INTERCONNECTS .050” Grid Headers and Sockets Single and Double Row (Number of Pins X .050”) + .015” Series 850, 851 852, 853 • Series 850 single and double row interconnects have .050” pin spacing & permit board stacking as low as .248”. • Pin headers have .016” dia. pins ( MM #4006-0 ). See page 175 for details. • MM #0467 and MM #4890 receptacles use Hi-Rel, 3-finger BeCu #11 contacts rated at 3 amps. ( #11 contact accepts pin diameters from .015”-.020” ). See pages 129 and 131 for details. Fig. 1 (Number of Pins X .050”/2) + .015” RoHS • Insulators are high temp. thermoplastic, suitable for all soldering operations. 2002/95/EC Ordering Information Single Row Fig. 1 .087” Profile Pin Header 850-XX-0_ _-10-001000 Specify # of pins Fig. 2 Double Row (Number of Pins X .050”) + .015” Fig. 2 01-50 .075” Profile Pin Header 852-XX-_ _ _-10-001000 Specify # of pins For Electrical, Mechanical & Enviromental Data, See pg. 4 10 10μ” Au Pin Plating (Number of Pins X .050”/2) + .015” For RoHS compliance select plating code. XX=Plating Code See Below SPECIFY PLATING CODE XX= Fig. 3 002-100 Single Row Fig. 3 90 40 200μ” Sn/Pb 200μ” Sn .161” Profile Socket 851-XX-0_ _-10-001000 Specify # of pins Double Row Fig. 4 01-50 .161” Profile Socket 853-XX-_ _ _-10-001000 Specify # of pins Fig. 4 Single Row (Number of Pins X .050”) + .040” Fig. 5 002-100 .185” Profile Socket 851-XX-0_ _-10-002000 Specify # of pins For Electrical, Mechanical & Enviromental Data, See pg. 4 SPECIFY PLATING CODE XX= Fig. 5 w w w. m i l l - m a x . c o m For RoHS compliance select plating code. XX=Plating Code See Below 13 Sleeve (Pin) 10µ” Au Contact (Clip) 30µ” Au 66 01-77 91 93 41 99 43 44 200µ” Sn/Pb 200µ” Sn/Pb 200µ”Sn/Pb 200µ”Sn 200µ”Sn 200µ”Sn 10µ” Au 30µ” Au 200µ”Sn/Pb 10µ” Au 30µ” Au 200µ”Sn 516-922-6000