KSB130 003A KSB13003A ◎ SEMIHOW REV.A1,Oct 2007 KSB130 003A KSB13003A High g Voltage g Switch Mode Application pp • High Speed Switching • Suitable for Electronic Ballast up to 21W Absolute Maximum Ratings CHARACTERISTICS SYMBOL RATING UNIT VCBO VCEO VEBO IC ICP IB PC TJ TSTG 700 400 9 1.5 3 0.75 1.10 150 -65~150 V V V A A A W ℃ ℃ Collector-Base Voltage Collector-Emitter Collector Emitter Voltage Emitter-Base Voltage Collector Current(DC) Collector Current(Pulse) Base Current Collector Dissipation(Tc=25℃) Junction Temperature Storage Temperature Electrical Characteristics CHARACTERISTICS 1.5 Amperes NPN Silicon Power Transistor 1.1 Watts TC=25℃ unless otherwise noted TO-92 1. Base 2. Collector 3. Emitter 3 1 2 TC=25℃ unless otherwise noted SYMBOL Test Condition Min Typ. Max Unit Collector-Base Breakdown Voltage VCBO IC=500μA, IE=0 700 V Collector-Emitter Breakdown Voltage VCEO IC=5mA, IB=0 400 V Emitter Cut-off Current IEBO VEB=9V,IC=0 *DC Current Gain hFE1 hFE2 VCE=2V,IC=0.5A VCE=2V,IC=1A *Collector-Emitter Saturation Voltage VCE(sat) IC=0.5A,IB=0.1A IC=1A,IB=0.25A IC=1.5A,IB=0.5A 0.5 1.0 3.0 V V V *Base-Emitter Saturation Voltage VBE(sat) IC=0.5A,IB=0.1A IC=1A,IB=0.25A 1.0 1.2 V V Cob VCB=10V, f=0.1MHz C Current t Gain G i Bandwidth B d idth P Product d t fT VCE=10V,I 10V IC=0.1A 0 1A Turn on Time ton Storage Time tstg Fall Time tF Output Capacitance 10 8 5 ㎂ 35 ㎊ 21 ㎒ 4 Vcc=125V, Ic=2A IB1=0.2A, IB2= -0.2A RL=125Ω 1.1 ㎲ 4.0 ㎲ 0.7 ㎲ * Pulse Test: Pulse Width≤300μs, Duty Cycle≤2% Note. hFE1 Classification Package Mark information. R O Y G 9 ~ 16 14 ~ 21 19 ~ 26 25 ~ 35 S A 13003 YWW Z S YWW Z SemiHow Symbol Y; year code, WW; week code hFE1 Classification ◎ SEMIHOW REV.A1,Oct 2007 KSB130 003A Typical Characteristics ◎ SEMIHOW REV.A1,Oct 2007 KSB130 003A Typical Characteristics ◎ SEMIHOW REV.A1,Oct 2007 KSB130 003A Package Dimension TOTO -92 3.71±0.2 4.58±0.25 3° 4.58±0.25 4° 14.47 7±0.5 0.46±0.1 1 27t 1.27typ 3.6±0.25 1.02±±0.1 3.71±0.225 1.27typ Dimensions in Millimeters ◎ SEMIHOW REV.A1,Oct 2007 KSB130 003A Package Dimension W W1 W0 H0 H W2 H1 TOTO -92 TAPING D0 F1 F2 P1 P P2 Dimension [mm] Item Symbol Reference Tolerance Component pitch P 12.7 ±0.5 Side lead to center of feed hole P1 3.85 ±0.5 Center lead to center of feed hole P2 6.35 ±0.5 FI,F2 2.5 +0.2/-0.1 Carrier Tape width W 18.0 +1.0/-0.5 Adhesive tape width W0 6.0 ±0.5 Tape feed hole location W1 9.0 ±0.5 Adhesive tape position W2 Lead pitch 1.0 MAX Center of feed hole to bottom of component H 19.5 ±1 Center of feed hole to lead form H0 16.0 ±0.5 Component height H1 Tape feed hole diameter D0 27.0 max 4.0 ±0.2 ◎ SEMIHOW REV.A1,Oct 2007