OKI MSM6889

E2A0027-16-X1
¡ Semiconductor
MSM6889
¡ Semiconductor
This version: Jan.
1998
MSM6889
Previous version: Nov. 1996
Multi-Function Telecommunication LSI
GENERAL DESCRIPTION
The MSM6889 is best suited to be used as a signal transmitter/receiver LSI for a telemetering
system that employs a no-ringing communication system.
The meter terminal of a telemetering system consists of this device, meter, NCU, and
communication controller.
The MSM6889 contains a PB tone detector, a call progress tone (CPT) detector, a PB tone
generator, and a 300-bps full-duplex modem conforming to ITU-T V.21.
FEATURES
• Power supply : +5 V ±10%, +2.5 V or higher for digital interface.
• Power consumption
Operating mode : 9 mA Typ., 12 mA Max.
Power down mode : 0.1 mA Max.
• The operating mode can be selected from PB tone transmit, PB tone detect, and FSK modem
(answer/originate). The FSK modem cannot be operated concurrently with other functions.
Modem test modes are also available.
• The call progress tone (CPT) detector operates in PB tone transmit mode or in FSK modem
mode.
• PB receiver output is 3-state, and externally connectable to 4-bit input for PB tone generator
through the bus line.
• Modem transmit/receive data, carrier detect, request to send, and call progress tone detect
have their dedicated pins.
• Prefilter and smoothing filter are provided in analog input and output.
• On-chip 3.579545 MHz crystal oscillator
• 3.579545 MHz master clock output pin (CMOS compatible)
• Power down mode
• Modem : Conforms to ITU-T V.21 (300 bps, full-duplex)
• Transmit analog signals (modem signal, DTMF tone) : Level is independently adjustable
externally. Carrier detect level is also adjustable externally.
• Package options:
42-pin plastic DIP
(DIP42-P-600-2.54)
(Product name : MSM6889RS)
56-pin plastic QFP
(QFP56-P-1519-1.00-K) (Product name : MSM6889GS–K)
1/21
+ -
-
+
PB Tone
Generator
DET
CONTROL
TIMING
STATUS
I/O
*
*
TD
RS
CLK
RD
CD
CP
SP
PB1
PB2
PB3
X'tal
Power ON
+5 V (A)
0 V (A)
+5 V (D)
0 V (D)
Digital Interface
VD2
*
PON
VA
AG
VD
DG
MODE
SELECT
&
TEST
*
*
*
*
*
*
*
*
*
*
*
TEN
PBG1
PBG2
PBG3
PBG4
ICT3
ICT2
ICT1
MODE3
MODE2
VR1
FSK Modem
Carrier
Detect
400 Hz
PB-Tone Receiver
X1 3.58 MHz
MODE1
Vref
-
+
2765 Hz
X2
SG
LPF
Pre-LPF
PB4
VR2
PB
MOD
GAT1
GAT2
SMOOTH
AO
SG
GAR
AIN-
AIN+
8
Note) PB1 to PB4: 3-State Outputs
*With pull-up resistor
Microcontroller
¡ Semiconductor
MSM6889
BLOCK DIAGRAM
2/21
¡ Semiconductor
MSM6889
PIN CONFIGURATION (TOP VIEW)
42 VD
VA 1
GAR 2
41 VD2
AIN+ 3
40 NC
AIN– 4
39 PON
AO 5
38 SP
SG 6
37 PB4
GAT1 7
36 PB3
GAT2 8
35 PB2
MOD 9
34 PB1
PB 10
33 CP
VR1 11
32 CD
VR2 12
31 RD
AG 13
30 CLK
PBG1 14
29 X2
PBG2 15
28 X1
PBG3 16
27 MODE3
PBG4 17
26 MODE2
TEN 18
25 MODE1
TD 19
24 ICT3
RS 20
23 ICT2
DG 21
22 ICT1
42-Pin Plastic DIP
NC : No connect pin
3/21
43 SG
44 GAT1
45 GAT2
46 MOD
47 PB
48 NC
49 NC
50 VR1
51 VR2
52 AG
53 PBG1
54 PBG2
55 NC
MSM6889
56 PBG3
¡ Semiconductor
NC 1
42 NC
PBG4 2
41 AO
TEN 3
40 AIN–
TD 4
39 AIN+
NC 5
38 NC
RS 6
37 GAR
DG 7
36 NC
ICT1 8
35 VA
ICT2 9
34 VD
NC 10
33 NC
PB4 28
PB3 27
PB2 26
PB1 25
NC 24
CP 23
CD 22
29 NC
NC 21
MODE3 14
RD 20
30 SP
CLK 19
MODE2 13
NC 18
31 PON
X2 17
MODE1 12
X1 16
32 VD2
NC 15
ICT3 11
56-Pin Plastic QFP
NC : No connect pin
4/21
¡ Semiconductor
MSM6889
PIN DESCRIPTION
Pin Number
RS
GS
Name
I/O
Description
+5 V Power Supply (Analog Circuit).
When power is turned on or the power down mode is released, the
1
35
VA
—
2
37
GAR
O
Output, non-inverting input and inverting input pins of on-chip
3
39
AIN+
I
operational amplifier.
4
40
AIN–
I
No hybrid transformer is required by use of these pins. (See Fig. 2.)
5
41
AO
O
6
43
SG
O
On-chip signal ground, having a potential of about +2.5 V.
7
44
GAT1
I
PB is the PB tone output and MOD is the modem signal output.
8
45
GAT2
O
By connecting external resistors to GAT1 and GAT2 pins, signal level can
9
46
MOD
O
be set at required values for the modem signal and
10
47
PB
O
the PB tone that are output from AO, independently. (See Fig. 3.)
device must be put into the PB tone transmit mode or PB tone
detect mode.
Analog signal output.
PB tone or modem transmit signal is output from this pin.
These pins are used to externally adjust the received carrier
11
50
VR1
O
detect(CD) signal level.
The potential of VR1 to SG is about +1.1 V. The carrier
detect level can be set at the required value by a on-chip resistor
12
51
VR2
I
divider between VR1 and SG. The given potential to VR2 is set
about +0.88 V with high resistance inside the IC. (See Fig. 4.)
13
52
AG
—
14
53
PBG1
I*
15
54
PBG2
I*
16
56
PBG3
I*
17
2
PBG4
I*
Analog Ground, 0 V.
Inputs used to specify PB tone to be sent.
PB1 to PB4 can be connected externally like 4-bit bus line. Data is
latched at the falling edge of TEN. (See Fig. 7 and Fig. 8.)
* Digital input pulled up by a high resistance inside the IC.
5/21
¡ Semiconductor
MSM6889
Pin Number
RS
GS
Name
I/O
Description
PB tone transmit enable.
18
3
TEN
I*
PBG1 to PBG4 data are latched at the falling edge of TEN, and PB
tone is generated at digital "0" level. (See Fig. 7.)
Modem transmit serial data input.
19
4
TD
I*
Data stream less than 300 bps should be input.
Digital "1" and "0" correspond to "Mark" and "Space" respectively.
Request to send data input .
20
6
RS
I*
21
7
DG
—
22
8
ICT1
I*
23
9
ICT2
I*
Used to check performance characteristics of the IC.
24
11
ICT3
I*
Independent of operating mode. Leave these pins open.
25
12
MODE1
I*
26
13
MODE2
I*
27
14
MODE3
I*
28
16
X1
I
29
17
X2
O
30
19
CLK
O
While RS is at digital "0" level, modem transmit is enabled.
Digital Ground, 0 V.
Input used to select call progress tone (CPT) detect output
waveform. (See Fig. 9.)
Inputs used to specify operating mode.
(See Table 1.)
3.579545 MHz crystal resonator should be connected to X1 and X2.
When applying external clock to the device, it should be connected
to X2 through the AC coupling capacitor of 100 pF and X1 has to be
open.
3.579545 MHz clock output.
Modem receive serial data output.
31
20
RD
O
Digital "1" and "0" correspond to "Mark" and "Space" respectively.
When CD (Carrier Detect) is off, RD is hold at "Mark" state.
32
22
CD
O
Carrier Detect output.
Digital "0" and "1" represent "Detect" and "No-detect" respectively.
* Digital input pulled up by a high resistance inside the IC.
6/21
¡ Semiconductor
MSM6889
Pin Number
RS
GS
Name
I/O
Description
Call progress tone (CPT) detect output.
33
23
CP
O
When a CPT is detected, the waveform selected by ICT1 is output.
(See Fig. 9. )
34
25
PB1
O
35
26
PB2
O
36
27
PB3
O
37
28
PB4
O
38
30
SP
O
Receive PB tone code outputs.
The output impedance of these pins becomes high except when the
device operates as PB tone receiver. (See Fig. 7 and Fig. 8. )
PB tone receive data present.
Digital "1" represents that this pin is receiving the PB tone.
(See Fig. 8. )
39
31
PON
I
40
—
NC
—
Power down mode select. Digital "1" on this pin puts the whole
circuit of the device into the power down state.
No connection.
Power supply for digital interface output.
The supply voltage from +2.5 V to VD is possible for VD2. For
example, when the device interfaces to the MCU working on +3 V
41
32
VD2
—
supply, the +3 V supply has to be applied to the VD2 pin.
Note that this function is effective to all of digital output pins
except X1, X2, and CLK.
There is no restriction regarding the power supplies (VD and VD2)
applying procedure.
+5 V power supply (digital circuit).
42
34
VD
—
When power is turned on or the power down mode is released, the
device must be put into the PB tone transmit mode or PB tone
detect mode.
7/21
¡ Semiconductor
MSM6889
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Rating
Condition
VA, VD
Power Supply Voltage
VD2
Input Pin Voltage
–0.3 to 7
Ta = 25˚C
V
–0.3 to VD
with respect to AG and DG
–0.3 to VA(VD) + 0.3
—
–65 to 150
Within 10 sec
260
Storage Temperature
Pin Soldering Temperature
Unit
˚C
RECOMMENDED OPERATING CONDITIONS
Parameter
Power Supply Voltage
Digital Input Voltage
Symbol
VA, VD
VD2
VIH
VIL
Condition
—
—
Min.
Typ.
Max.
4.5
5.0
5.5
2.5
—
VD
2.0
—
VD
0
—
0.8
Unit
V
V
IOH
When VD2 = VD
–0.05
—
—
IOL
(excluding) X2
—
—
0.4
Operating Temperature
Top
—
–40
—
+85
°C
Input Clock Frequency
fCLK
—
%
Digital Output Current
Bypass Capacitance
Frequency Deviation
Crystal
Temperature
Characteristics
Equivalent Series
Resistance
Load Capacitance
VA
VD, VD2
mA
–0.1
—
+0.1
0.1 + 10
—
—
1
—
—
At 25°C ±5°C
–100
—
+100
At –40°C to ±85°C
–50
—
+50
—
—
—
50
W
—
—
16
—
pF
—
mF
ppm
8/21
¡ Semiconductor
MSM6889
ELECTRICAL CHARACTERISTICS
DC and Digital Interface Characteristics
(VA, VD, VD2 = +5 V ±10%, Ta = –40˚C to +85˚C)
Parameter
Symbol
Condition
Power Supply
IAD
IA + ID + ID2
Current
IPD
(VD2 = VD)
Digital Input
IIH
Current*
IIL
Digital Output
VOH
Voltage
VOL
VD2 = VD
Min.
Typ.
Max.
Unit
—
9
12
mA
PON = "1"
—
0.01
0.1
mA
VI = VIH Max.
–10
—
10
VI = VIL Min.
–100
—
10
IO = IOH Min.
2.4
—
VD2
IO = IOL Max.
0
—
0.4
PON = "0"
µA
V
* Internal pull-up resistor
Analog Interface and Dynamic Characteristics
(VD = VA = 5 V ±10%, Ta = –40˚C to +85˚C)
Parameter
Condition
RL ≥ 20 kW
Min.
Typ.
Max.
Unit
–3
1.55
–1
1.95
+1
2.46
dBm
VP-P
–8.5
–6.5
–4.5
dBm
–7.5
–5.5
–3.5
dBm
Modem Transmit Level
MOD
PB Tone Send Level
PB
Output Voltage Swing
Output Load Resistance
RL ≥ 20 kW
AO
MOD, PB, GAT2, AO
2.2
3
—
Vp-p
20
—
—
kW
Signal Level Relative Value
MODEM "Mark" & "Space" Signals
PB Tone High-Gr. Tone & Low-Gr. Tone
–2
0
0
1
2
2
dB
dB
VA – 0.1
2
VA
2
VA + 0.1
2
V
"1"
976
980
984
"0"
1176
1180
1184
"1"
1646
1650
1654
"0"
"Mark" and "Space" Signals
RL ≥ 20 kW
Low-Group Tone
High-Group Tone
Output DC Voltage
MOD, PB
AO (When GAT1 and GAT2 are
Modem Transmit Carrier
connected)
Originate
MARK
Mode
SPACE
Frequency
Out-of-band Energy
PB Tone Frequency
PB Tone Distortion
PBG1 to PBG4 Input Data Setup
Time
PBG1 to PBG4 Input Data Hold
Time
Answer
MARK
Mode
SPACE
TD
Hz
1846
1850
1854
4 to 8 kHz P : In-band Signal Energy
(0.3 kHz to 3.4 kHz)
8 to 12 kHz
Measured at primary side
12 kHz to of transformer line.
—
—
P-20
dB
—
—
P-40
dB
—
—
P-60
dB
With respect to nominal frequency
Harmonics/Fundamental
–1.5
—
+1.5
%
—
—
–23
dB
TPBGS, Fig. 7
250
—
—
ns
TPBGH, Fig. 7
250
—
—
ns
9/21
¡ Semiconductor
MSM6889
Analog Interface and Dynamic Characteristics (Continued)
(VD = VA = 5 V ±10%, Ta = –40˚C to +85˚C)
Parameter
Condition
Min.
Typ.
Max.
Unit
Input Impedance
AIN+, 0 to 10 kHz
20
—
—
kW
Modem Receive Signal Level
AIN+, FSK Demodulator Signal
—
—
–6
dBm
VR2; Open
OFFÆON
—
—
–42
dBm
Originate mode: 1750 Hz ONÆOFF
–48
—
—
dBm
1
—
—
dB
10
—
40
ms
Carrier Detect (CD) Signal
Level
CD Level Hysteresis
Answer mode: 1080 Hz
Answer mode: 1080 Hz
Originate mode: 1750 Hz
CD Delay Time
–60 dBm Æ –20 dBm Step
CD Hold Time
–20 dBm Æ –60 dBm Step
0
—
40
ms
Demod. Data Bias Distortion
300 bps, 1/0 Alternative Pattern
—
—
±10
%
NRTS Signal-to-Modem
vNRTS/v Receive Modem Signal
Receive Signal Ratio
NRTS: 2765 Hz ±30 Hz
—
—
–2
dB
CPT Detect Level
400 Hz
–40
—
–6
dBm
CPT Non-detect Level
400 Hz
—
—
–60
dBm
380
—
420
Hz
R > 20% (square waves output)
500
—
—
(See Fig. 9)
—
—
300
—
20
—
CPT Detect Frequency
CPT Non-detect Frequency
R > 20% (square waves output)
(See Fig. 9)
CPT Detect Delay Time
—
CPT Detect Hold Time
PB Tone Detect Amplitude
—
For Each Signal Tone
Hz
ms
—
20
—
ms
–46
—
–6
dBm
PB Tone Non-detect Amplitude For Each Signal Tone
—
—
–60
dBm
Detect Frequency
With respect to Nominal Frequency
—
—
±1.5
%
Non-detect Frequency
With respect to Nominal Frequency
±3.8
—
—
%
Allowable twist
High-Gr. Tone/Low-Gr. Tone
–6
—
+6
dB
—
–12
—
dB
37
—
—
dB
Allowable Noise Level
Dial Tone Rejection Ratio
Noise (0.3 kHz to 3.4 kHz)
Level/Tone Level
380 Hz to 420 Hz
Signal Repetition Time
TC
120
—
—
ms
Time to Receive
Ts
49
—
—
ms
Invalid Tone Duration
TI
—
—
24
ms
Output Delay Time
TG
24
39
49
ms
Interdigit Pause
TP
30
—
—
ms
Acceptable Drop Out
TB
—
—
2
ms
SP Delay Time
TSP
6
8
10
ms
Output Trailing edge Delay
TD
21
28
35
ms
Fig. 1
10/21
¡ Semiconductor
MSM6889
TC
TS
TP
TB
AIN Signal
TG
PB1 to PB4
SP
TD
TSP
Figure 1
11/21
¡ Semiconductor
MSM6889
FUNCTIONAL DESCRIPTION AND APPLICATION
Resistance Hybrid Condition (Ideal Condition)
600 W : 600 W
C1
3
2.2 mF
RL
VT VR
VT1,VR1
4
R3
R1
600 W
2
AIN+
AIN–
+
VT2,VR2
–
GAR
R2
+
AO
5
VAO
–
R2,R3 ≥ 20 kW
Figure 2
C1 is an ignorable impedance in the voice frequency band; therefore, if a line transformer and
phone line impedance are ideal (RL = 600 W pure resistance), the signal levels at each point are
as shown below.
VT, VR
VT1, VR1
VAO
VT2
VR2
:
:
:
:
:
Transmit at 2W on phone line, receive signal level (balanced)
Transmit at pin 3 (AIN+), receive signal level (unbalanced)
Transmit signal level at pin 5 (AO) (unbalanced)
Leaking of transmit signal into receive circuit (unbalanced)
Receive signal level of the device (unbalanced)
1) VT = VT1 = 1/2 ¥ VAO
The transmit signal level (voltage) on phone line is half the level at the output pin (AO) of the
device. (600 W : a 600 W line transformer is used)
2) VR1 = VR
3) VT2 = VT1 ¥ (1+
R3
R3
) + VAO ¥ (–
)
R2
R2
= 1 VAO ¥ (1+ R3 ) – VAO ¥ R3 = 1 VAO ¥ (1– R3 )
2
R2
R2
2
R2
Then, where R2 = R3 (e.g., 51 kW), VT2 = 0.
This means that the transmit signal is no longer leaking into the receive circuit.
4) VR2 = VR1 ¥ (1+ R3 ) , where R2 = R3, VR2 = 2 ¥ VR1 = 2 ¥ VR
R2
12/21
¡ Semiconductor
MSM6889
Setup of Transmit Signal Levels
LPF
VAO
5
8
AO
+
_
GAT2
R4
7
R5
R6
10
VP
9
VM
GAT1
PB
PB Tone
Generator
MOD
Modulator
R4,R5,R6 ≥ 20 kW
Figure 3
The modulation analog signal and PB tone from the modem are not sent at a time. The signal to
be sent is determined by the operating mode specified.
This device is provided with the pins for specifying levels of these transmit signals independently.
The answer tones, which are generated from MODULATOR, are handled as modem signals.
VM : Modem signal level (voltage) at MOD (pin 9)
VP : PB tone level (voltage) at PB (pin 10)
When the external resistors are R4, R5 and R6, the signal levels at AO (pin 5) are as shown below.
VAO (modem) =
R4
¥ VM
R5
VAO (PB)
R4
¥ VP
R6
=
Note : R4, R5, R6 ≥ 20 kW
As described in "Resistance Hybrid Condition", signal levels actually sent over a phone line will
be half the above mentioned values under the ideal condition.
13/21
¡ Semiconductor
MSM6889
External Setup of Carrier Detect Level
11
R1
12
R2
6
VR1
VR2
SG
VREF
r1
r2
COMP
R1//r1 + R2//r2 ≥ 20 kW
r1: 250 kW, r2 : 1 MW
Figure 4
Operating Mode
Table 1 Operating Mode Table
Mode Select
Functional Block
Operating Mode
1
2
3
0
0
0
PB Tone Transmit
1
0
0
PB Tone Detect
0
1
0
1
1
0
0
0
1
1
0
1
PB GEN.
PB REC.
CPT REC.
FSK
MODEM ICT1 = “1” ICT1 = “0”
*
*
*
Originate Mode
*
*
Modem (O)
Answer Mode
*
*
O
*
*
Test (ALB)
A
*
*
O
*
*
A
*
*
Modem (A)
Analog Loop Back
0
1
1
Remote Digtal Loop
1
1
1
Back Test (RDLB)
* : Active
When power is turned on or the power down mode is released, put the device into the PB tone
transmit mode or PB tone detect mode.
14/21
¡ Semiconductor
MSM6889
Signal flow concept for the modem normal operating mode is shown in Fig. 5.
AIN
Receive
Filter
Demodulator
Transmit
Filter
Modulator
RD
Receive Data
Line
AO
TD
Transmit
Data
Figure 5
In the test modes, signal flow shown in Fig. 6 is used. O/(originate)/A(answer) in the test mode
is the expression where the modulator side is referred to as the basis.
AIN
Receive
Filter
Demodulator
Transmit
Filter
Modulator
Receive
Filter
Demodulator
Transmit
Filter
Modulator
RD
Receive Data
[ALB]
AO
AIN
TD
RD
Transmit
Data
Receive Data
[RDLB]
AO
TD
Transmit
Data
Figure 6
15/21
¡ Semiconductor
MSM6889
PB Tone Transmit Mode and PB Tone Detect Mode
When PBG1 to PBG4 are externally connected to PB1 to PB4 so as to use them as 4-bit bus lines,
their tone generation timings are as shown below.
1)
PB Tone Transmit Mode
When TEN is in the digital "0" state, PB tone is generated according to Table 2.
TEN
TPBGS
TPBGH
PBG1/PB1
PBG2/PB2
PBG3/PB3
PBG4/PB4
PB
941 Hz + 1477 Hz
Figure 7
2)
PB Tone Detect Mode
941 Hz + 1477 Hz
852 Hz + 1209 Hz
AIN
TG
"0"
TD
"1"
PB1/PBG1
"0"
"1"
PB2/PBG2
PB3/PBG3
PB4/PBG4
SP
"1"
"1"
"0"
"1"
TSP
Figure 8
16/21
¡ Semiconductor
MSM6889
Table 2 PB Tone Code Table
Low-Group Freq. (Hz)
Button
697
1
*
2
*
3
770
852
941
*
6
*
1633
*
9
*
0
1
1
0
1
0
0
0
1
0
1
0
1
1
0
0
1
1
1
1
0
0
0
1
0
0
1
1
0
1
0
1
0
1
1
1
1
0
0
*
1
1
0
1
*
1
1
1
0
*
1
1
1
1
*
0
0
0
0
*
*
#
*
*
*
*
*
*
*
*
*
PBG4 PBG3 PBG2 PBG1
0
0
0
1
1
*
*
PB1/
0
*
0
PB2/
0
*
*
PB3/
0
*
8
PB4/
0
*
7
D
1477
*
*
5
C
1336
*
*
B
1209
*
4
A
High-Group Freq. (Hz)
Call Progress Tone (CPT) Detect Mode
400 Hz
AIN
R = TW/(TD + TW) ¥ 100 [%]
CP
ICT1 = "1"
TW TD
CP
ICT1 = "0"
Figure 9
17/21
¡ Semiconductor
MSM6889
APPLICATION CIRCUIT
Pin Connection
MSM6889RS
1
R3
C2
+
–
C1
2
3
4
R1
R2
5
+
6
–
7
R4
8
R5
9
R6
10
11
12
C3
+
–
13
14
15
16
17
18
19
20
21
VA
VD
GAR
VD2
AIN+
NC
AIN–
PON
AO
SP
SG
PB4
GAT1
PB3
GAT2
PB2
MOD
PB1
PB
CP
VR1
CD
VR2
RD
AG
CLK
PBG1
X2
PBG2
X1
PBG3
MODE3
PBG4
MODE2
TEN
MODE1
TD
ICT3
RS
ICT2
DG
ICT1
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
3.579545
MHz
26
25
24
23
22
R1 = 600 W, R2 = R3 = R4 = R5 = R6 = 51 kW
C1 = 2 mF, C2 = C3 = 10 mF
18/21
¡ Semiconductor
MSM6889
Bypass Capacitor Connections
The MSM6889 contains analog circuits.
Note that noise occurred in the power supply by trouble in other circuits may cause degradation
in characteristics of the device.
The examples of connected bypass capacitors of the MSM6889 are shown below.
MSM6889
VA, VD
10 mF to 47 mF
SG
AG, DG
MSM6889
VA, VD
1 mF
10 mF to 47 mF
SG
1 mF
AG, DG
MSM6889
VA, VD
10 mF
10 mF to 47 mF
*1 mF
SG
10 mF
AG, DG
* Laminated ceramic capacitor
19/21
¡ Semiconductor
MSM6889
PACKAGE DIMENSIONS
(Unit : mm)
DIP42-P-600-2.54
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
6.20 TYP.
20/21
¡ Semiconductor
MSM6889
(Unit : mm)
QFP56-P-1519-1.00-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.46 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
21/21