19-2015; Rev 2; 8/02 KIT ATION EVALU E L B A AVAIL RF Power Detectors in UCSP Features ♦ Space-Saving 2 ✕2 UCSP Occupies Only 1mm2 ♦ Internal Temperature Compensation Gives ±0.3dB Detection Accuracy ♦ No External Filter or Op Amp Required ♦ Power-Detection Range 40dB (MAX2206) 25dB (MAX2205/MAX2207/2208) Ordering Information PART TEMP RANGE BUMP-PACKAGE MAX2205EBS -40°C to +85°C 2 × 2 UCSP* MAX2206EBS -40°C to +85°C 2 × 2 UCSP* MAX2207EBS -40°C to +85°C 2 × 2 UCSP* MAX2208EBS -40°C to +85°C 2 × 2 UCSP* *Requires solder temperature profile described in the Absolute Maximum Ratings section. 2 ✕ 2 UCSP Applications 1.01 mm ✕ 1.01 mm Dual-Band GSM/EDGE Handsets Dual-Band CDMA/TDMA Handsets UCSP is a trademark of Maxim Integrated Products, Inc. WCDMA Handsets PA Modules Pin Configuration/Functional Diagram/Typical Operating Circuit TOP VIEW SHDN LOGIC INPUT 10kΩ (MAX2205) 240Ω (MAX2206/MAX2207/MAX2208) FROM PA OUTPUT (MAX2205) 680Ω (MAX2205) 10Ω (MAX2206) 0Ω (MAX2207/MAX2208) FROM COUPLER/TAP (MAX2206/MAX2207/MAX2208) 47pF VCC RFIN/SHDN (A1) TEMPERATURECOMPENSATED PEAK DETECTOR VCC (A2) 27pF MAX2205 MAX2206 MAX2207 MAX2208 SHUTDOWN LOGIC GND (B1) OUT (B2) TO ADC CFILTER (OPTIONAL) UCSP ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. 1 MAX2205–MAX2208 General Description The MAX2205–MAX2208 wideband (800MHz to 2GHz) power detectors are ideal for GSM/EDGE (MAX2206), TDMA (MAX2207), and CDMA (MAX2205/MAX2208) applications. The MAX2206/MAX2207/MAX2208 take an RF signal from a directional coupler at the input, and output a highly repeatable voltage. The output voltage increases monotonically with increasing input power. The output is compensated for temperature and process shifts, reducing the worst-case variation to less than ±1dB at full power and ±2.5dB at the lowest power. The MAX2206 features 40dB dynamic range, making it ideally suited to GSM/EDGE applications. The MAX2207 offers reduced current consumption for TDMA applications. The MAX2205/MAX2208 each have an integrated filter to allow for average power detection of CDMA signals over a 25dB dynamic range. The MAX2206/MAX2207/MAX2208 offer internal 50Ω termination for interfacing with a directional coupler. The MAX2205 has a high-impedance input to provide a lowloss resistive tap in CDMA applications. All devices allow the user to control the averaging time constant externally. The MAX2205–MAX2208 come in a space-saving 2 ✕ 2, 0.5mm-pitch UCSP™ and require only three external components. MAX2205–MAX2208 RF Power Detectors in UCSP ABSOLUTE MAXIMUM RATINGS VCC to GND ...........................................................-0.3V to +6.5V RFIN/SHDN to GND....................................-0.3V to (VCC + 0.3V) RF Input Power (800MHz) (MAX2206/MAX2207/MAX2208) .................................+20dBm RF Input Power (2GHz) (MAX2206/MAX2207/MAX2208) .................................+17dBm RF Input Voltage (800MHz) (MAX2205) ..............................1.5VP RF Input Voltage (2GHz) (MAX2205) ..................................0.8VP Continuous Power Dissipation (TA = +70°C) 2 ✕ 2 UCSP (derate 3.8mW/°C above +70°C) ............303mW Operating Temperature Range ...........................-40°C to +85°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +160°C Bump Temperature (soldering) (Note 1) Infrared (15s) ..............................................................+220°C Vapor Phase (60s) ......................................................+215°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (MAX2205–MAX2208) (VCC = +2.7V to +5.0V, SHDN = +2.0V, no RF signal applied, TA = -40°C to +85°C. Typical values are at VCC = +2.85V and TA = +25°C, unless otherwise noted.) (Note 2) PARAMETER Supply Voltage SYMBOL CONDITIONS VCC MAX2206 IIDLE Shutdown Supply Current I SHDN SHDN = 0V OUT Voltage During Shutdown VOUT SHDN = 0V VH Logic-Low Threshold VL TYP 2.7 Idle Supply Current Logic-High Threshold MIN MAX UNITS 5.0 V 3.5 5.5 2 3.5 0.5 10 µA 0.01 V MAX2205/MAX2207/MAX2208 2.0 mA V 0.6 V IIH SHDN = +2.0V -1 +10 IIL -1 +1 Output Current Source Capability SHDN = +0.6V MAX2206/MAX2207, VOUT = +2.5V 400 µA Output Current Sink Capability MAX2206/MAX2207, VOUT = 0V 300 µA SHDN Input Current µA AC ELECTRICAL CHARACTERISTICS (MAX2205) (MAX2205 EV kit, VCC = +2.7V to +5.0V, SHDN = +2.0V, fRF = 800MHz to 2GHz, 50Ω system, TA = -40°C to +85°C. Typical values are at VCC = +2.85V and TA = +25°C, unless otherwise noted.) (Note 2) PARAMETER fRF Turn-On Time tON Response Time Variation Due to Temperature 2 SYMBOL RF Input Frequency tR CONDITIONS MIN TYP 800 (Note 3) VCC = +2.85V, TA = -40°C to +85°C MAX UNITS 2000 MHz 2 µs 15 µs High input power (Note 4) ±0.3 ±1 Low input power (Note 5) ±1.3 ±2.5 dB _______________________________________________________________________________________ RF Power Detectors in UCSP (MAX2206/MAX2207/MAX2208 EV kit, VCC = +2.7V to +5.0V, SHDN = 2.0V, fRF = 800MHz to 2GHz, 50Ω system, TA = -40°C to +85°C. Typical values are at VCC = +2.85V and TA = +25°C, unless otherwise noted.) (Note 2) PARAMETER SYMBOL RF Input Frequency CONDITIONS MIN fRF RF Input VSWR TYP 800 VSWR Turn-On Time UNITS 2000 MHz 2:1 tON Response Time (Note 3) MAX MAX2206/MAX2207 tR 2 µs 300 ns MAX2208 15 High input power (Note 6) VCC = +2.85V, TA = -40°C to +85°C Low input power (Note 7) Variation Due to Temperature µs ±0.3 ±1 ±1.3 ±2.5 dB Note 1: This device is constructed using a unique set of packaging techniques that imposes a limit on the thermal profile the device can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not allowed. Note 2: Specifications over TA = -40°C to +85°C are guaranteed by design. Production tests are performed at TA = +25°C. Note 3: Response time is taken from the time the RF signal is applied to 90% of the final value of VOUT. Note 4: At 800MHz, output voltage is held at a value that nominally results from the final value of +31dBm input power. Deviation from +31dBm is specified. At 2GHz, output voltage is held at a value that nominally results from +28dBm input power. Deviation from +28dBm is specified. Note 5: At 2GHz, output voltage is held 22dB lower than specified in Note 4. At 800MHz, output voltage is held 25dB lower than specified in Note 4. Note 6: At 800MHz, output voltage is held at a value that nominally results from +15dBm input power. Deviation from +15dBm is specified. At 2GHz, output voltage is held at a value that nominally results from +13dBm input power. Deviation from +13dBm is specified. Note 7: For MAX2206, output voltage is held 40dB lower than specified in Note 7; for MAX2207/MAX2208, output voltage is held 25dB lower than specified in Note 7. Typical Operating Characteristics (MAX2206/MAX2207/MAX2208 EV kit, TA = +25°C, unless otherwise noted.) MAX2206 OUTPUT VOLTAGE vs. INPUT POWER 1.2 1.0 VCC = +3.5V TA = +85°C 0.8 0.6 VCC = +2.7V to +3.5V fRF = 2GHz TA = -40°C TO +85°C 1.4 1.2 1.0 0.8 0.6 VCC = +3.5V TA = +85°C 0.4 320 MAX2205/06/07/08 toc03 1.4 MAX2205/06/07/08 toc02 1.6 1.6 OUTPUT VOLTAGE (V) VCC = +2.7V to +3.5V fRF = 800MHz TA = -40°C TO +85°C 1.8 OUTPUT VOLTAGE (V) MAX2205/06/07/08 toc01 2.0 MAX2206 RESPONSE TIME vs. TEMPERATURE fRF = 900MHz PIN = +15dBm 315 310 RESPONSE TIME (ns) MAX2206 OUTPUT VOLTAGE vs. INPUT POWER 305 300 295 VCC = +2.7V 290 285 280 0.4 275 0.2 VCC = +2.7V TA = -40°C 0.2 0 -25 -20 -15 -10 -5 0 POWER (dBm) 5 10 VCC = +2.7V TA = -40°C 0 15 -25 -20 -15 -10 -5 0 POWER (dBm) 5 10 15 VCC = +3.5V 270 VCC = +3.0V 265 -40 -15 10 35 60 85 TEMPERATURE (°C) _______________________________________________________________________________________ 3 MAX2205–MAX2208 AC ELECTRICAL CHARACTERISTICS (MAX2206/MAX2207/MAX2208) Typical Operating Characteristics (continued) (MAX2206/MAX2207/MAX2208 EV kit, TA = +25°C, unless otherwise noted.) 0.5 1.0 0.8 VCC = +3.5V TA = +85°C 0.6 0 0 -10 -5 0 5 10 -10 15 -5 0 5 10 VCC = +2.7V 15 VCC = +3.0V 14 13 VCC = +3.5V 12 -40 1.5 VCC = +3.5V TA = +85°C 1.0 VCC = +2.7V TA = -40°C 11 -15 10 35 60 TEMPERATURE (°C) 85 35 0.8 60 85 VCC = +2.7V to +3.5V fRF = 1880MHz TA = -40°C to +85°C MAX2205 EV KIT 0.7 0.6 0.5 VCC = +3.5V TA = +85°C 0.4 0.3 VCC = +2.7V TA = -40°C 0.1 0 0 -40 10 0.2 0.5 10 -15 MAX2205 OUTPUT VOLTAGE vs. INPUT POWER MAX2205/06/07/08 toc08 16 VCC = +2.7V to +3.5V fRF = 836MHz TA = -40°C to +85°C MAX2205 EV KIT 2.0 OUTPUT VOLTAGE (V) 17 MAX2205/06/07/08 toc07 MAX2205 OUTPUT VOLTAGE vs. INPUT POWER 2.5 VCC = +3.5V TEMPERATURE (°C) MAX2205/MAX2208 RESPONSE TIME vs. TEMPERATURE fRF = 900MHz PIN = +15dBm (MAX2208) PIN = +31dBm (MAX2205) VCC = +3.0V 285 275 POWER (dBm) 18 290 15 POWER (dBm) 19 VCC = +2.7V 295 280 VCC = +2.7V TA = -40°C 0.2 300 MAX2205/06/07/08 toc06 1.2 0.4 VCC = +2.7V TA = -40°C MAX2205/06/07/08 toc05 1.4 fRF = 900MHz PIN = +15dBm 305 MAX2205/06/07/08 toc09 VCC = +3.5V TA = +85°C 1.6 310 RESPONSE TIME (ns) 1.0 VCC = +2.7V to +3.5V fRF = 2GHz TA = -40°C TO +85°C OUTPUT VOLTAGE (V) 1.5 1.8 OUTPUT VOLTAGE (V) VCC = +2.7V to +3.5V fRF = 800MHz TA = -40°C TO +85°C 2.0 OUTPUT VOLTAGE (V) MAX2205/06/07/08 toc04 2.5 MAX2207 RESPONSE TIME vs. TEMPERATURE MAX2207/MAX2208 OUTPUT VOLTAGE vs. INPUT POWER MAX2207/MAX2208 OUTPUT VOLTAGE vs. INPUT POWER RESPONSE TIME (µs) MAX2205–MAX2208 RF Power Detectors in UCSP 6 11 16 21 26 31 6 10 14 18 22 26 INPUT POWER (dBm) INPUT POWER (dBm) Pin Description 4 PIN NAME A1 RFIN/SHDN A2 VCC B1 GND B2 OUT FUNCTION RF Input and Shutdown Logic Input. AC-couple the RF input to this pin and apply the shutdown logic input through a resistor. Drive low to turn the part off, drive high, or connect to VCC to turn the part on. Power-Supply Pin. Bypass to GND with a capacitor as close to the bump as possible. Ground Connection. Multiple ground vias placed as close to the IC as possible should be used to connect the ground pin to the ground plane. Connect to PC board ground plane with as low inductance as possible. Detector Output _______________________________________________________________________________________ RF Power Detectors in UCSP The MAX2205 has high-input impedance for use with high-value resistive tapping from a CDMA power amplifier. This coupling method is the lowest cost and lowest loss when used with an isolator. The application circuit is shown in Figure 2. Connect C FILTER from the MAX2205 output to GND to reduce residual amplitude ripple. For IS98A reverse channel signal with peak-toavg ratio of 3.9dB, a 1.5nF capacitor gives 43mVP-P ripple at 28dBm PA output and 390µs response time. For CDMA2000 (pilot + DCCH) with peak-to-avg ratio of 5.4dB, the ripple is about 65mVP-P at 26dBm PA output. The MAX2205 input impedance is listed in Table 1. Layout As with any RF circuit, the layout of the MAX2205– MAX2208 circuits affects performance. Use a short 50Ω line at the input with multiple ground vias along the length of the line. The input capacitor and resistor should be placed as close to the IC as possible. The VCC input should be bypassed as close as possible to the IC with multiple vias connecting the capacitor to ground. Refer to the MAX2205–MAX2208 EV kit data sheet for a sample layout and details. PA UCSP Reliability The UCSP is a unique package that greatly reduces board space compared to other packages. UCSP reliability is integrally linked to the user’s assembly methods, circuit board material, and usage environment. The user should closely review these areas when considering using a UCSP. This form factor might not perform equally to a packaged product through traditional mechanical reliability tests. Performance through operating life test and moisture resistance remains uncompromised, as it is determined primarily by the wafer-fabrication process. Mechanical stress performance is a greater consideration for a UCSP. UCSP solder-joint contact integrity must be considered because the package is attached through direct solder contact to the user’s PC board. Testing done to characterize the UCSP reliability performance shows that it is capable of performing reliably through environmental stresses. Results of environmental stress tests and additional usage data and recommendations are detailed in the UCSP application note, which can be found on Maxim’s website, www.maxim-ic.com. Chip Information TRANSISTOR COUNT: 344 ISOLATOR/ CIRCULATOR COUPLER TO ANT PA 50Ω TO ANT 680Ω TO ADC OR OP AMP MAX2206 MAX2207 MAX2208 PEAK DETECTOR Figure 1. MAX2206/MAX2207/MAX2208 Typical Application Circuit 47pF TO ADC MAX2205 PEAK DETECTOR CFILTER Figure 2. MAX2205 Typical Application Circuit _______________________________________________________________________________________ 5 MAX2205–MAX2208 Applications Information The MAX2205–MAX2208 have internal termination resistors for use with directional couplers. The application circuit is shown in Figure 1. The output of the detector goes to an op amp in an analog GSM powercontrol scheme, or to an ADC in other systems such as TDMA or discrete-time GSM power control. MAX2205–MAX2208 RF Power Detectors in UCSP Table 1. MAX2205 Input Impedance (R || jX, PC Board De-Embedded) FREQUENCY (GHz) PIN = -30dBm PIN = +5dBm REAL IMAG REAL IMAG 0.8 189.9 -51.7 199.4 -54.0 0.9 177.3 -47.4 185.5 -49.4 1.0 165.8 -43.6 175.2 -45.7 1.1 155.2 -40.3 167.0 -42.5 1.2 146.4 -37.6 158.8 -39.8 1.3 138.8 -35.0 150.9 -37.3 1.4 131.5 -32.9 144.0 -35.1 1.5 123.3 -30.7 139.4 -33.3 1.6 115.0 -29.1 131.6 -31.8 1.7 107.2 -27.5 132.0 -30.9 1.8 110.7 -26.7 126.6 -29.3 1.9 105.3 -25.2 120.3 -27.9 2.0 94.7 -23.6 111.4 -26.7 Table 2. MAX2205–MAX2208 Device Marking Codes DEVICE 6 CODE MAX2205EBS AFR MAX2206EBS AFO MAX2207EBS AFP MAX2208EBS AFQ _______________________________________________________________________________________ RF Power Detectors in UCSP 4L, UCSP 2x2.EPS PACKAGE OUTLINE, 2x2 UCSP 21-0117 G 1 1 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 7 _____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 © 2002 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products. MAX2205–MAX2208 Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.)