SG5768, SG5770, SG5772, SG5774 SG6506/SG6507/SG6508/SG6509 DIODE ARRAY CIRCUITS DESCRIPTION FEATURES The Linfinity series of diode arrays feature high breakdown, high speed diodes in a variety of configurations. • 60V minimum breakdown voltage • 500mA current capability per diode • Fast switching speeds: typically less than 10ns • Low leakage current Each array configuration consists of either common anode diodes, common cathode diodes, or a combination of common anode and common cathode diodes. HIGH RELIABILITY FEATURES Individual diodes within the array have 60V minimum breakdown voltage, can handle 500mA of current and typically switch in less than 10 nanoseconds. Each of the array configurations is available in ceramic DIP or ceramic flatpack and can be processed to JANTXV, JANTX, or JAN flows at Linfinity’s MIL-S-19500 facility. ♦ MIL-S-19500/474 QPL - 1N5768 - 1N5770 - 1N5772 - 1N5774 ♦ JANTXV, JANTX & JAN available ♦ LMI level "S" processing available 1N6506 1N6507 1N6508 1N6509 CIRCUIT DIAGRAMS COMMON CATHODE SG5768/SG6506 COMMON ANODE SG5770/SG6507 COMMON ANODE / COMMON CATHODE SG5772/SG6508 DUAL COMMON ANODE / COMMON CATHODE SG5774/SG6509 LINFINITY 6/90 Rev 1.1 2/94 Copyright 1994 1 Microelectronics Inc. 11861 Western Avenue ∞ Garden Grove, CA 92841 (714) 898-8121 ∞ FAX: (714) 893-2570 DIODE ARRAY SERIES ABSOLUTE MAXIMUM RATINGS (Note 1 & 2) Breakdown Voltage (VBR) ................................................... 60V Output Current (IO), TC = 25°C Continuous ................................................................ 500mA Operating Junction Temperature Hermetic (J, F Packages) ............................................ 150°C Storage Temperature Range ............................ -65°C to 200°C Note 1. Exceeding these ratings could cause damage to the device. Note 2. Applicable for each diode. THERMAL DATA J Package: Thermal Resistance-Junction to Case, θ JC .................. 30°C/W Thermal Resistance-Junction to Ambient, θ JA .............. 80°C/W F Package (10 Pin): Thermal Resistance-Junction to Case, θ JC .................. 80°C/W Thermal Resistance-Junction to Ambient, θ JA ............ 145°C/W F Package (14 Pin): Thermal Resistance-Junction to Case, θ JC .................. 80°C/W Thermal Resistance-Junction to Ambient, θ JA ............ 140°C/W RECOMMENDED OPERATING CONDITIONS Note A. Junction Temperature Calculation: TJ = TA + (PD x θ JA). Note B. The above numbers for θJC are maximums for the limiting thermal resistance of the package in a standard mounting configuration. The θJA numbers are meant to be guidelines for the thermal performance of the device/pcboard system. All of the above assume no ambient airflow. (Note 3) Operating Ambient Temperature Range SG5768 .......................................................... -55°C to 150°C SG5770 .......................................................... -55°C to 150°C SG5772 .......................................................... -55°C to 150°C Operating Ambient Temperature Range SG5774 .......................................................... -55°C SG6506 .......................................................... -55°C SG6507 .......................................................... -55°C SG6508 .......................................................... -55°C SG6509 .......................................................... -55°C to to to to to 150°C 150°C 150°C 150°C 150°C Note 3. Range over which the device is functional. ELECTRICAL CHARACTERISTICS (Unless otherwise specified, these specifications apply for the operating temperature of TA = 25°C for each diode. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.) Parameter Breakdown Voltage (VBR) Forward Voltage (VF) Reverse Current (IR) Capacitance (C) (Note 4) Forward Recovery Time (tfr ) (Note 4) Reverse Recovery Time (trr) (Note 4) Test Conditions IR = 10µA Duty Cycle ≤ 2%, 300 µs pulse IF = 100mA IF = 200mA IF = 500mA IF = 10mA, TA = -55°C VR = 40V VR = 40V, TA = 150°C VR = 0V, f = 1MHz, Pin-to-pin SG5768/SG6506 Units Min. Typ. Max. 60 V 1.0 1.1 1.5 1.0 100 50 4 V V V V nA µA pf IF = 500mA, tr ≤ 15ns, Vfr = 1.8V, RS = 50Ω 40 ns IF = IR = 200mA, irr = 20mA, RL = 100Ω 20 Note 4. The parameters, although guaranteed, are not 100% tested in production. LINFINITY 6/90 Rev 1.1 2/94 Copyright 1994 2 Microelectronics Inc. 11861 Western Avenue ∞ Garden Grove, CA 92841 (714) 898-8121 ∞ FAX: (714) 893-2570 DIODE ARRAY SERIES ELECTRICAL CHARACTERISTICS Parameter Breakdown Voltage (VBR ) Forward Voltage (VF ) Reverse Current (I R) Capacitance (C) (Note 4) Forward Recovery Time (t fr) (Note 4) Reverse Recovery Time (t rr) (Note 4) Parameter Breakdown Voltage (VBR) Forward Voltage (VF) Reverse Current (IR) Capacitance (C) (Note 4) Forward Recovery Time (tfr ) (Note 4) Reverse Recovery Time (trr) (continued) Test Conditions IR = 10µA, 100ms pulse, ≤ 20% Duty Cycle Duty Cycle ≤ 2%, 300 µs pulse IF = 100mA IF = 200mA IF = 500mA IF = 10mA, TA = -55°C VR = 40V VR = 40V, TA = 150°C VR = 0V, f = 1MHz, Pin-to-pin Units Min. Typ. Max. 60 V IF = 500mA, tr ≤ 15ns, Vfr = 1.8V, RS = 50Ω IF = IR = 200mA, irr = 20mA, RL = 100Ω Test Conditions IR = 10µA, 100ms pulse, ≤ 20% Duty Cycle Duty Cycle ≤ 2%, 300µs pulse IF = 100mA IF = 200mA IF = 500mA IF = 10mA, TA = -55°C VR = 40V VR = 40V, TA = 150°C VR = 0V, f = 1MHz, Pin-to-pin 7 7 LINFINITY 6/90 Rev 1.1 2/94 3 1.0 1.1 1.5 1.0 100 50 8 V V V V nA µA pf 40 ns 20 ns SG5772/SG6508 SG5774/SG6509 Min. Typ. Max. 60 IF = 500mA, tr ≤ 15ns, Vfr = 1.8V, RS = 50Ω (Note 4) Copyright 1994 SG5770/SG6507 Units V 1.0 1.1 1.5 1.0 100 50 8 V V V V nA µA pf 40 ns 20 ns Microelectronics Inc. 11861 Western Avenue ∞ Garden Grove, CA 92841 (714) 898-8121 ∞ FAX: (714) 893-2570 DIODE ARRAY SERIES CONNECTION DIAGRAMS & ORDERING INFORMATION Package 14-PIN CERAMIC DIP J - PACKAGE (See Notes Below) Part No. Ambient Temperature Range SG6506J (1N6506) -55°C to 150°C -55°C to 150°C Connection Diagram 1 2 14 13 3 4 12 11 5 10 9 6 7 10-PIN CERAMIC FLATPACK F - PACKAGE 14-PIN CERAMIC DIP J - PACKAGE SG5768F (1N5768) SG6507J (1N6507) -55°C to 150°C -55°C to 150°C 1 10 2 9 3 4 8 5 6 7 -55°C to 150°C -55°C to 150°C 1 2 14 3 4 5 12 6 7 10-PIN CERAMIC FLATPACK F - PACKAGE 14-PIN CERAMIC DIP J - PACKAGE 10-PIN CERAMIC FLATPACK F - PACKAGE SG5770F (1N5770) SG6508J (1N6508) SG5772F (1N5772) -55°C to 150°C -55°C to 150°C -55°C to 150°C -55°C to 150°C -55°C to 150°C -55°C to 150°C 8 13 11 10 9 8 1 10 2 9 3 4 8 5 6 7 1 14 2 13 3 12 4 11 5 10 6 9 7 8 1 10 2 9 3 8 4 7 5 6 Note 1. Consult factory for other packages available. 2. All packages are viewed from the top. 3. Consult factory for JAN, JAN TX, and JAN TXV product availability. LINFINITY 6/90 Rev 1.1 2/94 Copyright 1994 4 Microelectronics Inc. 11861 Western Avenue ∞ Garden Grove, CA 92841 (714) 898-8121 ∞ FAX: (714) 893-2570 DIODE ARRAY SERIES CONNECTION DIAGRAMS & ORDERING INFORMATION Package 14-PIN CERAMIC DIP J - PACKAGE 14-PIN CERAMIC FLATPACK F - PACKAGE Part No. Ambient Temperature Range SG6509J (1N6509) -55°C to 150°C -55°C to 150°C SG5774F (1N5774) -55°C to 150°C -55°C to 150°C Connection Diagram 1 14 2 13 3 12 4 11 5 10 6 9 7 8 1 14 2 13 3 12 4 11 5 10 6 9 7 8 LINFINITY 6/90 Rev 1.1 2/94 Copyright 1994 (continued) 5 Microelectronics Inc. 11861 Western Avenue ∞ Garden Grove, CA 92841 (714) 898-8121 ∞ FAX: (714) 893-2570