ta = 25°C)
CHARACTERISTIC
SYMBOL
RATING
UNIT
Supply Voltage
VDD
0~7.0
V
Input Voltage
VIN
−0.4~VDD + 0.4
V
Output Current
IOUT
90
mA
Output Voltage
VCE
−0.5~17.0
V
Clock Frequency
fCK
15
MHz
720
mA
GND Terminal Current
Power Dissipation
Thermal Resistance
IGND
1.47 (CP−type : FREE AIR, Ta = 25°C)
PD
W
0.78 (CF / CFN−type : ON PCB, Ta = 25°C)
Rth (j−a)
85 (CP−type : FREE AIR, Ta = 25°C)
°C / W
160 (CF / CFN−type : ON PCB, Ta = 25°C)
Operating Temperature
Topr
−40~85
°C
Storage Temperature
Tstg
−55~150
°C
Note:
CP type: For an ambient temperature above 25°C, the derating is 11.8 mW/°C.
CF and CFN type: For an ambient temperature above 25°C, the derating is 6.3 mW/°C.
RECOMMENDED OPERATING CONDITION (Ta = −40~85°C unless otherwise stated)
CHARACTERISTIC
SYMBOL
CONDITION
MIN
TYP.
MAX
UNIT
Supply Voltage
VDD
―
4.5
5.0
5.5
V
Output Voltage
VOUT
―
―
―
15.0
V
OUTn , DC 1 circuit
5
―
88
Output Current
IOH
SERIAL−OUT
―
―
1.0
IOL
SERIAL−OUT
―
―
−1.0
IO
VIH
―
0.7
VDD
―
VDD
+0.3
VIL
―
−0.3
―
0.3
VDD
Input Voltage
mA
V
LATCH Pulse Width
tw LAT
100
―
―
ns
CLOCK Pulse Width
tw CLK
50
―
―
ns
ENABLE Pulse Width
tw EN
4500
―
―
ns
Set-up Time for DATA
tsetup (D)
60
―
―
ns
Hold Time for DATA
thold (D)
20
―
―
ns
Set-up Time for LATCH
tsetup (L)
100
―
―
ns
Hold Time for LATCH
thold (L)
Clock Frequency
Power Dissipation
fCK
PD
VDD = 4.5~5.5 V
60
―
―
ns
10.0
―
―
MHz
Ta = 85°C
(CP−type FREE AIR)
―
―
0.82
Ta = 85°C
(CF / CFN−type ON PCB)
―
―
0.40
Cascade operation
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ELECTRICAL CHARACTERISTICS (VDD = 5.0 V, Ta = 25°C unless otherwise stated)
SYMBOL
TEST
CIR−
CUIT
CONDITION
MIN
TYP.
MAX
"H" Level
VIH
―
―
0.7
VDD
―
VDD
"L" Level
VIL
―
―
GND
―
0.3
VDD
CHARACTERISTIC
Input Voltage
Output Leakage Current
UNIT
V
IOH
―
VOH = 15.0 V
―
―
10
VOL
―
IOL = 1.0 mA
―
―
0.4
VOH
―
IOH = −1.0 mA
4.6
―
―
IOL1
―
VCE = 0.7 V
34.1
40.0
45.9
IOL2
―
VCE = 0.4 V
REXT = 470 Ω
(Include skew)
33.7
39.5
45.3
∆IOL1
―
IO = 40 mA,
VCE = 0.4 V
REXT = 470 Ω
―
±1.5
±6.0
IOL3
―
VCE = 1.0 V
64.2
75.5
86.8
IOL4
―
VCE = 0.7 V
REXT = 250 Ω
(Include skew)
63.8
75.0
86.2
∆IOL2
―
IO = 75 mA,
VCE = 0.7 V
REXT = 250 Ω
―
±1.5
±6.0
%
Supply Voltage Regulation
% / VDD
―
REXT = 470 Ω, Ta = −40~85°C
―
1.5
5.0
%/V
Pull−Up Resistor
RIN (up)
―
―
150
300
600
Ω
―
Ω
Output Voltage
S−OUT
Output Current 1
Current Skew
Output Current 2
Current Skew
Pull−Down Resistor
"OFF"
Supply Current
"ON"
RIN (down)
―
100
200
400
IDD (off) 1
―
REXT = OPEN, OUT0 ~ 7 = off
―
0.6
1.2
IDD (off) 2
―
REXT = 470 Ω, OUT0 ~ 7 = off
3.5
5.8
8.0
IDD (off) 3
―
REXT = 250 Ω, OUT0 ~ 7 = off
6.5
10.7
15.0
IDD (on) 1
―
REXT = 470 Ω, OUT0 ~ 7 = on
7.0
12.0
18.0
IDD (on) 2
―
REXT = 250 Ω, OUT0 ~ 7 = on
10.0
22.0
32.0
5
µA
V
mA
%
mA
mA
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TB62705CP/CF/CFN
SWITCHING CHARACTERISTICS (Ta = 25°C unless otherwise stated)
TEST
CIR−
CUIT
MIN
TYP.
MAX
―
1200
1500
―
1200
1500
―
1200
1500
CLK−SOUT
―
30
70
SIN − OUTn
―
700
1000
CHARACTERISTIC
SYMBOL
CONDITION
SIN− OUTn
Propagation
Delay Time
(“L” to “H”)
Propagation
Delay Time
(“H” to “L”)
LATCH − OUTn
ENABLE − OUTn
LATCH − OUTn
ENABLE − OUTn
tpLH
tpHL
―
―
CLK−SOUT
Pulse Width
CK
tw CLK
―
LATCH
tw LAT
―
tsetup
―
thold
―
tr
―
Set−up Time
for LATCH
L−H
Hold Time for
LATCH
L−H
H−L
H−L
Maximum CLOCK Rise Time
VDD = 5.0 V
VCE = 0.4 V
VIH = VDD
VIL = GND
REXT = 470 Ω
IOUT = 40 mA
VL = 3.0 V
RL = 65 Ω
CL = 10.5 pF
―
700
1000
―
700
1000
―
30
70
―
20
30
―
10
25
―
25
50
―
25
50
―
0
30
―
0
30
―
―
10
UNIT
ns
ns
ns
ns
ns
µs
Maximum CLOCK Fall Time
tf
―
―
―
10
µs
Output Rise Time
tor
―
300
600
1000
ns
Output Fall Time
tof
―
150
300
600
ns
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TB62705CP/CF/CFN
TEST CIRCUIT
DC characteristics
OUTn
OUTn
AC characteristics
OUTn
OUTn
Precaution on Use
Utmost care is necessary in the design of the output line, VCC (VDD) and GND line since the IC may be damaged
due to short-circuits between outputs, air contamination faults, or faults caused by improper grounding.
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TIMING WAVEFORM
1. CLOCK−SERIAL OUT, OUTn
OUTn (current)
2. CLOCK− LATCH
3. ENABLE − OUTn
OUTn
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LED DRIVER TB6270X SERIES APPLICATION NOTE
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TB62705CP/CF/CFN
[1]
Output current (IOUT)
IOUT is set by the external resistor (R−EXT), as shown in Fig. 1.
[2]
Total supply voltage (VLED)
This device can operate on 0.4~0.7 V (VO).
When a higher voltage is input to the device, the excess voltage is consumed inside the device, which leads to
power dissipation. To minimize power dissipation and loss, we recommend that the total supply voltage be set
as follows:
VLED (total supply voltage) = VCE (Tr Vsat) + Vf (LED forward voltage) + VO (IC supply voltage).
When the total supply is too high in the light of the power dissipation of this device, an additional resistor (R)
can be used to decrease the supply voltage (VO).
PATTERN LAYOUT
OUTn
OUTn
OUTn
OUTn
[3]
Pattern layout
This device has only one ground pin, i.e., the combined signal ground pin and power ground pin.
If the ground pattern layout contains a large amount of inductance and impedance, and the voltage between
the ground and LATCH or CLOCK terminals exceeds 2.5 V due to switching noise, the device may not operate
correctly. Be sure to pay attention to pattern layout to minimize inductance.
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PACKAGE DIMENSIONS
Weight: 1.11 g (Typ.)
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TB62705CP/CF/CFN
PACKAGE DIMENSIONS
Weight: 0.14 g (Typ.)
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TB62705CP/CF/CFN
PACKAGE DIMENSIONS
Weight: 0.07 g (Typ.)
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TB62705CP/CF/CFN
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only.
Thorough evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
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TB62705CP/CF/CFN
IC Usage Considerations
Notes on Handling of ICs
(1)
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
(2)
Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of
breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are
required.
(3)
If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.
(4)
Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.
(5)
Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input
withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied
Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
Points to Remember on Handling of ICs
(1) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device
so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time
and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation
design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition,
please design the device taking into considerate the effect of IC heat radiation with peripheral
components.
(2) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the
motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply
is small, the device’s motor power supply and output pins might be exposed to conditions beyond
maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system
design.
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RESTRICTIONS ON PRODUCT USE
060116EBA
• The information contained herein is subject to change without notice. 021023_D
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others. 021023_C
• The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E
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