SP5T Antenna Switch CXG1235XR Description The CXG1235XR is an SP5T antenna switch. On chip logic reduces component count and simplifies PCB layout by allowing direct connection of the switch to digital baseband control lines with the CMOS logic levels. It requires 3 CMOS control lines. The Sony GaAs JPHEMT MMIC Process is used for low insertion loss. Features Insertion loss: 0.40dB (Typ.) @960MHz 0.50dB (Typ.) @2170MHz Lead-Free and RoHS compliant Package Small package size: 16-pin XQFN (2.3mm × 2.3mm × 0.35mm) (Typ.) Structure GaAs JPHEMT MMIC Absolute Maximum Ratings Bias voltage VDD 7 V (Ta = 25°C) Control voltage Vctl 5 V (Ta = 25°C) Input power max. 27 dBm (824 to 915MHz, Ta = 25°C) Input power max. 24 dBm (1710 to 1980MHz, Ta = 25°C) Operating temperature –35 to +85 °C Storage temperature –65 to +150 °C Allowable power dissipation *1 PD 100 mW *1 25mm × 25mm × t: 0.8mm, Mounted on standard board (FR-4) This IC is ESD sensitive device. Special handling precautions are required. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E08227 CXG1235XR Block Diagram Ant RF1 F1 F6 F7 RF2 F2 RF3 F3 F8 F9 RF4 F4 F10 RF5 F5 GND 5 VDD 6 CTLA 7 CTLB 8 CTLC Pin Configuration 9 4 ANT RF5 10 3 GND GND 11 2 RF4 12 RF1 RF2 16 GND 15 RF3 14 GND 13 1 GND 16-pin XQFN 2.3mm × 2.3mm × 0.35mm (Typ.) -2- CXG1235XR Truth Table Port A B C F1 F2 F3 F4 F5 F6 F7 F8 F9 F10 ANT – RF1 H L H ON OFF OFF OFF OFF OFF ON ON ON ON ANT – RF2 H H L OFF ON OFF OFF OFF ON OFF ON ON ON ANT – RF3 H L L OFF OFF ON OFF OFF ON ON OFF ON ON ANT – RF4 L L/H L OFF OFF OFF ON OFF ON ON ON OFF ON ANT – RF5 L L/H H OFF OFF OFF OFF ON ON ON ON ON OFF DC Bias Condition (Ta = +25°C) Item Min. Typ. Max. Vctl (H) 1.5 1.8 3.6 Vctl (L) 0 — 0.3 2.6 2.8 3.6 VDD Unit V -3- CXG1235XR Electrical Characteristics (Ta = +25°C, VDD = 2.8V, Vctl = 0V/1.8V) Item Symbol Insertion loss IL VSWR VSWR Port Condition Ant – RF1, 2, 3, 4, 5 2fo Harmonics 3fo 2fo Min. Typ. Max. *1 — 0.40 0.55 *2 — 0.50 0.65 869 to 2170MHz — 1.2 1.5 — –50 –35 — –45 –35 — –50 –35 — –50 –35 — –94 –84 dBm 89 99 — dBm — –91 –81 dBm 53 58 — dBm *3 Ant – RF1, 2, 3, 4, 5 *4 3fo Unit dB — dBm IMD2 IMD2 Input IP2 IIP2 IMD3 IMD3 Input IP3 IIP3 Control current Ictl Vctl = 1.8V — 10 25 μA Supply current Idd VDD = 2.8V (state: HLH) — 160 260 μA Switching speed Swt 50% Ctl to 90% RF — 3 6 μs Ant – RF1, 2, 3, 4, 5 *5 Ant – RF1, 2, 3, 4, 5 *6 Electrical characteristics are measured with all RF ports terminated in 50Ω. *1 *2 *3 *4 *5 *6 Power incident on Ant, Pin = 0dBm, 869 to 960MHz. Power incident on Ant, Pin = 0dBm, 1805 to 2170MHz. Power incident on RFx, Pin = 24dBm, 824 to 915MHz. Power incident on RFx, Pin = 21dBm, 1710 to 1980MHz. Pin = 20dBm, Ftx = 1950MHz, PBlocker = –15dBm, FBlocker = 190MHz, Fim = 2140MHz, IIP2 = Pin + (PBlocker – IMD2) Pin = 20dBm, Ftx = 1950MHz, PBlocker = –15dBm, FBlocker = 1760MHz, Fim = 2140MHz, IIP3 = Pin + (PBlocker – IMD3)/2 -4- CXG1235XR (Ta = +25°C, VDD = 2.8V, Vctl = 0V/1.8V) Item Symbol Port Active RF1 RF2 Isolation ISO. RF3 RF4 RF5 Port Ant – RF2 Ant – RF3 Ant – RF4 Ant – RF5 Ant – RF2 Ant – RF3 Ant – RF4 Ant – RF5 Ant – RF1 Ant – RF3 Ant – RF4 Ant – RF5 Ant – RF1 Ant – RF3 Ant – RF4 Ant – RF5 Ant – RF1 Ant – RF2 Ant – RF4 Ant – RF5 Ant – RF1 Ant – RF2 Ant – RF4 Ant – RF5 Ant – RF1 Ant – RF2 Ant – RF3 Ant – RF5 Ant – RF1 Ant – RF2 Ant – RF3 Ant – RF5 Ant – RF1 Ant – RF2 Ant – RF3 Ant – RF4 Ant – RF1 Ant – RF2 Ant – RF3 Ant – RF4 Condition *1 *2 *1 *2 *1 *2 *1 *2 *1 *2 Electrical characteristics are measured with all RF ports terminated in 50Ω. *1 *2 Power incident on Ant, Pin = 0dBm, 869 to 960MHz. Power incident on Ant, Pin = 0dBm, 1805 to 2170MHz. -5- Min. Typ. Max. Unit 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 35 33 33 33 32 38 34 31 31 35 32 31 24 40 33 29 30 35 34 30 26 36 28 24 31 35 32 32 27 42 28 28 31 35 31 34 27 40 32 35 — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — dB CXG1235XR Recommended Circuit Cbypass (100pF) CTLB 7 CTLC 8 Cbypass (100pF) CtlA VDD Cbypass (100pF) Cbypass (100pF) VDD 5 CtlB CTLA 6 CtlC CRF (56pF) 9 GND ANT 4 10 RF5 GND 3 ANT ∗1 (56nH) CRF (56pF) RF5 CRF (56pF) 11 GND RF1 2 CRF (56pF) 12 RF4 CRF (56pF) RF3 1 16 RF2 14 RF3 15 GND GND 13 GND RF4 CRF (56pF) RF2 When using this IC, the following external components should be used: CRF: This capacitor is used for RF decoupling and must be used all applications. Cbypass: This capacitor is used for DC line filtering. 100pF is recommended. ∗1 Inductor (56nH) is recommended on Ant port for ESD protection. Capacitors are required on all RF ports for DC blocking. -6- RF1 CXG1235XR Package Outline (Unit: mm) LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL -7- SPEC. COPPER ALLOY SOLDER COMPOSITION Sn-Bi Bi:1-4wt% PLATING THICKNESS 5-18µm Sony Corporation