1N4148-1 Qualified Levels: JAN, JANTX, and JANTXV Glass Axial Switching Diode Available on commercial versions Qualified per MIL-PRF-19500/116 DESCRIPTION This popular 1N4148-1 JEDEC registered switching/signal diode features internal metallurgical bonded construction for military grade products per MIL-PRF-19500/116. This small low capacitance diode, with very fast switching speeds, is hermetically sealed and bonded into a double-plug DO-35 package. It may be used in a variety of very high speed applications including switchers, detectors, transient OR'ing, logic arrays, blocking, as well as low-capacitance steering diodes, etc. Microsemi also offers a variety of other switching/signal diodes. Important: For the latest information, visit our website http://www.microsemi.com. DO-35 (DO-204AH) Package FEATURES • Popular JEDEC registered 1N4148 number. • Hermetically sealed glass construction. • Metallurgically bonded. Also available in: • Double plug construction. • DO-213AA package Very low capacitance. • Very fast switching speeds with minimal reverse recovery times. • JAN, JANTX, and JANTXV qualifications are available per MIL-PRF-19500/116. • UB package MSP screening is also available in reference to MIL-PRF-19500 (JANS). (surface mount) 1N4148UB (surface mount) 1N4148UR-1 (See part nomenclature for all available options.) • RoHS compliant version available (commercial grade only). UB2 package (2-Pin surface mount) 1N4148UB2 APPLICATIONS / BENEFITS • • • • • • • High frequency data lines. Small size for high density mounting using flexible thru-hole leads (see package illustration). RS-232 & RS–422 interface networks. Ethernet 10 base T. Low capacitance steering or blocking. LAN. Computers. UBC package (Ceramic Lid surface mount) 1N4148UBC MAXIMUM RATINGS @ 25 ºC unless otherwise stated Parameters/Test Conditions Symbol TJ & TSTG RӨJL RӨJA Junction and Storage Temperature (1) Thermal Resistance Junction-to-Lead (2) Thermal Resistance Junction-to-Ambient Maximum Breakdown Voltage Working Peak Reverse Voltage (3) Average Rectified Current @ TA = 75 ºC Non-Repetitive Sinusoidal Surge Current (tp = 8.3 ms) V(BR) VRWM IO IFSM Value -65 to +175 250 325 100 Unit o C o C/W o C/W V 75 200 2 V mA A (pk) NOTES: 1. Lead length = .375 inch (9.35 mm). See Figure 2 for thermal impedance curves. 2. TA = +75°C on printed circuit board (PCB), PCB = FR4 - .0625 inch (1.59 mm) 1-layer 1-Oz Cu, horizontal, in still air; pads for axial = .092 inch (2.34 mm) diameter, strip = .030 inch (0.76 mm) x 1 inch (25.4 mm) long, lead length L ≤ 0.187 inch (≤ 4.75 mm); RӨJA with a defined PCB thermal resistance condition included, is measured at IO = 200 mA. 3. See Figure 1 for derating. T4-LDS-0281, Rev. 1 (121567) ©2012 Microsemi Corporation MSC – Lawrence 6 Lake Street, Lawrence, MA 01841 Tel: 1-800-446-1158 or (978) 620-2600 Fax: (978) 689-0803 MSC – Ireland Gort Road Business Park, Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 Website: www.microsemi.com Page 1 of 4 1N4148-1 MECHANICAL and PACKAGING • • • • • • • CASE: Hermetically sealed glass package. TERMINALS: Tin/lead plated or RoHS compliant matte-tin (on commercial grade only) over copper clad steel. Solderable per MIL-STD-750, method 2026. POLARITY: Cathode indicated by band. MARKING: Part number. TAPE & REEL option: Standard per EIA-296. Consult factory for quantities. WEIGHT: 0.2 grams. See Package Dimensions on last page. PART NOMENCLATURE JAN 1N4148 -1 (e3) Reliability Level JAN = JAN level JANTX = JANTX level JANTXV = JANTXV level MSP (reference JANS) RoHS Compliance e3 = RoHS compliant (on commercial grade only) Blank = non-RoHS compliant See 1N6642 for JANS level Metallurgically Bonded Blank = Commercial grade JEDEC type number (see Electrical Characteristics table) SYMBOLS & DEFINITIONS Definition Symbol IR Reverse Current: The maximum reverse (leakage) current that will flow at the specified voltage and temperature. Average Rectified Forward Current: The output current averaged over a full cycle with a 50 Hz or 60 Hz sine-wave input and a 180 degree conduction angle. Reverse Recovery Time: The time interval between the instant the current passes through zero when changing from the forward direction to the reverse direction and a specified decay point after a peak reverse current occurs. Forward Voltage: The forward voltage the device will exhibit at a specified current (typically shown as maximum value). Reverse Voltage: The reverse voltage dc value, no alternating component. Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating temperature range excluding all transient voltages (ref JESD282-B). Also sometimes known as PIV. IO trr VF VR VRWM ELECTRICAL CHARACTERISTICS @ 25 ºC unless otherwise noted FORWARD FORWARD REVERSE FORWARD VOLTAGE VOLTAGE RECOVERY RECOVERY VF2 @ TIME VF1 @ TIME trr tfr IF=10 mA IF=100 mA (Note 1) (Note 2) V V ns ns 0.8 1.2 5 20 NOTE 1: IF = IR = 10 mA, RL = 100 Ohms. NOTE 2: IF = 50 mA. T4-LDS-0281, Rev. 1 (121567) REVERSE CURRENT IR1 @ 20 V REVERSE CURRENT IR2 @ 75 V nA µA 25 0.5 REVERSE REVERSE CURRENT CURRENT IR3 IR4 @ 20 V @ 75 V TA=150oC TA=150oC µA µA 35 75 CAPACITANCE C (Note 3) CAPACITANCE C (Note 4) pF pF 4.0 2.8 NOTE 3: VR = 0 V, f = 1 MHz, VSIG = 50 mV (pk to pk). NOTE 4: VR = 1.5V, f = 1 MHz, VSIG = 50 mV (pk to pk). ©2012 Microsemi Corporation Page 2 of 4 1N4148-1 DC Operation Maximum Io Rating (mA) GRAPHS TA (ºC) (Ambient) Theta (°C/W) FIGURE 1 – Temperature – Current Derating Time (s) FIGURE 2 – Thermal Impedance T4-LDS-0281, Rev. 1 (121567) ©2012 Microsemi Corporation Page 3 of 4 1N4148-1 PACKAGE DIMENSIONS Ltr BD BL LD LL LL1 Inch Min .056 .140 .018 1.000 Dimensions Millimeters Max Min Max .075 1.42 1.91 .180 3.56 4.57 .022 0.46 0.56 1.500 25.40 38.10 .050 1.27 Notes 3 3 4 NOTES: 1. Dimensions are in inch. 2. Millimeters are given for general information only. 3. Package contour optional within BD and length BL. Heat slugs, if any, shall be included within this cylinder but shall not be subject to minimum limit of BD. The BL dimension shall include the entire body including slugs. 4. Within this zone lead, diameter may vary to allow for lead finishes and irregularities other than heat slugs. 5. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology. T4-LDS-0281, Rev. 1 (121567) ©2012 Microsemi Corporation Page 4 of 4