19-4946; Rev 0; 10/09 TION KIT EVALUA BLE IL AVA A RF Power Detector Features The MAX2209 is a wideband (800MHz to 2GHz) RF power detector. It takes an RF signal from the directional coupler at the input, and outputs a DC voltage proportional to the RF peak voltage. The change in output voltage versus temperature is very repeatable from part to part and enables a lookup table based on nominal behavior, minimizing the effective detection error to less than Q0.5dB relative to room temperature. S -25dBm to 0dBm Power Detection Range S ±0.5dB Detection Error Due to Temperature S +2.7V to +5V Single-Supply Operation S Space-Saving 4-Bump, 1mm2 UCSP™ Package S On-Chip 50I Termination and DC-Blocking Capacitor The MAX2209 comes in a space-saving 2 x 2, 0.5mm pitch wafer-level package (WLP) and requires only two external components. Applications Ordering Information Dual-Band WCDMA Handsets High-Speed Downlink Packet Access (HSDPA) High-Speed Uplink Packet Access (HSUPA) PART TEMP RANGE PINPACKAGE TOP MARK MAX2209EBS+ -40NC to +85NC 4 UCSP AGJ +Denotes a lead(Pb)-free/RoHS-compliant package. Pin Configuration/Functional Diagram/Typical Operating Circuit MAX2209 ADC A1 OUT A2 VCC B1 GND B2 RFIN VCC RF INPUT UCSP is a trademark of Maxim Integrated Products, Inc. ________________________________________________________________ Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. MAX2209 General Description MAX2209 RF Power Detector ABSOLUTE MAXIMUM RATINGS VCC to GND..............................................................-0.3V to +6V RFIN to GND.......................................... -0.3V to + (VCC + 0.3V) OUT to GND........................................... -0.3V to + (VCC + 0.3V) RFIN Input Power........................................................... +10dBm Continuous Power Dissipation (TA = +70NC) 4-Bump WLP (derate 3mW/NC above +70NC)..............238mW Junction-to-Ambient Thermal Resistance (BJA) (Note 1)...........................................335NC/W Operating Temperature Range........................... -40NC to +85NC Storage Temperature Range............................. -65NC to +160NC Junction Temperature .....................................................+150NC Bump Temperature (soldering, Note 2) Infrared (15s)................................................................+260NC Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Note 2: For detailed information on soldering, refer to Application Note 1891: Wafer-Level Packaging (WLP) and Its Applications. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. CAUTION! ESD SENSITIVE DEVICE DC ELECTRICAL CHARACTERISTICS (VCC = 2.7V to 5.0V, TA = -40NC to +85NC, no RF signal applied. Typical values are at VCC = 2.8V, TA = +25NC, unless otherwise noted.) (Note 3) PARAMETER CONDITIONS Supply Voltage MIN TYP 2.7 Supply Current 3.6 Idle Output Voltage VCC = 2.8V, no RF signal Output Current Source Capability PIN = 0dBm, VOUT forced to 0.5V Output Current Sink Capability No RF signal, VOUT forced to 2V MAX UNITS 5.0 V 6 mA 35 mV 750 1800 FA 300 525 FA AC ELECTRICAL CHARACTERISTICS (TA = -40NC to +85NC, 50I system, VCC = 2.8V. Typical values are at TA = +25NC, unless otherwise noted.) (Note 3) PARAMETER CONDITIONS RF Input Frequency RF Input VSWR Output Voltage, 836MHz Output Voltage, 1950MHz Residual Error after Room Temperature Calibration (TA = -40NC to +85NC) (Note 4) MIN TYP 800 800MHz -17 2000MHz -12 -5dBm input 0.88 -25dBm input 0.06 -5dBm input 0.72 -25dBm input 0.06 MAX UNITS 2000 MHz dB V V -5dBm input Q0.5 -25dBm input Q1.5 Note 3: Guaranteed by production test at TA = +25NC. Guaranteed by design and characterization at TA = -40NC and TA = +85NC. Note 4: Guaranteed by design and characterization. See the Typical Operating Characteristics. 2 _______________________________________________________________________________________ dB RF Power Detector OUTPUT VOLTAGE vs. FREQUENCY PIN = -5dBm OUT (V) OUT (V) 1 OUT (V) 1 1 MAX2209 toc02 10 MAX2209 toc01 10 OUTPUT VOLTAGE vs. INPUT POWER (RF = 1950MHz) MAX2209 toc03 OUTPUT VOLTAGE vs. INPUT POWER (RF = 836MHz) 0.1 0.01 PIN = -15dBm 0.01 0.01 -20 -15 -10 -5 0 -25 -20 -15 -10 -5 INPUT POWER (dBm) ERROR DUE TO TEMPERATURE (RF = 836MHz, 58 UNITS) ERROR DUE TO TEMPERATURE (RF = 1950MHz, 58 UNITS) 1.0 -40°C 1.5 500 1000 1500 2000 2500 3000 3500 SIGMA OF -40°C ERROR 0.16 MAX2209 toc05 1.5 0 0 INPUT FREQUENCY (MHz) INPUT POWER (dBm) MAX2209 toc04 -25 1.0 MAX2209 toc06 0.1 PIN = -10dBm 0.1 0.14 0.12 0.5 0 0 -0.5 -0.5 -1.0 -20 -15 -10 -5 -20 -15 -10 -5 0 -25 -20 -15 -10 -5 INPUT POWER (dBm) INPUT POWER (dBm) SIGMA OF +85°C ERROR RESIDUAL ERROR AFTER ROOM TEMPERATURE CALIBRATION RESIDUAL ERROR AFTER ROOM TEMPERATURE CALIBRATION RF = 836MHz, 58 UNITS, -40°C 0.4 0.5 0.3 0.3 ERROR (dB) RF = 1950MHz 0.06 0.04 RF = 836MHz 0 0.2 ERROR (dB) 0.2 0.08 0.1 0 -0.1 -15 -10 INPUT POWER (dBm) -5 0 0.1 0 -0.1 -0.2 -0.2 -0.3 -0.3 -0.4 -0.4 -0.5 -20 RF = 836MHz, 58 UNITS, +85°C 0.4 0 MAX2209 toc09 0.5 MAX2209 toc07 0.10 -25 RF = 1950MHz INPUT POWER (dBm) 0.12 0.02 0.06 0 -25 0 MAX2209 toc08 -25 0.08 0.02 -1.5 -1.5 RF = 836MHz 0.10 0.04 +85°C +85°C -1.0 SIGMA (dB) -40°C SIGMA (dB) ERROR (dB) ERROR (dB) 0.5 -0.5 -25 -20 -15 -10 INPUT POWER (dBm) -5 0 -25 -20 -15 -10 -5 0 INPUT POWER (dBm) _______________________________________________________________________________________ 3 MAX2209 Typical Operating Characteristics (VCC = 2.8V, typical values are at TA = +25NC, unless otherwise noted.) Typical Operating Characteristics (continued) (VCC = 2.8V, typical values are at TA = +25NC, unless otherwise noted.) 0.3 RF = 1950MHz, 58 UNITS, +85°C 0.4 0.3 1.0 0.8 0.2 0.1 0 -0.1 0.1 0 -0.1 -0.2 -0.2 -0.3 -0.3 -0.4 -0.4 -0.5 -0.5 -25 -20 -15 -10 INPUT POWER (dBm) -5 0 OUT (V) ERROR (dB) 0.2 SETTLING TIME FROM RF POWER (ON/OFF RF = 836MHz) MAX2209 toc11 RF = 1950MHz, 58 UNITS, -40°C 0.4 0.5 MAX2209 toc10 0.5 RESIDUAL ERROR AFTER ROOM TEMPERATURE CALIBRATION MAX2209 toc12 RESIDUAL ERROR AFTER ROOM TEMPERATURE CALIBRATION ERROR (dB) MAX2209 RF Power Detector 0.6 PIN = -5dBm PIN = -7dBm 0.4 PIN = -10dBm 0.2 PIN = -15dBm -25 -20 -15 -10 INPUT POWER (dBm) -5 0 0 0.0E+00 5.0E-07 1.0E-06 TIME (s) 4 _______________________________________________________________________________________ 1.5E-06 2.0E-06 RF Power Detector BUMP NAME A1 OUT Detector Output FUNCTION A2 VCC Power Supply. Bypass to GND with a capacitor as close as possible to the bump. B1 GND Ground Connection. Connect to PCB ground plane with as low inductance as possible. B2 RFIN RF Input. Internally terminated to 50I. AC-couple the RF input to this pin. Detailed Description The MAX2209 power detector is designed to operate from 800MHz to 2.0GHz. The device is ideal for wideband code-division multiple access (WCDMA), cdma2000M, and high-speed downlink/uplink packet access. The MAX2209 accepts an RF signal at the input, and outputs a temperature-independent voltage related to the input signal voltage. The output voltage expressed in dBV is proportional to the input power expressed in dBm. The device has a detection range from -25dBm to 0dBm. Applications Information The MAX2209 contains an internal termination resistor for use with directional couplers. The typical application circuit is shown in Figure 1. The output of the detector goes to an ADC for further processing by the baseband system. Connect a series resistor and shunt capacitor to the MAX2209 output to reduce residual amplitude ripple. PA TO ANTENNA DIRECTIONAL COUPLER MAX2209 VCC ADC A1 OUT A2 VCC B1 GND B2 RFIN RF INPUT Layout There are two areas that require attention: the GND pin and the supply bypassing. Connect the GND pin to the PCB ground with a GND via as close as possible, and bypass VCC to ground with a capacitor as close as possible to the part. Chip Information PROCESS: BIPOLAR Figure 1. Typical Application Circuit Package Information For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE DOCUMENT NO. 4 UCSP B4+4 21-0117 cdma2000 is a registered trademark of the Telecommunications Industry Association. Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 © 2009 Maxim Integrated Products 5 Maxim is a registered trademark of Maxim Integrated Products, Inc. MAX2209 Pin Description