10/100Base-TX Interface PCMCIA Module ELECTRONICS INC. EPF8209S-RC • Designed to work with Broadcom BCM5201, BCM5221 Chipsets • Complies with or exceeds IEEE 802.3, 10/100Base-TX Standards • Robust design allows for toughest soldering processes • Add “-RC” after part number for RoHS Compliant • 1500 Vrms Isolation • Lead-Free Electrical Parameters @ 25° C OCL (µH Min.) @ 8 mA DC Bias Interwinding Capacitance (pF Max.) Leakage Inductance (µH Max.) 100 KHz, 0.1 Vrms @ 100 KHz, 0.1 Vrms @ 100 KHz, 0.1 Vrms 1 MHz Xmit & Rcv Xmit & Rcv Xmit & Rcv Xmit/Rcv 350 @ Pins 16-15 & 10-9 25 0.3 -27/-27 CMRR (dB Min.) 30 MHz 60 MHz Xmit/Rcv Xmit/Rcv -17/-9 -16/-4 Primary DCR (Ω Max.) Return Loss (dB Min.) 80 MHz 100 MHz 1-30 MHz Xmit/Rcv Xmit/Rcv -14/-2 -12/-1 30-60 MHz 60-80 MHz Xmit Rcv Xmit & Rcv -10 -14 -10 1.5 1.0 • Insertion Loss : -1 dB Max., 1 MHz to 100 MHz • Package Schematic .500 (12.70) .050 (1.27) .070 (1.78) PCA EPF8209S-RC Date Code Pin 1 I.D. .270 (6.86) Pri. 1 .105 (2.67) Pad Layout .420 (10.67) 2 6 .030 (.762) .007/.012 (.178/.305) 15 14 Transmit 7 .008/.012 (.203/.305) 0°-6° Sec. 16 1CT:1CT 3 .350 (8.89) .080/.088 (2.03/2.23) Receive 11 10 8 9 1CT:1CT .018/.022 (.457/.559) .050 (1.27) .021 Typ. (.533) .374 Max. (9.50) Notes : EPF8209S-RC 1. Lead Finish Hot Tin Dip (Sn) † 2. Peak Temperature Rating 245°C 3. Moisture Sensitive Levels MSL = 1 (Unlimited, ≤30°C/85%RH) 4. Weight TBD gram (Tube) 5. Packaging Information (Tape & Reel) TBD pieces/tube 1500 pieces/13” reel † Lead Material : Ni Barrier over Cu Unless Otherwise Specified Dimensions are in Inches /mm ± .010 /.25 PCA ELECTRONICS, INC. 16799 SCHOENBORN ST. NORTH HILLS, CA 91343 Product performance is limited to specified parameters. Data is subject to change without prior notice. CSF8209S -RC Rev. 1 4/9/07 JDG TEL: (818) 892-0761 FAX: (818) 894-5791 http://www.pca.com