High-speed Buffer Amplifier for CCD Image Sensor CXA3791EN Description The CXA3791EN is a high-speed buffer amplifier IC. (Applications: CCD image sensor output buffers, Digital still cameras, Camcorders, Other general buffers) Features Power consumption: 22mW (typ.) (IDRV = 50μA (180kΩ when VCC = 13V), ISF pin connected to GND, during no signal) Push-pull output High-speed response: 500V/μs (IDRV = 50μA (180kΩ when VCC = 13V), CL = 20pF) Internal sink current mode for CCD with open source output (Settable by external resistance RISF) Enables to set the responsibility by changing the drive current by an external resistor Structure Bipolar silicon monolithic IC Absolute Maximum Ratings (Ta = 25°C) Supply voltage VCC Supply voltage IN Storage temperature Tstg Allowable power dissipation PD 16 V GND – 0.3 to VCC + 0.3 V –65 to +150 °C 0.22 W (when mounted on a two-layer board; 13mm × 13mm, t = 0.63mm) Recommended Operating Conditions Supply voltage VCC 9.0 to 15.5 V Operating temperature Ta –20 to +75 °C Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E08233-PS CXA3791EN Block Diagram and Pin Configuration (Top View) ISF VCC IDRV 6 5 4 1 2 3 IN GND OUT Pin Description and I/O Pin Equivalent Circuit Pin No. 2 5 Symbol I/O GND VCC — — Standard voltage level 0V 13V Equivalent circuit — — Description GND. Supply voltage input. VCC 10 × IDRV 2k 1 IN I CCD output voltage 1 Input. 58 × IISF 2k 10 × IDRV GND External resistor connection for setting the sink current for CCD with open source output. Connect an external resistor between this pin and VCC (Pin 5). Connect this pin to GND (Pin 2) when not using this function. * Set the resistance so that ISF current is 90μA or less. VCC 6 ISF I — 6 30k 20k GND VCC 50 3 OUT O ≈IN 3 Output. 50 GND VCC 4 IDRV I — 4 30k 20k GND -2- External resistor connection for setting the drive current. Connect an external resistor between this pin and VCC (Pin5). * Set the resistance so that IDRV current is 90μA or less. CXA3791EN Electrical Characteristics (Ta = 25°C, VCC = 13V, RIDRV = 180kΩ, ISF pin: connected to GND) DC Characteristics Item Supply current Symbol Measurement conditions Min. Typ. Max. Unit ICC IN = 10V, RIDRV = 180kΩ 1.4 1.6 1.8 mA — 0.999 — V/V –100 — 100 mV *1 IN: 10Vdc ΔV = 1V GAIN = ΔOUT/ΔV Voltage gain VGAIN I/O offset voltage VOFFSET IN = 10V VOFFSET = OUT-IN I/O voltage range VRANGE RIDRV = 78kΩ RIDRV = 120kΩ RIDRV = 180kΩ RIDRV = 270kΩ 3.3 2.9 2.5 2.1 — — — — VCC – 2.0 VCC – 1.85 VCC – 1.8 VCC – 1.7 V Input bias current IBIAS IN = 10V, ISF = 0V –15 –5 6 μA Sync current ISINK IN = 10V, RISF = 180kΩ 2.6 2.9 3.2 mA *1 Voltage gain 10.5V IN ΔV = 1V 9.5V OUT ΔOUT -3- CXA3791EN AC Characteristics (Ta = 25°C, VCC = 13V, IDRV = 50μA (180kΩ when VCC = 13V), ISF pin: connected to GND, RL = 15Ω, CL = 20pF) Item Symbol Measurement conditions Bandwidth GBW IN = 50mVp-p Rise time TRISE IN = 9.5 to 10.5V 10 to 90% Fall time TFALL IN = 10.5 to 9.5V 10 to 90% I/O delay time TDELAY IN = 9.5 to 10.5V @50% Min. Typ. Max. Unit — 220 — MHz — 2.5 3.5 ns — 3.0 4.0 ns 0.9 1.0 2.0 ns *1 *1 *1 *1 Rise time, fall time and I/O delay time 10.5V 50% IN 9.5V 90% 90% OUT 50% 10% TFALL 10% TRISE TDELAY -4- CXA3791EN Evaluation Circuit 180kΩ 180kΩ 1000pF 47µF VCC ISF 6 IDRV 4 5 1 3 2 IN GND 15Ω OUT 20pF A 13V GND -5- CXA3791EN Description of Operation Current Settings 1. Output Drive Current The small signal output impedance of the OUT pin (Pin 3) can be set by connecting the IDRV pin (Pin 4) to VCC through a resistor. The inflow current to the IDRV pin is multiplied by 10 times inside the IC, and flows as the output stage idling current. The IDRV pin has an internal 50kΩ resistor, so the inflow current to the IDRV pin can be calculated as follows. IIDRV = (VCC – VBE × 2)/(RIDRV + 50kΩ) = (13 – 1.46)/(180kΩ + 50kΩ) = 50.2μA Here, VCC = 13V, VBE = 0.73V (typ.), and RIDRV = 180kΩ. The small signal output impedance at this time can be calculated as follows. ROUT = (26mV/(10 × IIDRV))/2 = (26mV/502μA)/2 = 26Ω 2. Sink Current for CCD with open source output The sink current of the IN pin (Pin 6) can be set by connecting the ISF pin (Pin 1) to VCC through a resistor. This sink current can be used as the CCD output stage source follower drive current. The inflow current to the ISF pin is multiplied by 58 times inside the IC, and flows as the sink current. The ISF pin has an internal 50kΩ resistor, so the inflow current to the ISF pin can be calculated as follows. IISF = (VCC – VBE × 2)/(RISF + 50kΩ) = (13 – 1.46)/(180kΩ + 50kΩ) = 50.2μA Here, VCC = 13V, VBE = 0.73V (typ.), and RISF = 180kΩ. The sink current at this time can be calculated as follows. Isink = 58 × IISF = 2.9mA Note) This IC operation depends on IDRV and ISF. Set the external resistance so that IDRV and ISF current are 90μA or less, referring to the table shown below. [IDRV and ISF vs. external resistor] Current (μA) 90 68 50 35 26 Unit When VCC = 15V 100 150 220 330 470 kΩ When VCC = 13V 78 120 180 270 390 kΩ -6- CXA3791EN Example of Representative Characteristics (Upper side) I/O voltage range vs. IDRV pin setting resistance (Lower side) I/O voltage range vs. IDRV pin setting resistance Vcc – 0.0 5.0 Ta = 25˚C Ta = 25˚C 4.5 0.5 4.0 1.0 I/O voltage [V] I/O voltage [V] 3.5 1.5 Vcc = 13V Vcc = 15V 2.0 2.5 3.0 Vcc = 15V 2.5 Vcc = 13V 2.0 1.5 3.0 1.0 3.5 0.5 4.0 0.0 0 50 100 150 200 250 300 350 0 IDRV pin setting resistance [kΩ] 50 100 200 250 300 350 IDRV pin setting resistance [kΩ] Current consumption vs. IDRV pin setting resistance Sink current vs. ISF pin setting resistance 7.0 4.0 Ta = 25˚C Ta = 25˚C 3.5 6.0 3.0 2.5 Sink current [mA] Current consumption [mA] 150 Vcc = 15V Vin = Vcc – 5V 2.0 Vcc = 13V Vin = Vcc – 4V 1.5 5.0 4.0 Vcc = 15V Vin = Vcc – 5V 3.0 Vcc = 13V Vin = Vcc – 4V 2.0 1.0 1.0 0.5 0.0 0.0 0 50 100 150 200 250 300 0 350 50 100 150 200 250 300 350 IDRV pin setting resistance [kΩ] ISF pin setting resistance [kΩ] Current consumption vs. Supply voltage Current consumption vs. Operating temperature 2.0 2.0 1.8 1.6 Current consumption [mA] Current consumption [mA] Ta = 25˚C Ridrv = 180kΩ Vin = Vcc – 4V 1.4 Ridrv = 220kΩ Vin = Vcc – 5V 1.8 1.6 Vcc = 15V Ridrv = 220kΩ Vin = Vcc – 5V Vcc = 13V Ridrv = 180kΩ Vin = Vcc – 4V 1.4 1.2 1.0 10.0 11.0 12.0 13.0 14.0 15.0 16.0 Supply voltage [V] 1.2 –50.0 –25.0 0.0 25.0 50.0 Operating temperature [˚C] -7- 75.0 100.0 CXA3791EN I/O offset voltage vs. Supply voltage I/O offset voltage vs. Operating temperature 20.0 20.0 Ta = 25˚C 10.0 I/O offset voltage [mV] I/O offset voltage [mV] 10.0 0.0 Ridrv = 220kΩ Vin = Vcc – 5V Ridrv = 180kΩ Vin = Vcc – 4V –10.0 –20.0 10.0 11.0 12.0 13.0 14.0 15.0 0.0 Vcc = 13V Ridrv = 180kΩ Vin = Vcc – 4V Vcc = 15V Ridrv = 220kΩ Vin = Vcc – 5V –10.0 –20.0 –50.0 16.0 –25.0 0.0 25.0 50.0 75.0 100.0 Operating temperature [˚C] Supply voltage [V] Input bias current vs. Supply voltage Input bias current vs. Operating temperature 5.0 3.4 Ta = 25˚C Input bias current [µA] Input bias current [µA] 3.2 0.0 Ridrv = 220kΩ Vin = Vcc – 5V –5.0 Ridrv = 180kΩ Vin = Vcc – 4V –10.0 3.0 Vcc = 15V Ridrv = 220kΩ Vin = Vcc – 5V 2.8 Vcc = 13V Ridrv = 180kΩ Vin = Vcc – 4V 2.6 –15.0 10.0 11.0 12.0 13.0 14.0 15.0 2.4 –50.0 16.0 –25.0 0.0 25.0 50.0 75.0 100.0 Operating temperature [˚C] Supply voltage [V] Sink current vs. Supply voltage Sink current vs. Operating temperature 3.4 4.0 Ta = 25˚C 3.2 Ridrv/Risf = 180kΩ Vin = Vcc – 4V Sink current [mA] Sink current [mA] 3.5 3.0 2.5 Ridrv/Risf = 220kΩ Vin = Vcc – 5V 11.0 12.0 13.0 14.0 15.0 16.0 Vcc = 15V Ridrv/Risf = 220kΩ Vin = Vcc – 5V 2.8 2.6 2.0 1.5 10.0 3.0 2.4 –50.0 Vcc = 13V Ridrv/Risf = 180kΩ Vin = Vcc – 4V –25.0 0.0 25.0 50.0 Operating temperature [˚C] Supply voltage [V] -8- 75.0 100.0 CXA3791EN Tr and Tf vs. Supply voltage Tr and Tf vs. Operating temperature 6.0 4.0 3.5 5.0 Tf 3.0 Tr Tf Tr and Tf [ns] Tr and Tf [ns] 4.0 Tr 3.0 2.0 Ta = 25˚C, Idrv = 50µA, CL = 20pF, RL = 15Ω, Input DC offset = VCC – 5V, Input amplitude = 1.0V, Input rise, fall time = 2.0ns 1.0 0 10.0 11.0 12.0 13.0 14.0 2.5 2.0 1.5 Idrv = 50µA, CL = 20pF, RL = 15Ω, Input DC offset = VCC – 5V, Input amplitude = 1.0V, Input rise, fall time = 2.0ns 1.0 0.5 15.0 0 –50 16.0 1.75 1.50 1.50 I/O delay time [ns] 1.75 1.25 1.00 0.75 Ta = 25˚C, Idrv = 50µA, CL = 20pF, RL = 15Ω, Input DC offset = VCC – 5V, Input amplitude = 1.0V, Input rise, fall time = 2.0ns 12.0 11.0 13.0 14.0 75 100 Idrv = 50µA, CL = 20pF, RL = 15Ω, Input DC offset = VCC – 5V, Input amplitude = 1.0V, Input rise, fall time = 2.0ns 1.25 1.00 0.75 0.50 0.25 15.0 16.0 0 –50 0 –25 25 50 75 Supply voltage [V] Operating temperature [˚C] Positive pulse response Negative pulse response 0.2V/div 0 10.0 50 I/O delay time vs. Operating temperature 2.00 0.2V/div I/O delay time [ns] I/O delay time vs. Supply voltage 2.00 0.25 25 Operating temperature [˚C] Supply voltage [V] 0.50 0 –25 Idrv = 50µA, CL = 20pF, RL = 15Ω Input rise, fall time = 2.0ns T Input 100 Output T 10.0V 10.0V T Output T Input Idrv = 50µA, CL = 20pF, RL = 15Ω Input rise, fall time = 2.0ns Ch1 200mVΩ Ch2 200mVΩ M 1.00ns Ch1 10.0V 1.0ns/div -9- Ch1 200mVΩ Ch2 200mVΩ M 1.00ns Ch1 10.0V 1.0ns/div CXA3791EN Application Circuit 1 when using CCD with open source output 180kΩ 180kΩ 1000pF 0.1µF 0.1µF VCC ISF 6 IDRV 4 5 1 3 2 IN GND OUT 13V GND CDS/ADC CCD Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. - 10 - CXA3791EN Application Circuit 2 when using CCD with internal current source 180kΩ 1000pF VCC ISF 6 IDRV 4 5 1 3 2 IN 0.1µF GND OUT 13V GND CDS/ADC CCD Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. - 11 - CXA3791EN Notes on Operation Provide the widest GND pattern possible on the board. Use a 1000pF (recommended) and a 0.1μF (recommended) ceramic capacitors in parallel for the bypass capacitor connected between the power supply and GND, and connect them as close to the IC pins as possible. Load capacitance causes the input/output wiring response to worsen and results in noise. Use the shortest wiring layout possible, and shield it with GND. When the output pin (Pin 3) is shorted to either the power supply or GND, an overcurrent may flow to the output stage elements and damage them. When the input pin (Pin 1) is shorted to GND, an overcurrent may flow to the internal parasitic elements and damage them. - 12 - CXA3791EN Package Outline (Unit: mm) LEAD PLATING SPECIFICATIONS ITEM - 13 - SPEC. LEAD MATERIAL COPPER ALLOY SOLDER COMPOSITION Sn-Bi Bi:1-4wt% PLATING THICKNESS 5-18µm Sony Corporation