Z-Power LED X10490 Technical Data Sheet Specification AWT801-S SSC Drawn Approval CUSTOMER Approval Rev. 01 August 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet CONTENTS 1. Features & Application 2. Absolute Maximum Ratings 3. Electro Characteristics 4. Optical characteristics 5. Rank of AWT801-S 6. Color & Binning 7. Outline Dimension 8. Packing 9. Soldering 10. Precaution for use 11. Handling of Silicone Resin LEDs 12. Reliability Test Item and Condition Rev. 01 August 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet AWT801-S Features Description This surface-mount LED comes in PLCC standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by epoxy or silicone The package design coupled with careful selection of component materials allow these products to perform with high reliability in a larger temperature range -40℃ to 100℃. The high reliability feature is crucial to Automotive interior and Indoor ESS. AWT801-S 사진 • Industry Standard PLCC SMT package • High brightness using InGaN dice technologies • High volume, high reliability Applications • Interior automotive • Electronic Signs and Signals • Office Automation, Electrical Appliances, Industrial Equipment Rev. 01 August 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 1. Features & Application • Warm-White colored SMT package • Material InGaN/SiC • Suitable for all SMT assembly methods Suitable for all soldering methods • RoHS Compliant •Interior automotive •Electronic Signs and Signals •Office Automation, Electrical Appliances, Industrial Equipment Rev. 01 August 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 2. Absolute maximum ratings Parameter Symbol Value Unit Power Dissipation Pd 120 mW Forward Current IF 30 mA Peak Forward Current IFM *2 90 mA Reverse Voltage VR 5 V Topr -40 ~ +100 oC Tstg -40 ~ +100 oC Operating Temperature Storage Temperature *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio. 3. Electric characteristics Parameter Symbol Condition Min Typ Max Unit Forward Voltage VF IF=20 mA 2.7 3.3 4.0 V Reverse Current IR VR=5V - - 50 μA Luminous Intensity*1 IV IF=20 mA 1600 mcd Luminance Flux ΦV IF =20 mA 4 lm 2θ1/2 IF=20 mA Optical Efficiency ηop IF =20 mA Thermal Resistance*3 Rthja IF =20 mA Viewing Angle *1. the the *2. *3. *2 - 120 - 63 - 120 deg. lm/W - K/W The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with mechanical axis of LED package. Luminous Intensity Measurement allowance is ±10% 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. Rthja results from mounting on PCB FR4(pad size≥16mm2 per pad, thickness≒ 0.6mm) Rev. 01 August 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Relative Luminous Intensity vs Forward Current Forward Current vs. Forward Voltage (Ta=25 OC ) (Ta=25 OC ) 2.2 Relative Luminous Intensity [a.u.] 2.0 Forward Current IF[mA] Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics 1 10 0 10 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 4.2 0 10 Forward Voltage VF[V] 20 30 Forward Current Derating Curve Radiation Diagram (Ta=25 OC ) 40 Forward Current IF[mA] 40 Forward Current IF[mA] 0 30 -30 30 20 -60 60 10 0 -40 -20 0 20 40 60 80 100 120 -90 90 o Ambient Temperature TA[ C] Rev. 01 August 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 5. Rank of AWT801-S ▣ Rank Name X1 X2 X3 IV Color Rank VF ▣ Luminous Intensity [mcd] Rank Name MIN MAX Color Target J0 1000 1300 V, W J3 1300 1700 R, S, T, V, W J7 1700 2300 R, S, T, V Rank Name MIN MAX Z 3.0 3.3 A 3.3 3.6 ▣ Forward Voltage [V] Rev. 01 August 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 6. Color & Binning 0.9 515 0.8 520 525 530 510 535 0.7 540 545 550 555 505 560 0.6 565 570 575 580 585 590 595 600 CIE (y) 500 0.5 0.4 0.3 0.2 0.1 0.0 0.0 495 610 620 630 830 490 485 480 475 470 460 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 CI E(x) Rev. 01 August 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) 0.46 2700K 0.44 3000K 0.40 4500K R1 0.38 R0 RA 0.36 SA V0 T0 S1 S0 W0 T1 4000K VA TA W1 V1 3500K 0.42 Y Z-Power LED X10490 Technical Data Sheet 6. Color & Binning WA WB VB TB SB RB 0.34 0.34 0.36 0.38 0.40 0.42 0.44 0.46 X ● COLOR RANK 0.48 0.50 <IF=20mA, Ta=25℃> 4500K RB X 0.3515 0.35 0.3649 0.3676 RA Y 0.3487 0.34 0.3482 0.36 X 0.3531 0.3515 0.3676 0.3704 R0 Y 0.3605 0.3487 0.36 0.3725 X 0.3546 0.3531 0.3704 0.3733 R1 Y 0.3717 0.3605 0.3725 0.3855 X 0.3562 0.3546 0.3733 0.376 Y 0.3855 0.3725 0.3881 0.402 X 0.376 0.3733 0.3997 0.4044 Y 0.3983 0.3843 0.3991 0.4127 X 0.4037 0.3985 0.4283 0.4356 Y 0.4127 0.3991 0.4058 0.422 X 0.4356 0.4283 0.4541 0.4617 Y 0.422 0.4058 0.415 0.43 X 0.4617 0.4541 0.4867 0.497 Y 0.3826 0.3717 0.3855 0.3974 4000K SB X 0.3676 0.3649 0.3866 0.391 SA Y 0.36 0.3482 0.3618 0.375 X 0.3704 0.3676 0.391 0.3952 S0 Y 0.3725 0.36 0.375 0.3881 X 0.3733 0.3704 0.3952 0.3997 S1 Y 0.3974 0.3855 0.402 0.416 3500K TB X 0.3898 0.386 0.4106 0.4158 TA Y 0.3716 0.36 0.372 0.3841 X 0.394 0.3898 0.4158 0.4225 T0 Y 0.3843 0.3716 0.3841 0.3991 X 0.3985 0.394 0.4225 0.4283 T1 Y 0.414 0.3983 0.4127 0.4294 3000K VB X 0.4158 0.4106 0.4307 0.4381 VA Y 0.3841 0.372 0.3768 0.391 X 0.4225 0.4158 0.4381 0.4457 V0 Y 0.3991 0.3841 0.391 0.4058 X 0.4283 0.4225 0.4457 0.4541 V1 Y 0.4294 0.4127 0.422 0.4371 2700K WB X Y 0.4381 0.391 0.4307 0.3768 0.4588 0.3838 0.467 0.3979 * Measurement Uncertainty WA X 0.4457 0.4381 0.467 0.478 of the Color W0 Y 0.4058 0.391 0.3979 0.415 Coordinates X 0.4541 0.4457 0.478 0.4867 : ± 0.01 W1 Y 0.4371 0.422 0.43 0.4466 Rev. 01 August 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 6. Color & Binning 0.46 2700K 0.44 W1 3000K 0.40 S2 R1 0.38 R0 RA 0.36 SA V0 T0 S1 4500K W0 T1 4000K Y V1 3500K 0.42 TA VA VB WA WB TB SB RB 0.34 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 X 0.46 0.44 0.42 Y 2500K 2900K 0.40 3200K 3700K 0.38 4200K 0.36 4700K 0.34 0.34 0.36 0.38 0.40 0.42 X 0.44 0.46 0.48 0.50 Rev. 01 August 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Recommended Solder Pattern 1.9 2.80 2.20 1.8 0.80 0.85 1.6 Cathode 1.8 1.50 3.20 2.40 1.65 Anode 0.50 0.15 2.2 ATTENTION MARKING ON LED IS ANODE(+) ( Tolerance: ±0.2, Unit: mm ) 8. packing 4 .0 ±0 .1 3.5±0.1 5° 5° 1.75±0.1 2 .0 ±0 .0 5 0 .2 2 ±0 .0 5 1 .5 5 ± 0 .0 5 1 .0 ±0 .1 3.83±0.1 C0.8 8±0.1 8° 3 .1 ±0 .1 2 .2 2 ±0 .1 11.4 ± 0.1 180 +0 -3 9.0 ± 0.3 LABLE 2.0 ± 0.2 13 ±0.2 30° 10 60 Z-Power LED X10490 Technical Data Sheet 7.outline dimension 22 Package M arking (1) Quantity : 2000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package Rev. 01 August 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet ● Reel Packing Structure Reel QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) c a b 245 220 102 7inch 245 220 142 TYPE 1 SIDE c TUV QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. MADE IN KOREA Acriche 1 Semiconductor EcoLight b RoHS a Rev. 01 August 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 9. soldering (1) Lead Solder Lead Solder 2.5~5 o C / sec. Lead Solder Pre-heat 120~150℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 10 sec. Max. 2.5~5 C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC 120sec. Max. (2) Lead-Free Solder Lead-frame Solder 1~5 o C / sec. Lead Free Solder Pre-heat 150~200℃ Pre-heat time 120 sec. Max. Peak-Temperature 260℃ Max. Soldering time Condition 10 sec. Max. 1~5 o C / sec. Pre-heating 150~200 o C 260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC 120sec. Max. (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. Rev. 01 August 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 10. precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desicator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture-proof packing. (11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice. Rev. 01 August 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 11. Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. Rev. 01 August 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 12. Reliability Test Item and Condition Item Reference Test Condition Duration / Cycle Number of Damage Thermal Shock EIAJ ED4701 Ta =-40oC (30MIN) ~ 100oC (30MIN) 100 Cycle 0/22 Temperature Cycle EIAJ ED4701 Ta =-40oC (30MIN) ~ 25oC (5MIN) ~ 100oC (30MIN) ~ 25oC (5MIN) 100 Cycle 0/22 High Temperature Storage High Temperature High Humidity Storage Low Temperature Storage EIAJ ED4701 Ta =100oC 1000 Hours 0/22 EIAJ ED4701 Ta =85oC, RH=85% 1000 Hours 0/22 EIAJ ED4701 Ta =-40oC 1000 Hours 0/22 Operating Endurance Test Internal Reference Ta =25oC, IF =20mA 1000 Hours 0/22 Internal Reference Ta =85oC, RH=85%, IF =15mA 300 Hours 0/22 Internal Reference Ta =85oC, IF =20mA 500 Hours 0/22 Internal Reference Ta =-40oC, IF =20mA 1000 Hours 0/22 MIL-STD883D 1KV at 1.5kΩ; 100pF 3 Time 0/22 High Temperature High Humidity Life Test High Temperature Life Test Low Temperature Life Test ESD(HBM) Criteria for Judging the Damage Item Symbol Condition Forward Voltage VF Reverse Current Luminous Intensity Criteria for Judgement MIN MAX IF =20mA - USL*1 × 1.2 IR VR=5V - USL*1 × 2.0 IV IF =20mA LSL*2 × 0.5 - Note : *1 USL : Upper Standard Level *2 LSL : Lower Standard Level Rev. 01 August 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)