YELLOW Item No.: 171282 1. This specification applies to AlInGaP / GaAs LED Chips 2. Structure 2.1 Mesa structure 2.2 Electrodes 3. Outlines (dimensions in microns) p-side (anode) n-side (cathode) Au alloy or Al Au alloy p-Electrode Epitaxy AlInGaP 235 110 250 n-Substrate GaAs 235 n-Electrode Chip thickness could also be 180 µm or 210 µm Wire bond contacts can also be square 4. Electrical and optical characteristics (T=25°C) Parameter Symbol Conditions VF IR IF = 20 mA VR = 5 V Forward voltage Reverse current min typ max Unit 2,10 2,40 10 V Luminous intensity * IV IF = 10 mA 55 dom. wavelength IF = 20 mA 580 λD * On request, wafers will be delivered according to luminous intensity classes Brightness measurement at OSA on gold plate 5. µA mcd nm Packing Dice on adhesive film with 1) wire bond side on top 2) back contact on top 6. Labeling Type Lot No. IV typ min max Quantity © 2004 OSA Opto Light GmbH Tel. +49-(0)30-65 76 26 83 Fax +49-(0)30-65 76 26 81 [email protected]