05107 P0402FC3.3C* thru P0402FC36C* . . . engineered solutions for the transient environment™ BIDIRECTIONAL FLIP CHIP APPLICATIONS ✔ Cellular Phones ✔ MCM Boards ✔ Wireless Communication Circuits ✔ IR LEDs ✔ SMART Cards & PCMCIA Cards IEC COMPATIBILITY (EN61000-4) 0402 ✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV ✔ 61000-4-4 (EFT): 40A - 5/50ns FEATURES ✔ ESD Protection > 25 kilovolts ✔ Available in Multiple Voltage Types Ranging From 3.3V to 36V ✔ 250 Watts Peak Pulse Power Dissipation per Line (8/20µs) ✔ Monolithic Structure MECHANICAL CHARACTERISTICS ✔ Standard EIA Chip Size: 0402 ✔ Weight 0.73 milligrams (Approximate) ✔ Flammability Rating UL 94V-0 ✔ 8mm Tape and Reel Per EIA Standard 481(Plastic or Paper) ✔ Device Marking On Reel ✔ Top Contacts: Solder Bump 0.004” in Height (Nominal) CIRCUIT DIAGRAM * U.S. Patent No. Des. “D456,367 S” 05107.R7 11/02 1 www.protekdevices.com P0402FC3.3C* thru P0402FC36C* DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25°C Unless Otherwise Specified SYMBOL VALUE UNITS Peak Pulse Power (tp = 8/20µs) - See Figure 1 PPP 250 Watts Operating Temperature TJ -55°C to 150°C °C TSTG -55°C to 150°C °C PARAMETER Storage Temperature ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified PART NUMBER (See Note 1 & Note 2) RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM CLAMPING VOLTAGE (See Fig. 2) VWM VOLTS @ 1mA V(BR) VOLTS @ IP = 1A VC VOLTS 3.3 5.0 8.0 12.0 15.0 24.0 36.0 4.0 6.0 8.5 13.3 16.7 26.7 40.0 7.0 9.8 13.4 19.0 24.0 43.0 64.0 P0402FC3.3C P0402FC05C P0402FC08C P0402FC12C P0402FC15C P0402FC24C P0402FC36C MAXIMUM LEAKAGE CURRENT TYPICAL CAPACITANCE @8/20µs VC @ IPP @VWM ID µA 0V @ 1 MHz C pF 12.5V @ 20A 14.7V @ 17A 19.2V @ 13A 29.7V @ 9.0A 35.7V @ 7.0A 55.0V @ 5.0A 84.0V @ 3.0A 75 10 10 1 1 1 1 150 100 75 50 40 30 25 Note 1: All devices are bidirectional. Electrical characteristics apply in both directions. Note 2: SPICE model and parameters are available for the P0402FC05C on the ProTek Devices website: http://www.protekdevices.com/spice. FIGURE 1 PEAK PULSE POWER VS PULSE TIME 120 1,000 250W, 8/20µs Waveform 100 IPP - Peak Pulse Current - % of IPP PPP - Peak Pulse Current - Watts 10,000 10 0.01 FIGURE 2 PULSE WAVE FORM tf 100 Peak Value IPP 80 e-t TEST WAVEFORM PARAMETERS tf = 8µs td = 20µs 60 40 td = t I /2 PP 20 0 1 10 td - Pulse Duration - µs 100 1,000 0 5 10 15 t - Time - µs 20 25 * U.S. Patent No. Des. “D456,367 S” 05107.R7 11/02 2 www.protekdevices.com 30 P0402FC3.3C* thru P0402FC36C* GRAPHS FIGURE 3 POWER DERATING CURVE 100 Peak Pulse Power 8/20µs 80 % Of Rated Power FIGURE 4 REFLOW SOLDER PROFILE 225°C 5-10 sec 60 200°C Instantaneous to 200°C 40 1-2 Minutes to 150°C 20 1-2 Minutes to 25°C 100°C Average Power 0 0 25 50 75 100 125 TL - Lead Temperature - °C 150 Pre-Heat Time Soldering Time Cool Down Time Note: This reflow profile does not take into account the printed circuit board (PCB) material heating time. Additional time may be required for the preheat time and cool down time upon the PCB or board material. FIGURE 5 OVERSHOOT & CLAMPING VOLTAGE FOR P0402FC05C 40 5 Volts per Division 30 20 10 0 ESD Test Pulse - 12 kilovolt, 1/30ns (waveshape) FIGURE 6 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT VC - Clamping Voltage - Volts 14 12 10 P0402FC05C 8 6 4 2 0 0 5 10 15 20 IPP - Peak Pulse Current - Amps * U.S. Patent No. Des. “D456,367 S” 05107.R7 11/02 3 www.protekdevices.com P0402FC3.3C* thru P0402FC36C* APPLICATION NOTE The P0402FC Series are flip-chip components that provide board level EFT and ESD protection > 25 kilovolts with an additional surge capability of 250 Watts PPP per line for an 8/20µs waveform. BIDIRECTIONAL COMMON MODE CONFIGURATION (Figure 1) The 0402FC Series provides single line, bidirectional protection in a common mode configuration as depicted in Figure 1. CIRCUIT BOARD LAYOUT RECOMMENDATIONS Circuit board layout is critical for Electromagnetic Compatibility (EMC) protection. The following guidelines are recommended: ♦ The protection device should be placed near the input terminals or connectors, the device will divert the transient current immediately before it can be coupled into the nearby traces. ♦ The path length between the TVS device and the protected line should be minimized. ♦ All conductive loops including power and ground loops should be minimized. ♦ The transient current return path to ground should be kept as short as possible to reduce parasitic inductance. ♦ Ground planes should be used whenever possible. For multilayer PCBs, use ground vias. Figure 1 - Bidirectional Configuration Common-Mode I/O Port Protection * U.S. Patent No. Des. “D456,367 S” 05107.R7 11/02 4 www.protekdevices.com P0402FC3.3C* thru P0402FC36C* PACKAGE OUTLINE & DIMENSIONS SIDE 0402 PACKAGE DIMENSIONS G B TOP C A PACKAGE OUTLINE D E F H END I DIM MILLIMETERS INCHES A B C D E F G H 0.46 NOM 0.86 NOM 0.99 ± 0.0254 0.10 NOM 0.35 NOM 0.483 ± 0.0254 0.20 NOM 0.127 MAX 0.076 MIN 0.406 NOM 0.018 NOM 0.034 NOM 0.039 ± 0.001 0.004 NOM 0.014 NOM 0.019 ± 0.001 0.008 NOM 0.005 MAX 0.003 MIN 0.016 NOM I MOUNTING PAD C PAD DIMENSIONS B SOLDER PAD D A F SOLDER BUMP E H DIE A B C D E F G H I 0.23 0.48 0.69 0.46 0.99 0.20 0.20 0.66 0.13 Inches 0.009 0.019 0.027 0.018 0.039 0.008 0.008 0.026 0.005 NOTE: Preferred: Using 0.1mm (0.004”) stencil. TAPE & REEL ORIENTATION Single Die 0402 NOTE: 1. Top view of tape. Solder bumps are face down in tape package. G I SOLDER PRINT DIAMETER 0.010” 0.012” DIM Millimeters NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). 3. Maximum chip size: 1.02 (0.040”) by 0.51(0.020”). 06001 Rev 3 - 11/02 TAPE & REEL ORDERING INFORMATION: Surface mount product is taped and reeled in accordance with EIA-481. Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., P0402FC05C-T75-1). Paper Tape: 7 Inch Reels - 10,000 pieces per reel. Ordering Suffix: -T710-2 (i.e., P0402FC05C-T710-2). COPYRIGHT © ProTek Devices 2003 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: [email protected] Web Site: www.protekdevices.com * U.S. Patent No. Des. “D456,367 S” 05107.R7 11/02 5 www.protekdevices.com